September 2, 1994
AVIONICS APPLICATIONS
RF & MICROWAVE TRANSISTORS
.2 80 2 LFL (S 06 8)
epoxy sealed
.REFRACTORY/GOLD METALLIZATION
.EMITTER SITE BALLASTED
.∞:1 VSWR CAPABILITY
.LOW THERMAL RESISTANCE
.INPUT MATCHING
.OVERLAY GEOMETRY
.METAL/CERAMIC HERMETIC PACKAGE
.POUT = 35 W MIN. WITH 10.7 dB GAIN
DESCRIPTION
The MSC81035M is a medium power Class C
transistor designed specifically for pulsed L-Band
avionics applications. This device is a direct re-
placement for the MSC1035M. MSC81035M of-
fers improved saturated ouput power and collec-
tor efficiency based on the test circuit described
herein.
Low RF thermal resistance and computerized au-
tomatic wire bonding techniques ensure high reli-
ability and product consistency.
The MSC81035M is housed in the IMPAC™
package with internal input matching.
PIN CONNECTION
BRANDING
81035M
OR DER COD E
MSC81035M
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C)
Symbol Parameter Value Unit
PDISS Power Dissipation* (TC ≤ 100˚C) 150 W
ICDevice Current* 3. 0 A
VCC Collector-Supply Voltage* 55 V
TJJunction Temperature (Pulsed RF Operation) 25 0 °C
TSTG Storage Temperature − 65 to +200 °C
RTH(j-c) Junction-Case Thermal Resistance* 1. 0 °C/W
*Applies only to rated RF amplifier operation
Note: Thermal Resistance determined by Infra-Red Scanning of Hot-Spot
Junction Temperature at rated RF operating conditions.
MSC81035M
1. Collector 3. Emitter
2. Base 4. Base
THERMAL DATA
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