W9864G2GH
512K X 4 BANKS X 32BITS SDRAM
Publication Release Date:Jan. 29 , 2008
- 1 - Revision A10
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 3
2. FEATURES ................................................................................................................................. 3
3. AVAILABLE PART NUMBER...................................................................................................... 4
4. PIN CONFIGURATION............................................................................................................... 5
5. PIN DESCRIPTION..................................................................................................................... 6
6. BLOCK DIAGRAM ...................................................................................................................... 7
7. FUNCTIONAL DESCRIPTION.................................................................................................... 8
7.1 Power Up and Initialization ............................................................................................. 8
7.2 Programming Mode Register.......................................................................................... 8
7.3 Bank Activate Command ................................................................................................ 8
7.4 Read and Write Access Modes ...................................................................................... 8
7.5 Burst Read Command .................................................................................................... 9
7.6 Burst Command.............................................................................................................. 9
7.7 Read Interrupted by a Read ........................................................................................... 9
7.8 Read Interrupted by a Write............................................................................................ 9
7.9 Write Interrupted by a Write............................................................................................ 9
7.10 Write Interrupted by a Read............................................................................................ 9
7.11 Burst Stop Command ................................................................................................... 10
7.12 Addressing Sequence of Sequential Mode .................................................................. 10
7.13 Addressing Sequence of Interleave Mode.................................................................... 10
7.14 Auto-precharge Command ........................................................................................... 11
7.15 Precharge Command.................................................................................................... 11
7.16 Self Refresh Command ................................................................................................ 11
7.17 Power Down Mode ....................................................................................................... 12
7.18 No Operation Command............................................................................................... 12
7.19 Deselect Command ...................................................................................................... 12
7.20 Clock Suspend Mode.................................................................................................... 12
8. OPERATION MODE ................................................................................................................. 13
8.1 Simplified Stated Diagram ............................................................................................ 14
9. ELECTRICAL CHARACTERISTICS......................................................................................... 15
9.1 Absolute Maximum Ratings .......................................................................................... 15
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 2 - Revision A10
9.2 Recommended DC Operating Conditions .................................................................... 15
9.3 Capacitance .................................................................................................................. 16
9.4 DC Characteristics........................................................................................................ 16
9.5 AC Characteristics and Operating Condition................................................................ 17
10. TIMING WAVEFORMS............................................................................................................. 20
10.1 Command Input Timing ................................................................................................ 20
10.2 Read Timing.................................................................................................................. 21
10.3 Control Timing of Input Data......................................................................................... 22
10.4 Control Timing of Output Data ...................................................................................... 23
10.5 Mode Register Set Cycle .............................................................................................. 24
11. OPERATING TIMING EXAMPLE ............................................................................................. 25
11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3)...................................... 25
11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge)........... 26
11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3)...................................... 27
11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge)........... 28
11.5 Interleaved Bank Write (Burst Length = 8) ................................................................... 29
11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ........................................ 30
11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3)............................................... 31
11.8 Page Mode Read/Write (Burst Length = 8, CAS Latency = 3)..................................... 32
11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3) ........................................ 33
11.10 Auto-precharge Write (Burst Length = 4) .................................................................... 34
11.11 Auto Refresh Cycle ..................................................................................................... 35
11.12 Self Refresh Cycle....................................................................................................... 36
11.13 Bust Read and Single Write (Burst Length = 4, CAS Latency = 3)............................. 37
11.14 Power Down Mode ...................................................................................................... 38
11.15 Auto-precharge Timing (Write Cycle).......................................................................... 39
11.16 Auto-precharge Timing (Read Cycle).......................................................................... 40
11.17 Timing Chart of Read to Write Cycle........................................................................... 41
11.18 Timing Chart of Write to Read Cycle........................................................................... 41
11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command).......................................... 42
11.20 Timing Chart of Burst Stop Cycle (Precharge Command) .......................................... 42
11.21 CKE/DQM Input Timing (Write Cycle)......................................................................... 43
11.22 CKE/DQM Input Timing (Read Cycle)......................................................................... 44
12. PACKAGE SPECIFICATION .................................................................................................... 45
12.1 86L TSOP (II)-400 mil................................................................................................... 45
13. REVISION HISTORY ................................................................................................................ 46
W9864G2GH
512K X 4 BANKS X 32BITS SDRAM
Publication Release Date:Jan. 29 , 2008
- 3 - Revision A10
1. GENERAL DESCRIPTION
W9864G2GH is a high-speed synchronous dynamic random access memory (SDRAM), organized as
512K words × 4 banks × 32 bits. Using pipelined architecture and 0.11 µm process technology,
W9864G2GH delivers a data bandwidth of up to 800M bytes per second. For different application,
W9864G2GH is sorted into the following speed grades:-5,-6/-6C/-6I,-7.The -5 parts can run up to
200MHz/CL3.The -6/-6C/-6I parts can run up to 166 MHz/CL3. And the grade of –6C with tCK=7.5nS
on CL=2, tIH=0.8nS on CL=2/3.And the -6I grade which is guaranteed to support -40°C ~ 85°C.The -7
parts can run up to 143 MHz/CL3.
Accesses to the SDRAM are burst oriented. Consecutive memory location in one page can be
accessed at a burst length of 1, 2, 4, 8 or full page when a bank and row is selected by an ACTIVE
command. Column addresses are automatically generated by the SDRAM internal counter in burst
operation. Random column read is also possible by providing its address at each clock cycle. The
multiple bank nature enables interleaving among internal banks to hide the precharging time.
By having a programmable Mode Register, the system can change burst length, latency cycle,
interleave or sequential burst to maximize its performance. W9864G2GH is ideal for main memory in
high performance applications.
2. FEATURES
• 3.3V± 0.3V for -5/-6/-6C/-6I grade power supply
2.6V～3.6V for -7 grade power supply
• 524,288 words × 4 banks × 32 bits organization
• Self Refresh Current: Standard and Low Power
• CAS Latency: 2 & 3
• Burst Length: 1, 2, 4, 8 and full page
• Sequential and Interleave Burst
• Byte data controlled by DQM0-3
• Auto-precharge and controlled precharge
• Burst read, single write operation
• 4K refresh cycles/64 mS
• Interface: LVTTL
• Packaged in TSOP II 86-pin, 400 mil
• W9864G2GH is using Lead free materials
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 4 - Revision A10
3. AVAILABLE PART NUMBER
PART NUMBER SPEED (CL=3) SELF REFRESH
CURRENT (MAX.) OPERATING
TEMPERATURE
W9864G2GH-5 200 MHz 2mA 0°C ~ 70°C
W9864G2GH-6/-6C 166 MHz 2mA 0°C ~ 70°C
W9864G2GH-6I 166 MHz 2mA
-40°C ~ 85°C
W9864G2GH-7 143 MHz 2mA 0°C ~ 70°C
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 5 - Revision A10
4. PIN CONFIGURATION
86
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
37
38
39
40
41
42
43
28
29
30
31
32
33
34
35
36
50
49
48
47
46
45
44
58
57
56
55
54
53
52
51
85
V
ss
DQ15
V
SS
Q
DQ14
DQ13
V
CC
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
CC
Q
DQ8
NC
V
SS
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
V
SS
NC
DQ31
V
CC
Q
DQ30
DQ29
V
SS
Q
DQ28
DQ27
V
CC
Q
DQ26
DQ25
V
SS
Q
DQ24
V
SS
VCC
DQ0
V
CC
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
CC
Q
DQ5
DQ6
VSSQ
DQ7
NC
VCC
DQM0
WE
CAS
RAS
CS
NC
BS0
BS1
A10/AP
A0
A1
A2
DQM2
V
CC
NC
DQ16
V
SS
Q
DQ17
DQ18
V
CC
Q
DQ19
DQ20
V
SS
Q
DQ21
DQ22
V
CC
Q
DQ23
V
CC
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 6 - Revision A10
5. PIN DESCRIPTION
PIN NUMBER PIN NAME FUNCTION DESCRIPTION
24, 25, 26, 27, 60, 61, 62,
63, 64, 65, 66 A0−A10 Address
Multiplexed pins for row and column address.
Row address: A0−A10. Column address: A0−A7.
A10 is sampled during a precharge command to
determine if all banks are to be precharged or
bank selected by BS0, BS1.
22, 23 BS0, BS1 Bank Select
Select bank to activate during row address latch
time, or bank to read/write during address latch
time.
2, 4, 5, 7, 8, 10, 11, 13, 31,
33, 34, 36, 37, 39, 40, 42,
45, 47, 48, 50, 51, 53, 54,
56, 74, 76, 77, 79, 80, 82,
83, 85
DQ0−DQ31 Data
Input/ Output Multiplexed pins for data output and input.
20 CS Chip Select
Disable or enable the command decoder. When
command decoder is disabled, new command is
ignored and previous operation continues.
19 RAS Row Address
Strobe
Command input. When sampled at the rising
edge of the clock RAS , CAS and WE define
the operation to be executed.
18 CAS Column Address
Strobe Referred to RAS
17 WE Write Enable Referred to RAS
16, 28, 59, 71 DQM0−DQM3 Input/Output
Mask
The output buffer is placed at Hi-Z (with latency
of 2) when DQM is sampled high in read cycle.
In write cycle, sampling DQM high will block the
write operation with zero latency.
68 CLK Clock Inputs
System clock used to sample inputs on the rising
edge of clock.
67 CKE Clock Enable
CKE controls the clock activation and
deactivation. When CKE is low, Power Down
mode, Suspend mode, or Self Refresh mode is
entered.
1, 15, 29, 43 VCC Power
Power for input buffers and logic circuit inside
DRAM.
44, 58, 72, 86 VSS Ground
Ground for input buffers and logic circuit inside
DRAM.
3, 9, 35, 41, 49, 55, 75, 81 VCCQ Power for I/O
Buffer
Separated power from VCC, to improve DQ
noise immunity.
6, 12, 32, 38, 46, 52, 78, 84 VSSQ Ground for I/O
Buffer
Separated ground from VSS, to improve DQ
noise immunity.
14, 21, 30, 57, 69, 70, 73 NC No Connection No connection.(The NC pin must connect to
ground or floating.)
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 7 - Revision A10
6. BLOCK DIAGRAM
DQ0
DQ31
DQM0~3
CLK
CKE
A10
CLOCK
BUFFER
COMMAND
DECODER
ADDRESS
BUFFER
REFRESH
COUNTER
COLUMN
COUNTER
CONTROL
SIGNAL
GENERATOR
MODE
REGISTER
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #2
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #0
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #3
DATA CONTROL
CIRCUIT
DQ
BUFFER
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #1
NOTE:
The cell array configuration is 2048 * 256 * 32
ROW DECODER ROW DECODER
ROW DECODERROW DECODER
A0
A9
BS0
BS1
CS
RAS
CAS
WE
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 8 - Revision A10
7. FUNCTIONAL DESCRIPTION
7.1 Power Up and Initialization
The default power up state of the mode register is unspecified. The following power up and
initialization sequence need to be followed to guarantee the device being preconditioned to each user
specific needs.
During power up, all VCC and VCCQ pins must be ramp up simultaneously to the specified voltage when
the input signals are held in the “NOP” state. The power up voltage must not exceed VCC + 0.3V on
any of the input pins or VCC supplies. After power up, an initial pause of 200 µS is required followed by
a precharge of all banks using the precharge command. To prevent data contention on the DQ bus
during power up, it is required that the DQM and CKE pins be held high during the initial pause period.
Once all banks have been precharged, the Mode Register Set Command must be issued to initialize
the Mode Register. An additional eight Auto Refresh cycles (CBR) are also required before or after
programming the Mode Register to ensure proper subsequent operation.
7.2 Programming Mode Register
After initial power up, the Mode Register Set Command must be issued for proper device operation.
All banks must be in a precharged state and CKE must be high at least one cycle before the Mode
Register Set Command can be issued. The Mode Register Set Command is activated by the low
signals of RAS , CAS , CS and WE at the positive edge of the clock. The address input data
during this cycle defines the parameters to be set as shown in the Mode Register Operation table. A
new command may be issued following the mode register set command once a delay equal to tRSC has
elapsed. Please refer to the next page for Mode Register Set Cycle and Operation Table.
7.3 Bank Activate Command
The Bank Activate command must be applied before any Read or Write operation can be executed.
The operation is similar to RAS activate in EDO DRAM. The delay from when the Bank Activate
command is applied to when the first read or write operation can begin must not be less than the RAS
to CAS delay time (tRCD). Once a bank has been activated it must be precharged before another Bank
Activate command can be issued to the same bank. The minimum time interval between successive
Bank Activate commands to the same bank is determined by the RAS cycle time of the device (tRC).
The minimum time interval between interleaved Bank Activate commands (Bank A to Bank B and vice
versa) is the Bank to Bank delay time (tRRD). The maximum time that each bank can be held active is
specified as TRAS (max.).
7.4 Read and Write Access Modes
After a bank has been activated, a read or write cycle can be followed. This is accomplished by setting
RAS high and CAS low at the clock rising edge after minimum of tRCD delay. WE pin voltage level
defines whether the access cycle is a read operation ( WE high), or a write operation ( WE low). The
address inputs determine the starting column address. Reading or writing to a different row within an
activated bank requires the bank be precharged and a new Bank Activate command be issued. When
more than one bank is activated, interleaved bank Read or Write operations are possible. By using the
programmed burst length and alternating the access and precharge operations between multiple
banks, seamless data access operation among many different pages can be realized. Read or Write
Commands can also be issued to the same bank or between active banks on every clock cycle.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 9 - Revision A10
7.5 Burst Read Command
The Burst Read command is initiated by applying logic low level to CS and CAS while holding
RAS and WE high at the rising edge of the clock. The address inputs determine the starting column
address for the burst. The Mode Register sets type of burst (sequential or interleave) and the burst
length (1, 2, 4, 8 and full page) during the Mode Register Set Up cycle. Table 2 and 3 in the next page
explain the address sequence of interleave mode and sequence mode.
7.6 Burst Command
The Burst Write command is initiated by applying logic low level to CS , CAS and WE while
holding RAS high at the rising edge of the clock. The address inputs determine the starting column
address. Data for the first burst write cycle must be applied on the DQ pins on the same clock cycle
that the Write Command is issued. The remaining data inputs must be supplied on each subsequent
rising clock edge until the burst length is completed. Data supplied to the DQ pins after burst finishes
will be ignored.
7.7 Read Interrupted by a Read
A Burst Read may be interrupted by another Read Command. When the previous burst is interrupted,
the remaining addresses are overridden by the new read address with the full burst length. The data
from the first Read Command continues to appear on the outputs until the CAS Latency from the
interrupting Read Command the is satisfied.
7.8 Read Interrupted by a Write
To interrupt a burst read with a Write Command, DQM may be needed to place the DQs (output
drivers) in a high impedance state to avoid data contention on the DQ bus. If a Read Command will
issue data on the first and second clocks cycles of the write operation, DQM is needed to insure the
DQs are tri-stated. After that point the Write Command will have control of the DQ bus and DQM
masking is no longer needed.
7.9 Write Interrupted by a Write
A burst write may be interrupted before completion of the burst by another Write Command. When the
previous burst is interrupted, the remaining addresses are overridden by the new address and data
will be written into the device until the programmed burst length is satisfied.
7.10 Write Interrupted by a Read
A Read Command will interrupt a burst write operation on the same clock cycle that the Read
Command is activated. The DQs must be in the high impedance state at least one cycle before the
new read data appears on the outputs to avoid data contention. When the Read Command is
activated, any residual data from the burst write cycle will be ignored.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 10 - Revision A10
7.11 Burst Stop Command
A Burst Stop Command may be used to terminate the existing burst operation but leave the bank open
for future Read or Write Commands to the same page of the active bank, if the burst length is full
page. Use of the Burst Stop Command during other burst length operations is illegal. The Burst Stop
Command is defined by having RAS and CAS high with CS and WE low at the rising edge of
the clock. The data DQs go to a high impedance state after a delay, which is equal to the CAS
Latency in a burst read cycle, interrupted by Burst Stop.
7.12 Addressing Sequence of Sequential Mode
A column access is performed by increasing the address from the column address which is input to
the device. The disturb address is varied by the Burst Length as shown in Table 2.
Table 2 Address Sequence of Sequential Mode
DATA ACCESS ADDRESS BURST LENGTH
Data 0 n BL = 2 (disturb address is A0)
Data 1 n + 1 No address carry from A0 to A1
Data 2 n + 2 BL = 4 (disturb addresses are A0 and A1)
Data 3 n + 3 No address carry from A1 to A2
Data 4 n + 4
Data 5 n + 5 BL = 8 (disturb addresses are A0, A1 and A2)
Data 6 n + 6 No address carry from A2 to A3
Data 7 n + 7
7.13 Addressing Sequence of Interleave Mode
A column access is started in the input column address and is performed by inverting the address bit
in the sequence shown in Table 3.
Table 3 Address Sequence of Interle ave Mode
DATA ACCESS ADDRESS BURST LENGTH
Data 0 A8 A7 A6 A5 A4 A3 A2 A1 A0 BL = 2
Data 1 A8 A7 A6 A5 A4 A3 A2 A1
A
0
Data 2 A8 A7 A6 A5 A4 A3 A2
A
1 A0 BL = 4
Data 3 A8 A7 A6 A5 A4 A3 A2
A
1
A
0
Data 4 A8 A7 A6 A5 A4 A3
A
2 A1 A0 BL = 8
Data 5 A8 A7 A6 A5 A4 A3
A
2 A1
A
0
Data 6 A8 A7 A6 A5 A4 A3
A
2
A
1 A0
Data 7 A8 A7 A6 A5 A4 A3
A
2
A
1
A
0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 11 - Revision A10
7.14 Auto-precharge Command
If A10 is set to high when the Read or Write Command is issued, then the Auto-precharge function is
entered. During Auto-precharge, a Read Command will execute as normal with the exception that the
active bank will begin to precharge automatically before all burst read cycles have been completed.
Regardless of burst length, it will begin a certain number of clocks prior to the end of the scheduled
burst cycle. The number of clocks is determined by CAS Latency.
A Read or Write Command with Auto-precharge cannot be interrupted before the entire burst
operation is completed for the same bank. Therefore, use of a Read, Write, or Precharge Command is
prohibited during a read or write cycle with Auto-precharge. Once the precharge operation has started,
the bank cannot be reactivated until the Precharge time (tRP) has been satisfied. Issue of Auto-
precharge command is illegal if the burst is set to full page length. If A10 is high when a Write
Command is issued, the Write with Auto-precharge function is initiated. The SDRAM automatically
enters the precharge operation two clocks delay from the last burst write cycle. This delay is referred
to as write tWR. The bank undergoing Auto-precharge cannot be reactivated until tWR and tRP are
satisfied. This is referred to as tDAL, Data-in to Active delay (tDAL = tWR + tRP). When using the Auto-
precharge Command, the interval between the Bank Activate Command and the beginning of the
internal precharge operation must satisfy tRAS (min).
7.15 Precharge Command
The Precharge Command is used to precharge or close a bank that has been activated. The
Precharge Command is entered when CS , RAS and WE are low and CAS is high at the rising
edge of the clock. The Precharge Command can be used to precharge each bank separately or all
banks simultaneously. Three address bits, A10, BS0 and BS1 are used to define which bank(s) is to
be precharged when the command is issued. After the Precharge Command is issued, the precharged
bank must be reactivated before a new read or write access can be executed. The delay between the
Precharge Command and the Activate Command must be greater than or equal to the Precharge time
(tRP).
7.16 Self Refresh Command
The Self Refresh Command is defined by having CS , RAS , CAS and CKE held low with WE
high at the rising edge of the clock. All banks must be idle prior to issuing the Self Refresh Command.
Once the command is registered, CKE must be held low to keep the device in Self Refresh mode.
When the SDRAM has entered Self Refresh mode all of the external control signals, except CKE, are
disabled. The clock is internally disabled during Self Refresh Operation to save power. The device will
exit Self Refresh operation after CKE is returned high. A minimum delay time is required when the
device exits Self Refresh Operation and before the next command can be issued. This delay is equal
to the tAC cycle time plus the Self Refresh exit time.
If, during normal operation, AUTO REFRESH cycles are issued in bursts (as opposed to being evenly
distributed), a burst of 4,096 AUTO REFRESH cycles should be completed just prior to entering and
just after exiting the self refresh mode.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 12 - Revision A10
7.17 Power Down Mode
The Power Down mode is initiated by holding CKE low. All of the receiver circuits except CKE are
gated off to reduce the power. The Power Down mode does not perform any refresh operations,
therefore the device can not remain in Power Down mode longer than the Refresh period (tREF) of the
device.
The Power Down mode is exited by bringing CKE high. When CKE goes high, a No Operation
Command is required on the next rising clock edge, depending on tCK. The input buffers need to be
enabled with CKE held high for a period equal to tCES (min.) + tCK (min.).
7.18 No Operation Command
The No Operation Command should be used in cases when the SDRAM is in a idle or a wait state to
prevent the SDRAM from registering any unwanted commands between operations. A No Operation
Command is registered when CS is low with RAS , CAS and WE held high at the rising edge of
the clock. A No Operation Command will not terminate a previous operation that is still executing, such
as a burst read or write cycle.
7.19 Deselect Command
The Deselect Command performs the same function as a No Operation Command. Deselect
Command occurs when CS is brought high, the RAS , CAS and WE signals become don’t cares.
7.20 Clock Suspend Mode
During normal access mode, CKE must be held high enabling the clock. When CKE is registered low
while at least one of the banks is active, Clock Suspend Mode is entered. The Clock Suspend mode
deactivates the internal clock and suspends any clocked operation that was currently being executed.
There is a one clock delay between the registration of CKE low and the time at which the SDRAM
operation suspends. While in Clock Suspend mode, the SDRAM ignores any new commands that are
issued. The Clock Suspend mode is exited by bringing CKE high. There is a one clock cycle delay
from when CKE returns high to when Clock Suspend mode is exited.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 13 - Revision A10
8. OPERATION MODE
Fully synchronous operations are performed to latch the commands at the positive edges of CLK.
Table 1 shows the truth table for the operation commands.
TABLE 1 TRUTH TABLE (NOTE (1), (2))
COMMAND Device State CKEn-1 CKEn DQM BS0, 1 A10 A0-A9 CS RAS CAS WE
Bank Active Idle H x x v v V L L H H
Bank Precharge Any H x x v L x L L H L
Precharge All Any H x x x H x L L H L
Write Active (3) H x x v L v L H L L
Write with Auto-precharge Active (3) H x x v H v L H L L
Read Active (3) H x x v L v L H L H
Read with Auto-precharge Active (3) H x x v H v L H L H
Mode Register Set Idle H x x v v v L L L L
No-Operation Any H x x x x x L H H H
Burst Stop Active (4) H x x x x x L H H L
Device Deselect Any H x x x x x H x x x
Auto-Refresh Idle H H x x x x L L L H
Self-Refresh Entry Idle H L x x x x L L L H
Self Refresh Exit idle
(S.R)
L
L
H
H
x
x
x
x
x
x
x
x
H
L
x
H
x
H
x
x
Clock suspend Mode
Entry Active H L x x x x x x x x
Power Down Mode Entry Idle
Active (5)
H
H
L
L
x
x
x
x
x
x
x
x
H
L
x
H
x
H
X
H
Clock Suspend Mode Exit Active L H x x x x x x x X
Power Down Mode Exit
Any
(power
down)
L
L
H
H
x
x
x
x
x
x
x
x
H
L
x
H
x
H
X
H
Data write/Output Enable Active H x L x x x x x x x
Data Write/Output Disable Active H x H x x x x x x x
Notes:
(1) v = valid, x = Don’t care, L = Low Level, H = High Level
(2) CKEn signal is input leve l when commands are provided.
(3) These are state of bank designated by BS0, BS1 signals.
(4) Device state is full page burst operation.
(5) Power Down Mode can not be entered in the burst cycle.
When this command asserts in the burst cycle, device state is clock suspend mode.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 14 - Revision A10
8.1 Simplified Stated Diagram
Mode
Register
Set
IDLE CBR
Refresh
Self
Refresh
ROW
ACTIVE
Power
Down
Precharge
POWER
ON
Active
Power
Down
WRITE
WRITE
SUSPEND
WRITEA
WRITEA
SUSPEND
READ
SUSPEND
READ
READA
SUSPEND
READA
Precharge
MRS REF
ACT
CKE
CKE
CKE
CKE
CKE
CKE
CKE
CKE
CKE
CKE
SELF
SELF exit
CKE
CKE
Write with
Read
Write
Auto precharge
Auto precharge
Read with
Write
Write
Read
PRE(precharge termination)
PRE(precharge termination)
Read
BST
BST
PRE
Manual input
Automatic sequence
MRS = Mode Register Set
REF = Refresh
ACT = Active
PRE = Precharge
WRITEA = Write with Auto-precharge
READA = Read with Auto-precharge
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 15 - Revision A10
9. ELECTRICAL CHARACTERISTICS
9.1 Absolute Maximum Ratings
PARAMETER SYMBOL RATING UNIT NOTES
Input, Column Output Voltage VIN, VOUT -0.3~VCC+ 0.3V V 1
Power Supply Voltage VCC, VCCQ -0.3~4.6V V 1
Operating Temperature TOPR 0 ~ 70 °C 1
Operating Temperature (-6I) TOPR -40 ~ 85 °C 1
Storage Temperature TSTG -55 ~ 150 °C 1
Soldering Temperature (10s) TSOLDER 260 °C 1
Power Dissipation PD 1 W 1
Short Circuit Output Current IOUT 50 mA 1
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
9.2 Recommended DC Operating Conditions
(TA = 0 to 70°C for -5/-6/-6C/-7, TA = -40 to 85°C for -6I )
PARAMETER SYM. MIN. TYP. MAX. UNIT NOTES
Power Supply Voltage VCC 3.0 3.3 3.6 V
Power Supply Voltage (for I/O Buffer) VCCQ3.0 3.3 3.6 V
Power Supply Voltage(-7) VCC 2.6 3.3 3.6 V
Power Supply Voltage
(for I/O Buffer)(-7) VCCQ2.6 3.3 3.6 V
Input High Voltage VIH 2 - VCC +0.3 V 1
Input Low Voltage VIL -0.3 - +0.8 V 2
Output logic high voltage VOH 2.4 - - V IOH= -2mA
Output logic low voltage VOL - - 0.4 V
IOL= 2mA
Input leakage current II(L) -10 - 10 µA 3
Output leakage current Io(L) -10 - 10 µA 4
Note: 1. VIH (max.) = VCC/VCCQ+1.2V for pulse width < 5 nS
2. V
IL (min.) = VSS/VSSQ-1.2V for pulse width < 5 nS
3. Any input 0V<VIN<VCCQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
4. Output disabled, 0V ≤ VOUT ≤ VCCQ.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 16 - Revision A10
9.3 Capacitance
(VCC =3.3V±0.3V for -5/-6/-6C/-6I , VCC=2.6V-3.6V for -7, TA = 25 °C, f = 1 MHz)
PARAMETER SYM. MIN. MAX. UNIT
Input Capacitance
(A0 to A10, BS0, BS1, CS , RAS , CAS , WE , DQM, CKE) Ci 2.5 4 pf
Input Capacitance (CLK) CCLK 2.5 4 pf
Input/Output capacitance (DQ0−DQ31) Co 4 6.5 pf
Note: These parameters are periodically sampled and not 100% tested
9.4 DC Characteristics
(VCC = 3.3V±0.3V for -5/-6/-6C,VCC=2.6V-3.6V for -7 on TA = 0°~70°C, VCC = 3.3V±0.3V for 6I on TA = -40°~85°C. )
-5 -6/-
6C/-6I -7
PARAMETER SYM. MAX. MAX. MAX. UNIT NOTES
Operating Current
tCK = min., tRC = min.
Active precharge command
cycling without burst operation
1 Bank Operation
ICC1 110 100 90 3
Standby Current
tCK = min., CS = VIH
VIH/L = VIH (min.)/VIL (max.)
CKE = VIH ICC2 40 35 30 3
Bank: Inactive State CKE = VIL
(Power Down mode) ICC2P 3 3 3 3
Standby Current
CLK = VIL, CS = VIH
VIH/L=VIH (min.)/VIL (max.)
CKE = VIH ICC2S 15 15 15
Bank: Inactive State CKE = VIL
(Power Down mode) ICC2PS 3 3 3 mA
No Operating Current
tCK = min., CS = VIH (min.) CKE = VIH ICC3 70 65 60
Bank: Active State (4 Banks) CKE = VIL
(Power Down mode) ICC3P 15 15 15
Burst Operating Current
(tCK = min.)
Read/Write command cycling
ICC4 150 140 130 3, 4
Auto Refresh Current
(tCK = min.)
Auto refresh command cycling
ICC5 170 150 140 3
Self Refresh Current
Self refresh mode
(CKE = 0.2V)
ICC6 2 2 2
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 17 - Revision A10
9.5 AC Characteristics and Operating Condition
(VCC = 3.3V±0.3V for -5/-6/-6C,VCC=2.6V-3.6V for -7 on TA = 0°~70°C, VCC = 3.3V±0.3V for 6I on TA = -40°~85°C.)
(Notes: 5, 6.)
-5 -6/-6I -6C -7
PARAMETER SYM
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT NOTES
Ref/Active to
Ref/Active Command
Period
tRC 55 60 60 65
Active to precharge
Command Period tRAS 40
100000 42 100000 42 100000 45 100000
Active to Read/Write
Command Delay Time tRCD 15 18 18 20
nS
Read/Write(a) to
Read/ Write(b)
Command Period
tCCD 1 1 1 1 tCK
Precharge to Active(b)
Command Period tRP 15 18 18 20
Active(a) to Active(b)
Command Period tRRD 10 12 12 14
nS
Write Recovery Time
CL* = 2
CL* = 3
tWR 2 2 2 2 tCK
CLK Cycle Time
CL* = 2 10 1000 10 1000 7.5 1000 10 1000
CL* = 3
tCK
5 1000 6 1000 6 1000 7 1000
CLK High Level tCH 2 2 2 2 9
CLK Low Level tCL 2 2 2 2 9
Access Time from
CLK CL* = 2 － 6 5.5 6
CL* = 3
tAC
4.5 5 5 5.5
11
Output Data Hold
Time tOH 2 2 2 2 11
Output Data High
Impedance Time tHZ 2 5 2 6 2 6 2 7 8
Output Data Low
Impedance Time tLZ 0 0 0 0 11
Power Down Mode
Entry Time tSB 0 5 0 6 0 6 0 7
Transition Time of
CLK (Rise and Fall) tT 0.5 1 0.5 1 0.5 1 0.5 1 7
Data-in-Set-up Time tDS 1.5 1.5 1.5 1.5 10
Data-in Hold Time tDH 1 1 0.8 1 10
Address Set-up Time tAS 1.5 1.5 1.5 1.5 10
Address Hold Time tAH 1 1 0.8 1 10
CKE Set-up Time tCKS 1.5 1.5 1.5 1.5 10
CKE Hold Time tCKH 1 1 0.8 1 10
Command Set-up Time tCMS 1.5 1.5 1.5 1.5 10
Command Hold Time tCMH 1 1 0.8 1
nS
10
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 18 - Revision A10
AC Characteristics and Operating Condition, continued
-5 -6/-6I -6C -7
PARAMETER SYM
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT NOTES
Refresh Time tREF 64 64 64 64 mS
Mode Register Set
Cycle Time tRSC 10 12 12 14 nS
Exit self refresh to
Active command tXSR 70 72 72 75 nS
Notes:
1.Operation exceeds “Absolute Maximum Ratings” may cause permanent damage to the devices.
2. All voltages are referenced to VSS
3. These parameters depend on the cycle rate and listed values are measured at a cycle rate with the
minimum values of tCK and tRC.
4. These parameters depend on the output loading conditions. Specified values are obtained with
output open.
5. Power up sequence please refer to "Functional Description" section described before.
6. AC Testing Conditions
PARAMETER CONDITIONS
Output Reference Level 1.4V
Output Load See diagram below
Input Signal Levels (VIH/VIL) 2.4V/0.4V
Transition Time (tT: tr/tf) of Input Signal 1/1 nS
Input Reference Level 1.4V
50 ohms
1.4 V
AC TEST LOAD
Z = 50 ohmsoutput
30pF
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 19 - Revision A10
7. Transition times are measured between VIH and VIL.
8. tHZ defines the time at which the outputs achieve the open circuit condition and is not referenced to
output level.
9. These parameters account for the number of clock cycles and depend on the operating frequency
of the clock, as follows the number of clock cycles = specified value of timing/ clock period (count
fractions as whole number)
(1)tCH is the pulse width of CLK measured from the positive edge to the negative edge referenced to VIH (min.).
tCL is the pulse width of CLK measured from the negative edge to the positive edge referenced to VIL (max.).
(2)A.C Latency Characteristics
CKE to clock disable (CKE Latency) 1 tCK
DQM to output to HI-Z (Read DQM Latency) 2
DQM to output to HI-Z (Write DQM Latency) 0
Write command to input data (Write Data Latency) 0
CS to Command input ( CS Latency) 0
CL = 2 2
Precharge to DQ Hi-Z Lead time
CL = 3 3
CL = 2 1
Precharge to Last Valid data out
CL = 3 2
CL = 2 2
Bust Stop Command to DQ Hi-Z Lead time
CL = 3 3
CL = 2 1
Bust Stop Command to Last Valid Data out
CL = 3 2
CL = 2 BL + tRP tCK + nS
Read with Auto-precharge Command to Active/Ref Command
CL = 3 BL + tRP
CL = 2 (BL+1) + tRP
Write with Auto-precharge Command to Active/Ref Command
CL = 3 (BL+1) + tRP
10. Assumed input rise and fall time (tT ) = 1nS.
If tr & tf is longer than 1nS, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]nS should be added to the parameter
( The tT maximum can’t be more than 10nS for low frequency application. )
11. If clock rising time (tT) is longer than 1nS, (tT/2-0.5)nS should be added to the parameter.
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 20 - Revision A10
10. TIMING WAVEFORMS
10.1 Command Input Timing
t
CK
CLK
A0-A10
BS0, 1
VIH
VIL
t
CMH
t
CMS
t
CH
t
CL
t
T
t
T
t
CKS
t
CKH
t
CKH
t
CKS
t
CKS
t
CKH
CS
RAS
CAS
WE
CKE
t
CMS
t
CMH
t
CMS
t
CMH
t
CMS
t
CMH
t
CMS
t
CMH
t
AS
t
AH
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 21 - Revision A10
10.2 Read Timing
Read CAS Latency
t
AC
t
LZ
t
AC
t
OH
t
HZ
t
OH
Burst Length
Read Command
CLK
CS
RAS
CAS
WE
A0-A10
BS0, 1
DQ
Valid
Data-Out
Valid
Data-Out
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 22 - Revision A10
10.3 Control Timing of Input Data
*DQM2,3="L"
CLK
(Word Mask)
t
CMH
t
CMS
t
CMH
t
CMS
DQM0
t
CMS
t
CMH
t
CMH
DQM1
DQ0 -DQ7
DQ16 -DQ23
DQ8-DQ15
DQ24-DQ31
t
DH
t
DS
t
DH
t
DS
t
DH
t
DS
t
DH
Valid
Data-in
Valid
Data-in
Valid
Data-in
Valid
Data-in
t
DS
t
DH
Valid
Data-in
Valid
Data-in
t
DH
Valid
Data-in
t
DH
t
DS
t
DH
t
DS
Valid
Data-in
Valid
Data-in
t
DH
Valid
Data-in
t
DH
Valid
Data-in
t
DS
t
DH
t
DS
t
DH
t
DS
Valid
Data-in
Valid
Data-in
t
DH
Valid
Data-in
t
DH
Valid
Data-in
t
DS
t
DH
t
DS
t
DH
t
DH
t
DH
t
DS
t
DS
t
DS
t
DS
DQ0 -DQ7
CLK
CKE
t
CKH
t
CKS
t
CKH
t
CKS
t
DS
t
DH
t
DS
t
DH
t
DH
t
DS
t
DS
t
DH
Valid
Data-in
Valid
Data-in
Valid
Data-in
Valid
Data-in
DQ24 -DQ31
DQ16 -DQ23
DQ8 -DQ15
(Clock Mask)
t
DS
t
DH
t
DS
t
DH
t
DH
t
DS
t
DS
t
DH
Valid
Data-in
Valid
Data-in
Valid
Data-in
Valid
Data-in
t
DS
t
DH
t
DS
t
DH
t
DH
t
DS
t
DS
t
DH
Valid
Data-in
Valid
Data-in
Valid
Data-in
Valid
Data-in
t
DS
t
DH
t
DS
t
DH
t
DH
t
DS
t
DS
t
DH
Valid
Data-in
Valid
Data-in
Valid
Data-in
Valid
Data-in
t
DS
t
DS
t
DS
Valid
Data-in
Valid
Data-in
Valid
Data-in
t
CMS
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 23 - Revision A10
10.4 Control Timing of Output Data
DQ0 -DQ7
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
t
OH
t
AC
t
OH
t
AC
t
OH
t
HZ
t
LZ
t
AC
t
OH
t
AC
OPEN
CLK
(Output Enable)
DQM0
t
CMH
t
CMS
t
CMH
t
CMS
t
CMH
t
CMS
t
CMH
t
CMS
DQM1
t
OH
t
AC
t
AC
t
HZ
t
AC
t
AC
Valid
Data-Out
Valid
Data-Out
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
t
OH
DQ8 -DQ15
t
AC
t
HZ
t
LZ
OPEN
DQ24 -DQ31
DQ16 -DQ23
Valid
Data-Out
Valid
Data-Out
t
OH
t
AC
t
OH
t
AC
t
OH
t
HZ
t
AC
t
OH
t
AC
t
OH
Valid
Data-Out
Valid
Data-Out
t
OH
t
OH
t
LZ
t
OH
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
DQ16 -DQ23
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
DQ24 -DQ31
t
CKH
t
CKS
t
CKH
t
CKS
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
DQ0 -DQ7
CKE
CLK
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
t
OH
t
AC
Valid
Data-Out
Valid
Data-Out
Valid
Data-Out
DQ8 -DQ15
(Clock Mask)
*DQM2,3="L"
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 24 - Revision A10
10.5 Mode Register Set Cycle
A0A3 A0Addressing Mode
A0
0A0
Sequential
A01A0Interleave
A0
A9 Single Write Mode
A00A0Burst read and Burst write
A0
1A0
Burst read and single write
A0
A0
A2 A1 A0
A00 0 0
A00 0 1
A0
0 1 0
A00 1 1
A0
1 0 0
A0
1 0 1
A01 1 0
A0
1 1 1
A0Burst Length
A0
Sequential A0
Interleave
1A01
A02A02
A0
4A0
4
A0
8A0
8
A0
Reserved A0
Reserved
A0
Full Page
A0CAS Latency
A0
Reserved
A0Reserved
2
A03
Reserved
A0A6 A5 A4
A0
0 0 0
A0
0 1 0
A00 1 1
A01 0 0
A00 0 1
tRSC
tCMS tCMH
tCMS tCMH
tCMS tCMH
tCMS tCMH
tAS tAH
CLK
CS
RAS
CAS
WE
A0-A10
BS0,1
Register
set data
next
command
A0
A1
A2
A3
A4
A5
A6
Burst Length
Addressing Mode
CAS Latency
(Test Mode)
A8 Reserved
A0
A7
A0
A9 A0
Write Mode
A10
BS1
A0
BS0
"0"
"0"
"0"
"0"
"0"
Reserved
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 25 - Revision A10
11. OPERATING TIMING EXAMPLE
11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3)
0123456 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
(CLK = 100 MHz)
CLK
DQ
CKE
DQM
A0-A9
A10
WE
CS
t
RC
t
RC
t
RC
t
RC
t
RAS
t
RP
t
RAS
t
RP
t
RP
t
RAS
t
RAS
t
RCD
t
RCD
t
RCD
t
RCD
t
AC
t
AC
t
AC
t
AC
t
RRD
t
RRD
t
RRD
t
RRD
Active Read
Active Read
Active
Active
Active
Read
Read
Precharge
Precharge
Precharge
RAa RBb RAc RBd RAe
RAa CAw RBb CBx RAc CAy RBd CBz RAe
aw0 aw1 aw2 aw3 bx0 bx1 bx2 bx3 cy0 cy1 cy2 cy3
Bank #0
Idle
Bank #1
Bank #2
Bank #3
RAS
CAS
BS1
BS0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 26 - Revision A10
11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge)
01234567891011 12 13 14 15 16 17 18 19 20 21 22 23
(CLK = 100 MHz)
CLK
CKE
DQM
A0-A9
A10
BS1
WE
CAS
RAS
CS
BS0
t
RC
t
RC
t
RC
t
RAS
t
RP
t
RAS
t
RP
t
RAS
t
RP
t
RAS
t
RCD
t
RCD
t
RCD
t
AC
t
AC
t
AC
t
AC
t
RRD
t
RRD
t
RRD
t
RRD
Active Read
Active Read
Active
Active
Active
Read
Read
t
RC
RAa RAc RBd RAe
DQ
aw0 aw1 aw2 aw3 bx0 bx1 bx2 bx3 cy0 cy1 cy2 cy3 dz0
* AP is the internal precharge start timing
Bank #0
Idle
Bank #1
Bank #2
Bank #3
AP* AP*
RAa CAw RBb CBx RAc CAy RBd RAe
CBz
RBb
AP*
t
RCD
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 27 - Revision A10
11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3)
01 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
t
RC
t
RAS
t
RP
t
RAS
t
RP
t
RAS
t
RCD
t
RCD
t
RCD
t
RRD
t
RRD
RAa
RAa CAx
RBb
RBb CBy
RAc
RAc CAz
ax0 ax1 ax2 ax3 ax4 ax5 ax6 by0 by1 by4 by5 by6 by7 CZ0
(CLK = 100 MHz)
CLK
DQ
CKE
DQM
A0-A9
A10
BS1
WE
CAS
RAS
CS
Active Read
Precharge Active Read
Precharge Active
t
AC
t
AC
Read
Precharge
t
AC
Bank #0
Idle
Bank #1
Bank #2
Bank #3
BS0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 28 - Revision A10
11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge)
A0-A9
Bank #0
Idle
Bank #1
Bank #2
Bank #3
0123456 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
t
RC
t
RAS
t
RP
t
RAS
t
RCD
t
RCD
t
RCD
t
RRD
t
RRD
ax0 ax1 ax2 ax3 ax4 ax5 ax6 ax7 by0 by1 by4 by5 by6 CZ0
RAa
RAa
CAx
RBb
RBb CBy
(CLK = 100 MHz)
RAc
RAc CAz
* AP is the internal precharge start timing
Active Read
Active
Active Read
t
CAC
t
CAC
t
CAC
CLK
DQ
CKE
DQM
A10
WE
CAS
RAS
CS
Read
AP*
AP*
BS1
BS0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 29 - Revision A10
11.5 Interleaved Bank Write (Burst Length = 8)
0123456 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
t
RC
t
RAS
t
RP
t
RAS
t
RCD
t
RCD
t
RCD
t
RRD
t
RRD
RAa
RAa CAx
RBb
RBb CBy
RAc
RAc CAz
ax0 ax1 by4 by5 by6 by7 CZ0 CZ1 CZ2
(CLK = 100 MHz)
Write
Precharge
Active
Active Write
Precharge
Active Write
CLK
DQ
CKE
DQM
A0-A9
A10
BS1
WE
CAS
RAS
CS
Idle
Bank #0
Bank #1
Bank #2
Bank #3
BS0
ax4 ax5 ax6 ax7 by0 by1 by2 by3
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 30 - Revision A10
11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge)
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
tRC
t
RAS tRP
tRAS
t
RCD tRCD t
RCD
t
RRD tRRD
RAa
RAa CAx
RBb
RBb CBy
RAb
RAc
ax0 ax1 ax4 ax5 ax6 ax7 by0 by1 by2 by3 by4 by5 by6 by7 CZ0 CZ1 CZ2
CAz
(CLK = 100 MHz)
* AP is the internal precharge start timing
CLK
DQ
CKE
DQM
A
0-A9
A
10
BS1
WE
CAS
RAS
CS
A
ctive Write Write
A
ctive
Bank #0
Idle
Bank #1
Bank #2
Bank #3
A
P*
A
ctive Write
A
P*
BS0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 31 - Revision A10
11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3)
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
t
CCD
t
CCD
t
CCD
t
RAS
t
RAS
t
RCD
t
RCD
t
RRD
RAa
RAa CAI
RBb
RBb CBx CAy CAm CBz
a0 a1 a2 a3 bx0 bx1 Ay0 Ay1 Ay2 am0 am1 am2 bz0 bz1 bz2 bz3
(CLK = 100 MHz)
* AP is the internal precharge start timing
CLK
DQ
CKE
DQM
A0-A9
A10
BS1
WE
CAS
RAS
CS
Active Read
Active Read
Read Read
Read
Precharge
t
AC
t
AC
t
AC
t
AC
t
AC
Bank #0
Idle
Bank #1
Bank #2
Bank #3
AP*
BS0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 32 - Revision A10
11.8 Page Mode Read/Write (Burst Length = 8, CAS Latency = 3)
01 2 3 4 5 678910 11 12 13 14 15 16 17 18 19 20 21 22 23
tRAS tRP
tRCD
tWR
RAa
RAa CAx CAy
ax0 ax1 ax2 ax3 ax4 ax5 ay1
ay0 ay2 ay4
ay3
QQQQQQ DDD
D
D
CLK
DQ
CKE
DQM
A0-A9
A10
BS0
WE
CAS
RAS
CS
BS1
Active Read Write Precharge
tAC
Bank #0
Idle
Bank #1
Bank #2
Bank #3
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 33 - Revision A10
11.9 Auto-precharge Read (Burst Length = 4, CAS Latency = 3)
01 2 3 456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23
(CLK = 100 MHz)
CLK
DQ
CKE
DQM
A0-A9
A10
WE
CAS
RAS
CS
BS1
t
RC
t
RAS
t
RP
t
RAS
t
RCD
t
RCD
t
AC
t
AC
Active Read AP* Active Read AP*
RAa RAb
RAa CAw RAb CAx
aw0 aw1 aw2 aw3
* AP is the internal precharge start timing
Bank #0
Idle
Bank #1
Bank #2
Bank #3
BS0
bx0 bx2bx1 bx3
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 34 - Revision A10
11.10 Auto-precharge Write (Burst Length = 4)
0 1 2 3 4 5 6 7 8910 11 12 13 14 15 16 17 18 19 20 21 22 23
(CLK = 100 MHz)
CLK
DQ
CKE
DQM
A
0-A9
A
10
WE
CAS
RAS
CS
BS1
t
RC tRC
tRP tRAS t
RP
RAa t
RCD tRCD
RAb RAc
RAa RAb CAx RAc
bx0 bx1 bx2 bx3
A
ctive
A
ctive Write
A
P*
A
ctive Write
A
P*
* AP is the internal precharge start
Bank #0
Idle
Bank #1
Bank #2
Bank #3
t
RAS
BS0
CAw
aw0 aw1 aw2 aw3
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 35 - Revision A10
11.11 Auto Refresh Cycle
0123456789 10 11 12 13 14 15 16 17 18 19 20 21 22 23
(CLK = 100 MHz)
All Banks
Prechage
Auto
Refresh Auto Refresh (Arbitrary Cycle)
t
RC
t
RP
t
RC
CLK
DQ
CKE
DQM
A0-A9
A10
WE
CAS
RAS
CS
BS0,1
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 36 - Revision A10
11.12 Self Refresh Cycle
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
(CLK = 100 MHz)
CLK
DQ
CKE
DQM
A0-A9
A10
BS0,1
WE
CAS
RAS
CS
tCKS
tSB tCKS tCKS
All Banks
Precharge Self Refresh
Entry
Arbitrary Cycle
tRP
Self Refresh Cycle
tXSR
No Operation / Command Inhibit
Self Refresh
Exit
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 37 - Revision A10
11.13 Bust Read and Single Write (Burst Length = 4, CAS Latency = 3)
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK
CS
RAS
CAS
WE
BS0
BS1
A10
A0-A9
DQM
CKE
DQ
tRCD
RBa
RBa CBv CBw CBx CBy CBz
av0 av1 av2 av3 aw0 ax0 ay0 az0 az1 az2 az3
QQ Q Q D DDQQQQ
tAC tAC
Read Read
Single WriteActive
Bank #0
Idle
Bank #1
Bank #2
Bank #3
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 38 - Revision A10
11.14 Power Down Mode
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
RAa CAa RAa CAx
RAa RAa
ax0 ax1 ax2 ax3
tSB
tCKS tCKS tCKS
tSB
tCKS
Active Standby
Power Down mode
Precharge Standby
Power Down mode
Active NOP Precharge NOPActive
Note: The PowerDown Mode is entered by asserting CKE "low".
All Input/Output buffers (except CKE buffers) are turned off in the Power Down mode.
When CKE goes high, command input must be No operation at next CLK rising edge.
Violating refresh requirements during power-down may result in a loss of data.
CLK
DQ
CKE
DQM
A0-A9
A10
BS
WE
CAS
RAS
CS
Read
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 39 - Revision A10
11.15 Auto-precharge Timing (Write Cycle)
Act
01 32
(1) CAS Latency = 2
(a) burst length = 1
DQ
45 76891110
Write
D0
ActAP
Command
(b) burst length = 2
DQ
Write
D0
ActAP
Command
tRP
tRP
D1
(c) burst length = 4
DQ
Write
D0
ActAP
Command
tRP
D1
(d) burst length = 8
DQ
Write
D0
ActAP
Command
tRP
D1
D2 D3
D2 D3 D4 D5 D6 D7
(2) CAS Latency = 3
(a) burst length = 1
DQ
Write
D0
ActAP
Command
(b) burst length = 2
DQ
Write
D0
ActAP
Command
tRP
tRP
D1
(c) burst length = 4
DQ
Write
D0
ActAP
Command
tRP
D1
(d) burst length = 8
DQ
Write
D0
AP
Command
tRP
D1
D2 D3
D2 D3 D4 D5 D6 D7
tWR
tWR
tWR
tWR
tWR
tWR
tWR
tWR
12
Act
represents the Write with Auto precharge command.
represents the start of internal precharing.
represents the Bank Active command.
Write
AP
Act
Act
When the /auto precharge command is asserted,the period from Bank Activate
command to the start of intermal precgarging must be at least tRAS (min).
Note )
CLK
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 40 - Revision A10
11.16 Auto-precharge Timing (Read Cycle)
Read AP
01110987654321
Q0
Q0
Read AP Act
Q1
Read AP Act
Q1 Q2
AP ActRead
Act
Q0
Q3
(1) CAS Latency=2
Read
Act
AP
When the Auto precharge command is asserted, the period from Bank Activate command to
the start of internal precgarging must be at least tRAS (min).
represents the Read with Auto precharge command.
represents the start of internal precharging.
represents the Bank Activate command.
Note:
tRP
tRP
tRP
( a ) burst length = 1
Command
( b ) burst length = 2
Command
( c ) burst length = 4
Command
( d ) burst length = 8
Command
DQ
DQ
DQ
DQ
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
tRP
Q0
Read AP Act
Q0
Read AP Act
Q1
Q0
Read AP Act
Q1 Q2 Q3
Read AP Act
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
(2) CAS Latency=3
tRP
tRP
tRP
tRP
( a ) burst length = 1
Command
( b ) burst length = 2
Command
( c ) burst length = 4
Command
( d ) burst length = 8
Command
DQ
DQ
DQ
DQ
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 41 - Revision A10
11.17 Timing Chart of Read to Write Cycle
Note: The Output data must be masked by DQM to avoid I/O conflict.
Read Write
1110987654321
Read
Read
Read Write
Write
D0 D1 D2 D3
Write
DQ
DQ
( a ) Command
0
DQ
DQ
DQM
( b ) Command
DQM
( b ) Command
DQM
DQM
D0 D1 D2 D3
D0 D1 D2 D3
D0 D1 D2 D3
(1) CAS Latency=2
( a ) Command
(2) CAS Latency=3
In the case of Burst Length = 4
11.18 Timing Chart of Write to Read Cycle
ReadWrite
01110987654321
Q0
Read
Q1 Q2 Q3
Read
Read
Write
Write
Q0 Q1 Q2 Q3
Write
Q0 Q1 Q2 Q3
D0 D1
DQ
DQ
( a ) Command
DQ
DQ
DQM
( b ) Command
DQM
( a ) Command
( b ) Command
DQM
DQM
In the case of Burst Length=4
(1) CAS Latency=2
(2) CAS Latency=3
D0
D0 D1
Q0 Q1 Q2 Q3D0
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 42 - Revision A10
11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command)
Read BST
0 1110987654321
DQ
Q0 Q1 Q2 Q3
BST
( a ) CAS latency =2
Command
( b )CAS latency = 3
(1) Read cycle
Q4
(2) Write cycle
Command
Read
Command
Q0 Q1 Q2 Q3 Q4
Q0 Q1 Q2 Q3 Q4
DQ
DQ
Write BST
Note: represents the Burst stop command
BST
11.20 Timing Chart of Burst Stop Cycle (Precharge Command)
01 111098765432
(1) Read cycle
(a) CAS latency =2
Command
Q0 Q1 Q2 Q3 Q4
PRCGRead
(b) CAS latency =3
Command
Q0 Q1 Q2 Q3 Q4
PRCGRead
DQ
DQ
(2) Write cycle
(a) CAS latency =2
Command
Q0 Q1 Q2 Q3 Q4
PRCG
Write
(b) CAS latency =3
Command
Q0 Q1 Q2 Q3 Q4
Write
DQ
DQ
DQM
DQM
PRCG
tWR
tWR
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 43 - Revision A10
11.21 CKE/DQM Input Timing (Write Cycle)
7
6
5432
1
CKE MASK
( 1 )
D1 D6D5D3D2
CLK cycle No.
External
Internal
CKE
DQM
DQ
7
6
5432
1
( 2 )
D1 D6
D5
D3D2
CLK cycle No.
External
Internal
CKE
DQM
DQ
76
5432
1
( 3 )
D1 D6D5D4
D3D2
CLK cycle No.
External
CKE
DQM
DQ
DQM MASK
DQM MASK CKE MASK
CKE MASK
Internal
CLK
CLK
CLK
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 44 - Revision A10
11.22 CKE/DQM Input Timing (Read Cycle)
7
6
5432
1
( 1 )
Q1 Q6
Q4Q3Q2
CLK cycle No.
External
Internal
CKE
DQM
DQ
Open Open
7
6
5432
1
Q1 Q6
Q3
Q2
CLK cycle No.
External
Internal
CKE
DQM
DQ
Open
( 2 )
765432
1
Q1 Q6
Q3
Q2
CLK cycle No.
External
Internal
CKE
DQM
DQ
Q5Q4
( 3 )
Q4
CLK
CLK
CLK
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 45 - Revision A10
12. PACKAGE SPECIFICATION
12.1 86L TSOP (II)-400 mil
SEATING PLANE
E
D
A2
A1
A
b
ZD
1 43
86 44
e
HE
Y
L
C
L1
q
ZD 0.61 0.024
0.002
0.007
MAX.MIN. NOM.
A2
b
A
A1
0.17
1.00
0.05
0.27
1.20
0.15
SYM.
DIMENSION
(MM)
MAX.MIN. NOM.
e0.50 0.020
0.016
L0.40 0.50 0.60 0.020 0.024
0.396
E10.06 10.16 10.26 0.400 0.404
0.871
D22.2222.12 22.62 0.875 0.905
0.039
0.011
0.047
0.006
DIMENSION
(INCH)
L1 0.80 0.032
c0.12 0.005
0.45511.7611.56 11.96 0.463 0.471
HE
Y0.10 0.004
Controlling Dimension: Millimeters
0.21 0.008
W9864G2GH
Publication Release Date:Jan. 29 , 2008
- 46 - Revision A10
13. REVISION HISTORY
VERSION DATE PAGE DESCRIPTION
A01 Jul. 05, 2006 All Create new datasheet
A02 Aug. 03, 2006 3,14,15,16 Add –6C grade
A03 Aug. 07, /2006 15,16 Modify ICC1, ICC4 , ICC5 & Transition Time of CLK
A04 Oct. 03, 2006 16 Add tXSR timing specification.
A05 Nov. 13, 2006 3,13,14 Modify tIH=0.8nS in –6C grade
A06 Jan. 11, 2007 16,18
Modify AC Characteristics Notes 10 and add Notes 11
(tT)
A07 Apr. 10, 2007 3,14,15,16 Add -6I for TA = -40°~85°C
A08 Jul. 19, 2007 14 Add output leakage current Io(L) specification.
A09 Aug. 13, 2007 18,19
Revise transient time tT AC test condition and calculate
formula for compensation consideration in Notes 6, 10
of AC Characteristics and Operating Condition
A10 Jan. 29, 2008 3,15,16,17
Change -7 grade power supply voltage from 2.7V-3.6V
to 2.6V-3.6V
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or envi ronmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnif y Winbond for any damages resulting from such improper
use or sales.
