
®
NIC COMPONENTS CORP.
.niccomp.
.lowESR.
.RFpassives.
.SMTmagnetics.
52
53
®
NIC COMPONENTS CORP. .niccomp. .lowESR. .RFpassives. .SMTmagnetics.
Ambient Temperature: 10°C ~ 30°C
Applied Current: Rated Current
Rated Current x 110% @ 70°C ± 2°C for 1 hr
Working Temperature Range
Time/Current Characteristic
See Available Values and Ratings Tables
Pre-acting time 5 sec. max.
Test current shall be applied continuously to the fuse
mounted on the test substrate
Pre-acting time 5 sec. max.
Internal Resistance Change ±3% (AD, AB)
On the test substrate bending value is 3mm
At least 95% coverage of the terminal surface
Immersion into solder at 235C ±5°C for 2 ± 0.5 secs.
Resistance to Soldering Heat
Internal resistance range ±10% max.
Immersion into solder at 260°C for 10 sec.
1. Pre-heating: 150°C ±5°C, 120 sec. max.
2. T max. 240°C ±5°C, 10 sec. max, 2 passes
Within 10% of voltage drop
At normal ambient temperature & RH on the test
Rated Current x 1.05, 1 hour "ON", 1/4 hour "OFF",
Rated current x 1.25 for 1 hour
Surface Mount Fuse
RECOMMENDED REFLOW PROFILE
150°C ~ 180°C 120 sec. max.
110°C ~ 130°C 120 sec. max.
Recommended Land Pattern Dimensions (mm)