-Formerly Austin Semiconductor, Inc. Copper Lead Frame 54-Pin TSOPII SDRAM Products FEATURES BENEFITS * Clock frequency: up to 133 MHz * * Configurations: 32Mx16, 16Mx16, 8Mx16 & 4Mx16 Enhanced Long-term reliability with copper lead frames * Fully synchronous; all signals referenced to a positive clock edge * Superior thermal conductivity improvement: 170 W/m*K vs. 14 W/m*K (a 12X difference) * Internal pipelined operation; column address can be changed every clock cycle * * Internal banks for hiding row access/precharge ja and jc characteristics provide up to 3X advantage of heat dissipation capability versus parts with alloy 42 lead frames * Power supply: +3.3V +/-0.3V * * LVTTL interface Heat dissipated from the die faster makes it run cooler, leading to longer life * Programmable burst length (1, 2, 4, 8, full page) * Solder joint reliability vastly improved. * Programmable burst sequence: Sequential/Interleave * Auto Refresh (CBR) * Self Refresh Mode (/IT) 64ms, 8,192 cycle refresh (/IT) <24ms, 8,192 cycle refresh (/XT) * Write recovery (tWR = "2 CLK") * Random column address every clock cycle * Programmable CAS latency (2, 3 clocks) * Burst read/write and burst read/single write operations capability * Burst termination by burst stop and precharge command * Available in 54-pin TSOP-II, choice of lead frame: - Copper lead frame - Alloy 42 lead frame * Operating Temperature Range: Industrial: -40oC to +85oC Military: -55oC to +125oC * Pb/Sn finish or RoHS available * 100% product screened at temperature extremes & Vcc extremes - CTE of Copper (17 ppm/ oC), matches the CTE of Typical FR4 PWBs (15-17 ppm/ oC), whereas CTE of Alloy 42 (5 ppm/ oC), is a mismatch * RoHS Version (NiPdAu plating) - Most preferred for elimination of risk for whisker growth * Over broader Military and Industrial temperature ranges, the above benefits are even more important APPLICATIONS Examples Include: * Military, Aerospace, Avionics * Cellular Base Stations * Gas / Oil Exploration * Engine Control * On-Board Flight Computers * Radar / Sonar w w w.m icross.com PACKAGE DIAGRAMS MicrossPackagedesignator:DGC CuLeadframe Symbol Min. Nom. Max. A 1.20 A1 0.05 0.10 0.20 A2 0.90 1.00 1.10 b 0.25 0.45 c 0.08 0.18 D 22.02 22.22 22.42 E1 10.03 10.16 10.29 E 11.56 11.76 11.96 e 0.80BSC L 0.40 0.75 ZD T 0deg 0.71REF MicrossPackagedesignator:DG Alloy42Leadframe Symbol Min. Nom. Max. A 1.20 A1 0.05 0.15 A2 0.95 1.00 1.05 b 0.30 0.45 C 0.12 0.21 D 22.02 22.22 22.42 E1 10.03 10.16 10.29 E 11.56 11.76 11.96 e 0.80BSC L 0.40 0.50 0.60 L1 0.25BSC ZD 0.71REF T 0deg 8deg 8deg (Note 4: Alloy 42 LF) (Alloy 42 Lead frame) (Cu Lead frame) Configuration PartNumber Speed VCC TempRange o Package Package Designator Leadframe Status o 32Mx16 AS4SD32M16 133MHz 3.3V 40 Cto+85 C 54PINTSOPII o o 55 Cto+125 C DGC&DGCR Cu Qual 16Mx16 AS4SD16M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII 55oCto+125oC DGC&DGCR Cu Production 8Mx16 AS4SD8M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII 55oCto+125oC DGC&DGCR Cu Production 4Mx16 AS4SD4M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII o o 55 Cto+125 C DGC&DGCR Cu Production 32Mx16 AS4SD32M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII o o 55 Cto+125 C DG Alloy42 Production 16Mx16 AS4SD16M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII o o 55 Cto+125 C DG Alloy42 Production 8Mx16 AS4SD8M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII o o 55 Cto+125 C DG Alloy42 Production 4Mx16 AS4SD4M16 133MHz 3.3V 40oCto+85oC 54PINTSOPII o o 55 Cto+125 C DG Alloy42 Production DG&DGChavePb/Snfinish,DGCRisRoHScompliant Phone: 512.339.1188 semiconductors@micross.com www.micross.com Rev. 1.7 5/10