-Formerly Austin Semiconductor, Inc.
FEATURES
Clock frequency: up to 133 MHz•
Configurations: 32Mx16, 16Mx16, 8Mx16 & 4Mx16•
Fully synchronous; all signals referenced to a•
positive clock edge
Internal pipelined operation; column address can be •
changed every clock cycle
Internal banks for hiding row access/precharge•
Power supply: +3.3V +/-0.3V•
LVTTL interface•
Programmable burst length (1, 2, 4, 8, full page)•
Programmable burst sequence: Sequential/Interleave•
Auto Refresh (CBR)•
Self Refresh Mode (/IT)•
64ms, 8,192 cycle refresh (/IT)
<24ms, 8,192 cycle refresh (/XT)
Write recovery (tWR = “2 CLK”) •
Random column address every clock cycle•
Programmable CAS latency (2, 3 clocks)•
Burst read/write and burst read/single write•
operations capability
Burst termination by burst stop and precharge command•
Available in 54-pin TSOP-II, choice of lead frame:•
- Copper lead frame
- Alloy 42 lead frame
Operating Temperature Range:•
Industrial: -40oC to +85oC
Military: -55oC to +125oC
Pb/Sn finish or RoHS available•
100% product screened at temperature extremes & Vcc •
extremes
BENEFITS
Enhanced Long-term reliability with copper •
lead frames
Superior thermal conductivity improvement: •
170 W/m*K vs. 14 W/m*K (a 12X difference)
θ• ja and jc characteristics provide up to 3X
advantage of heat dissipation capability
versus parts with alloy 42 lead frames
Heat dissipated from the die faster makes it •
run cooler, leading to longer life
Solder joint reliability vastly improved.•
- CTE of Copper (17 ppm/ oC), matches the
CTE of Typical FR4 PWBs (15-17 ppm/ oC),
whereas CTE of Alloy 42 (5 ppm/ oC),
is a mismatch
RoHS Version (NiPdAu plating)•
- Most preferred for elimination of risk for
whisker growth
Over broader Military and Industrial •
temperature ranges, the above benefits are
even more important
APPLICATIONS
Examples Include:
Military, Aerospace, Avionics•
Cellular Base Stations•
Gas / Oil Exploration•
Engine Control•
On-Board Flight Computers•
Radar / Sonar•
Copper Lead Frame
54-Pin TSOPII
SDRAM Products
www.micross.com
(Note 4: Alloy 42 LF)
(Alloy 42 Lead frame)
(Cu Lead frame)
PACKAGE DIAGRAMS
Rev. 1.7 5/10
Symbol Min. Nom. Max. Symbol Min. Nom. Max.
AͲͲ1.20 A ͲͲ1.20
A1 0.05 0.10 0.20 A1 0.05 Ͳ0.15
A2 0.90 1.00 1.10 A2 0.95 1.00 1.05
b0.25 Ͳ0.45 b 0.30 0.45
c0.08Ͳ0.18 C 0.12 Ͳ0.21
D 22.02 22.22 22.42 D 22.02 22.22 22.42
E1 10.03 10.16 10.29 E1 10.03 10.16 10.29
E 11.56 11.76 11.96 E 11.56 11.76 11.96
e0.80BSC e 0.80BSC
L0.40Ͳ0.75 L 0.40 0.50 0.60
L1 0.25BSC
ZD 0.71REF ZD 0.71REF
T0deg Ͳ8deg T0deg Ͳ8deg
Alloy42Leadframe
MicrossPackagedesignator:DG
CuLeadframe
MicrossPackagedesignator:DGC
Phone: 512.339.1188
semiconductors@micross.com
www.micross.com
Configuration PartNumber Speed VCC TempRange Package
Package
Designator Leadframe Status
32Mx16 AS4SD32M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DGC&DGCRCu Qual
16Mx16 AS4SD16M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DGC&DGCRCu Production
8Mx16 AS4SD8M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DGC&DGCRCu Production
4Mx16 AS4SD4M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DGC&DGCRCu Production
32Mx16 AS4SD32M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DG Alloy42 Production
16Mx16 AS4SD16M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DG Alloy42 Production
8Mx16 AS4SD8M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DG Alloy42 Production
4Mx16 AS4SD4M16 133MHz 3.3V Ͳ40oCto+85oC
Ͳ55oCto+125oC54PINTSOPII DG Alloy42 Production
DG&DGChavePb/Snfinish,DGCRisRoHScompliant
