ISP1105/1106
Advanced Universal Serial Bus transceivers
Rev. 08 — 19 February 2004 Product data
1. General description
The ISP1105/1106 range of Universal Serial Bus (USB) transceivers are compliant
with the
Universal Serial Bus Specification Rev. 2.0
. They can transmit and receive
serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. The
ISP1105/1106 range can be used as a USB device transceiver or a USB host
transceiver.
They allow USB Application Specific ICs (ASICs) and Programmable Logic Devices
(PLDs) with power supply voltages from 1.65 V to 3.6 V to interface with the physical
layer of the Universal Serial Bus. They have an integrated 5 V-to-3.3 V voltage
regulator for direct powering via the USB supply VBUS.
ISP1105 allows single-ended and differential input modes selectable by a MODE
input and it is available in HVQFN16 and HBCC16 packages. ISP1106 allows only
differential input mode and is available in both TSSOP16 and HBCC16 packages.
The ISP1105/1106 are ideal for portable electronics devices such as mobile phones,
digital still cameras, Personal Digital Assistants (PDA) and Information Appliances
(IA).
2. Features
■Complies with
Universal Serial Bus Specification Rev. 2.0
■Can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed
(1.5 Mbit/s) data rates
■Integrated bypassable 5 V-to-3.3 V voltage regulator for powering via USB VBUS
■VBUS disconnection indication through VP and VM
■Used as a USB device transceiver or a USB host transceiver
■Stable RCV output during SE0 condition
■Two single-ended receivers with hysteresis
■Low-power operation
■Supports an I/O voltage range from 1.65 V to 3.6 V
■±12 kV ESD protection at the D+, D−, VCC(5.0) and GND pins
■Full industrial operating temperature range from −40 to +85 °C
■Available in small HBCC16, HVQFN16 (only ISP1105) and TSSOP16 (only
ISP1106) packages; HBCC16 and HVQFN16 are lead-free and halogen-free
packages.
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 2 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
3. Applications
■Portable electronic devices, such as:
◆Mobile phone
◆Digital still camera
◆Personal Digital Assistant (PDA)
◆Information Appliance (IA).
4. Ordering information
4.1 Ordering options
Table 1: Ordering information
Type number Package
Name Description Version
ISP1105BS HVQFN16 plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 ×3×0.85 mm SOT758-1
ISP1105W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals;
body 3 ×3×0.65 mm SOT639-2
ISP1106DH TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
ISP1106W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals;
body 3 ×3×0.65 mm SOT639-2
Table 2: Selection guide
Product Package Description
ISP1105 HVQFN16 and HBCC16 supports both single-ended and differential input modes; see Table 5 and Table 6.
ISP1106 TSSOP16 and HBCC16 supports only the differential input mode; see Table 6.
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 3 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
5. Block diagram
(1) Connect to D− for low-speed operation.
(2) Pin function depends on device type.
(3) Only for ISP1105.
Fig 1. Block diagram (combined ISP1105 and ISP1106).
MBL301
VCC(I/O) VCC(5.0)
VOLTAGE
REGULATOR
3.3 V
1.5 kΩ
(1)
33 Ω
(1%)
33 Ω
(1%)
LEVEL
SHIFTER
ISP1105
ISP1106
SOFTCON
SPEED
Vreg(3.3)
GND
Vpu(3.3)
D+
D−
OE
VMO/FSE0
(2)
VPO/VO
(2)
MODE
(3)
SUSPND
RCV
VP
VM
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 4 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
6. Pinning information
6.1 Pinning
Fig 2. Pin configuration ISP1105BS (HVQFN). Fig 3. Pin configuration ISP1105W (HBCC16).
004aaa314
ISP1105BS
D−
D+
MODE
SUSPND
VPO/VO
VMO/FSE0
8
GND
(exposed diepad)
VCC(I/O)
567
4
3
2
9
10
11
13
14
15
16
SPEED
112
Bottom view
RCV
VP
OE
VM
Vpu(3.3)
SOFTCON
VCC(5.0)
Vreg(3.3)
MBL303
Bottom view
ISP1105W
SOFTCON
Vpu(3.3)
RCV
VP
OE
D+
D−
SPEED
VCC(I/O)
VPO/VO
VM
SUSPND
MODE
VCC(5.0)
Vreg(3.3)
VMO/FSE0
13
141516
876
12
11
10
9
2
1
3
4
5
GND
(exposed diepad)
Fig 4. Pin configuration ISP1106DH (TSSOP16). Fig 5. Pin configuration ISP1106W (HBCC16).
ISP1106DH
MBL302
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Vpu(3.3)
SOFTCON
OE
RCV
VP
VM
SUSPND
GND VCC(I/O)
SPEED
D−
D+
VPO
VMO
Vreg(3.3)
VCC(5.0)
MBL304
Bottom view
ISP1106W
SOFTCON
Vpu(3.3)
RCV
VP
OE
D+
D−
SPEED
VCC(I/O)
VPO
VM
SUSPND
GND
VCC(5.0)
Vreg(3.3)
VMO
13
141516
876
12
11
10
9
2
1
3
4
5
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 5 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
6.2 Pin description
Table 3: Pin description
Symbol[1] Pin Type Description
ISP1105 ISP1106
BS W DH W
OE 1131I output enable input (CMOS level with respect to VCC(I/O), active LOW);
enables the transceiver to transmit data on the USB bus
input pad; push pull; CMOS
RCV 2242O differential data receiver output (CMOS level with respect to VCC(I/O));
driven LOW when input SUSPND is HIGH; the output state of RCV is
preserved and stable during an SE0 condition
output pad; push pull; 4 mA output drive; CMOS
VP 3353O single-ended D+ receiver output (CMOS level with respect to VCC(I/O)); for
external detection of single-ended zero (SE0), error conditions, speed of
connected device; driven HIGH when no supply voltage is connected to
VCC(5.0) and Vreg(3.3)
output pad; push pull; 4 mA output drive; CMOS
VM 4464O single-ended D− receiver output (CMOS level with respect to VCC(I/O)); for
external detection of single-ended zero (SE0), error conditions, speed of
connected device; driven HIGH when no supply voltage is connected to
VCC(5.0) and Vreg(3.3)
output pad; push pull; 4 mA output drive; CMOS
SUSPND 5575I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables
low-power state while the USB bus is inactive and drives output RCV to a
LOW level
input pad; push pull; CMOS
MODE 6 6 - - I mode input (CMOS level with respect to VCC(I/O)); a HIGH level enables the
differential input mode (VPO, VMO) whereas a LOW level enables a
single-ended input mode (VO, FSE0); see Table 5 and Table 6
input pad; push pull; CMOS
GND die
pad die
pad 8 6 - ground supply[2]
VCC(I/O) 7797- supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not
connected, the (D+, D−) pins are in three-state; this supply pin is totally
independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3)
voltage
SPEED 8 8 10 8 I speed selection input (CMOS level with respect to VCC(I/O)); adjusts the
slew rate of differential data outputs D+ and D− according to the
transmission speed
LOW — low-speed (1.5 Mbit/s)
HIGH — full-speed (12 Mbit/s)
input pad; push pull; CMOS
D−9 9 11 9 AI/O negative USB data bus connection (analog, differential); for low-speed
mode connect to pin Vpu(3.3) via a 1.5 kΩ resistor
D+10 10 12 10 AI/O positive USB data bus connection (analog, differential); for full-speed mode
connect to pin Vpu(3.3) via a 1.5 kΩ resistor
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 6 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
[2] ISP1105: ground terminal is connected to the exposed die pad (heatsink).
VPO/VO 11 11 - - I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see
Table 5 and Table 6
input pad; push pull; CMOS
VPO - - 13 11
VO ----
VMO/FSE0 12 12 - - I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see
Table 5 and Table 6
input pad; push pull; CMOS
VMO - - 14 12
FSE0 - - - -
Vreg(3.3) 13 13 15 13 - internal regulator option: regulated supply voltage output (3.0 to 3.6 V)
during 5 V operation; a decoupling capacitor of at least 0.1 µF is required
regulator bypass option: used as a supply voltage input for 3.3 V ±10%
operation
VCC(5.0) 14 14 16 14 - internal regulator option: supply voltage input (4.0 to 5.5 V); can be
connected directly to USB supply VBUS
regulator bypass option: connect to Vreg(3.3)
Vpu(3.3) 15 15 1 15 - pull-up supply voltage (3.3 V ±10%); connect an external 1.5 kΩresistor on
D+ (full-speed) or D− (low-speed); pin function is controlled by input
SOFTCON
SOFTCON = LOW — Vpu(3.3) floating (high impedance); ensures zero
pull-up current
SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3)
SOFTCON 16 16 2 16 I software controlled USB connection input; a HIGH level applies 3.3 V to pin
Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this
allows USB connect/disconnect signalling to be controlled by software
input pad; push pull; CMOS
Table 3: Pin description
…continued
Symbol[1] Pin Type Description
ISP1105 ISP1106
BS W DH W
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 7 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
7. Functional description
7.1 Function selection
[1] Signal levels on (D+, D−) are determined by other USB devices and external pull-up/down resistors.
[2] In ‘suspend’ mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always
LOW. Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM.
[3] During suspend, the slew-rate control circuit of low-speed operation is disabled. The (D+, D−) lines
are still driven to their intended states, without slew-rate control. This is permitted because driving
during suspend is used to signal remote wake-up by driving a ‘K’ signal (one transition from idle to
‘K’ state) for a period of 1 to 15 ms.
7.2 Operating functions
[1] VP = VM = H indicates the sharing mode (VCC(5.0) and Vreg(3.3) are disconnected).
[2] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is stable during
the SE0 period.
Table 4: Function table
SUSPND OE (D+, D−) RCV VP/VM Function
L L driving and
receiving active active normal driving
(differential receiver active)
L H receiving[1] active active receiving
H L driving inactive[2] active driving during ‘suspend’[3]
(differential receiver inactive)
H H high-Z[1] inactive[2] active low-power state
Table 5: Driving function (pin OE = L) using single-ended input data interface for
ISP1105 (pin MODE = L)
FSE0 VO Data
L L differential logic 0
L H differential logic 1
H L SE0
H H SE0
Table 6: Driving function (pin OE = L) using differential input data interface for
ISP1105 (pin MODE = H) and ISP1106
VMO VPO Data
L L SE0
L H differential logic 1
H L differential logic 0
H H illegal state
Table 7: Receiving function (pin OE=H)
(D+, D−) RCV VP[1] VM[1]
Differential logic 0 L L H
Differential logic 1 H H L
SE0 RCV*[2] LL
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 8 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
7.3 Power supply configurations
The ISP1105/1106 can be used with different power supply configurations, which can
be changed dynamically. An overview is given in Table 9.
Normal mode — Both VCC(I/O) and VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected.
For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal
voltage regulator then produces 3.3 V for the USB connections. For 3.3 V operation,
both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source (3.0 to 3.6 V). VCC(I/O) is
independently connected to a voltage source (1.65 V to 3.6 V), depending on the
supply voltage of the external circuit.
Disable mode — VCC(I/O) is not connected, VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are
connected. In this mode, the internal circuits of the ISP1105/1106 ensure that the
(D+, D−) pins are in three-state and the power consumption drops to the low-power
(suspended) state level. Some hysteresis is built into the detection of VCC(I/O) lost.
Sharing mode — VCC(I/O) is connected, (VCC(5.0) and Vreg(3.3)) are not connected. In
this mode, the (D+, D−) pins are made three-state and the ISP1105/1106 allows
external signals of up to 3.6 V to share the (D+, D−) lines. The internal circuits of the
ISP1105/1106 ensure that virtually no current (maximum 10 µA) is drawn via the (D+,
D−) lines. The power consumption through pin VCC(I/O) drops to the low-power
(suspended) state level. Both the VP and VM pins are driven HIGH to indicate this
mode. Pin RCV is made LOW. Some hysteresis is built into the detection of Vreg(3.3)
lost.
[1] High impedance or driven LOW.
[2] ISP1105 only.
Table 8: Pin states in disable or sharing mode
Pins Disable mode state Sharing mode state
VCC(5.0) / Vreg(3.3) 5 V input / 3.3 V output;
3.3 V input / 3.3 V input not present
VCC(I/O) not present 1.65 V to 3.6 V input
Vpu(3.3) high impedance (off) high impedance (off)
(D+, D−) high impedance high impedance
(VP, VM) invalid[1] H
RCV invalid[1] L
Inputs (VO/VPO, FSE0/VMO,
SPEED, MODE[2], SUSPND, OE,
SOFTCON)
high impedance high impedance
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 9 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1] High impedance or driven LOW.
7.4 Power supply input options
The ISP1105/1106 range has two power supply input options.
Internal regulator — VCC(5.0) is connected to 4.0 to 5.5 V. The internal regulator is
used to supply the internal circuitry with 3.3 V (nominal). The Vreg(3.3) pin becomes a
3.3 V output reference.
Regulator bypass — VCC(5.0) and Vreg(3.3) are connected to the same supply. The
internal regulator is bypassed and the internal circuitry is supplied directly from the
Vreg(3.3) power supply. The voltage range is 3.0 to 3.6 V to comply with the USB
specification.
The supply voltage range for each input option is specified in Table 10.
Table 9: Power supply configuration overview
VCC(5.0) or
Vreg(3.3)
VCC(I/O) Configuration Special characteristics
Connected connected normal mode -
Connected not connected disable mode (D+, D−) and Vpu(3.3) high
impedance; VP, VM, RCV:
invalid[1]
Not connected connected sharing mode (D+, D−) and Vpu(3.3) high
impedance;
VP, VM driven HIGH;
RCV driven LOW
Table 10: Power supply input options
Input option VCC(5.0) Vreg(3.3) VCC(I/O)
Internal regulator supply input for internal
regulator
(4.0 to 5.5 V)
voltage reference
output
(3.3 V, 300 µA)
supply input for digital
I/O pins
(1.65 V to 3.6 V)
Regulator
bypass connected to Vreg(3.3)
with maximum voltage
drop of 0.3 V
(2.7 to 3.6 V)
supply input
(3.0 V to 3.6 V) supply input for digital
I/O pins
(1.65 V to 3.6 V)
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 10 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
8. Electrostatic discharge (ESD)
8.1 ESD protection
The pins that are connected to the USB connector (D+, D−,V
CC(5.0) and GND) have a
minimum of ±12 kV ESD protection. The ±12 kV measurement is limited by the test
equipment. Capacitors of 4.7 µF connected from Vreg(3.3) to GND and VCC(5.0) to GND
are required to achieve this ±12 kV ESD protection (see Figure 6).
ISP1105/1106 can withstand ±12 kV using the Human Body Model and ±5 kV using
the Contact Discharge Method as specified in
IEC 61000-4-2
.
8.2 ESD test conditions
A detailed report on test set-up and results is available on request.
Fig 6. Human Body ESD test model.
1 MΩ1500 Ω
HIGH VOLTAGE
DC SOURCE
4.7 µF
4.7 µF
RCRD
VCC(5.0)
Vreg(3.3)
DEVICE UNDER
TEST
CS
100 pF storage
capacitor
charge current
limit resistor discharge
resistance
GND
A
B
004aaa145
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 11 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9. Limiting values
[1] Testing equipment limits measurement to only ±12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3); see Section 8.
[2] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
10. Recommended operating conditions
Table 11: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCC(5.0) supply voltage −0.5 +6.0 V
VCC(I/O) I/O supply voltage −0.5 +4.6 V
Vreg(3.3) regulated supply voltage −0.5 +4.6 V
VIDC input voltage −0.5 VCC(I/O) +0.5 V
Ilu latch-up current VI=−1.8 to 5.4 V - 100 mA
Vesd electrostatic discharge voltage ILI <1µA[1][2]
on pins D+, D−,
VCC(5.0) and GND −12000 +12000 V
on other pins −2000 +2000 V
Tstg storage temperature −40 +125 °C
Table 12: Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VCC(5.0) supply voltage (internal
regulator option) 5 V operation 4.0 5.0 5.5 V
Vreg(3.3) supply voltage (regulator
bypass option) 3.3 V operation 3.0 3.3 3.6 V
VCC(I/O) I/O supply voltage 1.65 - 3.6 V
VIinput voltage 0 - VCC(I/O) V
VI(AI/O) input voltage on analog I/O
pins (D+/D−)0 - 3.6 V
Tamb operating ambient temperature −40 - +85 °C
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 12 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
11. Static characteristics
[1] Iload includes the pull-up resistor current via pin Vpu(3.3).
[2] In ‘suspend’ mode, the minimum voltage is 2.7 V.
[3] Maximum value is characterized only, not tested in production.
[4] Excluding any load current and Vpu(3.3)/Vsw source current to the 1.5 kΩ and 15 kΩpull-up and pull-down resistors (200 µA typ.).
[5] When VCC(I/O) < 2.7 V, the minimum value for Vth(reg3.3)(present) is 2.0 V.
Table 13: Static characteristics: supply pins
V
CC
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
CC(I/O)
= 1.65 to 3.6 V; V
GND
= 0 V; see Table 10 for valid voltage level
combinations; T
amb
=
−
40 to
+
85
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Vreg(3.3) regulated supply voltage
output internal regulator option;
Iload ≤300 µA[1][2] 3.0 3.3 3.6 V
ICC operating supply current full-speed transmitting and
receivingat 12 Mbit/s; CL=50pF
on D+/D−
[3] - 48mA
ICC(I/O) operating I/O supply current full-speed transmitting and
receiving at 12 Mbit/s [3] - 12mA
ICC(idle) supply current during
full-speed idle and SE0 full-speed idle: VD+> 2.7 V,
VD−< 0.3 V; SE0: VD+< 0.3 V,
VD−< 0.3 V
[4] - - 500 µA
ICC(I/O)(static) static I/O supply current full-speed idle, SE0 or suspend - - 20 µA
ICC(susp) suspend supply current SUSPND = HIGH [4] --20µA
ICC(dis) disable mode supply current VCC(I/O) not connected [4] --20µA
ICC(I/O)(sharing) sharing mode I/O supply
current VCC(5.0) or Vreg(3.3) not connected - - 20 µA
IDx(sharing) sharing mode load current
on pins D+ and D−VCC(5.0) orVreg(3.3) notconnected;
SOFTCON = LOW; VDx = 3.6 V --10µA
Vreg(3.3)th regulated supply voltage
detection threshold 1.65 V ≤VCC(I/O) ≤Vreg(3.3);
2.7 V ≤Vreg(3.3) ≤3.6 V
supply lost - - 0.8 V
supply present [5] 2.4 - - V
Vreg(3.3)hys regulated supply voltage
detection hysteresis VCC(I/O) = 1.8 V - 0.45 - V
VCC(I/O)th I/O supply voltage detection
threshold Vreg(3.3) = 2.7 to 3.6 V
supply lost - - 0.5 V
supply present 1.4 - - V
VCC(I/O)hys I/O supply voltage detection
hysteresis Vreg(3.3) = 3.3 V - 0.45 - V
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 13 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Table 14: Static characteristics: digital pins
V
CC(I/O)
= 1.65 to 3.6 V; V
GND
=0V; T
amb
=
−
40 to
+
85
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VCC(I/O) = 1.65 to 3.6 V
Input levels
VIL LOW-level input voltage - - 0.3VCC(I/O) V
VIH HIGH-level input voltage 0.6VCC(I/O) -- V
Output levels
VOL LOW-level output voltage IOL = 100 µA - - 0.15 V
IOL = 2 mA - - 0.4 V
VOH HIGH-level output voltage IOH = 100 µAV
CC(I/O) −0.15 - - V
IOH = 2 mA VCC(I/O) −0.4 - - V
Leakage current
ILI input leakage current −1-+1µA
Example 1: VCC(I/O) = 1.8 V ±0.15 V
Input levels
VIL LOW-level input voltage - - 0.5 V
VIH HIGH-level input voltage 1.2 - - V
Output levels
VOL LOW-level output voltage IOL = 100 µA - - 0.15 V
IOL = 2 mA - - 0.4 V
VOH HIGH-level output voltage IOH = 100 µA 1.5 - - V
IOH = 2 mA 1.25 - - V
Example 2: VCC(I/O) = 2.5 V ±0.2 V
Input levels
VIL LOW-level input voltage - - 0.7 V
VIH HIGH-level input voltage 1.7 - - V
Output levels
VOL LOW-level output voltage IOL = 100 µA - - 0.15 V
IOL = 2 mA - - 0.4 V
VOH HIGH-level output voltage IOH = 100 µA 2.15 - - V
IOH = 2 mA 1.9 - - V
Example 3: VCC(I/O) = 3.3 V ±0.3 V
Input levels
VIL LOW-level input voltage - - 0.9 V
VIH HIGH-level input voltage 2.15 - - V
Output levels
VOL LOW-level output voltage IOL = 100 µA - - 0.15 V
IOL = 2 mA - - 0.4 V
VOH HIGH-level output voltage IOH = 100 µA 2.85 - - V
IOH = 2 mA 2.6 - - V
Capacitance
CIN input capacitance pin to GND - - 10 pF
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 14 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1] VOH(min) =V
reg(3.3) −0.2 V.
[2] Includes external resistors of 33 Ω±1% on both D+ and D−.
[3] This voltage is available at pins Vreg(3.3) and Vpu(3.3).
[4] In ‘suspend’ mode the minimum voltage is 2.7 V.
Table 15: Static characteristics: analog I/O pins (D+, D−)
V
CC
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
GND
=0V; T
amb
=
−
40 to
+
85
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Input levels
Differential receiver
VDI differential input sensitivity |VI(D+)−VI(D−)|0.2 - - V
VCM differential common mode
voltage includes VDI range 0.8 - 2.5 V
Single-ended receiver
VIL LOW-level input voltage - - 0.8 V
VIH HIGH-level input voltage 2.0 - - V
Vhys hysteresis voltage 0.4 - 0.7 V
Output levels
VOL LOW-level output voltage RL= 1.5 kΩ to +3.6 V - - 0.3 V
VOH HIGH-level output voltage RL=15kΩ to GND [1] 2.8 - 3.6 V
Leakage current
ILZ OFF-state leakage current −1- +1µA
Capacitance
CIN transceiver capacitance pin to GND - - 20 pF
Resistance
ZDRV driver output impedance steady-state drive [2] 34 39 44 Ω
ZINP input impedance 10 - - MΩ
RSW internal switch resistance at
pin Vpu(3.3)
--10Ω
Termination
VTERM termination voltage for
upstream port pull-up (RPU)[3][4] 3.0 - 3.6 V
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 15 of 28
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12. Dynamic characteristics
Table 16: Dynamic characteristics: analog I/O pins (D+, D−)[1]
V
CC
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
CC(I/O)
= 1.65 to 3.6 V; V
GND
= 0 V; see Table 10 for valid voltage level
combinations; T
amb
=
−
40 to
+
85
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Driver characteristics
Full-speed mode
tFR rise time CL= 50 to 125 pF;
10% to 90% of |VOH −VOL|;
see Figure 7
4 - 20 ns
tFF fall time CL= 50 to 125 pF;
90% to 10% of |VOH −VOL|;
see Figure 7
4 - 20 ns
FRFM differential rise/fall time
matching (tFR/tFF)excluding the first transition from
idle state 90 - 111.1 %
VCRS output signal crossover
voltage excluding the first transition from
idle state; see Figure 10 [2] 1.3 - 2.0 V
Low-speed mode
tLR rise time CL= 50 to 600 pF;
10% to 90% of |VOH −VOL|;
see Figure 7
75 - 300 ns
tLF fall time CL= 50 to 600 pF;
90% to 10% of |VOH −VOL|;
see Figure 7
75 - 300 ns
LRFM differential rise/fall time
matching (tLR/tLF)excluding the first transition from
idle state 80 - 125 %
VCRS output signal crossover
voltage excluding the first transition from
idle state; see Figure 10 [2] 1.3 - 2.0 V
Driver timing
Full-speed mode
tPLH(drv) driver propagation delay
(VO/VPO, FSE0/VMO to
D+,D−)
LOW-to-HIGH; see Figure 10 --18ns
tPHL(drv) driver propagation delay
(VO/VPO, FSE0/VMO to
D+,D−)
HIGH-to-LOW; see Figure 10 --18ns
tPHZ driver disable delay (OE to
D+,D−)HIGH-to-OFF; see Figure 8 --15ns
tPLZ driver disable delay (OE to
D+,D−)LOW-to-OFF; see Figure 8 --15ns
tPZH driver enable delay (OE to
D+,D−)OFF-to-HIGH; see Figure 8 --15ns
tPZL driver enable delay (OE to
D+,D−)OFF-to-LOW; see Figure 8 --15ns
Low-speed mode
Not specified: low-speed delay timings are dominated by the slow rise/fall times tLR and tLF.
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 16 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1] Test circuit: see Figure 13.
[2] Characterized only, not tested. Limits guaranteed by design.
Receiver timings (full-speed and low-speed mode)
Differential receiver
tPLH(rcv) propagation delay (D+,D−to
RCV) LOW-to-HIGH; see Figure 9 --15ns
tPHL(rcv) propagation delay (D+,D−to
RCV) HIGH-to-LOW; see Figure 9 --15ns
Single-ended receiver
tPLH(se) propagation delay (D+,D−to
VP, VM) LOW-to-HIGH; see Figure 9 --18ns
tPHL(se) propagation delay (D+,D−to
VP, VM) HIGH-to-LOW; see Figure 9 --18ns
Table 16: Dynamic characteristics: analog I/O pins (D+, D−)[1]
…continued
V
CC
= 4.0 to 5.5 V or V
reg(3.3)
= 3.0 to 3.6 V; V
CC(I/O)
= 1.65 to 3.6 V; V
GND
= 0 V; see Table 10 for valid voltage level
combinations; T
amb
=
−
40 to
+
85
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Fig 7. Rise and fall times. Fig 8. Timing of OE to D+, D−.
Fig 9. Timing of D+, D− to RCV, VP, VM. Fig 10. Timing of VO/VPO, FSE0/VMO to D+, D−.
MGS963
VOL
tFR, tLR tFF, tLF
VOH 90 %
10 % 10 %
90 %
MGS966
VOL
VOH
tPZH
tPZL tPHZ
tPLZ
VOH −0.3 V
VOL +0.3 V
VCRS
0.9 V
0.9 V
1.8 V
0 V
logic input
differential
data lines
MGS965
VOL
VOH
tPHL(rcv)
tPHL(se)
tPLH(rcv)
tPLH(se)
VCRS VCRS
0.9 V
0.9 V
2.0 V
0.8 V
logic output
differential
data lines
MGS964
VOL
VOH
tPHL(drv)
tPLH(drv)
VCRS VCRS
0.9 V
0.9 V
1.8 V
0 V
logic input
differential
data lines
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 17 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
13. Test information
V = 0 V for tPZH, tPHZ
V=V
reg(/3.3) for tPZL, tPLZ
Fig 11. Load for enable and disable times.
Fig 12. Load for VM, VP and RCV.
Load capacitance:
CL= 50 pF or 125 pF (full-speed mode, minimum or maximum timing)
CL= 50 pF or 600 pF (low-speed mode, minimum or maximum timing)
(1) Full-speed mode: connected to D+; low-speed mode: connected to D−.
Fig 13. Load for D+, D−.
test point
V
33 Ω
D.U.T. 500 Ω
50 pF
MBL142
MGS968
25 pF
test point
D.U.T.
MGS967
CL
test point
15 kΩ
D+/D−
Vpu(3.3)
1.5 kΩ(1)
33 Ω
D.U.T.
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 18 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
14. Package outline
Fig 14. HBCC16 package outline.
2.5
A1bA2
UNIT DEhe1
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
01-11-13
03-03-12
IEC JEDEC JEITA
mm 0.8 0.10
0.05 0.7
0.6 3.1
2.9 1.45
1.35
3.1
2.9
1.45
1.35
0.33
0.27
DIMENSIONS (mm are the original dimensions)
SOT639-2 MO-217
Dh
0.33
0.27
b1
0.38
0.32
b3
0.38
0.32
b2
2.45
e3
E
0.23
0.17
f
0.5
we yy
1
0.1 0.05 0.2
2.5
e2
2.45
e4
0.08
v
0 2.5 5 mm
scale
SOT639-2
HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm
A
max.
detail X
y
y1C
e
e
e1
e3
Dh
e4
D
E
X
C
BA
16
113
59
e2
1/2 e3
1/2 e4
Eh
A1
A2
A
b2
b1
b3
b
f
terminal 1
index area
AC
CB
vM
wM
AC
CB
vM
wM
AC
CB
vM
wM
AC
CB
vM
wM
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 19 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Fig 15. HVQFN16 package outline.
terminal 1
index area
0.51
A1Eh
b
UNIT y
e
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1
2.9
Dh
1.75
1.45
y1
3.1
2.9 1.75
1.45
e1
1.5
e2
1.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT758-1 MO-220 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT758-1
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
58
16 13
12
9
4
1
X
D
E
C
BA
e2
02-03-25
02-10-21
terminal 1
index area
1/2 e
1/2 e
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 20 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Fig 16. TSSOP16 package outline.
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.40
0.06 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
A
max.
1.1
pin 1 index
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 21 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
15. Packaging
The ISP1105/1106W (HBCC16 package) is delivered on a type A carrier tape, see
Figure 17. The tape dimensions are given in Table 17.
The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not
designed for use in a baking process.
The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber
must not exceed 1 mm in 100 mm.
Fig 17. Carrier tape dimensions.
Table 17: Type A carrier tape dimensions for ISP1105/1106W
Dimension Value Unit
A03.3 mm
B03.3 mm
K01.1 mm
P18.0 mm
W 12.0 ±0.3 mm
i
dth
MLC338
Type B
Type A
B0
4
W
K0
A0
4K0
A0
P1
B0
P1
elongated
sprocket hole
direction of feed
W
direction of feed
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 22 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
16. Soldering
16.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
•below 225 °C (SnPb process) or below 245 °C (Pb-free process)
–for all BGA, HTSSON..T and SSOP..T packages
–for packages with a thickness ≥2.5 mm
–for packages with a thickness < 2.5 mm and a volume ≥350 mm3 so called
thick/large packages.
•below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
16.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
•Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 23 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
•For packages with leads on two sides and a pitch (e):
–larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
–smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
•For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or
265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
16.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
16.5 Package related soldering information
[1] For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
.
Table 18: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package[1] Soldering method
Wave Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, USON, VFBGA not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4] suitable
PLCC[5], SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended[5][6] suitable
SSOP, TSSOP, VSO, VSSOP not recommended[7] suitable
CWQCCN..L[8], PMFP[9], WQCCN..L[8] not suitable not suitable
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 24 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C±10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 25 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
17. Additional soldering information
17.1 (H)BCC packages: footprint
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 µm min.) ensures
solderability, the Ni layer (5 µm min.) prevents diffusion, and the Pd layer on top
(0.5 µm min.) ensures effective wire bonding.
17.2 (H)BCC packages: reflow soldering profile
The conditions for reflow soldering of (H)BCC packages are as follows:
•Preheating time: minimum 90 s at T = 145 to 155 °C
•Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 °C
•Peak temperature:
–Ambient temperature: Tamb(max) = 260 °C
–Device surface temperature: Tcase(max) = 255 °C.
Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages.
Fig 18. (H)BCC footprint and solder resist mask dimensions.
004aaa123
b1
b
b2
Dh
0.05
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
Normal
Terminal PCB land Solder resist mask Stencil mask
Solder land
Corner
0.05
b2
b2
b2
Eh
0.05
0.05
0.05
0.05
0.05
0.1
(4×)
0.3 (8×)
0.05
Solder resist
Solder stencil
b1
b
Stencil print thickness:
0.1 to 0.12 mm
Cavity
0.05
0.05
Dh
Eh
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
Product data Rev. 08 — 19 February 2004 26 of 28
9397 750 11231 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
18. Revision history
Table 19: Revision history
Rev Date CPCN Description
08 20040219 - Product data (9397 750 11231); removed ISP1107 related information.
Modifications:
•Changed the data sheet title from ISP1105/1106/1107 to ISP1105/1106 and removed all
information pertaining to ISP1107
•Changed USB 1.1 reference to USB 2.0; also added data transfer rates
•Added HVQFN16 package details in Table 1,Section 6 and Section 14
•Figure 1: removed the first figure note
•Table 3: added pad details
•Table 11: updated
•Table 15: removed ZDRV2, and also table note 3
•Figure 8 and Figure 10: changed 1.65 V to 1.8 V.
07 20020329 - Product data (9397 750 09529)
06 20011130 - Product data; sixth version (9397 750 08872)
05 20010903 - Product data; fifth version (9397 750 08681)
04 20010802 - Preliminary data; fourth version (9397 750 08643)
03 20010704 - Preliminary data; third version (9397 750 08515)
02 20010205 - Objective specification; second version (9397 750 07879) ISP1107 stand-alone data
sheet only.
01 20000223 - Objective specification; initial version (9397 750 06899) ISP1107 stand-alone data
sheet only.
9397 750 11231
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 08 — 19 February 2004 27 of 28
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.Fax: +31 40 27 24825
19. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
20. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
21. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Level Data sheet status[1] Product status[2][3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2004.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 19 February 2004 Document order number: 9397 750 11231
Contents
Philips Semiconductors ISP1105/1106
Advanced USB transceivers
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 7
7.1 Function selection. . . . . . . . . . . . . . . . . . . . . . . 7
7.2 Operating functions. . . . . . . . . . . . . . . . . . . . . . 7
7.3 Power supply configurations. . . . . . . . . . . . . . . 8
7.4 Power supply input options. . . . . . . . . . . . . . . . 9
8 Electrostatic discharge (ESD). . . . . . . . . . . . . 10
8.1 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . 10
8.2 ESD test conditions . . . . . . . . . . . . . . . . . . . . 10
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
10 Recommended operating conditions. . . . . . . 11
11 Static characteristics. . . . . . . . . . . . . . . . . . . . 12
12 Dynamic characteristics . . . . . . . . . . . . . . . . . 15
13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 17
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
15 Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 22
16.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 22
16.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
16.5 Package related soldering information . . . . . . 23
17 Additional soldering information . . . . . . . . . . 25
17.1 (H)BCC packages: footprint . . . . . . . . . . . . . . 25
17.2 (H)BCC packages: reflow soldering profile. . . 25
18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 26
19 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 27
20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
21 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
