AP15P10GS/P RoHS-compliant Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET Low Gate Charge D Simple Drive Requirement Fast Switching Characteristic -100V RDS(ON) 230m ID G RoHS Compliant BVDSS -15A S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. GD S TO-263(S) The TO-263 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP15P10GP) are available for low-profile applications. G D Absolute Maximum Ratings Symbol Parameter TO-220(P) S Rating Units VDS Drain-Source Voltage -100 V VGS Gate-Source Voltage +20 V ID@TC=25 Continuous Drain Current, VGS @ 10V -15 A ID@TC=100 Continuous Drain Current, VGS @ 10V -9.4 A 1 IDM Pulsed Drain Current -60 A PD@TC=25 Total Power Dissipation 96 W Linear Derating Factor 0.77 W/ TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 1.3 /W Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount)3 40 /W Rthj-a Maximum Thermal Resistance, Junction-ambient 62 /W Data and specifications subject to change without notice 1 200910083 AP15P10GS/P Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. -100 - - V - -0.1 - V/ VGS=-10V, ID=-6A - - 230 m BVDSS Drain-Source Breakdown Voltage BVDSS/Tj Breakdown Voltage Temperature Coefficient Reference to 25, ID=-1mA VGS=0V, ID=-1mA 2 Max. Units RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance VDS=-10V, ID=-9A - 8 - S IDSS Drain-Source Leakage Current VDS=-100V, VGS=0V - - -25 uA Drain-Source Leakage Current (T j=125 C) VDS=-80V, VGS=0V - - -100 uA Gate-Source Leakage VGS= +20V, VDS=0V - - +100 nA ID=-9A - 37 60 nC o IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=-80V - 5 - nC Qgd Gate-Drain ("Miller") Charge VGS=-10V - 15 - nC VDS=-50V - 11 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=-9A - 25 - ns td(off) Turn-off Delay Time RG=10,VGS=-10V - 56 - ns tf Fall Time RD=5.6 - 36 - ns Ciss Input Capacitance VGS=0V - 1180 1900 pF Coss Output Capacitance VDS=-25V - 250 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 75 - pF Rg Gate Resistance f=1.0MHz - 3.6 5 Min. Typ. IS=-9A, VGS=0V - - -1.3 V IS=-9A, VGS=0V, - 95 - ns dI/dt=-100A/s - 410 - nC Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 trr Reverse Recovery Time Qrr Reverse Recovery Charge Test Conditions Max. Units Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP15P10GS/P 30 30 -10V -10V T C = 150 o C T C =25 o C -7.0V -ID , Drain Current (A) -ID , Drain Current (A) -7.0V 20 -5.0V 10 -4.5V 20 -5.0V 10 -4.5V V G = - 3 .0V V G = - 3 .0V 0 0 0 5 10 15 20 25 0 -V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 10 15 20 25 Fig 2. Typical Output Characteristics 2.4 550 I D = -6 A V G = - 10V Normalized RDS(ON) I D = -6 A T C =25 450 RDS(ON) (m ) 5 -V DS , Drain-to-Source Voltage (V) 350 1.9 1.4 0.9 250 0.4 150 2 4 6 8 -50 10 0 50 100 150 T j , Junction Temperature ( o C) -V GS , Gate-to-Source Voltage (V) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.5 10 8 T j =25 o C Normalized -VGS(th) (V) -IS(A) T j =150 o C 6 4 2 0 1.1 0.7 0.3 0 0.4 0.8 -V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP15P10GS/P f=1.0MHz 12 10000 I D = -9A V DS = -80V 8 C iss 1000 C (pF) -VGS , Gate to Source Voltage (V) 10 6 C oss 100 4 C rss 2 10 0 0 10 20 30 1 40 5 9 13 17 21 25 29 -V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 100 Operation in this area limited by RDS(ON) Normalized Thermal Response (Rthjc) 1 100us 10 -ID (A) 1ms 10ms 100ms DC 1 o T C =25 C Single Pulse Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 0.1 1 10 100 1000 0.00001 0.0001 -V DS , Drain-to-Source Voltage (V) 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 10 VG V DS =-5V T j =25 o C -ID , Drain Current (A) 8 T j =150 o C QG -10V 6 QGS QGD 4 2 Charge Q 0 0 2 4 6 8 -V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform 4