03659950 - NXP SEMICONDUCTORS

TP8

www.vishay.com Vishay Sprague

Revision: 11-May-16 1Document Number: 40151

For technical questions, contact: tantalum@vishay.com

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Solid Tantalum Chip Capacitors, MICROTAN®,

High CV Leadframeless Molded Automotive Grade

FEATURES

• Highest capacitance-voltage product in

industry in given case size

• Small sizes include 0603 footprint

• Lead (Pb)free L-shaped terminations

• AEC-Q200 qualified. PPAP available upon

request

• 8 mm tape and reel packaging available per

EIA-481

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

PERFORMANCE/ELECTRICAL CHARACTERISTICS

www.vishay.com/doc?40215

Operating Temperature: -55 °C to +125 °C

(above 85 °C, voltage derating is required)

Capacitance Range: 1.0 μF to 100 μF

Capacitance Tolerance: ± 10 %, ± 20 %

Voltage Rating: 6.3 VDC to 40 VDC

Note

• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. 

Voltage substitutions will be marked with the higher voltage rating.

ORDERING INFORMATION

TP8 M 105 M 010 C

TYPE CASE CODE CAPACITANCE CAPACITANCE

TOLERANCE

DC VOLTAGE

RATING AT +85 °C

TERMINATION/

PACKAGING

See Ratings

and Case

Codes table.

This is expressed in

picofarads. The first

two digits are the

significant figures. The

third is the number

of zeros to follow.

K = ± 10 %

M = ± 20 %

This is expressed in V.

To complete the three-digit

block, zeros precede the

voltage rating. A decimal

point is indicated by an “R”

(6R3 = 6.3 V).

C = 100 % tin

7" [178 mm] reel

DIMENSIONS in inches [millimeters]

CASE CODE L W H (MAX.) P1 P2 (REF.) C

M0.063 ± 0.008

[1.60 ± 0.2]

0.033 ± 0.008

[0.85 ± 0.2]

0.035

[0.9]

0.020 ± 0.004

[0.50 ± 0.1]

0.024

[0.60]

0.024 ± 0.004

[0.60 ± 0.1]

W0.079 ± 0.008

[2.00 ± 0.2] 0.050 ± 0.008

[1.25 ± 0.2] 0.048

[1.2] 0.020 ± 0.004

[0.50 ± 0.1] 0.040

[1.00] 0.035 ± 0.004

[0.90 ± 0.1]

R0.081 ± 0.008

[2.05 ± 0.2] 0.053 ± 0.008

[1.35 ± 0.2] 0.063

[1.6] 0.020 ± 0.004

[0.50 ± 0.1] 0.043

[1.1] 0.035 ± 0.004

[0.9 ± 0.1]

P0.094 ± 0.004

[2.4 ± 0.1]

0.057 ± 0.004

[1.45 ± 0.1]

0.047

[1.2]

0.020 ± 0.004

[0.50 ± 0.1]

0.057

[1.40]

0.035 ± 0.004

[0.90 ± 0.1]

A0.126 ± 0.008

[3.2 ± 0.2] 0.063 ± 0.008

[1.6 ± 0.2] 0.071

[1.8] 0.031 ± 0.004

[0.80 ± 0.1] 0.063

[1.60] 0.047 ± 0.004

[1.20 ± 0.1]

N0.138 ± 0.008

[3.5 ± 0.2] 0.112 ± 0.008

[2.8 ± 0.2] 0.048

[1.2] 0.031 ± 0.008

[0.80 ± 0.2] 0.077

[1.95] 0.094 ± 0.004

[2.4 ± 0.1]

T0.138 ± 0.008

[3.5 ± 0.2] 0.112 ± 0.008

[2.8 ± 0.2] 0.063

[1.6] 0.031 ± 0.008

[0.80 ± 0.2] 0.077

[1.95] 0.094 ± 0.004

[2.4 ± 0.1]

B0.138 ± 0.008

[3.5 ± 0.2] 0.112 ± 0.008

[2.8 ± 0.2] 0.08

[2.0] 0.031 ± 0.008

[0.80 ± 0.2] 0.077

[1.95] 0.094 ± 0.004

[2.4 ± 0.1]

Anode Polarity Bar

Anode Termination

P2P1

Cathode Termination

TP8

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Revision: 11-May-16 2Document Number: 40151

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RATINGS AND CASE CODES

μF 6.3 V 10 V 16 V 20 V 25 V 40 V

1.0 M M M / W R P

2.2 M

3.3 M R

4.7 M M P P

6.8 W N / B

10 M R A / R A

15 R

22 A

47 T / B

100 A

MARKING

VOLTAGE CODE CAPACITANCE CODE

VCODECAP, μFCODE

6.3 J 1.0 A

10 A 2.2 J

16 C 3.3 N

20 D 4.7 S

25 E 6.8 W

35 V 10 

40 g 15 e

50 T 22 j

33 n

47 s

68 w

100 A

M-Case

Voltage code

Polarity bar

N, T, B-Case

Vishay

marking

47 10

VoltageCapacitancePolarity bar

P, R, W-Case

A-Case

Capacitance

code

Voltage

code

Polarity bar

EIA capacitance

code (pF)

107

Voltage

code

Polarity bar

TP8

www.vishay.com Vishay Sprague

Revision: 11-May-16 3Document Number: 40151

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STANDARD RATINGS

CAPACITANCE

(μF) CASE CODE PART NUMBER

MAX. DCL

AT +25 °C

(μA)

MAX. DF

AT +25 °C

120 Hz

(%)

MAX. ESR

AT +25 °C

100 kHz

()

MAX. RIPPLE

100 kHz

IRMS

(A)

6.3 VDC AT +85 °C; 4 VDC AT +125 °C

4.7 M TP8M475M6R3C 0.50 8 6 0.06

10 M TP8M106M6R3C 0.63 8 5 0.07

100 A TP8A107(1)6R3C 6.30 30 3 0.16

10 VDC AT +85 °C; 7 VDC AT +125 °C

1.0 M TP8M105M010C 0.50 6 12 0.05

3.3 M TP8M335(1)010C 0.50 8 6 0.06

4.7 M TP8M475M010C 0.50 8 6 0.06

6.8 W TP8W685(1)010C 0.68 8 8 0.06

10 R TP8R106(1)010C 1.00 8 8 0.08

15 R TP8R156(1)010C 1.50 8 5 0.09

22 A TP8A226(1)010C 2.20 8 8 0.10

47 B TP8B476(1)010C 4.70 8 2 0.20

47 T TP8T476(1)010C 4.70 8 1 0.29

16 VDC AT +85 °C; 10 VDC AT +125 °C

1.0 M TP8M105M016C 0.50 6 12 0.05

2.2 M TP8M225M016C 0.50 10 12 0.05

10 A TP8A106(1)016C 1.60 8 6 0.11

10 R TP8R106(1)016C 1.60 8 8 0.08

20 VDC AT +85 °C; 13 VDC AT +125 °C

1.0 M TP8M105M020C 0.50 6 12 0.05

1.0 W TP8W105M020C 0.50 8 8 0.06

3.3 R TP8R335(1)020C 0.70 8 8 0.08

4.7 P TP8P475(1)020C 0.90 6 6 0.09

6.8 B TP8B685(1)020C 1.36 8 6 0.12

6.8 N TP8N685(1)020C 1.36 8 6 0.11

10 A TP8A106(1)020C 2.00 8 3 0.16

25 VDC AT +85 °C; 17 VDC AT +125 °C

1.0 R TP8R105(1)025C 0.50 6 10 0.07

4.7 P TP8P475(1)025C 1.20 6 6 0.09

40 VDC AT +85 °C; 28 VDC AT +125 °C

1.0 P TP8P105(1)040C 0.50 8 10 0.07

Note

• Part number definition:

(1) Tolerance: For 10 % tolerance, specify “K”; for 20 % tolerance, change to “M”

TP8

www.vishay.com Vishay Sprague

Revision: 11-May-16 4Document Number: 40151

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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Note

(1) Exception: Instead of Solder Bath/Dip and Look Test (J-STD-002, method B at 215 °C, category 3) was performed “Method 2 - Surface

Mount Process Simulation Test” per JESD22-B102E as specified in AEC-Q005 REV-A.

AEC-Q200 QUALIFICATION TESTING

NO. AEC-Q200 TEST ITEM REFERENCE

1 Pre- and post stress electrical test Internal spec

3 High temperature exposure (storage) AEC-Q200

4 Temperature cycling AEC-Q200

7 Biased humidity AEC-Q200

8 Operational life AEC-Q200

9 External visual AEC-Q200

10 Physical dimension AEC-Q200

12 Resistance to solvents AEC-Q200

13 Mechanical shock AEC-Q200

14 Vibration AEC-Q200

15 Resistance to soldering heat AEC-Q200

17 ESD AEC-Q200

18 Solderability (1) AEC-Q200

19 Electrical characterization Internal spec

22 Terminal strength (SMD) AEC-Q200

STANDARD PACKAGING QUANTITY

CASE CODE QUANTITY (pcs/reel)

7" REEL

M 4000

W 2500

R 2500

P 3000

A 2000

N 2500

T 2500

B 2000

POWER DISSIPATION

CASE CODE MAXIMUM PERMISSIBLE

POWER DISSIPATION AT +25 °C (W) IN FREE AIR

M 0.025

W 0.040

R 0.045

P 0.045

A 0.075

N 0.075

T 0.084

B 0.085

PRODUCT INFORMATION

Micro Guide www.vishay.com/doc?40115

Moisture Sensitivity www.vishay.com/doc?40135

SELECTOR GUIDES

Solid Tantalum Selector Guide www.vishay.com/doc?49053

FAQ

Frequently Asked Questions www.vishay.com/doc?40110

Micro Guide

www.vishay.com Vishay Sprague

Revision: 12-Sep-17 1Document Number: 40115

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Guide for Leadframeless Molded Tantalum Capacitors

INTRODUCTION

Tantalum electrolytic capacitors are the preferred choice in

applications where volumetric efficiency, stable electrical

parameters, high reliability, and long service life are primary

considerations. The stability and resistance to elevated

temperatures of the tantalum / tantalum oxide / manganese

dioxide system make solid tantalum capacitors an

appropriate choice for today’s surface mount assembly

technology.

Vishay Sprague has been a pioneer and leader in this field,

producing a large variety of tantalum capacitor types for

consumer, industrial, automotive, military, and aerospace

electronic applications.

Tantalum is not found in its pure state. Rather, it is

commonly found in a number of oxide minerals, often in

combination with Columbium ore. This combination is

known as “tantalite” when its contents are more than

one-half tantalum. Important sources of tantalite include

Australia, Brazil, Canada, China, and several African

countries. Synthetic tantalite concentrates produced from

tin slags in Thailand, Malaysia, and Brazil are also a

significant raw material for tantalum production.

Electronic applications, and particularly capacitors,

consume the largest share of world tantalum production.

Other important applications for tantalum include cutting

tools (tantalum carbide), high temperature super alloys,

chemical processing equipment, medical implants, and

military ordnance.

Vishay Sprague is a major user of tantalum materials in the

form of powder and wire for capacitor elements and rod and

sheet for high temperature vacuum processing.

THE BASICS OF TANTALUM CAPACITORS

Most metals form crystalline oxides which are

non-protecting, such as rust on iron or black oxide on

copper. A few metals form dense, stable, tightly adhering,

electrically insulating oxides. These are the so-called “valve”

metals and include titanium, zirconium, niobium, tantalum,

hafnium, and aluminum. Only a few of these permit the

accurate control of oxide thickness by electrochemical

means. Of these, the most valuable for the electronics

industry are aluminum and tantalum.

Capacitors are basic to all kinds of electrical equipment,

from radios and television sets to missile controls and

automobile ignitions. Their function is to store an electrical

charge for later use.

Capacitors consist of two conducting surfaces, usually

metal plates, whose function is to conduct electricity. They

are separated by an insulating material or dielectric. The

dielectric used in all tantalum electrolytic capacitors is

tantalum pentoxide.

Tantalum pentoxide compound possesses high-dielectric

strength and a high-dielectric constant. As capacitors are

being manufactured, a film of tantalum pentoxide is applied

to their electrodes by means of an electrolytic process. The

film is applied in various thicknesses and at various voltages

and although transparent to begin with, it takes on different

colors as light refracts through it. This coloring occurs on the

tantalum electrodes of all types of tantalum capacitors.

Rating for rating, tantalum capacitors tend to have as much

as three times better capacitance / volume efficiency than

aluminum electrolytic capacitors. An approximation of the

capacitance / volume efficiency of other types of capacitors

may be inferred from the following table, which shows the

dielectric constant ranges of the various materials used in

each type. Note that tantalum pentoxide has a dielectric

constant of 26, some three times greater than that of

aluminum oxide. This, in addition to the fact that extremely

thin films can be deposited during the electrolytic process

mentioned earlier, makes the tantalum capacitor extremely

efficient with respect to the number of microfarads available

per unit volume. The capacitance of any capacitor is

determined by the surface area of the two conducting

plates, the distance between the plates, and the dielectric

constant of the insulating material between the plates.

In the tantalum electrolytic capacitor, the distance between

the plates is very small since it is only the thickness of the

tantalum pentoxide film. As the dielectric constant of the

tantalum pentoxide is high, the capacitance of a tantalum

capacitor is high if the area of the plates is large:

where

C= capacitance

e = dielectric constant

A = surface area of the dielectric

t = thickness of the dielectric

Tantalum capacitors contain either liquid or solid

electrolytes. In solid electrolyte capacitors, a dry material

(manganese dioxide) forms the cathode plate. A tantalum

lead is embedded in or welded to the pellet, which is in turn

connected to a termination or lead wire. The drawings show

the construction details of the surface mount types of

tantalum capacitors shown in this catalog.

COMPARISON OF CAPACITOR DIELECTRIC

CONSTANTS

DIELECTRIC e

DIELECTRIC CONSTANT

Air or Vacuum 1.0

Paper 2.0 to 6.0

Plastic 2.1 to 6.0

Mineral Oil 2.2 to 2.3

Silicone Oil 2.7 to 2.8

Quartz 3.8 to 4.4

Glass 4.8 to 8.0

Porcelain 5.1 to 5.9

Mica 5.4 to 8.7

Aluminum Oxide 8.4

Tantalum Pentoxide 26

Ceramic 12 to 400K

CeA

-------

Micro Guide

www.vishay.com Vishay Sprague

Revision: 12-Sep-17 2Document Number: 40115

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SOLID ELECTROLYTE TANTALUM CAPACITORS

Solid electrolyte capacitors contain manganese dioxide,

which is formed on the tantalum pentoxide dielectric layer

by impregnating the pellet with a solution of manganous

nitrate. The pellet is then heated in an oven, and the

manganous nitrate is converted to manganese dioxide.

The pellet is next coated with graphite, followed by a layer

of metallic silver, which provides a conductive surface

between the pellet and the leadframe.

Molded chip tantalum capacitor encases the element in

plastic resins, such as epoxy materials. After assembly, the

capacitors are tested and inspected to assure long life and

reliability. It offers excellent reliability and high stability for

consumer and commercial electronics with the added

feature of low cost.

Surface mount designs of “Solid Tantalum” capacitors use

lead frames or lead frameless designs as shown in the

accompanying drawings.

TANTALUM CAPACITORS FOR ALL DESIGN

CONSIDERATIONS

Solid electrolyte designs are the least expensive for a given

rating and are used in many applications where their very

small size for a given unit of capacitance is of importance.

They will typically withstand up to about 10 % of the rated

DC working voltage in a reverse direction. Also important

are their good low temperature performance characteristics

and freedom from corrosive electrolytes.

Vishay Sprague patented the original solid electrolyte

capacitors and was the first to market them in 1956. Vishay

Sprague has the broadest line of tantalum capacitors and

has continued its position of leadership in this field. Data

sheets covering the various types and styles of Vishay

Sprague capacitors for consumer and entertainment

electronics, industry, and military applications are available

where detailed performance characteristics must be

specified.

Fig. 1 - Leadframeless Molded Capacitors, All Types

Side Cathode

Termination (-)

Sintered

Tantalum Pellet

MnO2/Carbon/

Silver Coating

Bottom Cathode

Termination (-)

Silver Adhesive Epoxy

Glass Reinforced

Epoxy Resin Bottom Anode

Termination (+)

Side Anode

Termination (+)

Polarity Bar Marking

Epoxy Resin

Encapsulation

Voltage Code

Excluding 0402 (1005 metric)

case size

Micro Guide

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Revision: 12-Sep-17 3Document Number: 40115

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SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED

SERIES TL8 298D 298W TR8

PRODUCT IMAGE

TYPE Solid tantalum leadframeless molded chip capacitors

FEATURES

Small size including 0603 and 0402 foot print

Ultra low profile Industrial grade Industrial grade,

extended range Low ESR

TEMPERATURE RANGE

Operating Temperature:

-55 °C to +125 °C

(above 40 °C, voltage

derating is required)

Operating Temperature:

-55 °C to +125 °C

(above 85 °C, voltage

derating is required)

Operating Temperature:

-55 °C to +125 °C

(above 40 °C, voltage

derating is required)

Operating Temperature:

-55 °C to +125 °C

(above 85 °C, voltage

derating is required)

CAPACITANCE RANGE 0.68 μF to 220 μF 0.33 μF to 220 μF 2.2 μF to 220 μF 1 μF to 220 μF

VOLTAGE RANGE 4 V to 25 V 2.5 V to 50 V 4 V to 16 V 2.5 V to 25 V

CAPACITANCE TOLERANCE ± 20 %, ± 10 %

DISSIPATION FACTOR 6 % to 80 % 6 % to 80 % 30 % to 80 % 6 % to 80 %

CASE CODES W9, A0, B0 K, M, R, P, Q, A, S, B K, M, Q M, R, P, Q, A, B

TERMINATION 100 % tin 100 % tin or gold plated

SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED

SERIES TP8 TM8 DLA 11020 T42

PRODUCT IMAGE

TYPE Solid tantalum leadframeless molded chip capacitors

FEATURES

Small size including 0603 and 0402 foot print Built in fuse,

double-stacked

High performance,

automotive grade High reliability High reliability,

DLA approved

High reliability,

ultra-low ESR

TEMPERATURE RANGE Operating Temperature:

-55 °C to +125 °C (above 85 °C, voltage derating is required)

CAPACITANCE RANGE 1 μF to 100 μF 0.68 μF to 47 μF 1 μF to 47 μF 10 μF to 470 μF

VOLTAGE RANGE 6.3 V to 40 V 2 V to 40 V 6.3 V to 40 V 16 V to 75 V

CAPACITANCE TOLERANCE ± 20 %, ± 10 %

DISSIPATION FACTOR 6 % to 30 % 6 % to 20 % 6 % to 8 % 6 % to 15 %

CASE CODES M, W, R, P, A, N, T, B K, M, G, W, R, P, A, N, T M, W, R, P, A, N, T M2

TERMINATION 100 % tin Tin / lead solder plated,

100 % tin and gold plated

Tin / lead solder plated

or gold plated

Tin / lead solder plated

or 100 % tin

Micro Guide

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Revision: 12-Sep-17 4Document Number: 40115

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

• Metric dimensions will govern. Dimensions in inches are rounded and for reference only.

(1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body

dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the

cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent

rotation of the component within the cavity of not more than 20°.

(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide

“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.

(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed

cavities or to the edge of the cavity whichever is less.

(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier

tape between the embossed cavity or to the edge of the cavity whichever is less.

(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of

embossement location shall be applied independent of each other.

(6) B1 dimension is a reference dimension tape feeder clearance only.

Notes

(1) For reference only

(2) Packaging of M case in plastic tape is available per request

PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]

Tape and Reel Specifications: all case sizes are

available on plastic embossed tape per EIA-481.

Standard reel diameter is 7" [178 mm].

CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8

CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W

M (2) 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0]

W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0]

R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0]

P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0]

A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0]

A0, Q 8 mm - 0.02 [0.5] 0.138 [3.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0]

B 8 mm 0.157 [4.0] 0.039 [1.0] 0.138 [3.5] 0.087[2.22] 0.157 [4.0] 0.315 [8.0]

W9, S 8 mm 0.126 [3.20] 0.029 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0]

B0 12 mm 0.181 [4.61] 0.059 [1.5] 0.217 [5.5] 0.049 [1.25] 0.157 [4.0] 0.472 [12.0]

0.004 [0.10]

max.

Tape thickness

B1 (max.) (6)

0.014

[0.35]

max.

10 pitches cumulative

tolerance on tape

± 0.008 [0.200]

Embossment

0.069 ± 0.004

[1.75 ± 0.10]

D1 (min.) for components

0.079 x 0.047 [2.0 x 1.2] and larger (5)

Maximum

USER DIRECTION

OF FEED

Center lines

of cavity

0.030 [0.75]

min. (3)

0.030 [0.75]

min. (4)

0.079 ± 0.002

[2.0 ± 0.05]

0.157 ± 0.004

[4.0 ± 0.10]

0.059 + 0.004 - 0.0

[1.5 + 0.10 - 0.0]

Maximum

component

rotation

(Side or front sectional view)

20°

For tape feeder

reference only

including draft.

Concentric around B0

(5)

Deformation

between

embossments

Top

cover

tape

Top cover

tape

cavity size (1)

Cathode (-)

Anode (+)

DIRECTION OF FEED

20° maximum

component rotation

Typical

component

cavity

center line

Typical

component

center line

(Top view)

0.9843 [250.0]

Tape

3.937 [100.0]

0.039 [1.0]

max.

0.039 [1.0]

max.

Camber

Allowable camber to be 0.039/3.937 [1/100]

(Top view)

Non-cumulative over 9.843 [250.0]

Micro Guide

www.vishay.com Vishay Sprague

Revision: 12-Sep-17 5Document Number: 40115

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

(1) For reference only

Note

(1) For reference only

Note

(1) A0, B0 are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body

dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the

cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation

of the component within the cavity of not more than 20°.

CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8

CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W

M 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0]

G 8 mm 0.077 [1.96] 0.02 [0.5] 0.138 [3.5] 0.051 [1.30] 0.157 [4.0] 0.315 [8.0]

W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0]

R 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0]

P 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0]

A 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0]

N 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0]

T 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0]

CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42

CASE CODE TAPE SIZE B1 (MAX.) (1) D1 (MIN.) F K0 (MAX.) P1W

M2 16 mm 0.404 [10.3] 0.059 [1.5] 0.295 [7.5] 0.176 [4.5] 0.472 [12.0] 0.630 [16.0]

PAPER TAPE AND REEL PACKAGING in inches [millimeters]

FOR 298D, 298W, TR8, TP8, TL8, TM8 (K case only)

CASE

SIZE

TAPE

SIZE A

EFWT

K8 mm

0.033 ± 0.002

[0.85 ± 0.05]

0.053 ± 0.002

[1.35 ± 0.05]

0.06 ± 0.004

[1.5 ± 0.1]

0.157 ± 0.004

[4.0 ± 0.1]

0.078 ± 0.004

[2.0 ± 0.1]

0.079 ± 0.002

[2.0 ± 0.05]

0.069 ± 0.004

[1.75 ± 0.1]

0.0138 ± 0.002

[3.5 ± 0.05]

0.315 ± 0.008

[8.0 ± 0.2]

0.03 ± 0.002

[0.75 ± 0.05]

M8 mm

0.041 ± 0.002

[1.05 ± 0.05]

0.071 ± 0.002

[1.8 ± 0.05]

0.06 ± 0.004

[1.5 ± 0.1]

0.157 ± 0.004

[4.0 ± 0.1]

0.157 ± 0.004

[4.0 ± 0.1]

0.079 ± 0.002

[2.0 ± 0.05]

0.069 ± 0.004

[1.75 ± 0.1]

0.0138 ± 0.002

[3.5 ± 0.05]

0.315 ± 0.008

[8.0 ± 0.2]

0.037 ± 0.002

[0.95 ± 0.05]

Ø D0

Bottom cover

tape

B0E2

P0E1

Cavity size

(1)

Bottom cover tape

USER FEED DIRECTION

Cavity center lines

Top

cover tape

[10 pitches cumulative tolerance on tape ± 0.2 mm]

Anode

Micro Guide

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Revision: 12-Sep-17 6Document Number: 40115

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RECOMMENDED REFLOW PROFILES

Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.

PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY

PREHEAT AND SOAK

Temperature min. (TSmin.) 100 °C 150 °C

Temperature max. (TSmax.) 150 °C 200 °C

Time (tS) from (TSmin. to TSmax.) 60 s to 90 s 60 s to 150 s

RAMP UP

Ramp-up rate (TL to Tp) 3 °C/s maximum

Liquidus temperature (TL) 183 °C 217 °C

Time (tL) maintained above TL60 s to 150 s

Peak package body temperature (Tp) max. 235 °C 260 °C

Time (tp) within 5 °C of the peak max. temperature 20 s 30 s

RAMP DOWN

Ramp-down rate (Tp to TL) 6 °C/s maximum

Time from 25 °C to peak temperature 6 min maximum 8 min maximum

PAD DIMENSIONS in inches [millimeters]

CASE CODE A (NOM.) B (MIN.) C (NOM.) D (MIN.)

K 0.021 [0.53] 0.016 [0.41] 0.022 [0.55] 0.054 [1.37]

M, G 0.024 [0.61] 0.027 [0.70] 0.025 [0.64] 0.080 [2.03]

R, W9, S 0.035 [0.89] 0.029 [0.74] 0.041 [1.05] 0.099 [2.52]

W 0.035 [0.89] 0.029 [0.74] 0.037 [0.95] 0.095 [2.41]

P 0.035 [0.89] 0.029 [0.74] 0.054 [1.37] 0.112 [2.84]

A, Q, A0 0.047 [1.19] 0.042 [1.06] 0.065 [1.65] 0.148 [3.76]

B, B0 0.094 [2.39] 0.044 [1.11] 0.072 [1.82] 0.159 [4.03]

N, T 0.094 [2.39] 0.044 [1.11] 0.065 [1.65] 0.152 [3.86]

M2 0.315 [8.00] 0.098 [2.50] 0.197 [5.00] 0.394 [10.0]

Time

Temperature

Time 25 °C to Peak

TSmin.

TSmax. Preheat Area

Max. Ramp Up Rate = 3 °C/s

Max. Ramp Down Rate = 6 °C/s

Micro Guide

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Revision: 12-Sep-17 7Document Number: 40115

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

•At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table

•At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table

•At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table

TYPICAL LEAKAGE CURRENT FACTOR RANGE

TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY

100

1.0

0.1

0.01

0.001

010 40 708090605020 30 100

+ 125 °C

+ 85 °C

+ 55 °C

+ 25 °C

0 °C

- 55 °C

PERCENT OF RATED VOLTAGE

LEAKAGE CURRENT FACTOR

100

0.1 1 10 100 1000

FREQUENCY, kHz

“M” Case

22 μF - 4 V

IMPEDANCE

ESR

ESR/Z, Ω

0.1

100

0.1 1 10 100 1000

FREQUENCY, kHz

ESR/Z, Ω

“M” Case

47 μF - 4 V

IMPEDANCE

ESR

100

1000

0.1 1 10 100 1000

FREQUENCY, kHz

ESR/Z, Ω

“M” Case

10 μF - 6 V

IMPEDANCE

ESR

0.1

100

1000

0.1 1 10 100 1000

FREQUENCY, kHz

ESR/Z, Ω

“M” Case

4.7 μF - 10 V

IMPEDANCE

ESR

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Revision: 12-Sep-17 8Document Number: 40115

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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY

100

1000

0.1 1 10 100 1000

FREQUENCY, kHz

ESR/Z, Ω

“M” Case

10 μF - 10 V

IMPEDANCE

ESR

100

1000

10 000

0.1 1 10 100 1000

FREQUENCY, kHz

ESR/Z, Ω

“M” Case

1 μF - 16 V

IMPEDANCE

ESR

100.0

10.0

1.0

0.1

ESR/Z, Ω

0.1 1 10 100 1000

33 μF - 10 V

IMPEDANCE

ESR

“P” CASE

FREQUENCY, kHz

1000.0

100.0

10.0

1.0

0.1

0.1 110 100 1000

IMPEDANCE

ESR

FREQUENCY, kHz

ESR/Z, Ω

“P” CASE

4.7 μF - 25 V

100.0

1.0

10.0

0.1

0.1 110 100 1000

ESR/Z, Ω

FREQUENCY, kHz

“P” CASE

IMPEDANCE

ESR

47 μF - 10 V

10.0

1.0

0.1

0.1 1 10 100 1000

ESR/Z, Ω

FREQUENCY, kHz

“P” CASE

220 μF - 4 V

IMPEDANCE

ESR

Micro Guide

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Revision: 12-Sep-17 9Document Number: 40115

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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

GUIDE TO APPLICATION

1. AC Ripple Current: the maximum allowable ripple

current shall be determined from the formula:

where,

P = power dissipation in watts at +25 °C (see

paragraph number 5 and the table Power

Dissipation as given in the tables in the

product datasheets)

RESR = the capacitor equivalent series resistance at

the specified frequency

2. AC Ripple Voltage: the maximum allowable ripple

voltage shall be determined from the formula:

or, from the formula:

where,

P = power dissipation in watts at +25 °C (see

paragraph number 5 and the table Power

Dissipation as given in the tables in the

product datasheets)

RESR = the capacitor equivalent series resistance at

the specified frequency

Z = the capacitor impedance at the specified

frequency

2.1 The sum of the peak AC voltage plus the applied DC

voltage shall not exceed the DC voltage rating of the

capacitor.

2.2 The sum of the negative peak AC voltage plus the

applied DC voltage shall not allow a voltage reversal

exceeding 10 % of the DC working voltage at

+25 °C.

3. Reverse Voltage: these capacitors are capable of

withstanding peak voltages in the reverse direction

equal to 10 % of the DC rating at +25 °C, 5 % of the

DC rating at +25 °C, 5 % of the DC rating at +85 °C,

and 1 % of the DC rating at +125 °C.

4. Temperature Derating: if these capacitors are to be

operated at temperatures above +25 °C, the

permissible RMS ripple current shall be calculated

using the derating factors as shown:

5. Power Dissipation: power dissipation will be

affected by the heat sinking capability of the

mounting surface. Non-sinusoidal ripple current may

produce heating effects which differ from those

shown. It is important that the equivalent IRMS value

be established when calculating permissible

operating levels. (Power Dissipation calculated using

+25 °C temperature rise.)

6. Printed Circuit Board Materials: molded capacitors

are compatible with commonly used printed circuit

board materials (alumina substrates, FR4, FR5, G10,

PTFE-fluorocarbon and porcelanized steel).

7. Attachment:

7.1 Solder Paste: the recommended thickness of the

solder paste after application is 0.007" ± 0.001"

[0.178 mm ± 0.025 mm]. Care should be exercised in

selecting the solder paste. The metal purity should

be as high as practical. The flux (in the paste) must

be active enough to remove the oxides formed on the

metallization prior to the exposure to soldering heat.

In practice this can be aided by extending the solder

preheat time at temperatures below the liquidous

state of the solder.

7.2 Soldering: capacitors can be attached by

conventional soldering techniques; vapor phase,

convection reflow, infrared reflow, wave soldering

and hot plate methods. The Soldering Profile charts

show recommended time / temperature conditions

for soldering. Preheating is recommended. The

recommended maximum ramp rate is 2 °C per s.

Attachment with a soldering iron is not

recommended due to the difficulty of controlling

temperature and time at temperature. The soldering

iron must never come in contact with the capacitor.

7.2.1 Backward and Forward Compatibility: capacitors

with SnPb or 100 % tin termination finishes can be

soldered using SnPb or lead (Pb)-free soldering

processes.

8. Cleaning (Flux Removal) After Soldering: molded

capacitors are compatible with all commonly used

solvents such as TES, TMS, Prelete, Chlorethane,

Terpene and aqueous cleaning media. However,

CFC / ODS products are not used in the production

of these devices and are not recommended.

Solvents containing methylene chloride or other

epoxy solvents should be avoided since these will

attack the epoxy encapsulation material.

8.1 When using ultrasonic cleaning, the board may

resonate if the output power is too high. This

vibration can cause cracking or a decrease in the

adherence of the termination. DO NOT EXCEED 9W/l

at 40 kHz for 2 min.

9. Recommended Mounting Pad Geometries: proper

mounting pad geometries are essential for

successful solder connections. These dimensions

are highly process sensitive and should be designed

to minimize component rework due to unacceptable

solder joints. The dimensional configurations shown

are the recommended pad geometries for both wave

and reflow soldering techniques. These dimensions

are intended to be a starting point for circuit board

designers and may be fine tuned if necessary based

upon the peculiarities of the soldering process and /

or circuit board design.

TEMPERATURE DERATING FACTOR

+25 °C 1.0

+85 °C 0.9

+125 °C 0.4

IRMS

RESR

------------=

VRMS ZP

RESR

------------=

VRMS IRMS x Z=

Typical Performance Characteristics

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Revision: 26-Jun-17 1Document Number: 40215

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Molded Chip Tantalum Capacitors, Automotive Grade

Notes

• All information presented in this document reflects typical performance characteristics

(1) Series TH3 - up to 150 °C; TH4 - up to 175 °C

(2) Capacitance value 15 μF and higher

(3) For 293D and TR3 only

Note

• For temperatures above +85 °C the same voltage derating ratio is recommended, but with respect to category voltage.

Up to +85 °C: category voltage = rated voltage

At +125 °C: category voltage = 2/3 of rated voltage

At 150 °C / 175 °C: category voltage = 1/2 of rated voltage

ELECTRICAL PERFORMANCE CHARACTERISTICS

ITEM PERFORMANCE CHARACTERISTICS

Category temperature range -55 °C to +85 °C

(to +125 °C / +150 °C / +175 °C with voltage derating - refer to graph “Category Voltage vs. Temperature”) (1)

Capacitance tolerance ± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz

Dissipation factor Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz

ESR Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz

Leakage current After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 kΩ

resistor in series with the capacitor under test, leakage current at 25 °C is not more than 0.01 CV or 0.5 μA,

whichever is greater. Note that the leakage current varies with temperature and applied voltage. See graph

“Typical Leakage Current Temperature Factor” for the appropriate adjustment factor.

Capacitance change by

temperature

+30 % max. (at +175 °C)

+20 % max. (at +125 °C and +150 °C)

+10 % max. (at +85 °C)

-10 % max. (at -55 °C)

Reverse voltage Capacitors are capable of withstanding peak voltages in the reverse direction equal to:

10 % of the DC rating at +25 °C

5 % of the DC rating at +85 °C

1 % of the DC rating at +125 °C

Ripple current For maximum ripple current values (at 25 °C) refer to relevant datasheet. If capacitors are to be used at

temperatures above +25 °C, the permissible RMS ripple current (or voltage) shall be calculated using the

derating factors:

1.0 at +25 °C

0.9 at +85 °C

0.4 at +125 °C

0.3 at +150 °C

0.2 at +175 °C

Maximum operating

and surge voltages vs.

temperature

+85 °C +125 °C +150 °C / +175 °C

RATED VOLTAGE

(V)

SURGE VOLTAGE

(V)