LM48860TLX - National Semiconductor

LM48860

LM48860 Ground-Referenced, Ultra Low Noise, Fixed Gain Stereo

Headphone Amplifier

Literature Number: SNAS398C

October 17, 2008

LM48860

Ground-Referenced, Ultra Low Noise, Fixed Gain Stereo

Headphone Amplifier

General Description

The LM48860 is a ground referenced, fixed-gain audio power

amplifier capable of delivering 40mW per channel of contin-

uous average power into a 16Ω single-ended load with less

than 1% THD+N from a 3V power supply.

The LM48860 features a new circuit technology that utilizes

a charge pump to generate a negative reference voltage. This

allows the outputs to be biased about ground, thereby elimi-

nating output-coupling capacitors typically used with normal

single-ended loads.

Boomer audio power amplifiers were designed specifically to

provide high quality output power with a minimal amount of

external components. The LM48860 does not require output

coupling capacitors or bootstrap capacitors, and therefore is

ideally suited for mobile phone and other low voltage appli-

cations where minimal power consumption is a primary re-

quirement.

The LM48860 features a low-power consumption shutdown

mode selectable for either channel separately. This is accom-

plished by driving either the SD_RC (Shutdown Right Chan-

nel) or SD_LC (Shutdown Left Channel) (or both) pins with

logic low, depending on which channel is desired shutdown.

Additionally, the LM48860 features an internal thermal shut-

down protection mechanism.

The LM48860 contains advanced pop & click circuitry that

eliminates noises which would otherwise occur during turn-on

and turn-off transitions.

The LM48860 has an internal fixed gain of 1.5V/V.

Key Specifications

■ PSRR at 217Hz (VDD = 3.0V) 80dB (typ)

■ Stereo Power Output at VDD = 3V

RL = 16Ω, THD+N = 1% 40mW (typ)

■ Shutdown Current 0.1μA (typ)

■ Internal Fixed Gain 1.5V/V (typ)

■ Operating Voltage 2.0V to 5.5V

Features

■Fixed logic levels with supply voltage

■Ground referenced outputs

■High PSRR

■Available in space-saving micro SMD package

■Ultra low current shutdown mode

■Improved pop & click circuitry eliminates noises during

turn-on and turn-off transitions

■No output coupling capacitors, snubber networks,

bootstrap capacitors, or gain-setting resistors required

■Shutdown either channel independently

Applications

■Mobile Phones

■MP3 Players

■PDAs

■Portable electronic devices

■Notebook PCs

Boomer® is a registered trademark of National Semiconductor Corporation.

LM48860 Ground-Referenced, Ultra Low Noise, Fixed Gain Stereo Headphone Amplifier

Typical Application

30006889

FIGURE 1. Typical Audio Amplifier Application Circuit

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LM48860

Connection Diagram

LM48860TL Pinout

(BUMP DOWN VIEW )

30006813

Top View

Order Number LM48860TL

See NS Package Number TLA12XXX

Pin Descriptions

Pin Name Function

A1 RIN Right Channel Input

A2 SGND Signal Ground

A3 LIN Left Channel Input

B1 ROUT Right Channel Output

B2 SD_LC Active Low Shutdown, Left Channel

B3 LOUT Left Channel Output

C1 VSS(CP) Charge Pump Voltage Output

C2 SD_RC Active-Low Shutdown, Right Channel

C3 VDD Supply Voltage

D1 CCP- Negative Terminal - Charge Pump Flying Capacitor

D2 PGND Power Ground

D3 CCP+ Positive Terminal - Charge Pump Flying Capacitor

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LM48860

Absolute Maximum Ratings (Notes 2, 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65°C to +150°C

Input Voltage -0.3V to VDD

Power Dissipation (Note 3) Internally Limited

ESD Rating(Note 4) 2000V

ESD Rating (Note 5) 200V

Junction Temperature 150°C

Thermal Resistance

θJA (typ) TLA12XXX 59.3°C/W

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ 85°C

Supply Voltage (VDD) 2.0V ≤ VDD ≤ 5.5V

Electrical Characteristics VDD = 3V (Notes 1, 2)

The following specifications apply for VDD = 3V and 16Ω load unless otherwise specified. Limits apply to TA = 25°C.

Symbol Parameter Conditions

LM48860 Units

(Limits)

Typical

(Note 6)

Limit

(Note 7)

IDD

Quiescent Power Supply Current

Full Power Mode

VDD = 3.0V,

VIN = 0V, inputs terminated

both channels enabled

4 5.5 mA (max)

VDD = 5.0V,

VIN = 0V, inputs terminated

both channels enabled

4.2 mA

ISD Shutdown Current

SD_LC = SD_RC= GND 0.1 1 µA (max)

SD_LC = SD_RC= GND,

VDD = 5.0V 0.1 1 µA (max)

VOS Output Offset Voltage RL = 32Ω, VIN = 0V 0.7 5.5 mV (max)

AVVoltage Gain –1.5 V/V

ΔAVChannel-to-channel Gain

Matching

1 %

RIN Input Resistance 20 15

kΩ (min)

kΩ (max)

POOutput Power

THD+N = 1% (max); f = 1kHz,

RL = 16Ω, (two channels in phase) 40 35 mW (min)

THD+N = 1% (max); f = 1kHz,

RL = 32Ω, (two channels in phase) 50 40 mW (min)

THD+N Total Harmonic Distortion +

Noise

PO = 20mW, f = 1kHz, RL = 16Ω

(two channels in phase) 0.025 %

PO = 25mW, f = 1kHz, RL = 32Ω

(two channels in phase) 0.014 %

PSRR Power Supply Rejection Ratio

Full Power Mode

VRIPPLE = 200mVPP, Input Referred

f = 217Hz 80 73 dB (min)

f = 1kHz 75 dB

f = 20kHz 60 dB

SNR Signal-to-Noise Ratio

RL = 32Ω, POUT = 50mW,

f = 1kHz, BW = 20Hz to 22kHz,

A-weighted

105 dB

VIH Shutdown Input Voltage High VDD = 2.0V to 5.5V 1.2 V (min)

VIL Shutdown Input Voltage Low VDD = 2.0V to 5.5V 0.45 V (max)

XTALK Crosstalk RL = 16Ω, PO = 1.6mW,

f = 1kHz 75 dB

∈OS Output Noise A-weighted filter, VIN = 0V 8 μV

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LM48860

Symbol Parameter Conditions

LM48860 Units

(Limits)

Typical

(Note 6)

Limit

(Note 7)

ZOUT Output Impedance

VSD = GND

Input Terminated

Input not terminated

SD_LC = SD_RC = GND

20 kΩ (min)

kΩ

ILInput Leakage ±0.1 nA

Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability

and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in

the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the

device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified

or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature, TA. The maximum

allowable power dissipation is PDMAX = (TJMAX - TA) / θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM48860, see power

derating curves for additional information.

Note 4: Human body model, applicable std. JESD22-A114C.

Note 5: Machine model, applicable std. JESD22-A115-A.

Note 6: Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of product

characterization and are not guaranteed.

Note 7: Datasheet min/max specification limits are guaranteed by test or statistical analysis.

Note 8: θJA value is measured with the device mounted on a PCB with a 1.5” x 1.375”, 1oz copper heatsink.

External Components Description

(Figure 1)

Components Functional Description

1. C1

Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a high pass-

pass filter with Ri at fC = 1/(2RiC1). Refer to the section Proper Selection of External Components, for an

explanation of how to determine the value of C1.

2. C2

Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a high pass-

pass filter with Ri at fC = 1/(2RiC2). Refer to the Power Supply Bypassing section for an explanation of how to

determine the value of C2.

3. C3Output capacitor. Low ESR ceramic capacitor (≤100mΩ)

4. C4Flying capacitor. Low ESR ceramic capacitor (≤100mΩ)

5. C5

Tantalum capacitor. Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply

Bypassing section for information concerning proper placement and selection of the supply bypass capacitor.

6. C6

Ceramic capacitor. Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply

Bypassing section for information concerning proper placement and selection of the supply bypass capacitor.

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LM48860

Typical Performance Characteristics

THD+N vs Output Power

VDD = 3V, RL = 16Ω

f = 1kHz, 22kHz BW, one channel enabled

300068d2

THD+N vs Output Power

VDD = 3V, RL = 16Ω, f = 1kHz

22kHz BW, two channels in phase

30006824

THD+N vs Output Power

VDD = 3V, RL = 32Ω

f = 1kHz, 22kHz BW, one channel enabled

300068d3

THD+N vs Output Power

VDD = 3V, RL = 32Ω, f = 1kHz

22kHz BW, two channels in phase

30006825

THD+N vs Output Power

VDD = 3.6V, RL = 16Ω

f = 1kHz, 22kHz BW, one channel enabled

300068c8

THD+N vs Output Power

VDD = 3.6V, RL = 16Ω, f = 1kHz

22kHz BW, two channels in phase

300068c9

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LM48860

THD+N vs Output Power

VDD = 3.6V, RL = 32Ω

f = 1kHz, 22kHz BW, one channel enabled

300068d0

THD+N vs Output Power

VDD = 3.6V, RL = 32Ω, f = 1kHz

22kHz BW, two channels in phase

300068d1

THD+N vs Output Power

VDD = 4.2V, RL = 16Ω

f = 1kHz, 22kHz BW, one channel enabled

300068d4

THD+N vs Output Power

VDD = 4.2V, RL = 16Ω, f = 1kHz

22kHz BW, two channels in phase

300068d5

THD+N vs Output Power

VDD = 4.2V, RL = 32Ω

f = 1kHz, 22kHz BW, one channel enabled

300068d6

THD+N vs Output Power

VDD = 4.2V, RL = 32Ω, f = 1kHz

22kHz BW, two channels in phase

300068d7

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LM48860

THD+N vs Frequency

VDD = 3V, RL = 16Ω

PO = 20mW, 22kHz BW

30006822

THD+N vs Frequency

VDD = 3V, RL = 32Ω

PO = 20mW, 22kHz BW

30006823

THD+N vs Frequency

VDD = 3.6V, RL = 16Ω

PO = 30mW, 22kHz BW

300068c4

THD+N vs Frequency

VDD = 3.6V, RL = 32Ω

PO = 30mW, 22kHz BW

300068c5

THD+N vs Frequency

VDD = 4.2V, RL = 16Ω

PO = 30mW, 22kHz BW

300068c6

THD+N vs Frequency

VDD = 4.2V, RL = 32Ω

PO = 30mW, 22kHz BW

300068c7

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LM48860

PSRR vs Frequency

VDD = 3V, RL = 16Ω

VRIPPLE = 200mVPP

30006887

PSRR vs Frequency

VDD = 3V, RL = 32Ω

VRIPPLE = 200mVPP

30006888

PSRR vs Frequency

VDD = 3.6V, RL = 16Ω

VRIPPLE = 200mVPP

300068c0

PSRR vs Frequency

VDD = 3.6V, RL = 32Ω

VRIPPLE = 200mVPP

300068c1

PSRR vs Frequency

VDD = 4.2V, RL = 16Ω

VRIPPLE = 200mVPP

300068c2

PSRR vs Frequency

VDD = 4.2V, RL = 32Ω

VRIPPLE = 200mVPP

300068c3

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LM48860

Output Power vs Supply Voltage

RL = 16Ω, f = 1kHz, 22kHz BW

30006885

Output Power vs Supply Voltage

RL = 32Ω, f = 1kHz, 22kHz BW

30006886

Power Dissipation vs Output Power

VDD = 3V, RL = 16Ω, f = 1kHz

30006894

Power Dissipation vs Output Power

VDD = 3V, RL = 32Ω, f = 1kHz

30006895

Power Dissipation vs Output Power

VDD = 5V, RL = 16Ω, f = 1kHz

30006896

Power Dissipation vs Output Power

VDD = 5V, RL = 32Ω, f = 1kHz

30006897

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LM48860

Supply Current vs Supply Voltage

VIN = GND, No Load

30006898

Power Derating Curve

VDD = 3V, RL = 16Ω

30006890

Power Derating Curve

VDD = 3V, RL = 32Ω

30006891

Power Derating Curve

VDD = 5V, RL = 16Ω

30006892

Power Derating Curve

VDD = 5V, RL = 32Ω

30006893

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LM48860

Application Information

SUPPLY VOLTAGE SEQUENCING

It is a good general practice to first apply the supply voltage

to a CMOS device before any other signal or supply on other

pins. This is also true for the LM48860 audio amplifier which

is a CMOS device.

Before applying any signal to the inputs or shutdown pins of

the LM48860, it is important to apply a supply voltage to the

VDD pins. After the device has been powered, signals may be

applied to the shutdown pins (see MICRO POWER SHUT-

DOWN) and input pins.

ELIMINATING THE OUTPUT COUPLING CAPACITOR

The LM48860 features a low noise inverting charge pump that

generates an internal negative supply voltage. This allows the

outputs of the LM48860 to be biased about GND instead of a

nominal DC voltage, like traditional headphone amplifiers.

Because there is no DC component, the large DC blocking

capacitors (typically 220µF) are not necessary. The coupling

capacitors are replaced by two, small ceramic charge pump

capacitors, saving board space and cost.

Eliminating the output coupling capacitors also improves low

frequency response. In traditional headphone amplifiers, the

headphone impedance and the output capacitor form a high

pass filter that not only blocks the DC component of the out-

put, but also attenuates low frequencies, impacting the bass

response. Because the LM48860 does not require the output

coupling capacitors, the low frequency response of the device

is not degraded by external components.

In addition to eliminating the output coupling capacitors, the

ground referenced output nearly doubles the available dy-

namic range of the LM48860 when compared to a traditional

headphone amplifier operating from the same supply voltage.

OUTPUT TRANSIENT ('CLICK AND POPS') ELIMINATED

The LM48860 contains advanced circuitry that virtually elim-

inates output transients ('clicks and pops'). This circuitry pre-

vents all traces of transients when the supply voltage is first

applied or when the part resumes operation after coming out

of shutdown mode.

AMPLIFIER CONFIGURATION EXPLANATION

As shown in Figure 2, the LM48860 has two internal opera-

tional amplifiers. The two amplifiers have internally configured

gain.

Since this is an output ground-referenced amplifier, the

LM48860 does not require output coupling capacitors.

POWER DISSIPATION

From the graph (THD+N vs Output Power , VDD = 3V, RL =

16Ω, f = 1kHz, 22kH BW, two channels in phase, page 6)

assuming a 3V power supply and a 16Ω load, the maximum

power dissipation point and thus the maximum package dis-

sipation point is 281mW. The maximum power dissipation

point obtained must not be greater than the power dissipation

that results from Equation 1.

PDMAX = (TJMAX - TA) / (θJA) (1)

For the micro SMD package θ JA = 59.3°C/W. TJMAX = 150°C

for the LM48860. Depending on the ambient temperature,

TA, of the system surroundings, Equation 1 can be used to

find the maximum internal power dissipation supported by the

IC packaging. If the maximum power dissipation from the

graph is greater than that of Equation 1, then either the supply

voltage must be decreased, the load impedance increased or

TA reduced (see power derating curves). For the application

of a 5V power supply, with a 16Ω load, the maximum ambient

temperature possible without violating the maximum junction

temperature is approximately 110°C provided that device op-

eration is around the maximum power dissipation point. Pow-

er dissipation is a function of output power and thus, if typical

operation is not around the maximum power dissipation point,

the ambient temperature may be increased accordingly.

POWER SUPPLY BYPASSING

As with any power amplifier, proper supply bypassing is crit-

ical for low noise performance and high power supply rejec-

tion. Applications that employ a 3V power supply typically use

a 4.7µF capacitor in parallel with a 0.1µF ceramic filter ca-

pacitor to stabilize the power supply's output, reduce noise on

the supply line, and improve the supply's transient response.

Keep the length of leads and traces that connect capacitors

between the LM48860's power supply pin and ground as short

as possible.

MICRO POWER SHUTDOWN

The voltage applied to the SD_LC (shutdown left channel) pin

and the SD_RC (shutdown right channel) pin controls the

LM48860’s shutdown function. When active, the LM48860’s

micropower shutdown feature turns off the amplifiers’ bias

circuitry, reducing the supply current. The trigger point is

0.45V for a logic-low level, and 1.2V for logic-high level. The

low 0.01µA (typ) shutdown current is achieved by applying a

voltage that is as near as ground a possible to the SD_LC/

SD_RC pins. A voltage that is higher than ground may in-

crease the shutdown current. Do not let SD_LC/SD_RC float,

connect either to high or low.

SELECTING PROPER EXTERNAL COMPONENTS

Optimizing the LM48860's performance requires properly se-

lecting external components. Though the LM48860 operates

well when using external components with wide tolerances,

best performance is achieved by optimizing component val-

ues.

Charge Pump Capacitor Selection

Use low ESR (equivalent series resistance) (<100mΩ) ce-

ramic capacitors with an X7R dielectric for best performance.

Low ESR capacitors keep the charge pump output

impedance to a minimum, extending the headroom on the

negative supply. Higher ESR capacitors result in reduced

output power from the audio amplifiers.

Charge pump load regulation and output impedance are af-

fected by the value of the flying capacitor (C4). A larger valued

C4 (up to 3.3uF) improves load regulation and minimizes

charge pump output resistance. Beyond 3.3uF, the switch-on

resistance dominates the output impedance.

The output ripple is affected by the value and ESR of the out-

put capacitor (C3). Larger capacitors reduce output ripple on

the negative power supply. Lower ESR capacitors minimize

the output ripple and reduce the output impedance of the

charge pump.

The LM48860 charge pump design is optimized for 2.2uF, low

ESR, ceramic, flying and output capacitors.

Input Capacitor Value Selection

Amplifying the lowest audio frequencies requires high value

input coupling capacitors (C1 and C2 in Figure 1). A high val-

ue capacitor can be expensive and may compromise space

efficiency in portable designs. In many cases, however, the

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LM48860

speakers used in portable systems, whether internal or ex-

ternal, have little ability to reproduce signals below 150Hz.

Applications using speakers with this limited frequency re-

sponse reap little improvement by using high value input and

output capacitors.

As shown in Figure 1, the internal input resistor, Ri and the

input capacitors, C1 and C2, produce a -3dB high-pass filter

cutoff frequency that is found using Equation (2).

fi-3dB = 1 / 2πRINC (Hz) (2)

The value of RIN can be found in the Electrical Characteris-

tics tables.

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LM48860

Demonstration Board PCB Layout

300068a5

Top Silkscreen

300068a4

Top Layer

300068a2

Midlayer 1

300068a3

Midlayer 2

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LM48860

300068a0

Bottom Layer

300068a1

Bottom Silkscreen

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LM48860

Revision History

Rev Date Description

1.0 01/16/08 Initial release.

1.01 01/29/08 Text edits.

1.02 02/14/08 Fixed typos (x-axis) on few curves.

1.03 10/17/08 Edited the X1 and X2 limits under the Physical Dimension section.

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LM48860

Physical Dimensions inches (millimeters) unless otherwise noted

12 – Bump micro SMD

Order Number LM48860TL

NS Package Number TLA12XXX

X1 = 1.5±0.03mm, X2 = 2.0±0.03mm, X3 = 0.600±0.075mm,

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LM48860

Notes

LM48860 Ground-Referenced, Ultra Low Noise, Fixed Gain Stereo Headphone Amplifier

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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265