SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 1 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
Description
The source color devices are made with InGaN Light
Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
2.2x1.4mm SURFACE MOUNT LED LAMP
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Part Number: AA2214VRBXS/A-SC-AMT Blue
Features
zHigh reliability LED package.
z2.2mm x 1.4mm, 1.3mm high.
zLow power consumption.
zAvailable on tape and reel.
zPackage : 2000pcs / reel.
zMoisture sensitivity level : level 3.
zRoHS compliant.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
Applications
zTraffic signaling.
zBacklighting (illuminated advertising , general lighting).
zInterior and exterior automotive lighting.
zSubstitution of micro incandescent lamps.
zReading lamps.
zSignal and symbol luminaire for orientation.
zMarker lights (e.g. Steps, exit ways, etc).
zDecorative and entertainment lighting.
zIndoor and outdoor commercial and residential
architectural lighting.
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 2 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame-
ter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 3 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
Selection Guide
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
Part No. Dice Lens Type
Iv (mcd) [2]
@ 20mA
V
iewing
Angle [1]
Code. Min. Max. 2θ1/2
AA2214VRBXS/A-SC-AMT Blue (InGaN) Water Clear 120°
S 500 700
T 700 1000
U 1000 1300
Electrical / Optical Characteristics at Ta=25°C
Notes:
1. Rth(j-a) Results from mounting on PC board FR4 (pad size16 mm2 per pad),
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Absolute Maximum Ratings at Ta=25°C
Notes:
1.Measurement tolerance of the chromaticity coordinates is ±0.01.
2.Forward Voltage: +/-0.1V.
Parameter Symbol Value Unit
Power dissipation PD 120 mW
Reverse Voltage VR 5 V
Junction temperature TJ 110 °C
Operating Temperature Top -40 To +10 0 °C
Storage Temperature Ts tg -40 To +11 0 °C
DC Forward Current[1] IF 30 mA
Peak Forward Current [2] IFM 100 mA
Electrostatic Discharge Threshold (HBM) 250 V
Thermal Resistance (Junction/ambient) [1] Rth j-a 300 °C/W
Parameter Symbol Value Unit
Chromaticity Coordinates IF=20mA X [1] 0.19 -
Y[1] 0.19 -
Forward Voltage IF=20mA [Min.]
VF [2]
-
V
Forward Voltage IF=20mA [Typ.] 3.3
Forward Voltage IF=20mA [Max.] 4.0
Reverse Current (VR = 5V) [Max.] IR 50 uA
Temperature coefficient of VF
IF=20mA, -10°C T100°C [Typ.] TCV -2.2 mV/°C
Temperature coefficient of X
IF=20mA, -10°C T100°C [Typ.] TCx -0.1 10-3/°C
Temperature coefficient of Y
IF=20mA, -10°C T100°C [Typ.] TCy -0.2 10-3°C
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 4 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
Blue AA2214VRBXS/A-SC-AMT
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 5 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
AA2214VRBXS/A-SC-AMT
CIE 1931
0.12
0.14
0.16
0.18
0.20
0.22
0.24
0.26
0.14 0.16 0.18 0.2 0.22 0.24
x
y
BSC1
BSC2
BSC3
Notes:
Shipment may contain more than one chromaticity regions.
Orders for single chromaticity region are generally not accepted.
Measurement tolerance of the chromaticity coordinates is ±0.01.
Bin code x y Bin code x y Bin code x y
BSC1
0.1861 0.2232
BSC2
0.1813 0.2021 0.1767 0.1819
0.1813 0.2021 0.1767 0.1819 0.1723 0.1626
0.1993 0.1957 0.1947 0.1760 0.1903 0.1572
0.2040 0.2163 0.1993 0.1957 0.1947 0.1760
BSC3
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 6 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
AA2214VRBXS/A-SC-AMT
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1) Reel Dimension
Tape Dimensions
(Units : mm)
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 7 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
PACKING & LABEL SPECIFICATIONS AA2214VRBXS/A-SC-AMT
SPEC NO: DSAL5013 REV NO: V.1 DATE: DEC/23/2010 PAGE: 8 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Y.H.Wu ERP: 1201007474
Failure Criteria
Items Symbols Conditions Failure Criteria
luminous Intensity lv IF = 20mA Testing Min. Value <Spec.Min.Value x 0.5
Forward Voltage VF IF = 20mA Testing Max. Value Spec.Max.Value x 1.2
Reverse Current IR VR = Maximum Rated Reverse Voltage Testing Max. Value Spec.Max.Value x 2.5
High temp. storage test - - Occurrence of notable decoloration, deformation
and cracking
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
No. Test Item Standards Test Condition Test Times /
Cycles
Number of
Damaged
1 Continuous operating test - Ta =25°C ,IF = maximum rated current* 1,000 h 0 / 22
2 High Temp. operating test EIAJED-
4701/100(101) Ta = 100°C IF = maximum rated current* 1,000 h 0 / 22
3 Low Temp. operating test - Ta = -40°C, IF = maximum rated current* 1,000 h 0 / 22
4 High temp. storage test EIAJED-
4701/100(201) Ta = maximum rated storage temperature 1,000 h 0 / 22
5 Low temp. storage test EIAJED-
4701/100(202) Ta = -40°C 1,000 h 0 / 22
6 High temp. & humidity storage test EIAJED-
4701/100(103) Ta = 60°C, RH = 90% 1,000 h 0 / 22
7 High temp. & humidity operating test EIAJED-
4701/100(102)
Ta = 60°C, RH = 90%
IF = maximum rated current* 1,000 h 0 / 22
8 Soldering reliability test EIAJED-
4701/100(301)
Moisture soak : 30°C,70% RH, 72h
Preheat : 150~180°C(120s max.)
Soldering temp : 260°C(10s)
3 times 0 / 18
9 Thermal shock operating test - Ta = -40°C(15min) ~ 100°C(15min)
IF = derated current at 100°C 1,000 cycles 0 / 22
10 Thermal shock test - Ta = -40°C(15min) ~ maximum rated
storage temperature(15min) 1,000 cycles 0 / 22
11 Electric Static Discharge (ESD) EIAJED-
4701/100(304) C = 100pF , R2 = 1.5K V = 250V Once each
Polarity 0 / 22
12 Vibration test - a = 196m/s² , f = 100~2KHz ,
t = 48min for all xyz axes 4 times 0 / 22
* : Refer to forward current vs. derating curve diagram