AFBR-16xxZ and AFBR-26x4Z/25x9Z
DC-50MBd Versatile Link Fiber Optic Transmitter
and Receiver for 1 mm POF and 200 m PCS
Data Sheet
Description
The AFBR-16xxZ transmitter utilizes a 650 nm LED source
with integrated optics and driver IC for e cient coupling
into 1 mm Polymer Optical Fiber (POF). The AFBR-
26x4Z/25x9Z receiver consists of an IC with an integrated
photodiode to produce a logic compatible output. The
transmitter input and receiver output are compatible with
TTL logic families. The pair operates any type of signal
from DC up to 50 MBd at distances up to 50 m with 1 mm
POF, up to 200 m at 10 MBd and 120 m at 50 MBd with 200
m Plastic-Clad Silica (PCS), respectively.
The transmitter is a 3-pin and the receiver is a 4-pin device,
packed in Versatile Link housing. Versatile Link compo-
nents can be interlocked (N-plexed together) to minimize
space and to provide dual connections with the duplex
connectors. Various simplex and duplex connectors, as
well as POF cables are available for Versatile Link compo-
nents. For details, contact Avago Technologies or visit our
company website at www.avagotech.com
AFBR-xxx4Z are delivering non-inverted output signals
while AFBR-xxx9Z deliver inverted output signals.
AFBR-xxxxZ - Part number selection guide
Features
RoHS-compliant
Data transmission at signal rates from DC up to 50 MBd
Transmitter: integrated 650 nm LED and driver IC with
TTL input logic
Receiver: integrated PIN diode and digitalizing IC with
TTL output logic
Up to 50 m distance with 1 mm Polymer Optical Fiber
(POF) over operating temperature range
Up to 200 m (10 MBd) distance and 120 m (50 MBd)
distance with 200 m Plastic-Clad Silica (PCS) over
operating temperature range
Operating temperature range of -40 C to +85 C
Compatible with Avago’s Versatile Link family of
connectors, for easy termination of ber
Applications
Optical Transmitter and Receiver for 50 MBd systems and
below:
Industrial control and factory automation
Extension of RS-232 and RS-485
High voltage isolation
Elimination of ground loops
Reduces voltage transient susceptibility
Available options
Horizontal Package AFBR-x624Z AFBR-1629Z AFBR-2529Z
Vertical Package AFBR-x634Z AFBR-1639Z AFBR-2539Z
Tilted (30°) package AFBR-x644Z
5/6 = 650 nm products
–xx x x Z
1 = Transmitter (TX)
2 = Receiver (RX)
2 = Horizontal Package
3 = Vertical Package
4 = Tilted (30°) Package
Z = Extended Temperature Range,
RoHS Compliant
4 = 50 MBd Non-Inverted
9 = 50 MBd Inverted
AFBR
2
Application Literature
Application Note 1035 (Versatile Link) - AV02-0730EN
Package and Handling Information
The compact Versatile Link pack age is made of a ame-
retardant material and uses the same pad layout as a
standard, eight-pin dual-in-line package. Horizontal,
Vertical, and Tilted (30°) packages are available. These
low pro le Versa tile Link packages are stackable and are
enclosed to provide a dust-resistant seal. Snap action
simplex, simplex latching, duplex, and duplex latching
connectors are o ered with simplex or duplex cables.
Package Orientation
Performance and pinouts for the horizontal, vertical, and
tilted (30°) packages are identical. To provide addi tional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a self-
tapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making con-
nections. Receiver packages are black and transmitter
packages are gray in color respectively.
Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link compo-
nents, the optical port plug should be left in to prevent
contamination of the port. Do not use re ow solder
processes (i.e., infrared re ow or vapor-phase re ow).
Nonhalogenated water soluble uxes (i.e., 0% chloride),
not rosin based uxes, are recom mended for use with
Versatile Link components.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period of
time, they may require a baking step before the solder ing
process. Refer to the special labeling on the shipping tube
for details.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential en-
vironmental harm.
3
Mechanical Dimensions
Horizontal Module Vertical Module
Tilted (30°) Module
2
[0.08]
6.5
[0.26]
0.6
[0.03]
7.7
[0.30]
7.6
[0.30]
18.8
[0.74]
2.8
[0.11]
3.8[0.15]MAX.
3.6[0.14]MIN.
5.1
[0.20]
4.2
[0.17]
1.3
[0.05]
2.54
[0.100]
1.7
[0.07]
0.5
[0.02]
NOTES:
1) Dimensions: mm [in]
0.6
[
0.03]
10.2
[0.40]
2
[0.08]
18.9
[0.75]
3.3 [0.13] MAX
2.8 [0.11] MIN
0.5
[0.02]
2.54
[0.100]
1.3
[0.05]
7.6
[0.30]
1.7
[0.07]
0.6
[0.02]
3.8
[0.15]
3.8
[0.15]
7.62
[0.300]
2)
18.1
[0.71]
5.1
[0.20]
10.2
[0.40]
1
[0.04]
3.6
[0.14]
0.6
[
0.03]
NOTES:
1) Dimensions: mm [in]
2) Optional mounting hole for #2 self-tapping-screw
(metric equivalent M2.2 x 0.45)
6.5
[0.26]
A
A
NOTES:
1) Dimensions: mm [in]
6.5
[0.26]
2
[0.08]
10.2
[0.40]
18.7
[0.74]
6.6
[0.26]
15.2
[0.60]
7.62
[0.300]
2.54
[0.100]
0.5
[0.02]
1.3
[0.05]
4.6
[0.18]
0.6
[0.03]
10.1
[0.40]
8.7
[0.34]
19.3
[0.76]
1.1
[0.05]
2.2
[0.09]
4.6
[0.18]
0.4
[0.02]
30°
0.7
[0.03]
4
Versatile Link Printed Board Layout Dimensions
Horizontal Module Vertical Module
Tilted (30°) Module
7.62
[0.300]
2.54
[0.100]
7.7
[0.30]
1.9
[0.07]
PCB EDGE
MIN.
123
4
8
5
Footprint - TOP VIEW
1
[
0.04]
NOTES:
1) Dimensions: mm [in]
7.62
[0.300]
3.8
[0.15]
3.8
[0.15]
7.62
[0.300]
2.54
[0.100]
2.25 [0.09] clearance hole
for optional vertical mount
self-tapping-screw #2
PCB EDGE
1.7
[0.07] MIN.
1
2
3
4
58
Footprint - TOP VIEW
1
[0.04]
NOTES:
1) Dimensions: mm [in]
2.54
[0.100]
7.62
[0.300]
8.7
[0.34]
PCB EDGE
4321
8
5
Footprint - TOP VIEW
2.2
[0.09] MIN.
1
[0.04]
NOTES:
1) Dimensions: mm [in]
5
Interlocked (Stacked) Assemblies (refer to Figure 1)
Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This tech nique prevents
potential harm that could occur to ngers and hands of assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated stacking and unstack ing causes no damage to individual units.
To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom.
Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed.
Stacking Horizontal Modules Stacking Vertical Modules
Figure 1. Interlocked (stacked) Horizontal, Vertical and Tilted (30°) packages
Tilted (30°) Module
6
Pin Description Transmitter
Fiber port facing front, pins downward, 1 = Rightmost pin to 4 = Leftmost pin
Pin Name Function/Description Notes
1V
CCT Transmitter Power 3.3 V ± 5% or 5 V ± 5%
2 No Pin No physical pin is available
3V
EET Transmitter Ground
4 Data In Transmitter Data Input 1, 2
5 Housing Pin Physical pin is available, recommended to chassis GND 3
8 Housing Pin Physical pin is available, recommended to chassis GND 3
Pin Description Receiver
Fiber port facing front, pins downward, 1 = Rightmost pin to 4 = Leftmost pin
Pin Name Function/Description Notes
1 Data Out Receiver Data Output 2
2V
EER Receiver Ground
3V
CCR Receiver Power 3.3 V ± 5% or 5 V ± 5%
4 Pin No function, physical pin is available, recommended to signal GND 4
5 Housing Pin Physical pin is available, recommended to chassis GND 3
8 Housing Pin Physical pin is available, recommended to chassis GND 3
Notes:
1. Logic 1 input will turn the light on and the logic 0 will turn the light o for AFBR-16x4Z. Logic 1 input will turn the light o and the logic 0 will turn
the light on for AFBR-16x9Z.
2. TTL compatible data input and output.
3. Pin 5 and 8 are for mounting and retaining purposes, and should be connected to chassis GND.
4. It is recommended to connect this pin to signal GND.
TX
34 21
RX
34 21
7
Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge (ESD) to
the Electrical Pins Human Body Model
MIL-STD-883 Method 3015 Min 2000 V
Eye Safety IEC 60825-1, 2, Class 1
Speci ed Link Performance, TA = -40 C to +85 C, 50 MBd
Parameter Min Max Unit Condition Notes
Link Distance with Standard POF cable 0.1 50 meters -40 C to +85 C 1, 3
Link distance with 200 m PCS (10 MBd) 0.1 200 meters -40 C to +85 C 2, 3
Link distance with 200 m PCS (50 MBd) 0.1 120 meters -40 C to +85 C 2, 3
Notes:
1. HFBR-R/EXXYYYZ is the part number for 1 mm POF. Worst-case attenuation used (0.27 dB/m for standard loss POF cable from -40 C to +85 C at
660 nm).
2. PCS, worst-case attenuation (12 dB/km from -40 C to +85 C at 650 nm).
3. The optical link performance is guaranteed only with transmitters AFBR-16xxZ and receivers AFBR-26x4Z/25x9Z.
Figure 2. Recommended Transmitter and Receiver Application Circuit
4
VEE
TX
Data In
VCC
NC
3
2
1
10 PF
C5
1 PH
L1
GND
Gnd
8
GND
GND
VCC
10 PF
C1
GND
100 nF
C3
GND
GND
TTL Input
TTL Output
Gnd 5
Pull down
resistor
4.7 kOhm
4
VCC
RX
NC
Data Out
VEE 2
3
1
10 PF
C6
1 PH
L2
GND
Gnd
8
GND GND
VCC
10 PF
C2
GND
100 nF
C4
GND
GND
Gnd 5
8
Absolute Maximum Ratings
Parameter Symbol Min Typical Max Unit Notes
Storage Temperature Ts -40 85 °C 1
Ambient Temperature Tc -40 85 °C 1
Relative Humidity RH 0 85 % 1
Supply Voltage VCCT /VCCR -0.5 6 V 1
Data Input Voltage VIN -0.5 Vcc+0.5 V 1
Data Output Current IO10 mA 1
Data Rate DC 50 MBd
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time.
Recommended Operating Conditions
Parameter Symbol Min Typical Max Unit Notes
Ambient Temp TA-40 25 85 °C 2
Supply Voltage VCCT/VCCR 3.135 3.3 3.465 V 2
4.75 5 5.25 V 2
Notes:
2. Recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied,
and damage to the device may occur over an extended period of time. See Reliability Data Sheet for speci c reliability performance.
Process Compatibility
Parameter Symbol Min Typical Max Unit Notes
Solder Environment TSOLD 260 °C 3, 5, 6
tSOLD 10 sec 4, 5, 6
Notes:
3. Maximum temperature refers to peak temperature.
4. Maximum time refers to time spent at peak temperature.
5. Solder surface to be at least 1mm below lead frame stops.
6. Product is moisture sensitive level 3.
9
AFBR-16xxZ Transmitter
The AFBR-16xxZ transmitter incorporates a 650 nm LED and integrated driver IC in a light gray, nonconductive plastic
Versatile Link housing. Its input data is compatible with TTL logic level. This transmitter can operate from DC to 50 MBd
with any kind of data pattern using 1 mm Polymer Optical Fiber (POF). Within the speci ed ranges AFBR-16x4Z and
AFBR-16x9Z devices will support a BER < 10E-9.
Transmitter Electrical Characteristics
(T
A = -40 C to +85 C, VCCT = 3.3 V ± 5% or 5 V ± 5%)
Parameter Symbol Min Typical Max Unit Notes
Supply Current (Optical Power ON) ICCT 21 31 mA 1
Input Voltage – Low VIL -0.3 0.8 V 2
Input Voltage – High VIH 2.0 Vcc+0.3 V 2
Data Input Capacitance CIN 7pF
Data Input Resistance RIN 2k
Propagation Delay tTD 30 ns
Transmitter Optical Characteristics
(T
A = -40 C to +85 C, VCCT = 3.3 V ± 5% or 5 V ± 5%)
Parameter Symbol Min Typical Max Unit Notes
Output Optical Power (peak), 1 mm POF PN-4.5 -2 +2 dBm 3
Output Optical Power (peak), PCS (200 μm) PN-16.5 -13 -9 dBm 3
Output Optical Power (Average), OFF PS-50 dBm
Extinction Ratio ER 10 dB
Peak Wavelength c630 685 nm
Rise Time (20%–80%) tRT 5ns
Fall Time (20%–80%) tFT 5ns
Pulse Width Distortion PWD -3 +3 ns 4, 5
Pulse Width Distortion of rst pulse PWD -5 +3 ns 5, 6
Notes:
1. For any type of data between DC and 50 Mbd. Typical value 21 mA for PRBS-7 pattern at 25 C at 5 V and 50 Mbaud.
2. Standard TTL compatible input.
3. Measured with polished connector end face: after 1 meter 1 mm POF, NA = 0.5, or 200 m PCS, NA = 0.37.
4. Pulse width is measured at 50% threshold using a rising edge trigger tested with PRBS-7 pattern
5. Electrical input pulse width is determined at 1.5 V and dU/dt between 1 V and 2 V shall not be less than 1 V/ns.
6. The rst pulse is shorter as the LED is completely discharged. This helps to mitigate the increase of pulse width of the rst pulse of the Receiver
AFBR-26x4Z/25x9Z Receiver
The AFBR-26x4Z/25x9Z receiver consists of a digitalizing IC with integrated photodiode to produce an output level that
is compatible with TTL logic. The integrated photodiode and the following ampli er uses a fully di erential approach
with an active and a passive area for an improved EMI performance. Within the speci ed ranges AFBR-25x9Z and AFBR-
26x4Z devices will support a BER <10E-9.
Receiver Electrical Characteristics
(T
A = -40 °C to +85 °C, VCCT = 3.3 V ± 5% or 5 V ± 5%)
Parameter Symbol Min Typical Max Unit Notes
Supply Current ICCR 20 30 mA
Data Output Voltage – Low VOL -0.3 0.4 V 1, 3
Data Output Voltage – High VOH 2.5 VCCR+0.3 V 1, 3
Rise Time (10%–90%) tRR 5 ns 2, 3
Fall Time (10%–90%) tFR 5 ns 2, 3
Pulse Width Distortion PWD -4 +4 ns 3, 6, 7, 8, 11
Pulse Width Distortion 1st to 3rd pulse PWDinit -5 +8 ns 3, 8, 9, 11
Propagation Delay tRD 30 ns
Max. Initiation time after Power up TINT 15 ms 12
Receiver Optical Characteristics
(T
A = -40 °C to +85 °C, VCCT = 3.3 V ± 5% or 5 V ± 5%)
Parameter Symbol Min Typical Max Unit Notes
Input Optical Power (Peak), 1 mm POF PIN -22 +2 dBm 3
Input Optical Power (Peak) O -State, 1 mm POF PIN_O -40 dBm 3, 10
Input Optical Power (Peak), PCS (200 m) PIN -25 -1 dBm 3
Input Optical Power (Peak) O -State, PCS (200 m) PIN_O -44 dBm 3
Optical Spectrum Range 630 685 nm
Notes:
1. Standard TTL output.
2. Measured with RL = 50 k and CL = 15 pF
3. Guaranteed only if optical input signal to the receiver is generated by AFBR-16xxZ, with ideal alignment to photo diode using 1mm POF (NA=0.5).
6. Optical input signal of 50 MBd, PRBS 27 -1 pattern and 50% duty cycle.
7. Pulse width is measured at 50% threshold using a rising edge trigger and PRBS 27-1 pattern.
8. If data rate is below 1MBd the pulse width distortion would be equal to the pulse width distortion of the 1st to 3rd pulses for higher datarates.
9. The threshold of the 1st pulse of a data sequence is di cult to adjust and therefore the pulse width distortion up to the 3rd pulse is higher than
for all other pulses (worst case for the 1st pulse). This strongly depends on the quality of the rising and falling edge of the optical input. The faster
the edges the smaller the pulse width variation. Furthermore lower data rates would result in the same issue as all the pulse become 1st pulses.
10. Output low for AFBR-26x4Z and Output high for AFBR-25x9Z.
11. Because of optical pulse width spreading, the PWD limits have to be increased by 0.1 ns for each 10 m ber length.
12. Starting point is when supply voltage passes ~2.8 V.
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Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or
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Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out
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any license under its patent rights nor the rights of others.
AV02-4369EN - July 25, 2016
