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Revision: 20-Nov-09 191
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
Vishay Beyschlag
Professional Thin Film Chip Resistors
MCS 0402, MCT 0603, MCU 0805 and MCA 1206
Professional Thin Film Flat Chip Resistors are the perfect
choice for most fields of modern professional electronics
where reliability and stability is of major concern. Typical
applications include telecommunication, medical equipment
and high-end computer and audio/video electronics.
FEATURES
•Approved according to EN 140401-801
•Excellent overall stability: Class 0.5
•
Professional tolerance of value: ± 0.5 % and ± 1 %
•Lead (Pb)-free solder contacts
•Compliant to RoHS directive 2002/95/EC
APPLICATIONS
•Automotive
•Telecommunication
•Medical equipment
•Industrial equipment
Notes
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded.
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
METRIC SIZE
INCH: 0402 0603 0805 1206
METRIC: RR 1005M RR 1608M RR 2012M RR 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION MCS 0402 MCT 0603 MCU 0805 MCA 1206
Metric size RR 1005M RR 1608M RR 2012M RR 3216M
Resistance range 10 Ωto 4.99 MΩ1Ωto 10 MΩ1Ωto 10 MΩ1Ωto2MΩ
Resistance tolerance ± 1 %; ± 0.5 %
Temperature coefficient ± 50 ppm/K; ± 25 ppm/K
Operation mode Standard Power Standard Power Standard Power Standard Power
Climatic category (LCT/UCT/days) 55/125/56 55/155/56 55/125/56 55/155/56 55/125/56 55/155/56 55/125/56 55/155/56
Rated dissipation, P70 (1) 0.063 W 0.1 W 0.1 W 0.125 W 0.125 W 0.2 W 0.25 W 0.4 W
Operating voltage, Umax. AC/DC 50 V 75 V 150 V 200 V
Film temperature 125 °C 155 °C 125 °C 155 °C 125 °C 155 °C 125 °C 155 °C
Max. resistance change at P70
for resistance range,
|ΔR/R| max., after:
10 Ωto 4.99 MΩ1Ωto 10 MΩ1Ωto 10 MΩ1Ωto 10 MΩ
1000 h ≤ 0.25 % ≤ 0.5 % ≤ 0.25 % ≤ 0.5 % ≤ 0.25 % ≤ 0.5 % ≤ 0.25 % ≤ 0.5 %
8000 h ≤ 0.5 % ≤ 1.0 % ≤ 0.5 % ≤ 1.0 % ≤ 0.5 % ≤ 1.0 % ≤ 0.5 % ≤ 1.0 %
225 000 h ≤ 1.5 % ≤ 1.5 % ≤ 1.5 % ≤ 1.5 %
Insulation voltage:
1 min; Uins 75 V 100 V 200 V 300 V
Continuous 75 V 75 V 75 V 75 V
Failure rate: FITobserved ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h ≤ 0.1 x 10-9/h
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Vishay Beyschlag Professional Thin Film Chip Resistors
Notes
(1) Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER
(2) Jumpers are ordered by the resistance value 0 Ω, e.g. MCT 0603 P5 0R0
Note
(3) Resistance values to be selected for ± 1 % tolerance from E24 and E96; for ± 0.5 % tolerance from E24 and E192
Resistance ranges printed in bold are preferred TCR/tolerance combinations with optimized availability.
PART NUMBER AND PRODUCT DESCRIPTION (1)
PART NUMBER: MCT06030D4641DPW00
MODEL/SIZE SPECIAL CHARACTER TCR VALUE TOLERANCE PACKAGING SPECIAL
MCS0402
MCT0603
MCU0805
MCA1206
0 = Neutral D = ± 25 ppm/K
C = ± 50 ppm/K
Z = Jumper
3 digit value
1 digit
multiplier
MULTIPLIER
7 = *10-3
8 = *10-2
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
4 = *104
5 = *105
6 = *106
0000 = Jumper
D = ± 0.5 %
F = ± 1 %
Z = Jumper
P5
PW
E0
Up to 2 digits
00 = Standard
PRODUCT DESCRIPTION: MCT 0603-25 0.5 % PW 4K64
MCT 0603 -25 0.5 % PW 4K64
MODEL SIZE TCR TOLERANCE PACKAGING RESISTANCE VALUE
MCS
MCT
MCU
MCA
0402
0603
0805
1206
± 25 ppm/K
± 50 ppm/K
± 0.5 %
± 1 %
P5
PW
E0
47K = 47 kΩ
50R1 = 50.1 Ω
0R0 = Jumper (2)
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION RESISTANCE VALUE (3)
TCR TOLERANCE MCS 0402 MCT 0603 MCU 0805 MCA 1206
± 50 ppm/K ± 1 % 10 Ωto 4.99 MΩ1Ωto 10 MΩ1Ωto 10 MΩ1Ωto 2 MΩ
± 0.5 % 100 Ωto 221 kΩ39 Ωto 511 kΩ10 Ωto 1.5 MΩ10 Ωto 2 MΩ
± 25 ppm/K ± 0.5 % 100 Ωto 221 kΩ39 Ωto 511 kΩ10 Ωto 1.5 MΩ10 Ωto 2 MΩ
Jumper - ≤ 20 mΩ;
Imax. = 0.63 A
≤ 20 mΩ;
Imax. = 1 A
≤ 20 mΩ;
Imax. = 1.5 A
≤ 20 mΩ;
Imax. = 2 A
PACKAGING
MODEL
REEL
PIECES/
PAPER TAPE ON REEL CODE
MCS 0402 10 000 E0
MCT 0603 5000 P5
20 000 PW
MCU 0805 5000 P5
20 000 PW
MCA 1206 5000 P5
M C T 0 6 0 3 0 D 4 6 4 1 D P W 0 0
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DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the
reliability of the assembly.
Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
Please note however that applications for “power operation mode” require special considerations for the design of solder pads and adjacent
conductor areas.
DIMENSIONS AND MASS
TYPE H
(mm)
L
(mm)
W
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
MCS 0402 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6
MCT 0603
0.45 + 0.1/- 0.05
1.55 ± 0.05 0.85 ± 0.1 > 75 % of W
0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2
1.9
MCU 0805
0.45 + 0.1/- 0.05
2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6
MCA 1206
0.55
±
0.1
3.2 ± 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2
T2
T1
L
H
WWT
GX
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
WAVE SOLDERING REFLOW SOLDERING
G
(mm) Y
(mm) X
(mm) Z
(mm) G
(mm) Y
(mm) X
(mm) Z
(mm)
MCS 0402 - - - - 0.35 0.55 0.55 1.45
MCT 0603 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MCA 1206 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
Al2O3 ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly cutting a meander
groove in the resistive layer without damaging the ceramics.
For the high and low ohmic range, optimized Cermet
products provide comparable properties. The resistor
elements are covered by a protective coating designed for
electrical, mechanical and climatic protection. The
terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. Only
accepted products are laid directly into the paper tape in
accordance with IEC 60286-3 (3).
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the GADSL (1) and the
CEFIC-EECA-EICTA (2) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
•2000/53/EC End of Vehicle life Directive (ELV) an Annex II
(ELV II)
•2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
•2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 140400 and the variety of environmental test procedures
of the IEC 60068 (3) series. The detail specification refers to
the climatic category 55/125/56, which relates to the
“standard operation mode” of this datasheet.
Conformity is attested by the use of the CECC Logo ( ) as
the Mark of Conformity on the package label.
Vishay BEYSCHLAG has achieved “Approval of
Manufacturer” in accordance with IEC QC 001002-3,
clause 2. The release certificate for “Technology Approval
Schedule” in accordance with CECC 240001 based on
IEC QC 001002-3, clause 6 is granted for the
Vishay BEYSCHLAG manufacturing process.
RELATED PRODUCTS
This product family of thin film flat chip resistors is completed
by Zero Ohm Jumpers.
For more information about products with better TCR and
tighter tolerance please refer to the Precision Thin Film
Chip Resistors datasheet document no. 28700.
On request, resistors are available with established
reliability in accordance with EN 140401-801 version E.
Please refer to the special datasheet document no. 28744 for
information on failure rate level, available resistance ranges
and order codes.
Precision chip resistor arrays may be used in voltage
divider applications or precision amplifiers where close
matching between multiple resistors is necessary.
ACAS 0612 chip arrays are specified by the following
datasheets:
•Professional type, document no. 28754
•Precision type, document no. 28751
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org/index.php?id=995
→ issues → environment policy → chemicals → chemicals for electronics
(3) The quoted IEC standards are also released as EN standards with the same number and identical contents
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FUNCTIONAL PERFORMANCE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
0.1
0.2
W
Power Dissipation
°C
100 150- 50 0 50 70
ϑ
Ambient Te mperature
amb
0
P
Derating - Standard Operation
0.1
0.2
0.3
0.4
0.5
W
Power Dissipation
P
°C
100 150- 50 0 50 70
ϑ
Ambient Te mperature
amb
MCS 0402
MCT 0603
MCU 0805
MCA 1206
Derating - Power Operation
1
W
100
10
Pulse Load max.
100 µs 1 ms 10 ms 1 s 10 s10 µs 100 ms
Pulse Duration
i
0.1
MCS 0402
MCT 0603
MCU 0805
MCA 1206
P
t
Maximum pulse load, single pulse; for permissible resistance change equivalent to 8000 h operation
Single Pulse
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1
W
10
100
Continuous Pulse Load
100 µs 1 ms 10 ms 1 s 10 s
10 µs 100 ms
Pulse Duration
0.1
max.
i
MCS 0402
MCT 0603
MCU 0805
MCA 1206
P
t
Maximum pulse load, continuous pulses; for permissible resistance change equivalent to 8000 h operation
Continuous Pulse
1 kV
100 µs 1 ms 10 ms 1 s 10 s
10 µs 100 ms
100 V
10 V
Pulse Voltage
Pulse Duration
max.
i
U
t
MCS 0402
MCT 0603
MCU 0805
MCA 1206
Maximum pulse voltage, single and continuous pulses; for permissible resistance change equivalent to 8000 h operation
Pulse Voltage
100 V
1 kV
10 V
10 kV
Resistance V alue
T
est
V
o
l
tage
100 Ω1 kΩ10 kΩ100 kΩ1 MΩ
10 Ω10 MΩ
MCS 0402
MCT 0603
MCU 0805,
MCA 1206
R
Pulse load rating in accordance with EN 60115-1 clause 4.27; 1.2 µs/50 µs; 5 pulses at 12 s interval;
for permissible resistance change 0.5 %
1.2/50 Pulse
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100 V
1 kV
10 V
10 kV
Resistance V alue R
T
est
V
o
l
tage
100
Ω
1 k
Ω
10 k
Ω
100 k
Ω
1 M
Ω
10
Ω
10 M
Ω
MCS 0402
MCT 0603
MCU 0805,
MCA 1206
Pulse load rating in accordance with EN 60115-1 clause 4.27; 10 µs/700 µs;
10 pulses at 1 min intervals; for permissible resistance change 0.5 %
10/700 Pulse
Resistance Value
Current Noise
A
1
0.01
1 k
Ω
10 k
Ω
100 k
Ω
1 M
Ω
10 M
Ω
0.1
1
µV/V
MCS 0402
MCT 0603
MCU 0805
MCA 1206
R
100
Ω
3
Current noise A1 in accordance with IEC 60195
Current Noise
0.1 0.3 1 GHz 20
0.5
1.0
1.5
2.0
Frequency
310
MC T 060 3
M CU 0805
f
| |/
R
Z
|Z|/R for 49.9 Ω chip resistor
RF-Behaviour
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TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification (includes tests)
EN 140400, sectional specification (includes schedule for
qualification approval)
EN 140401-801, detail specification (includes schedule for
conformance inspection)
The components are approved in accordance with the
European CECC-system, where applicable. The following
table contains only the most important tests. For the full test
schedule refer to the documents listed above. The testing
also covers most of the requirements specified by
EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
STABILITY
CLASS 0.5
STABILITY
CLASS 1
Stability for product types:
MCS 0402 10 Ωto 33.2 kΩ> 33.2 kΩto 4.99 MΩ
MCT 0603 10 Ωto 100 kΩ1Ωto < 10 Ω;
> 100 kΩto 10 MΩ
MCU 0805 10 Ωto 221 kΩ1Ωto < 10 Ω;
> 221 kΩto 10 MΩ
MCA 1206 10 Ωto 332 kΩ1Ωto < 10 Ω;
> 332 kΩto2MΩ
4.5 - Resistance ± 1 % R; ± 0.5 % R
4.8.4.2 - Temperature
coefficient
At (20/- 55/20) °C and
(20/125/20) °C± 50 ppm/K; ± 25 ppm/K
4.25.1 -
Endurance at
70 °C:
Standard
operation mode
U= or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.25 % R +0.05Ω)
70 °C; 8000 h ± (0.5 % R +0.05Ω)
Endurance at
70 °C:
Power
operation mode
U= or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.5 % R +0.05Ω)
70 °C; 8000 h ± (1 % R+0.05Ω)
4.25.3 -
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
± (0.25 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.5 % R+0.05Ω)± (1 % R + 0.05 Ω)
P70 x R
P70 x R
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4.23 Climatic
sequence:
± (0.5 % R+0.05 Ω)± (1 % R+0.05 Ω)
4.23.2 2 (Ba) dry heat UCT; 16 h
4.23.3 30 (Db) damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Aa) cold LCT; 2 h
4.23.5 13 (M) low air
pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) damp heat,
cyclic
55 °C; 5 days; > 90 % RH;
5 cycles
4.23.7 - DC load
U= ≤ Umax.;
1 min
LCT = - 55 °C
UCT = 125 °C
- 1 (Aa) Cold - 55 °C; 2 h ± (0.1 % R+0.01Ω) ± (0.25 % R+0.05 Ω)
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
5 cycles
± (0.1 % R+0.01Ω)
no visible damage
LCT = - 55 °C;
UCT = 125 °C; 1000 cycles
± (0.25 % R+0.05Ω)
no visible damage
4.13 -
Short time
overload;
standard
operation mode
U= 2.5 x or
U=2x Umax.;
whichever is the less severe;
5 s
± (0.1 % R+0.01Ω) ± (0.25 % R+0.05Ω)
Short time
overload;
power
operation mode
± (0.25 % R+0.05Ω) ± (0.5 % R+0.05Ω)
4.27 -
Single pulse
high voltage
overload;
standard
operation mode
Severity no. 4:
U= 10 x or
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 µs/700 µs
± (0.5 % R+0.05Ω)
no visible damage
4.37 -
Periodic electric
overload;
standard
operation mode
U= or
U = 2xUmax.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R+0.05Ω)
no visible damage
Periodic electric
overload;
power
operation
mode
± (1 % R+0.05Ω)
no visible damage
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
STABILITY
CLASS 0.5
STABILITY
CLASS 1
Stability for product types:
MCS 0402 10 Ωto 33.2 kΩ> 33.2 kΩto 4.99 MΩ
MCT 0603 10 Ωto 100 kΩ1Ωto < 10 Ω;
> 100 kΩto 10 MΩ
MCU 0805 10 Ωto 221 kΩ1Ωto < 10 Ω;
> 221 kΩto 10 MΩ
MCA 1206 10 Ωto 332 kΩ1Ωto < 10 Ω;
> 332 kΩto2MΩ
P70 x R
P70 x R
P70 x R
15 x P70 x R
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4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 6 h
± (0.1 % R+0.01Ω)
no visible damage
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning (≥ 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (≥ 95 % covered);
no visible damage
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.1 % R+0.01Ω)
no visible damage
± (0.25 % R+0.05Ω)
no visible damage
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol + 50 °C;
method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
RR 1005M and
RR 1608M; 9 N
No visible damage
RR 2012M and
RR 3216M; 45 N
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ± (0.1 % R+0.01Ω)
no visible damage; no open circuit in bent position
4.7 - Voltage proof URMS = Uins; (60 ± 5) s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5,
needle flame test; 10 s No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
STABILITY
CLASS 0.5
STABILITY
CLASS 1
Stability for product types:
MCS 0402 10 Ωto 33.2 kΩ> 33.2 kΩto 4.99 MΩ
MCT 0603 10 Ωto 100 kΩ1Ωto < 10 Ω;
> 100 kΩto 10 MΩ
MCU 0805 10 Ωto 221 kΩ1Ωto < 10 Ω;
> 221 kΩto 10 MΩ
MCA 1206 10 Ωto 332 kΩ1Ωto < 10 Ω;
> 332 kΩto2MΩ
Document Number: 28705 For technical questions, contact: thinfilmchip@vishay.com www.vishay.com
Revision: 20-Nov-09 201
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Professional
Professional Thin Film Chip Resistors Vishay Beyschlag
12NC INFORMATION FOR HISTORICAL CODING REFERENCE ONLY
•The resistors have a 12-digit numeric code starting with
2312.
•The subsequent 4 digits indicate the resistor type,
specification and packaging; see the 12NC table.
•The remaining 4 digits indicate the resistance value:
- The first 3 digits indicate the resistance value.
- The last digit indicates the resistance decade in
accordance with the Last digit of 12NC Indicating
Resistance Decade table.
Last Digit of 12NC Indicating Resistance Decade
12NC example
The 12NC of a MCT 0603 resistor, value 47 kΩ and TCR 50
with ± 1 % tolerance, supplied in cardboard tape of
5000 units per reel is: 2312 215 14703.
RESISTANCE DECADE LAST DIGIT
1Ω to 9.99 Ω8
10 Ω to 99.9 Ω9
100 Ω to 999 Ω1
1 kΩto 9.99 kΩ2
10 kΩ to 99.9 kΩ3
100 kΩ to 999 kΩ4
1MΩ to 9.99 MΩ5
10 MΩ to 99.9 MΩ6
12NC - Resistor type and packaging
DESCRIPTION
CODE 2312 ... .....
CARDBOARD TAPE ON REEL
TYPE TCR TOL. P5
(5000 UNITS)
E0
(10 000 UNITS)
PW
(20 000 UNITS)
MCS 0402
± 50 ppm/K
± 1 % - 275 1.... -
± 0.5 % - 275 5.... -
± 25 ppm/K ± 0.5 % - 276 5.... -
Jumper - - 275 90001 -
MCT 0603
± 50 ppm/K
± 1 % 215 1.... - 205 1....
± 0.5 % 215 5.... - 205 5....
± 25 ppm/K ± 0.5 % 216 5.... - 206 5....
Jumper - 215 90001 - 205 90001
MCU 0805
± 50 ppm/K ± 0.5 % 255 5.... - 245 5....
± 25 ppm/K ± 0.5 % 256 5.... - 246 5....
Jumper - 255 90001 - 245 90001
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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