Type
PRODUCT SPECIFICATION
NUMBER
GS-12-288
TITLE PAGE REV.
PCI EXPRESSTM RETENTION MECHANISM 1 of 4 B
AUTHORIZED BY
DATE
R Y LIU 11/29/04
NOTE: THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE FCI ELECTRONICS COMPANY. NO PART OF THE INFORMATION SHOWN
ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF FCI ELECTRONICS.
TABLE OF CONTENTS
SECTION 1 INTRODUCTION
SECTION 2 GENERAL REQUIREMENTS
SECTION 3 MECHANICAL
3.1 EXAMINATION OF PRODUCT
3.2 SOLDER PIN RETENTION
3.3 BOARD INSERTION/RETENTION FORCE
3.4 SOLDERABILITY
SECTION 4 ENVIRONMENTAL
4.1 RESISTANCE TO SOLDER HEAT
1.0 INTRODUCTION
1.1 SCOPE
This document describes the functional and test requirements
for the PCI ExpressTM retention mechanism (RM).
1.2 APPLICABLE DOCUMENTS
1.2.1 Solderability : BUS-19-002/A
1.2.2 AFCI drawing, PCI Express retention mechanism,
inspection & customer copy, part number 10035591.
1.2.3 EIA-364-56, Resistance to Soldering Heat
1.3 DRAWING PRECEDENCE
In the event of conflict between this document and product
prints,the product prints shall take precedence.
2.0 GENERAL REQUIREMENTS
2.1 Visual examination, unless otherwise specified, shall be
made at 7X.
2.2 Silicone compounds (mold releases, lubricants, etc.) May
not be used in the manufacturing processes.
2.3 Flammability to be rated UL 94V-0 minimum.
2.4 Unless otherwise specified, tests that require the use of
a pc retention mechanism shall use the following
E-3005 04/14/99 GES-01-001
PDM: Rev:B Released .STATUS: Printed: Jun 03, 2006
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-288
TITLE PAGE REV.
PCI EXPRESSTM RETENTION MECHANISM 2 of 4 B
AUTHORIZED BY
DATE
R Y LIU 11/29/04
NOTE: THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE FCI ELECTRONICS COMPANY. NO PART OF THE INFORMATION SHOWN
ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF FCI ELECTRONICS.
2.4.1 Card material: FR-4 glass epoxy.
2.4.2 Thickness: 1.57 +/- 0.13
2.5 SOLDERTAIL TERMINATION
Tests requiring termination of the to a PC board shall be
prepared as follows:
2.5.1 A 1.57mm +/- 0.13 thick FR-4 glass epoxy board
having no internal ground planes with plated thru
holes in the pattern specified in AFCI customer
drawing, shall be used.
2.5.2 Solder the RM to the PCB as described in paragraph
4.1
3.0 MECHANICAL REQUIREMENTS
3.1 EXAMINATION OF PRODUCT
Samples must comply to applicable AFCI product prints.
3.2 BOARD INSERTION / WITHDRAWAL FORCE
3.2.1 When applying the RM to a PCB 1.57mm thick and having a
footprint as defined on the AFCI customer drawing
prior to soldering, the total maximum insertion force
is 21N.
3.2.2 The force required to remove the RM from the PCB shall
be 10N minimum. The RM should be pulled in a direction
normal to the surface of the PCB. The PCB should be
mounted in a way as to minimize board deflection when
pull loads are applied.
3.3 SOLDER PIN RETENTION
Minimum retention force is 30 N of solder pin in the
product housing. Pull rate to be 1.27 mm/min.
3.4 SOLDERABILITY
Per EIA–364-638
a. steam age for 1 hour
b. Solder areas evaluated shall meet 95% minimum coverage.
4.0. Resistance To Soldering Heat
E-3005 04/14/99 GES-01-001
PDM: Rev:B Released .STATUS: Printed: Jun 03, 2006
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-288
TITLE PAGE REV.
PCI EXPRESSTM RETENTION MECHANISM 3 of 4 B
AUTHORIZED BY
DATE
R Y LIU 11/29/04
NOTE: THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE FCI ELECTRONICS COMPANY. NO PART OF THE INFORMATION SHOWN
ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF FCI ELECTRONICS.
4.1 RESISTANCE TO SOLDERING HEAT
Per EIA-364-56 procedure 3, test condition C.
260°±5°C 10±2 seconds
REVISION RECORD
REV PAGE DESCRIPTION ECR # DATE
E-3005 04/14/99 GES-01-001
PDM: Rev:B Released .STATUS: Printed: Jun 03, 2006
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-288
TITLE PAGE REV.
PCI EXPRESSTM RETENTION MECHANISM 4 of 4 B
AUTHORIZED BY
DATE
R Y LIU 11/29/04
NOTE: THIS DOCUMENT IS THE PROPERTY OF AND EMBODIES PROPRIETARY INFORMATION OF THE FCI ELECTRONICS COMPANY. NO PART OF THE INFORMATION SHOWN
ON THIS DOCUMENT MAY BE USED IN ANY WAY WITHOUT THE WRITTEN CONSENT OF FCI ELECTRONICS.
E-3005 04/14/99 GES-01-001
A ALL RELEASED T04-0415 11/25/2004
B ALL MODIFY PARAGRAPH T04-0417 11/29/2004
PDM: Rev:B Released .STATUS: Printed: Jun 03, 2006
