APTM20DAM10T
APTM20DAM10T – Rev 2 May, 2004
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CR1
VBUS NT C2
0/VBUS
VBUS SENSE
G2
S2
NT C1
Q2
OUT
VBUS OUT
OUT
NTC2
NTC1
0/VBUS
S2
S2
G2
G2
VBUS
SENSE
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
Symbol Parameter Max ratings Unit
VDSS Drain - Source Breakdown Voltage 200 V
Tc = 25°C 175
ID Continuous Drain Current Tc = 80°C 131
IDM Pulsed Drain current 700
A
VGS Gate - Source Voltage ±30 V
RDSon Drain - Source ON Resistance 10 mW
PD Maximum Power Dissipation Tc = 25°C 694 W
IAR Avalanche current (repetitive and non repetitive) 89 A
EAR Repetitive Avalanche Energy 50
EAS Single Pulse Avalanche Energy 2500 mJ
VDSS = 200V
RDSon = 10mW max @ Tj = 25°C
ID = 175A @ Tc = 25°C
Application
· AC and DC motor control
· Switched Mode Power Supplies
· Power Factor Correction
Features
· Power MOS 7® MOSFETs
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
· Kelvin source for easy drive
· Very low stray inductance
- Symmetrical design
- Lead frames for power connections
· Internal thermistor for temperature monitoring
· High level of integration
Benefits
· Outstanding performance at high frequency operation
· Direct mounting to heatsink (isolated package)
· Low junction to case thermal resistance
· Solderable terminals both for power and signal fo
r
easy PCB mounting
· Low profile
Boost chopper
MOSFET Power Module
APTM20DAM10T
APTM20DAM10T – Rev 2 May, 2004
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All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
BVDSS Drain - Source Breakdown Voltage VGS = 0V, ID = 375µA 200 V
VGS = 0V,VDS = 200V Tj = 25°C 150
IDSS Zero Gate Voltage Drain Current VGS = 0V,VDS = 160V Tj = 125°C 750
µA
RDS(on) Drain Source on Resistance VGS = 10V, ID = 87.5A 10 mW
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 5mA 3 5 V
IGSS Gate – Source Leakage Current VGS = ±30 V, VDS = 0V ±150 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Ciss Input Capacitance 13.7
Coss Output Capacitance 4.36
Crss Reverse Transfer Capacitance
VGS = 0V
VDS = 25V
f = 1MHz 0.19
nF
Qg Total gate Charge 224
Qgs Gate – Source Charge 86
Qgd Gate – Drain Charge
VGS = 10V
VBus = 100V
ID = 150A 94
nC
Td(on) Turn-on Delay Time 28
Tr Rise Time 56
Td(off) Turn-off Delay Time 81
Tf Fall Time
Inductive switching @ 125°C
VGS = 15V
VBus = 133V
ID = 150A
RG = 2.5W 99
ns
Eon Turn-on Switching Energy u 926
Eoff Turn-off Switching Energy v
Inductive switching @ 25°C
VGS = 15V, VBus = 133V
ID = 150A, RG = 2.5 910
µJ
Eon Turn-on Switching Energy u 1216
Eoff Turn-off Switching Energy v
Inductive switching @ 125°C
VGS = 15V, VBus = 133V
ID = 150A, RG = 2.5 1062
µJ
Diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
IF(AV) Maximum Average Forward Current 50% duty cycle Tc = 85°C 120 A
IF = 120A 1.1 1.15
IF = 240A 1.4
VF Diode Forward Voltage
IF = 120A Tj = 125°C 0.9
V
Tj = 25°C 31
trr Reverse Recovery Time
IF = 120A
VR = 133V
di/dt = 400A/µs Tj = 125°C 60
ns
Tj = 25°C 120
Qrr Reverse Recovery Charge
IF = 120A
VR = 133V
di/dt = 400A/µs Tj = 125°C 500
nC
u Eon includes diode reverse recovery.
v In accordance with JEDEC standard JESD24-1.
APTM20DAM10T
APTM20DAM10T – Rev 2 May, 2004
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Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
Transistor 0.18
RthJC Junction to Case Diode 0.46
°C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
TJ Operating junction temperature range -40 150
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 100
°C
Torque Mounting torque To Heatsink M5 4.7 N.m
Wt Package Weight 160 g
Temperature sensor NTC
Symbol Characteristic Min Typ Max Unit
R25 Resistance @ 25°C 68
kW
B 25/85 T
25 = 298.16 K 4080 K
ú
û
ù
ê
ë
é
÷
÷
ø
ö
ç
ç
è
æ-
=
TT
B
R
RT
11
exp
25
85/25
25
Package outline
T: Thermistor temperature
RT: Thermistor value at T
APTM20DAM10T
APTM20DAM10T – Rev 2 May, 2004
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Typical Performance Curve
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
5.5V
6V
6.5V
7V
7.5V
9V
0
100
200
300
400
500
0 5 10 15 20 25
VDS, Drain to Source Voltage (V)
I
D
, Drain Current (A)
VGS=15&10V
Low Voltage Output Characteristics Transfert Characteristics
TJ=-55°C
TJ=25°C
TJ=125°C
0
100
200
300
400
23456789
VGS, Gate to Source Voltage (V)
I
D
, Drain Current (A)
VDS > ID(on)xRDS(on)MAX
250µs pulse test @ < 0.5 duty cycle
RDS(on) vs Drain Current
VGS=10V
VGS=20V
0.9
0.95
1
1.05
1.1
1.15
1.2
0 40 80 120 160 200 240
ID, Drain Current (A)
R
DS
(on) Drain to Source ON Resistance
Normalized to
VGS=10V @ 87.5A
0
20
40
60
80
100
120
140
160
180
200
25 50 75 100 125 150
TC, Case Temperature (°C)
I
D
, DC Drain Current (A)
DC Drain Current vs Case Temperature
APTM20DAM10T
APTM20DAM10T – Rev 2 May, 2004
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0.7
0.8
0.9
1.0
1.1
1.2
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
BV
DSS
, Drain to Source Breakdown
Volta
g
e
(
Normalized
)
Breakdown Voltage vs Temperature ON resistance vs Temperature
0.0
0.5
1.0
1.5
2.0
2.5
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
R
DS
(on), Drain to Source ON resistance
(Normalized)
VGS=10V
ID= 87.5A
Threshold Voltage vs Temperature
0.6
0.7
0.8
0.9
1.0
1.1
1.2
-50 -25 0 25 50 75 100 125 150
TC, Case Temperature (°C)
V
GS
(TH), Threshold Voltage
(Normalized)
Maximum Safe Operating Area
DC line
10ms
1ms
100µs
1
10
100
1000
1 10 100 1000
VDS, Drain to Source Voltage (V)
I
D
, Drain Current (A)
limited b
y
RDSon
Single pulse
TJ=150°C
Ciss
Crss
Coss
100
1000
10000
100000
0 1020304050
VDS, Drain to Source Voltage (V)
C, Capacitance (pF)
Capacitance vs Drain to Source Voltage
VDS=40V
VDS=100V
VDS=160V
0
2
4
6
8
10
12
0 50 100 150 200 250
Gate Charge (nC)
V
GS
, Gate to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
ID=150A
TJ=25°C
APTM20DAM10T
APTM20DAM10T – Rev 2 May, 2004
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Delay Times vs Current
td(on)
td(off)
10
20
30
40
50
60
70
80
90
0 50 100 150 200 250 300
ID, Drain Current (A)
t
d(on)
and t
d(off)
(ns)
VDS=133V
RG=2.5
TJ=125°C
L=100
µ
H
Rise and Fall times vs Current
tr
tf
0
20
40
60
80
100
120
140
160
0 50 100 150 200 250 300
ID, Drain Current (A)
t
r
and t
f
(ns)
VDS=133V
RG=2.5
TJ=125°C
L=100µH
Switching Energy vs Current
Eon
Eoff
0
0.5
1
1.5
2
2.5
0 50 100 150 200 250 300
ID, Drain Current (A)
E
on
and E
off
(mJ)
VDS=133V
RG=2.5
TJ=125°C
L=100
µ
H
Eon
Eoff
1
1.5
2
2.5
3
0 5 10 15 20
Gate Resistance (Ohms)
Switching Energy (mJ)
Switching Energy vs Gate Resistance
VDS=133V
ID=150A
TJ=125°C
L=100µH
0
50
100
150
200
250
300
350
20 40 60 80 100 120 140 160
ID, Drain Current (A)
Frequency (kHz)
Operating Frequency vs Drain Current
VDS=133V
D=50%
RG=2.5
TJ=125°C
TJ=25°C
TJ=150°C
1
10
100
1000
0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9
VSD, Source to Drain Voltage (V)
I
DR
, Reverse Drain Current (A)
Source to Drain Diode Forward Voltage
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APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
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