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DMP22M2UPS
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DMP22M2UPS
D
S
G
20V P-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI®
Product Summary
BVDSS
ID
TC = +25°C
-20V
-60A
-60A
Description
This new generation P-Channel Enhancement Mode MOSFET is
designed to minimize RDS(ON) and yet maintain superior switching
performance.
Applications
Load Switch
Notebook Battery Power Management
Features
Thermally Efficient Package Cooler Running Applications
High Conversion Efficiency
Low RDS(ON) Minimizes On State Losses
<1.1mm Package Profile Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: POWERDI5060-8
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Finish - Matte Tin Annealed over Copper Leadframe;
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
Ordering Information (Note 4)
Part Number
Case
Packaging
DMP22M2UPS-13
POWERDI5060-8
2,500 / Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Bottom View
Top View
Pin Configuration
Top View
Internal Schematic
POWERDI5060-8
Pin1
S
D
D
G
D
D
S
S
P2002US
S
S
S
G
D
D
D
D
YY
WW
= = Manufacturers Marking
P22M2US or P2002US = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 14 = 2014)
WW = Week Code (01 to 53)
Green
P22M2US
S
S
S
G
D
D
D
D
YY
WW
POWERDI5060-8
POWERDI is a registered trademark of Diodes Incorporated.
DMP22M2UPS
Document number: DS37857 Rev. 2 - 2
2 of 7
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May 2015
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DMP22M2UPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
-20
V
Gate-Source Voltage
VGSS
±12
V
Continuous Drain Current, VGS = 10V (Note 5)
Steady State
(Note 6)
TC = +25°C
TC = +70°C
ID
-60
-60
A
t<10s
TA = +25°C
TA = +70°C
-42
-33.5
A
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
IDM
-100
A
Continuous Body Diode Forward Current (Note 5)
Steady State
(Note 6)
TC = +25°C
IS
-60
A
t<10s
TA = +25°C
-5.6
A
Avalanche Current, L = 0.1mH
IAS
-37
A
Avalanche Energy, L = 0.1mH
EAS
69.8
mJ
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
Steady State
PD
2.3
W
t<10s
6.25
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
55
°C/W
t<10s
20
Total Power Dissipation (Note 5)
Steady State
PD
104
W
Thermal Resistance, Junction to Case (Note 5)
RθJC
0.9
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Note: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
6. Package limited.
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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
-20
V
VGS = 0V, ID = -250µA
Zero Gate Voltage Drain Current
IDSS
-10
µA
VDS = -20V, VGS = 0V
Gate-Source Leakage
IGSS
±100
nA
VGS = 12V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(TH)
-0.5
-1.4
V
VDS = VGS, ID = -250µA
Static Drain-Source On-Resistance
RDS(ON)
2.5
mΩ
VGS = -10V, ID = -25A
3.5
VGS = -4.5V, ID = -20A
5.0
VGS = -2.5V, ID = -15A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
12826
pF
VDS = -10V, VGS = 0V
f = 1MHz
Output Capacitance
Coss
2547
Reverse Transfer Capacitance
Crss
1924
Gate Resistance
RG
4.2
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = -10V)
Qg
476
nC
VDS = -10V, ID = -20A
Total Gate Charge (VGS = -4.5V)
Qg
228
Gate-Source Charge
Qgs
24.8
Gate-Drain Charge
Qgd
61.9
Turn-On Delay Time
tD(ON)
14.2
ns
VDD = -10V, VGEN = -4.5V,
RGEN = 1Ω, ID = -10A
Turn-On Rise Time
tR
35.4
Turn-Off Delay Time
tD(OFF)
361
Turn-Off Fall Time
tF
224
BODY DIODE CHARACTERISTICS
Diode Forward Voltage
VSD
-0.58
V
VGS = 0V, IS = -5A
Reverse Recovery Time (Note 8)
tRR
137
ns
IF = -10A, di/dt = 100A/µs
Reverse Recovery Charge (Note 8)
Qrr
221
nC
Reverse Recovery Fall Time (Note 8)
ta
39
ns
Reverse Recovery Raise Time (Note 8)
tb
98
Notes: 7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
0.0
5.0
10.0
15.0
20.0
25.0
30.0
0 0.5 1 1.5 2 2.5 3
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
VGS = -1.2V
VGS = -1.3V
VGS = -1.4V
VGS = -2.0V
VGS = -1.5V
VGS = -4.5V
0
5
10
15
20
25
30
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
ID, DRAIN CURRENT (A)
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristic
V
DS
= -5V
-55oC
25oC
85oC
125oC
150oC
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0.0014
0.0016
0.0018
0.002
0.0022
0.0024
2 6 10 14 18 22 26 30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs. Drain Current
and Gate Voltage
VGS = -2.5V
VGS = -4.5V
VGS = -10V
0
0.001
0.002
0.003
0.004
0.005
0.006
0.007
0.008
0.009
0.01
0 2 4 6 8 10 12
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristic
ID = -25A
ID = -15A
ID = -20A
0.001
0.0012
0.0014
0.0016
0.0018
0.002
0.0022
0.0024
0 5 10 15 20 25 30
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE ()
ID, DRAIN CURRENT(A)
Figure 5 Typical On-Resistance vs. Drain Current
and Temperature
VGS = - 4.5V
125oC
150oC
85oC
25oC
-55oC
0.6
0.8
1
1.2
1.4
1.6
-50 -25 025 50 75 100 125 150
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
TJ, JUNCTION TEMPERATURE ()
Figure 6 On-Resistance Variation with
Temperature
VGS = -4.5V, ID = -20A
VGS = -2.5V, ID = -15A
VGS = -10V, ID = -25A
0.001
0.0014
0.0018
0.0022
0.0026
0.003
0.0034
-50 -25 025 50 75 100 125 150
RDS(ON), DRAIN-SOURCE ON-ESISTANCE ()
TJ, JUNCTION TEMPERATURE ()
Figure 7 On-Resistance Variation with Temperature
VGS = -10V, ID = -25A
VGS = -4.5V, ID = -20A
VGS = -2.5V, ID = -15A
0
0.2
0.4
0.6
0.8
1
-50 -25 025 50 75 100 125 150
VGS(TH), GATE THESHOLD VOLTAGE (V)
TA, AMBIENT TEMPERATURE ()
Figure 8 Gate Theshold Variation vs Ambient
Temperature
ID = -1mA
ID = -250µA
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0
5
10
15
20
25
30
0 0.2 0.4 0.6 0.8 1
IS, SOURCE CURRENT (A)
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
TA = 85oC
TA = -55oC
TA = 25oC
TA = 125oC
TA = 150oC
VGS = 0V
1000
10000
100000
0 4 8 12 16 20
CT, JUNCTION CAPACITANCE (pF)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
f = 1MHz
Ciss
Coss
Crss
0
2
4
6
8
10
050 100 150 200 250 300 350 400 450 500
VGS (V)
Qg (nC)
Figure 11 Gate Charge
VDS = -10V, ID = -20A
1
10
100
1000
0.1 1 10 100
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
TJ(Max)=150
TC=25
VGS=10V
Single Pulse
DUT on infinite heatsink
RDS(ON)
Limited
PW =1s
PW =100ms
PW =10ms
PW =1ms
PW =100µs
PW =10µs
PW =1µs
0.001
0.01
0.1
1
1E-06 1E-05 0.0001 0.001 0.01 0.1 1 10 100 1000
r(t), TRANSIENT THERMAL RESISTANCE
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
RθJC(t)=r(t) * RθJC
RθJC=0.9oC/W
Duty Cycle, D=t1/t2
D = Single Pulse
D = 0.005
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.3
D = 0.5 D = 0.7
D = 0.9
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
PowerDI5060-8
(Type K)
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0
0.05
0.02
b
0.33
0.51
0.41
b1
0.300
0.366
0.333
b2
0.20
0.35
0.25
c
0.23
0.33
0.277
D
5.15 BSC
D1
4.85
4.95
4.90
D2
-
-
3.98
E
6.15 BSC
E1
5.75
5.85
5.80
E2
3.56
3.76
3.66
E
1.27BSC
k
-
-
1.27
L
0.51
0.71
0.61
La
0.51
0.71
0.61
L1
0.05
0.20
0.175
L4
-
-
0.125
M
3.50
3.71
3.605
x
-
-
1.400
y
-
-
1.900
θ
10°
12°
11°
θ1
All Dimensions in mm
Dimensions
Value
(in mm)
C
1.270
G
0.660
G1
0.820
X
0.610
X1
3.910
X2
4.420
Y
1.270
Y1
1.020
Y2
3.810
Y3
6.610
DETAIL A
0(4x)
Seating Plane
A1
c
e
01(4x)
D1
E1
D
E
1
y
x
C
Ø1.000 Depth 0.07±0.030
A
DETAIL A
L
k
M
L1
La
E2
b(8x) e/2
1
b1(8x)
b2(2x)
D2
L4
Y
Y3
Y2
X1
Y1
G1
X2
CX (8x)
G
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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