1. Product profile
1.1 General description
PNP medium power transistor series.
[1] Valid for all available selection groups.
[2] Also available in SOT54A and SOT54 variant packages (see Section 2).
1.2 Features
High current
Two current gain selections
1.3 Applications
Linear voltage regulators
Low side switches
Supply line switches
MOSFET drivers
1.4 Quick reference data
BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
Rev. 06 — 13 March 2006 Product data sheet
Table 1: Product overview
Type number[1] Package NPN complement
Philips JEITA JEDEC
BC640[2] SOT54 SC-43A TO-92 BC639
BCP53 SOT223 SC-73 - BCP56
BCX53 SOT89 SC-62 TO-243 BCX56
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 80 V
ICcollector current - - 1A
ICM peak collector current single pulse; tp1ms - - 1.5 A
hFE DC current gain VCE =2 V; IC=150 mA 63 - 250
hFE selection -10 VCE =2 V; IC=150 mA 63 - 160
hFE selection -16 VCE =2 V; IC=150 mA 100 - 250
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 2 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
2. Pinning information
Table 3: Pinning
Pin Description Simplified outline Symbol
SOT54
1 base
2 collector
3 emitter
SOT54A
1 base
2 collector
3 emitter
SOT54 variant
1 base
2 collector
3 emitter
SOT223
1 base
2 collector
3 emitter
4 collector
SOT89
1 emitter
2 collector
3 base
001aab347
1
2
3
sym029
2
3
1
001aab348
1
2
3
sym029
2
3
1
001aab447
1
2
3
sym029
2
3
1
132
4
sym028
2, 4
3
1
321
006aaa231
2
1
3
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 3 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
3. Ordering information
[1] Valid for all available selection groups.
[2] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
Table 4: Ordering information
Type number[1] Package
Name Description Version
BC640[2] SC-43A plastic single-ended leaded (through hole) package;
3 leads SOT54
BCP53 SC-73 plastic surface mounted package with increased
heatsink; 4 leads SOT223
BCX53 SC-62 plastic surface mounted package; collector pad for
good heat transfer; 3 leads SOT89
Table 5: Marking codes
Type number Marking code
BC640 C640
BC640-16 C64016
BCP53 BCP53
BCP53-10 BCP53/10
BCP53-16 BCP53/16
BCX53 AH
BCX53-10 AK
BCX53-16 AL
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 4 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 100 V
VCEO collector-emitter voltage open base - 80 V
VEBO emitter-base voltage open collector - 5V
ICcollector current - 1A
ICM peak collector current single pulse;
tp1ms -1.5 A
IBM peak base current single pulse;
tp1ms -0.2 A
Ptot total power dissipation Tamb 25 °C
BC640 [1] - 0.83 W
BCP53 [1] - 0.65 W
[2] -1W
BCX53 [1] - 0.5 W
[2] - 0.9 W
[3] - 1.5 W
Tstg storage temperature 65 +150 °C
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 5 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
FR4 PCB; standard footprint FR4 PCB; standard footprint
Fig 1. Power derating curve SOT54 Fig 2. Power derating curve SOT223
(1) FR4 PCB; mounting pad for collector 6 cm2
(2) FR4 PCB; mounting pad for collector 1 cm2
(3) FR4 PCB; standard footprint
Fig 3. Power derating curves SOT89
Tamb (°C)
75 1751252507525
006aaa219
800
400
1200
1600
Ptot
(mW)
0
Tamb (°C)
75 1751252507525
006aaa220
800
400
1200
1600
Ptot
(mW)
0
Tamb (°C)
75 1751252507525
006aaa221
800
400
1200
1600
Ptot
(mW)
0
(1)
(2)
(3)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 6 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air
BC640 [1] - - 150 K/W
BCP53 [1] - - 190 K/W
[2] - - 125 K/W
BCX53 [1] - - 230 K/W
[2] - - 135 K/W
[3] - - 85 K/W
Rth(j-sp) thermal resistance from
junction to solder point
BC640 - - 40 K/W
BCP53 - - 17 K/W
BCX53 - - 20 K/W
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 7 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
FR4 PCB; standard footprint
(1) δ=1
(2) δ= 0.75
(3) δ= 0.33
(4) δ= 0.5
(5) δ= 0.2
(6) δ= 0.1
(7) δ= 0.05
(8) δ= 0.02
(9) δ= 0.01
(10) δ=0
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse time for SOT54; typical
values
006aaa222
10
1
102
103
Zth(j-a)
(K/W)
101
10510102
104102
101tp (s)
103103
1
(2)
(3) (4)
(6)
(8)
(5)
(7)
(9) (10)
(1)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 8 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
FR4 PCB; standard footprint
(1) δ=1
(2) δ= 0.75
(3) δ= 0.5
(4) δ= 0.33
(5) δ= 0.2
(6) δ= 0.1
(7) δ= 0.05
(8) δ= 0.02
(9) δ= 0.01
(10) δ=0
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse time for SOT223; typical
values
006aaa223
10
1
102
103
Zth(j-a)
(K/W)
101
10510102
104102
101tp (s)
103103
1
(2)
(3) (4)
(6)
(8)
(5)
(7)
(9)
(10)
(1)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 9 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
FR4 PCB; standard footprint
(1) δ=1
(2) δ= 0.75
(3) δ= 0.5
(4) δ= 0.33
(5) δ= 0.2
(6) δ= 0.1
(7) δ= 0.05
(8) δ= 0.02
(9) δ= 0.01
(10) δ=0
Fig 6. Transient thermal impedance from junction to ambient as a function of pulse time for SOT89; typical
values
006aaa224
10
1
102
103
Zth(j-a)
(K/W)
101
10510102
104102
101tp (s)
103103
1
(2)
(3) (4)
(6)
(8)
(5)
(7)
(9)
(10)
(1)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 10 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
FR4 PCB; mounting pad for collector 1 cm2
(1) δ=1
(2) δ= 0.75
(3) δ= 0.5
(4) δ= 0.33
(5) δ= 0.2
(6) δ= 0.1
(7) δ= 0.05
(8) δ= 0.02
(9) δ= 0.01
(10) δ=0
Fig 7. Transient thermal impedance from junction to ambient as a function of pulse time for SOT89; typical
values
006aaa225
10
1
102
103
Zth(j-a)
(K/W)
101
10510102
104102
101tp (s)
103103
1
(2)
(3) (4)
(6)
(8)
(5)
(7)
(9) (10)
(1)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 11 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
7. Characteristics
Table 8: Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off
current VCB =30 V; IE=0A - - 100 nA
VCB =30 V; IE=0A;
Tj= 150 °C--10 µA
IEBO emitter-base cut-off
current VEB =5 V; IC=0A - - 100 nA
hFE DC current gain VCE =2V
IC=5mA 63 - -
IC=150 mA 63 - 250
IC=500 mA 40 - -
DC current gain VCE =2V
hFE selection -10 IC=150 mA 63 - 160
hFE selection -16 IC=150 mA 100 - 250
VCEsat collector-emitter
saturation voltage IC=500 mA; IB=50 mA - - 0.5 V
VBE base-emitter voltage IC=500 mA; VCE =2V - - 1V
Cccollector capacitance VCB =15 V; IE=i
e=0A;
f = 1 MHz -15-pF
fTtransition frequency VCE =5 V; IC=50 mA;
f = 100 MHz - 145 - MHz
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 12 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
VCE =2V
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =55 °C
VCE =2V
(1) Tamb =55 °C
(2) Tamb =25°C
(3) Tamb = 150 °C
Fig 8. DC current gain as a function of collector
current; typical values Fig 9. Base-emitter voltage as a function of collector
current; typical values
IC/IB=10
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =55 °C
IC/IB=10
(1) Tamb = 150 °C
(2) Tamb =25°C
(3) Tamb =55 °C
Fig 10. Collector-emitter saturation voltage as a
function of collector current; typical values Fig 11. Collector-emitter saturation resistance as a
function of collector current; typical values
006aaa226
100
200
300
hFE
0
IC (mA)
101104
103
1102
10
(1)
(2)
(3)
006aaa227
600
800
400
1000
1200
VBE
(mV)
200
IC (mA)
101104
103
1102
10
(1)
(2)
(3)
006aaa228
102
103
VCEsat
(mV)
10
IC (mA)
101104
103
1102
10
(1)
(2)
(3)
006aaa229
1
10
102
103
RCEsat
()
101
IC (mA)
101104
103
1102
10
(2)
(1)
(3)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 13 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
Tamb =25°C
(1) IB=45 mA
(2) IB=40.5 mA
(3) IB=36 mA
(4) IB=31.5 mA
(5) IB=27 mA
(6) IB=22.5 mA
(7) IB=18 mA
(8) IB=13.5 mA
(9) IB=9mA
(10) IB=4.5 mA
Fig 12. Collector current as a function of collector-emitter voltage; typical values
VCE (V)
02.01.60.8 1.20.4
006aaa230
0.8
0.4
1.2
1.6
IC
(mA)
0
(1) (2) (3)
(4)
(5) (6)
(7) (8)
(9)
(10)
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 14 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
8. Package outline
Fig 13. Package outline SOT54 (SC-43A/TO-92) Fig 14. Package outline SOT54A
Fig 15. Package outline SOT54 variant Fig 16. Package outline SOT223 (SC-73)
Fig 17. Package outline SOT89 (SC-62/TO-243)
04-11-16Dimensions in mm
5.2
5.0 14.5
12.7
4.8
4.4
4.2
3.6 0.45
0.38
0.48
0.40
1.27 2.54
3
2
1
04-06-28Dimensions in mm
5.2
5.0 14.5
12.7
4.8
4.4
4.2
3.6 0.45
0.38
0.48
0.40
2.54
5.08
3 max
3
2
1
05-01-10Dimensions in mm
5.2
5.0 14.5
12.7
4.8
4.4
4.2
3.6
0.45
0.38
0.48
0.40
1.27
1.27
2.54
2.5
max
3
2
1
04-11-10Dimensions in mm
6.7
6.3
3.1
2.9
1.8
1.5
7.3
6.7 3.7
3.3
1.1
0.7
132
4
4.6
2.3 0.8
0.6 0.32
0.22
04-08-03Dimensions in mm
4.6
4.4
1.8
1.4
1.6
1.4
1.2
0.8
3
1.5 0.48
0.35 0.44
0.23
0.53
0.40
2.6
2.4 4.25
3.75
123
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 15 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
9. Packing information
[1] For further information and the availability of packing methods, see Section 15.
[2] Valid for all available selection groups.
Table 9: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number[2] Package Description Packing quantity
1000 4000 5000 10000
BC640 SOT54 bulk, straight leads - - -412 -
SOT54A tape and reel, wide pitch - - - -116
tape ammopack, wide pitch - - - -126
BC640 SOT54 variant bulk, delta pinning - - -112 -
BCP53 SOT223 4 mm pitch, 12 mm tape and reel -115 -135 - -
BCX53 SOT89 8 mm pitch, 12 mm tape and reel -115 -135 - -
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 16 of 18
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
10. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
BC640_BCP53_BCX53_
620060313 Product data sheet - 9397 750 14045 BC636_638_640_5
BCP51_52_53_5
BCX51_52_53_4
Modifications: The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
This data sheet contains a type combination out of the previous data sheets
BC636_638_640_5, BCP51_52_53_5 and BCX51_52_53_4.
Table 1 “Product overview”: added
Figure 1,2 and 3: added
Table 7: amended typing error for BCP53 maximum value on 1 cm2 footprint condition
Figure 4,5,6 and 7: added
Figure 8: amended
Figure 9,10,11 and 12: added
Figure 14 and 15: added
Figure 13,16 and 17: superseded by minimized package outline drawings
Section 9 “Packing information”: added
Section 14 “Trademarks”: added
BC636_638_640_5 20041011 Product specification - 9397 750 13575 BC636_638_640_4
BCP51_52_53_5 20030206 Product specification - 9397 750 10764 BCP51_52_53_4
BCX51_52_53_4 20011010 Product specification - 9397 750 08743 BCX51_52_53_3
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
9397 750 14045 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 06 — 13 March 2006 17 of 18
11. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
13. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights. Date of release: 13 March 2006
Document number: 9397 750 14045
Published in The Netherlands
Philips Semiconductors BC640; BCP53; BCX53
80 V, 1 A PNP medium power transistors
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Packing information. . . . . . . . . . . . . . . . . . . . . 15
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 17
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
15 Contact information . . . . . . . . . . . . . . . . . . . . 17