MB3841PF - Fujitsu Limited

FUJITSU MICROELECTRONICS

DATA SHEET

2009.7

ASSP For Power Management Applications

Power Management Switch IC

MB3841

■DESCRIPTION

The FUJITSU MICROELECTRONICS MB3841 is a one-channel power management switch IC with extremely

low on resistance.

The MB3841 is designed for a variety of switching applications, featuring operation from low input voltages

(VIN > 2.2 V) and stable on resistance that does not depend on input voltages. The switch current limit can be

externally set over a wide range from 100 mA to 2 A. A safety function detects overcurrent conditions, immediately

sets the switch to off mode and sends an external notification signal. The MB3841 is therefore ideal for power

management switching applications with USB specifications.

In addition, the MB3841 has features that ensure accurate on-off switching by preventing reverse cur rent in off

mode, as well as rapid discharge of capacitors connected to output.

■FEATURES

• Low on resistance switch (Typ. 45 mΩ)

• Low input voltage operation (2.2 V to 5.5 V)

• Switch current (Max. 2 A)

•UVLO (V

TH = 1.9 V)

• External settings for soft start time and switch current limit

• On-chip over temperature detection (the switch turns off and set the latch), over current detection (the switch

turns off and set the latch)

• On-chip abnormal state detection circuit (O.C. pin)

• On-chip output pin discharge contro l circuit

• Supply current = 0 μA in standby mode (CONTROL < 0.8 V)

• Reverse current protection function in off mode

DS04-27603-2E

MB3841

2DS04-27603-2E

■PIN ASSIGNMENT

CONTROL

CURRENT

VIN

O.C

GND

VCC

OUT

(T OP VIEW)

MB3841

DS04-27603-2E 3

■PIN DESCRIPTION

Pin no. Symbol Descriptions

1 CONTROL Control signal input pin. Set “H” to turn the switch on, “L” to turn the switch off.

At 0.8 V or less, the chip is in STBY state and current consumption is less

than1μA.

2SS

Slow start setting pin. Use d to ad ju st the switch on/off timing.

Add external capacitance to delay operation. Leave open when not in use.

In open mode voltages up to 10 V are present. Car e sh ou ld be taken in mounting

to prevent leak curr ent generation because high impedance is required.

3 CURRENT Current limit setting pin. The limit current level is set by connecting this pin to

external resist ance.

If this pin is connected to GND, no current limit is applied.

IN Switch input pin.

The VIN voltage monitoring function enables switch operation at 1.9 V or higher.

If the VIN voltage drops to 1.8 V or lower switch operation is disabled.

5OUT

Switch output pin.

The discharge function will immediately discharge the capacitance charge

connected to the OUT pin when the switch is in off position and 350 Ω resistance

(with VCC = 5 V) is connected to the GND terminal.

CC Control power supply input pin. This pin supplies power to the control circuit.

The input voltage level must be stable.

7 GND Ground pin.

8O.C

External signal pin.

When the switch is in on mode this pin no rmally outputs a “H” level signal, but

changes to “L” level when an o vercurrent, overheating, or UVLO condition is

detected.

When the switch is in off mode this signal is output at “L” level at all times.

This is an open drain out put, and should be pulled up to high potentia l usin g

resistance.

MB3841

4DS04-27603-2E

■BLOCK DIAGRAM

−

VIN

OSC

VCC

CONTROL

140 kΩ

945 kΩ

GND

BGR

COMP

(HYS)

COMP

(HYS)

COMP

DISCHARGE

O.C

OUT

CURRENT

Charge pump Load current

detection

Temperature

protection

MB3841

DS04-27603-2E 5

■ABSOLUTE MAXIMUM RATINGS

WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,

temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.

■RECOMMENDED OPERATING CONDITIONS

Note: F or CSS, RLIM settings, see p. 9.

WARNING: The recommended operating conditions are req uired in order to ensure the normal operation of

the semiconductor device. All of the device's electrical characteristics are warranted when the

device is operated within these ranges.

Always use semiconductor devices within their recommen ded operating condition ranges.

Operation outside these ranges may adversely affect reliability and could result in device failure.

No warranty is made with respect to uses, operating conditions, or combinations not represented

on the data sh eet. Users consider ing application outside th e listed conditio ns are advised to contact

their representatives beforehand.

Parameter Symbol Condition Rating Unit

Min. Max.

Input voltage VIN — –0.3 7.0 V

Power supply voltage VCC — –0.3 7.0 V

Control voltage VCTL — –0.3 7.0 V

Switch current ISW VIN = 2.2 V to 5.5 V —3 (DC)

—6 (t ≤ 10 ms)

Allowable dissipation PDTa = +85°C— 280mW

Storage temperature TSTG — –55 +125 °C

Parameter Symbol Condition Value Unit

Min. Typ. Max.

Input voltage VIN —0—5.5V

P o wer supply v oltage VCC —0—5.5V

Control voltage VCTL VCTL ≤ VCC 0—5.5V

Switch current ISW VIN = 2.2 V to 5.5 V,

VCTL = 2.2 V to 5.5 V ——2.0A

SS pin capacitance CSS ———10nF

Current limit

resistance RLIM VIN = 5.0 V (ISW = 2 A to 0.1 A) 1.8 k — 24 k Ω

VIN = 2.2 V (ISW = 2 A to 0.1 A) 2.2 k — 51 k Ω

O.C sync current IOC VIN = 2.2 V to 5.5 V, VCC ≥ 2.2 V — — 1.0 mA

Operating ambient

temperature Ta — –20 — +85 °C

MB3841

6DS04-27603-2E

■ELECTRICAL CHARACTERISTICS (VIN = 5 V, VCC = 5 V, Ta = +25°C)

Parameter Symbol Condition Value Unit

Min. Typ. Max.

Switch resistance RON VIN = 5 V, VCTL = 3 V, ISW = 2 A — 45 70 mΩ

IN pin disable current

IIN1 VIN = 5 V, VCTL = 3 V, ISW = 0 A — 170 340 μA

IIN2 VIN = 5 V, VCTL = 3 V, ISW = 2 A — 0.9 1.8 mA

IIN3 VIN = 5 V, VCTL = 0.4 V — — 1.0 μA

VCC power supply current ICC1 VIN = 5 V, VCTL = 3 V, ISW = 2 A — 105 210 μA

ICC2 VIN = 5 V, VCTL = 0.4 V — — 1.0 μA

UVLO threshold VIUH VCC = 5 V, VIN at O.C. = L → H 1.7 1.9 2.1 V

VIUL VCC = 5 V, VIN at O.C. = H → L 1.6 1.8 2.0 V

UVLO histeresis width VIUHY VIUHY = VIUH – VIUL 50 100 150 mV

CONTROL pin inp ut current ICTL VCTL = 5 V, ISW = 0 A — 5.0 10 μA

CONTROL pin threshold VTHCTL VCC = 2.2 V, VCTL at O.C. = L → H 1.2 1.35 1.5 V

VTLCTL VCC = 2.2 V, VCTL at O.C. = H → L 1.0 1.15 1.3 V

CONTROL pin hist eresis

width VCTLHY VCTLHY = VTHCTL – VTLCTL 100 200 300 mV

Switch current limit value

ISWLL1 VIN = 5 V RLIM = 24 kΩ, VCTL = 2.2 V 73 105 137 mA

ISWLH1 RLIM = 1.8 kΩ, VCTL = 2.2 V 1.57 1.97 2.37 A

ISWLL2 VIN = 2.2 V RLIM = 51 kΩ, VCTL = 2.2 V 68 98 128 mA

ISWLH2 RLIM = 2.2 kΩ, VCTL = 2.2 V 1.53 1.92 2.31 A

O.C sync current IOCS VCC = 5 V, VCTL = 0.8 V, VOC = 0.4 V 1.0 4.5 — mA

O.C leak current IOCL VCC = 5 V, VCTL = 3 V, V OC = 5.0 V — — 2.0 μA

Switch discharge

resistance RDCG VCC = 5 V, VCTL = 0.8 V, VOUT = 5.0 V — 350 700 Ω

Temperature protection (Tj)TLIM VCC = 5 V, VCTL = 2.2 V +125 — — °C

OUT pin rise time tON1 VCC = 5 V, VIN = 5 V, SS, OUT: Open — 300 900 μs

tON2 VCC = 5 V, VIN = 2.2 V, SS, OUT: Open — 610 1830 μs

OUT pin fall time tOFF1 VIN = 5 V, VCC = 5 V, SS, OUT: Open — 10 50 μs

tOFF2 VIN = 5 V, VCC = 2.2 V, SS, OUT: Open — 50 250 μs

MB3841

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■DIAGRAM

1. Normal operation

2. At VIN Fall

VCC

VIN

CONTROL

OUT

O.C

1.35 V 1.15 V

90%90%

10%10%

tON

ONOFF

tOFF

DISCHARGE logic

VCC

VIN

CONTROL

OUT

O.C

1.8 V 1.9 V

ON OFF

DISCHARGE logic

MB3841

8DS04-27603-2E

3. At V OUT short

VCC

VIN

CONTROL

OUT

O.C

1.15 V

ON ONOFF

Over current latch

DISCHARGE logic Latch set Latch release

MB3841

DS04-27603-2E 9

■TYPICAL CHARACTERISTICS

1. RLIM vs. ISW Characteristics

2. CSS vs. tON (SS) Characteristics

0.1

1000 10000 100000

RLIM (Ω)

LIM

- l

characteristics

(A)

VIN = 2.2

VIN = 3.3

VIN = 5 V

= 2.2 V

= 3.3 V

= 5 V

100

0.1 100 1000 10000

(pF)

- t

(SS) characteristics

(ms)

MB3841

10 DS04-27603-2E

3. SW Resistance Temperature Characteristics

100

−60 −40 −20 0 +20 +40 +60 +80 +100 +120

Ta (°C)

SW resistance (mΩ)SW resistance (mΩ)

Temperature dependency of SW resistance (VIN = 5 V, lOUT = 2 A, Ta: Ambient temperature)

VIN voltage dependency of SW resistance (lOUT = 2 A, Ta = −40, +25, +100°C)

−40°C

+25°C

+100°C

100

234567

VIN (V)

MB3841

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■FUNCTIONAL DESCRIPTION

Current Limit Setting

The MB3841 provides highly accurate switching current limit setting, in the range from 100 mA to 2 A by placing

resistance between the CURRENT and GND pins.

The accuracy of ± 20% can be secured by switching current of 2 A setting.

Because the setting is dependent on the VIN voltage, it is important that the appropriate resistance be connected

to the VIN pin.

See “RLIM vs. ISW Characteristics” on p. 9 and “■ OUTPUT CURRENT LIMITATION SETTING ” of the table.

The following appr ox im atio n form u la ma y be use d to calcu lat e the limit se ttin g wh en VIN = 5V.

When the switch limit level is exceeded , the switch turns off and then latch is set to protect the device.

At the same time the O. C output signal goes to “L” level to notify external systems.

When a “L” level signal is applied to the CONTROL switch, the latch is released, so that the normal operation

is resumed at the next “H” level signal to the CONTROL switch.

Thermal Shutdown

The MB3841 has a thermal shutdown function which turns the switch off and sets the latch to protect the device

when junction temperature exceeds 125°C.

At the same time the O. C output signal goes to “L” level to notify external systems.

When a “L” level signal is applied to the CONTROL switch, the latch is released,so that the normal operation is

resumed at the next “H” level signal to the CONTROL switch.

Slow Start

The on/off switching time of the MB3841 can be delayed by applying capacitance between the SS and GND

pins. Controlling the on time can soften the surge current to the load side capacitance when power is turned on.

(tON, tOff are measured at 90% of VOUT.)

For details, see “Css vs. tON (SS) Characteristics” on p. 9.

The following approximation formula may be used to set on time when VIN = 5 V.

DISCHARGE

The MB3841 has a DISCHARGE pin function that immediately discharges electric charge on the load side when

the switch is turned off.

■OUTPUT CURRENT LIMITATION SETTING RLIM [Ω]

ISW

VIN 0.1 A 0.2 A 0.4 A 0.8 A 1.0 A 1.2 A 1.4 A 1.6 A 1.8 A 2.0 A 2.5 A 3.0 A

5.0 V 24.0 k 14.3 k 7.68 k 4.0 2 k 3.30 k 2.80 k 2.43 k 2.15 k 1.96 k 1.80 k 1.47 k 1.24 k

3.3 V 36.5 k 18.2 k 8.87 k 4.42 k 3.60 k 3.00 k 2.61 k 2.32 k 2.05 k 1.91 k 1.54 k 1.30 k

2.2 V 51.0 k 23.2 k 10.7 k 5.23 k 4.12 k 3.48 k 3.00 k 2.61 k 2.32 k 2.20 k 1.65 k 1.37 k

ISW = [A]

7450

(RLIM[Ω])1.1

tON = 0.87 × 10–3 × CSS [pF] + 0.3[ms]

MB3841

12 DS04-27603-2E

■TYPICAL APPLICATION

CONTROL

CURRENT

VIN

Control signal Pull-up resistance

load

O.C

GND

VCC

OUT

CSS

RLIM

MB3841

DS04-27603-2E 13

■SAMPLE APPLICATIONS

(1) Bus Supplied Hub (GANG Mode Connection)

MB3841

CONTROL

Pull-up resistance

Down-port

100 mA Max/port

CSS

RLIM CURRENT

VIN

O.C

GND

VCC

OUT

5 V

USB controller

Bus Supply (Up-board)

MB3841

14 DS04-27603-2E

(2) Self Supplied Hub (NON-GANG Mode Connection)

MB3841 Pull-up

resistance

Pull-up

resistance

Pull-up

resistance

Pull-up resistance

USB controller

500 mA Max

CONTROL

Self supply

CSS

RLIM CURRENT

VIN

O.C

GND

VCC

OUT

MB3841

CONTROL

CSS

RLIM CURRENT

VIN

O.C

GND

VCC

OUT

MB3841

CONTROL

CSS

RLIM CURRENT

VIN

O.C

GND

VCC

OUT

MB3841

CONTROL

CSS

RLIM CURRENT

VIN

O.C

GND

VCC

OUT

5 V

3.3 V

Down-port

MB3841

DS04-27603-2E 15

■USAGE PRECAUTION

1. Never use settings exceeding maximum rated conditions.

Exceeding maximum rated conditions may cause permanent damage to the LSI.

Also, it is reco mmended that recommended operating conditions be observed in norma l use.

Exceeding recommended operating conditions may adversely affect LSI reliability.

2. Use this device within recommended operating conditions.

Recommended operating conditions are values within which the normal LSI oper ation is warranted.

Standard electrical characteristics are warranted within the range of recommended operating condit ions and

within the listed co nditions for each parameter.

3. Printed circuit board ground lines should be set up with consideration for common

impedance.

4. Take appropriate static electricity measures.

• Containers f or se miconductor mate rials should have anti-static protec tion or be ma de of co nductive material.

• After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.

• Work platforms, tools, and instruments should be properly grounded.

• W orking personnel should be grounded with resistance of 250 kΩ to 1 MΩ between body and ground in serial.

5. Do not apply negative voltages.

The use of neg at ive vo lta ge s be low –0.3 V may create parasitic transistors on LSI lines, which can cause

abnormal operation.

■ORDERING INFORMATION

Part number Package Remarks

MB3841 PF 8-pin Plastic SOP

(FPT-8P-M01)

MB3841

16 DS04-27603-2E

■PACKAGE DIMENSION

8-pin plastic SOP Lead pitch 1.27 mm

Pac kage width

package length

5.3 × 6.35 mm

Lead shape Gullwing

Sealing method Plastic mold

Mounting height 2.25 mm MAX

Weight 0.10 g

Code

(Reference) P-SOP8-5.3×6.35-1.27

8-pin plastic SOP

(FPT-8P-M01)

2002-2008 FUJITSU MICROELECTRONICS LIMITED F08002S-c-6-8

0.13(.005) M

Details of "A" part

7.80±0.405.30±0.30

(.209±.012) (.307±.016)

.250 –.008

+.010

–0.20

+0.25

6.35

INDEX

1.27(.050)

0.10(.004)

0.47±0.08

(.019±.003)

–0.04

+0.03

0.17

.007 +.001

–.002

"A" 0.25(.010)

(Stand off)

0~8°

(Mounting height)

2.00 +0.25

–0.15

.079 +.010

–.006

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.10 +0.10

–0.05

–.002

+.004

.004

0.10(.004)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) *1 : These dimensions include resin protrusion.

Note 2) *2 : These dimensions do not include resin protrusion.

Note 3) Pins width and pins thickness include plating thickness.

Note 4) Pins width do not include tie bar cutting remainder.

MB3841

DS04-27603-2E 17

■CONTENTS

page

-DESCRIPTION .................................................................................................................................................... 1

-FEATURES .......................................................................................................................................................... 1

-PIN ASSIGNMENT ............................................................................................................................................. 2

-PIN DESCRIPTION ............................................................................................................................................ 3

-BLOCK DIAGRAM .............................................................................................................................................. 4

-ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 5

-RECOMMENDED OPERATING CONDITIONS ............................................................................................ 5

-ELECTRICAL CHARACTERISTICS ................................................ .......................... .................................... .. 6

-DIAGRAM ............................................................................................................................................................. 7

-TYPICAL CHARACTERISTICS ............................................. ......................... ..................................... ............. 9

-FUNCTIONAL DESCRIPTION ................................... ......................... ......................... .................................... 11

-OUTPUT CURRENT LIMITATION SETTING RLIM [Ω] ............................................................................... 11

-TYPICAL APPLICATION ........ .............. ......................... .......................... ..................................... ..................... 12

-SAMPLE APPLICATIONS ................................................................................................................................. 13

-USAGE PRECAUTION ...................................................................................................................................... 15

-ORDERING INFORMATION ........................... .......................... ......................... .......................... ..................... 15

-PACKAGE DIMENSION .................................................................................................................................... 16

MB3841

18 DS04-27603-2E

MEMO

MB3841

DS04-27603-2E 19

MEMO

MB3841

FUJITSU MICROELECTRONICS LIMITED

Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome,

Shinjuku-ku, Tokyo 163-0722, Japan

Tel: +81-3-5322-3329

http://jp.fujitsu.com/fml/en/

F or further inf ormation please contact:

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http://www.fmal.fujitsu.com/

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Rm. 3102, Bund Center, No.222 Yan An Road (E),

Shanghai 200002, China

Tel : +86-21-6146-36 88 Fax : +86-21-6335-1605

http://cn.fujitsu.com/fmc/

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10/F., World Commerce Centre, 11 Canton Road,

Tsimshatsui, Kowloon, Hong Kong

Tel : +852-2377-0226 Fax : +852-2376-3269

http://cn.fujitsu.com/fmc/en/

Specifications are subject to change without notice. For further information please contact each office.

The contents of this document are subject to change without notice.

Customers are advised to consult with sales representatives before ordering.

The informatio n, such as desc riptions of function and application circuit examples, in this document a re present ed solely for the purpose

of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS

does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating

the device based on such information, you must assume any responsibility arising out of such use of the information.

FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.

Any information in this document, including descriptions of functio n and schematic diagrams, shall not be construed as license of the use

or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS

or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectu al proper ty right or

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property rights or other rights of third parties which would result from the use of information contained herein.

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and househo ld use, but are not designed, developed and manufactured

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Please note that FUJITSU MICROELECTR ONICS will not be liable against you and/or any third party for any claims or damages arising

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incorporating safety design measures into your facility and equipment such as redund ancy, fire protection, and prevention of over-current

levels and other abnormal operating conditions.

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The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

Edited: Sales Promotion Department