ATH006A0X-SRZ - GE Energy - Datasheet.Live

Data Sheet

September 10, 2013

Austin MicrolynxTM II SMT Non-isolated Power Modules:

2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A Output Current

* UL is a registered trademark of Underwriters Laboratories, Inc.

† CSA is a registered trademark of Canadian Standards Association.

‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

** ISO is a registered trademark of the International Organization of Standards

Document No: DS03-107 ver. 1.04

PDF name: microlynx_II_smt_ds.pdf

EZ-SEQUENCETM

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Compliant to ROHS EU Directive 2002/95/EC with

lead solder exemption (non-Z versions)

 Flexible output voltage sequencing EZ-

SEQUENCETM

 Delivers up to 6A output current

 High efficiency – 96% at 3.3V full load (VIN = 5.0V)

 Small size and low profile:

27.9 mm x 11.4 mm x 7.24 mm

(1.10 in x 0.45 in x 0.285 in)

 Low output ripple and noise

 High Reliability:

Calculated MTBF = 12.8M hours at 25oC Full-load

 Output voltage programmable from 0.75 Vdc to

3.63Vdc via external resistor

 Line Regulation: 0.3% (typical)

 Load Regulation: 0.4% (typical)

 Temperature Regulation: 0.4 % (typical)

 Remote On/Off

 Output overcurrent protection (non-latching)

 Wide operating temperature range (-40°C to 85°C)

 UL* 60950-1Recognized, CSA† C22.2 No.

60950-1-03 Certified, and VDE‡ 0805:2001-12

(EN60950-1) Licensed

 ISO** 9001 and ISO 14001 certified manufacturing

facilities

Applications

 Distributed power architectures

 Intermediate bus voltage applications

 Telecommunications equipment

 Servers and storage applications

 Networking equipment

 Enterprise Networks

 Latest generation IC’s (DSP, FPGA, ASIC) and

Microprocessor powered applications

Description

Austin MicroLynxTM II SMT (surface mount technology) power modules are non-isolated dc-dc converters that can

deliver up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a

precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide

range of input voltage (VIN = 2.4 – 5.5Vdc). Austin MicroLynxTM II has a sequencing feature, EZ-SEQUENCETM that

enable designers to implement various types of output voltage sequencing when powering multiple modules on

board.

RoHS Compliant

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

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Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are

absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in

excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for

extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage All VIN -0.3 5.8 Vdc

Continuous

Sequencing voltage All Vseq -0.3 VIN,max Vdc

Operating Ambient Temperature All TA -40 85 °C

(see Thermal Considerations section)

Storage Temperature All Tstg -55 125 °C

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage Vo,set ≤ 3.63 VIN 2.4

⎯ 5.5 Vdc

Maximum Input Current All IIN,max 6.0 Adc

(VIN= VIN, min to VIN, max, IO=IO, max )

Input No Load Current VO,set = 0.75 Vdc IIN,No load 20 mA

(VIN = VIN, nom, Io = 0, module enabled) VO,set = 3.3Vdc IIN,No load 45 mA

Input Stand-by Current All IIN,stand-by 0.6 mA

(VIN = VIN, nom, module disabled)

Inrush Transient All I2t 0.04 A2s

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 1μH source impedance; VIN, min to

VIN, max, IO= IOmax ; See Test configuration section)

All 35 mAp-p

Input Ripple Rejection (120Hz) All 30 dB

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to being

part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to

achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-

acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in

this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be

used. Refer to the fuse manufacturer’s data sheet for further information.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

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Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Output Voltage Set-point All VO, set -2.0 ⎯ +2.0 % VO, set

(VIN=IN, min, IO=IO, max, TA=25°C)

Output Voltage All VO, set –3.0 ⎯ +3.0 % VO, set

(Over all operating input voltage, resistive load,

and temperature conditions until end of life)

Adjustment Range All VO 0.7525 3.63 Vdc

Selected by an external resistor

Output Regulation

Line (VIN=VIN, min to VIN, max) All

⎯ 0.3 ⎯ % VO, set

Load (IO=IO, min to IO, max) All

⎯ 0.4 ⎯ % VO, set

Temperature (Tref=TA, min to TA, max) All

⎯ 0.4 ⎯ % VO, set

Output Ripple and Noise on nominal output

(VIN=VIN, nom and IO=IO, min to IO, max

Cout = 1μF ceramic//10μFtantalum capacitors)

RMS (5Hz to 20MHz bandwidth) All ⎯ 10 15 mVrms

Peak-to-Peak (5Hz to 20MHz bandwidth) All ⎯ 40 50 mVpk-pk

External Capacitance

ESR ≥ 1 mΩ All CO, max ⎯ ⎯ 1000 μF

ESR ≥ 10 mΩ All CO, max ⎯ ⎯ 5000 μF

Output Current All Io 0 6 Adc

Output Current Limit Inception (Hiccup Mode ) All IO, lim ⎯ 220 ⎯ % Io

(VO= 90% of VO, set)

Output Short-Circuit Current All IO, s/c ⎯ 2 ⎯ Adc

(VO≤250mV) ( Hiccup Mode )

Efficiency VO, set = 0.75Vdc η 81.2 %

VIN= VIN, nom, TA=25°C VO, set = 1.2Vdc η 86.8 %

IO=IO, max , VO= VO,set V

O,set = 1.5Vdc η 88.8 %

O,set = 1.8Vdc η 89.7 %

O,set = 2.5Vdc η 92.5 %

O,set = 3.3Vdc η 95.4 %

Switching Frequency All fsw ⎯ 300 ⎯ kHz

Dynamic Load Response

(dIo/dt=2.5A/μs; VIN = VIN, nom; TA=25°C) All Vpk ⎯ 130 ⎯ mV

Load Change from Io= 50% to 100% of

Io,max; 1μF ceramic// 10 μF tantalum

Peak Deviation

Settling Time (Vo<10% peak deviation) All ts ⎯ 25 ⎯ μs

(dIo/dt=2.5A/μs; VIN = VIN, nom; TA=25°C) All Vpk ⎯ 130 ⎯ mV

Load Change from Io= 100% to 50%of Io,max:

1μF ceramic// 10 μF tantalum

Peak Deviation

Settling Time (Vo<10% peak deviation) All ts ⎯ 25 ⎯ μs

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 4

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Dynamic Load Response

(dIo/dt=2.5A/μs; V VIN = VIN, nom; TA=25°C) All Vpk ⎯ 50 ⎯ mV

Load Change from Io= 50% to 100% of Io,max;

Co = 2x150 μF polymer capacitors

Peak Deviation

Settling Time (Vo<10% peak deviation) All ts ⎯ 50 ⎯ μs

(dIo/dt=2.5A/μs; VIN = VIN, nom; TA=25°C) All Vpk ⎯ 50 ⎯ mV

Load Change from Io= 100% to 50%of Io,max:

Co = 2x150 μF polymer capacitors

Peak Deviation

Settling Time (Vo<10% peak deviation) All ts ⎯ 50 ⎯ μs

General Specifications

Parameter Min Typ Max Unit

Calculated MTBF (IO=IO, max, TA=25°C) 12,841,800 Hours

Weight ⎯ 2.8 (0.1) ⎯ g (oz.)

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 5

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

On/Off Signal interface

Device code with Suffix “4” – Positive logic

(On/Off is open collector/drain logic input;

Signal referenced to GND - See feature description section)

Input High Voltage (Module ON) All VIH ― ― V

IN, max V

Input High Current All IIH ― ― 10 μA

Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V

Input Low Current All IIL ― 0.2 1 mA

Device Code with no suffix – Negative Logic

(On/OFF pin is open collector/drain logic input with

external pull-up resistor; signal referenced to GND)

Input High Voltage (Module OFF) All VIH 1.5 ― V

IN,max Vdc

Input High Current All IIH 0.2 1 mA

Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc

Input low Current All IIL ― 10 μA

Turn-On Delay and Rise Times

(IO=IO, max , VIN = VIN, nom, TA = 25 oC, )

Case 1: On/Off input is set to Logic Low (Module

ON) and then input power is applied (delay from

instant at which VIN =VIN, min until Vo=10% of Vo,set)

All Tdelay ― 3.9 ― msec

Case 2: Input power is applied for at least one second

and then the On/Off input is set to logic Low (delay from

instant at which Von/Off=0.3V until Vo=10% of Vo, set)

All Tdelay ― 3.9 ― msec

Output voltage Rise time (time for Vo to rise from 10%

of Vo,set to 90% of Vo, set)

All Trise ― 4.2 8.5 msec

Output voltage overshoot – Startup ― 1 % VO, set

IO= IO, max; VIN = 3.0 to 5.5Vdc, TA = 25 oC

Sequencing Delay time

Delay from VIN, min to application of voltage on SEQ pin All TsEQ-delay 10 msec

Tracking Accuracy (Power-Up: 2V/ms) All |VSEQ –Vo | 100 200 mV

(Power-Down: 1V/ms) All |VSEQ –Vo | 200 400 mV

(VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo)

Overtemperature Protection All Tref ⎯ 150 ⎯ °C

(See Thermal Considerations section)

Input Undervoltage Lockout

Turn-on Threshold All 2.2 V

Turn-off Threshold All 2.0 V

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 6

Characteristic Curves

The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25ºC.

EFFICIENCY, η (%)

0 12 3456

VIN=2.4V

VIN=5V

VIN=5.5V

EFFICIENCY, η (%)

0 123456

VIN=2.4V

VIN=5V

VIN=5.5V

OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)

Figure 1. Converter Efficiency versus Output Current

(Vout = 0.75Vdc).

Figure 4. Converter Efficiency versus Output Current

(Vout = 1.8Vdc).

EFFICIENCY, η (%)

0 123456

VIN=2.4V

VIN=5V

VIN=5.5V

EFFICIENCY, η (%)

0 123456

=3 V

=5V

=5.5V

OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)

Figure 2. Converter Efficiency versus Output Current

(Vout = 1.2Vdc).

Figure 5. Converter Efficiency versus Output Current

(Vout = 2.5Vdc).

EFFICIENCY, η (%)

0 123456

VIN=2.4V

VIN=5V

VIN=5.5V

EFFICIENCY, η (%)

0 123456

VIN=4 .5V

VIN=5V

VIN=5.5V

OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)

Figure3. Converter Efficiency versus Output Current

(Vout = 1.5Vdc).

Figure 6. Converter Efficiency versus Output Current

(Vout = 3.3Vdc).

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 7

Characteristic Curves (continued)

The following figures provide typical characteristics for the MicroLynxTM II SMT modules at 25ºC.

INPUT CURRENT, IIN (A)

1 1.75 2.5 3.25 4 4.75 5.5

Io =3 A

Io =0 A

Io =6 A

OUTPUT CURRENT, OUTPUT VOLTAGE

IO (A) (2A/div) VO (V) (100mV/div)

INPUT VOLTAGE

VIN

(

)

TIME

(

s/div

)

Figure 7. Input voltage vs. Input Current

(Vout =2.5Vdc).

Figure 10. Transient Response to Dynamic Load

Change from 50% to 100% of full load (Vo = 3.3Vdc).

OUTPUT VOLTAGE

VO (V) (20mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

IO (A) (2A/div) VO (V) (100mV/div)

TIME, t (2μs/div) TIME, t (5 μs/div)

Figure 8. Typical Output Ripple and Noise

(Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A).

Figure 11. Transient Response to Dynamic Load

Change from 100% to 50% of full load (Vo = 3.3 Vdc).

OUTPUT VOLTAGE

VO (V) (20mV/div)

OUTPUT CURRENT, OUTPUT VOLTAGE

IO (A) (2A/div) VO (V) (50mV/div)

TIME, t (2μs/div) TIME, t (10μs/div)

Figure 9. Typical Output Ripple and Noise

(Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A).

Figure 12. Transient Response to Dynamic Load

Change from 50% to 100% of full load (Vo = 3.3 Vdc,

Cext = 2x150 μF Polymer Capacitors).

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 8

Characteristic Curves (continued)

The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25ºC.

OUTPUT CURRENT, OUTPUTVOLTAGE

IO (A) (2A/div) VO (V) (50mV/div)

OUTPUT VOLTAGE, INPUT VOLTAGE

Vo (V) (1V/div) VIN (V) (2V/div)

TIME, t (10μs/div) TIME, t (2 ms/div)

Figure 13. Transient Response to Dynamic Load

Change from 100% of 50% full load (Vo = 3.3Vdc, Cext

= 2x150

F Pol

mer Ca

acitors

)

Figure 16. Typical Start-Up with application of Vin

(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).

OUTPUT VOLTAGE On/Off VOLTAGE

VOV) (1V/div) VOn/off (V) (2V/div)

OUTPUT VOLTAGE On/Off VOLTAGE

VOV) (1V/div) VOn/off (V) (2V/div)

TIME, t (2 ms/div) TIME, t (2 ms/div)

Figure 14. Typical Start-Up Using Remote On/Off

(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).

Figure 17 Typical Start-Up Using Remote On/Off with

Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias

=1.0Vdc).

OUTPUT VOLTAGE On/Off VOLTAGE

VOV) (1V/div) VOn/off (V) (2V/div)

OUTPUT CURRENT,

IO (A) (5A/div)

TIME, t (2 ms/div) TIME, t (5ms/div)

Figure 15. Typical Start-Up Using Remote On/Off with

Low-ESR external capacitors (7x150uF Polymer) (Vin

= 5.0Vdc, Vo = 3.3Vdc, Io = 6A, Co = 1050μF).

Figure 18. Output short circuit Current

(Vin = 5.0Vdc, Vo = 0.75Vdc).

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 9

Characteristic Curves (continued)

The following figures provide thermal derating curves for the Austin MicroLynxTM II SMT modules.

OUTPUT CURRENT, Io (A)

0.0

1. 5

3.0

4.5

6.0

7.5

20 30 40 50 60 70 80 90

0.5m/s (100 LFM)

1.0m/s (200 LFM)

OUTPUT CURRENT, Io (A)

20 30 40 50 60 70 80 90

1.0m/s (200 LFM)

0.5m/s (100 LFM)

AMBIENT TEMPERATURE, TA

C AMBIENT TEMPERATURE, TA

Figure 19. Derating Output Current versus Local

Ambient Temperature and Airflow (Vin = 5.0,

Vo=3.3Vdc).

Figure 22. Derating Output Current versus Local

Ambient Temperature and Airflow (Vin = 3.3dc,

Vo=0.75 Vdc).

OUTPUT CURRENT, Io (A)

0.0

1. 5

3.0

4.5

6.0

7.5

20 30 40 50 60 70 80 90

1. 0 m/ s ( 2 0 0 L F M )

0 .5m/ s (10 0 LFM )

AMBIENT TEMPERATURE, TA

Figure 20. Derating Output Current versus Local

Ambient Temperature and Airflow (Vin = 5.0Vdc,

Vo=0.75 Vdc).

OUTPUT CURRENT, Io (A)

0.0

1. 5

3.0

4.5

6.0

7.5

20 30 40 50 60 70 80 90

1.0m/s (200 LFM)

0.5m/s (100 LFM)

AMBIENT TEMPERATURE, T

Figure 21. Derating Output Current versus Local

Ambient Temperature and Airflow (Vin = 3.3Vdc,

Vo=2.5 Vdc).

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 10

Test Configurations

TO OSCILLOSCOPE CURRENT PROBE

LTEST

1μH

BATTERY

CS 1000μF

Electrolytic

E.S.R.<0.1Ω

@ 20°C 100kHz

2x100μF

Tantalum

VIN(+)

COM

NOTE: Measure input reflected ripple current with a simulated

source inductance (LTEST) of 1μH. Capacitor CS offsets

possible battery impedance. Measure current as shown

above.

CIN

Figure 23. Input Reflected Ripple Current Test Setup.

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

(+)

COM

1uF .

RESISTIVE

LOAD

SCOPE

COPPER STRIP

GROUND PLANE

10uF

Figure 24. Output Ripple and Noise Test Setup.

COM

VIN(+)

COM

RLOAD

Rcontac t Rdistribution

Rcontact

Rdistribution

VIN VO

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

Figure 25. Output Voltage and Efficiency Test Setup.

η =

VO. IO

VIN. IIN

x 100 %

Efficiency

Design Considerations

Input Filtering

The Austin MicroLynxTM II SMT module should be

connected to a low-impedance source. A highly

inductive source can affect the stability of the module.

An input capacitance must be placed directly adjacent

to the input pin of the module, to minimize input ripple

voltage and ensure module stability.

To minimize input voltage ripple, low-ESR polymer

and ceramic capacitors are recommended at the input

of the module. Figure 26 shows the input ripple

voltage (mVp-p) for various outputs with 1x150 µF

polymer capacitors (Panasonic p/n: EEFUE0J151R,

Sanyo p/n: 6TPE150M) in parallel with 1 x 47 µF

ceramic capacitor (Panasonic p/n: ECJ-5YB0J476M,

Taiyo- Yuden p/n: CEJMK432BJ476MMT) at full load.

Figure 27 shows the input ripple with 2x150 µF

polymer capacitors in parallel with 2 x 47 µF ceramic

capacitor at full load.

Input Ripple Voltage (mVp-p)

10 0

12 0

0 1234

Vin = 3.3V

Vin = 5.0V

Output Voltage (Vdc)

Figure 26. Input ripple voltage for various output

with 1x150 µF polymer and 1x47 µF ceramic

capacitors at the input (80% of Io,max).

Input Ripple Voltage (mVp-p)

10 0

12 0

01234

Vin = 3.3V

V i n = 5.0 V

Output Voltage (Vdc)

Figure 27. Input ripple voltage for various output

with 2x150 µF polymer and 2x47 µF ceramic

capacitors at the input (80% of Io,max).

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 11

Design Considerations (continued)

Output Filtering

The Austin MicroLynxTM II SMT module is designed for

low output ripple voltage and will meet the maximum

output ripple specification with 1 µF ceramic and 10 µF

tantalum capacitors at the output of the module.

However, additional output filtering may be required by

the system designer for a number of reasons. First, there

may be a need to further reduce the output ripple and

noise of the module. Second, the dynamic response

characteristics may need to be customized to a particular

load step change.

To reduce the output ripple and improve the dynamic

response to a step load change, additional capacitance at

the output can be used. Low ESR polymer and ceramic

capacitors are recommended to improve the dynamic

response of the module. For stable operation of the

module, limit the capacitance to less than the maximum

output capacitance as specified in the electrical

specification table.

Safety Considerations

For safety agency approval the power module must be

installed in compliance with the spacing and separation

requirements of the end-use safety agency standards,

i.e., UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE

0850:2001-12 (EN60950-1) Licensed.

For the converter output to be considered meeting the

requirements of safety extra-low voltage (SELV), the

input must meet SELV requirements. The power

module has extra-low voltage (ELV) outputs when all

inputs are ELV.

The input to these units is to be provided with a fast-

acting fuse with a maximum rating of 6A in the positive

input lead.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 12

Feature Description

Remote On/Off

The Austin LynxTM II SMT power modules feature an

On/Off pin for remote On/Off operation. Two On/Off logic

options are available in the Austin LynxTM II series

modules. Positive Logic On/Off signal, device code suffix

“4”, turns the module ON during a logic High on the

On/Off pin and turns the module OFF during a logic Low.

Negative logic On/Off signal, no device code suffix, turns

the module OFF during logic High on the On/Off pin and

turns the module ON during logic Low.

For positive logic modules, the circuit configuration for

using the On/Off pin is shown in Figure 28. The On/Off

pin is an open collector/drain logic input signal (Von/Off)

that is referenced to ground. During a logic-high (On/Off

pin is pulled high internal to the module) when the

transistor Q1 is in the Off state, the power module is ON.

Maximum allowable leakage current of the transistor

when Von/off = VIN,max is 10µA. Applying a logic-low

when the transistor Q1 is turned-On, the power module is

OFF. During this state VOn/Off must be less than 0.3V.

When not using positive logic On/off pin, leave the pin

unconnected or tie to VIN.

Q3 CSS

GND

VIN+

ON/OFF

PWM Enable

ON/OFF

ION/OFF

MODULE

Figure 28. Circuit configuration for using positive

logic On/OFF.

For negative logic On/Off devices, the circuit

configuration is shown is Figure 29. The On/Off pin is

pulled high with an external pull-up resistor (typical Rpull-up

= 5k, +/- 5%). When transistor Q1 is in the Off state, logic

High is applied to the On/Off pin and the power module is

Off. The minimum On/off voltage for logic High on the

On/Off pin is 1.5Vdc. To turn the module ON, logic Low

is applied to the On/Off pin by turning ON Q1. When not

using the negative logic On/Off, leave the pin

unconnected or tie to GND.

Q2 CSS

GND

PWM Enable

ON/OFF

VIN+

ON/OFF

MODULE

pull-up

ON/OFF

Figure 29. Circuit configuration for using negative

logic On/OFF.

Overcurrent Protection

To provide protection in a fault (output overload)

condition, the unit is equipped with internal

current-limiting circuitry and can endure current limiting

continuously. At the point of current-limit inception, the

unit enters hiccup mode. The unit operates normally once

the output current is brought back into its specified range.

The typical average output current during hiccup is 2A.

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout

limit, module operation is disabled. The module will begin

to operate at an input voltage above the undervoltage

lockout turn-on threshold.

Overtemperature Protection

To provide over temperature protection in a fault

condition, the unit relies upon the thermal protection

feature of the controller IC. The unit will shutdown if the

thermal reference point Tref, exceeds 150oC (typical), but

the thermal shutdown is not intended as a guarantee that

the unit will survive temperatures beyond its rating. The

module will automatically restart after it cools down.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 13

Feature Descriptions (continued)

Output Voltage Programming

The output voltage of the Austin MicroLynxTM II SMT can

be programmed to any voltage from 0.75 Vdc to 3.63

Vdc by connecting a single resistor (shown as Rtrim in

Figure 30) between the TRIM and GND pins of the

module. Without an external resistor between TRIM pin

and the ground, the output voltage of the module is

0.7525 Vdc. To calculate the value of the resistor Rtrim

for a particular output voltage Vo, use the following

equation:











−

−

=5110

7525.0

21070

Rtrim

For example, to program the output voltage of the Austin

MicroLynxTM II module to 1.8 Vdc, Rtrim is calculated is

follows:











−

−

=5110

7525.08.1

21070

Rtrim

Ω= kRtrim 004.15

(+)

TRIM

GND

trim

LOAD

(+)

ON/OFF

Vout

Figure 30. Circuit configuration to program output

voltage using an external resistor.

Table 1 provides Rtrim values required for some common

output voltages.

Table 1

VO, set (V) Rtrim (KΩ)

0.7525 Open

1.2 41.973

1.5 23.077

1.8 15.004

2.5 6.947

3.3 3.160

By using a 1% tolerance trim resistor, set point

tolerance of ±2% is achieved as specified in the

electrical specification. The POL Programming Tool,

available at www.lineagepower.com under the Design

Tools section, helps determine the required external trim

resistor needed for a specific output voltage.

Voltage Margining

Output voltage margining can be implemented in the

Austin MicroLynxTM II modules by connecting a

resistor, Rmargin-up, from the Trim pin to the ground pin

for margining-up the output voltage and by connecting

a resistor, Rmargin-down, from the Trim pin to the Output

pin for margining-down. Figure 31 shows the circuit

configuration for output voltage margining. The POL

Programming Tool, available at

www.lineagepower.com under the Design Tools

section, also calculates the values of Rmargin-up and

Rmargin-down for a specific output voltage and % margin.

Please consult your local Lineage Power technical

representative for additional details.

Austin Lynx or

Lynx II Series

GND

Trim

Rtrim

Rmargin-up

Rmargin-down

Figure 31. Circuit Configuration for margining

Output voltage.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 14

Feature Descriptions (continued)

Voltage Sequencing

Austin MicroLynxTM II series of modules include a

sequencing feature, EZ-SEQUENCETM that enables

users to implement various types of output voltage

sequencing in their applications. This is accomplished

via an additional sequencing pin. When not using the

sequencing feature, either tie the SEQ pin to VIN or leave

it unconnected.

When an analog voltage is applied to the SEQ pin, the

output voltage tracks this voltage until the output reaches

the set-point voltage. The SEQ voltage must be set

higher than the set-point voltage of the module. The

output voltage follows the voltage on the SEQ pin on a

one-to-one volt basis. By connecting multiple modules

together, customers can get multiple modules to track

their output voltages to the voltage applied on the SEQ

pin.

For proper voltage sequencing, first, input voltage is

applied to the module. The On/Off pin of the module is

left unconnected (or tied to GND for negative logic

modules or tied to VIN for positive logic modules) so that

the module is ON by default. After applying input voltage

to the module, a minimum of 10msec delay is required

before applying voltage on the SEQ pin. During this time,

potential of 50mV (± 10 mV) is maintained on the SEQ

pin. After 10msec delay, an analog voltage is applied to

the SEQ pin and the output voltage of the module will

track this voltage on a one-to-one volt bases until output

reaches the set-point voltage. To initiate simultaneous

shutdown of the modules, the SEQ pin voltage is lowered

in a controlled manner. Output voltage of the modules

tracks the voltages below their set-point voltages on a

one-to-one basis. A valid input voltage must be

maintained until the tracking and output voltages reach

ground potential to ensure a controlled shutdown of the

modules.

When using the EZ-SEQUENCETM feature to control

start-up of the module, pre-bias immunity feature during

start-up is disabled. The pre-bias immunity feature of the

module relies on the module being in the diode-mode

during start-up. When using the EZ-SEQUENCETM

feature, modules goes through an internal set-up time of

10msec, and will be in synchronous rectification mode

when voltage at the SEQ pin is applied. This will result in

sinking current in the module if pre-bias voltage is present

at the output of the module. When pre-bias immunity

during start-up is required, the EZ-SEQUENCETM feature

must be disabled. For additional guidelines on using EZ-

SEQUENCETM feature of Austin MicroLynxTM II , contact

Lineage Power technical representative for preliminary

application note on output voltage sequencing using

Austin Lynx II series.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 15

Thermal Considerations

Power modules operate in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,

module power dissipation, and the need for increased

reliability. A reduction in the operating temperature of the

module will result in an increase in reliability. The thermal

data presented here is based on physical measurements

taken in a wind tunnel. The test set-up is shown in Figure

33. Note that the airflow is parallel to the long axis of the

module as shown in figure 32. The derating data applies

to airflow in either direction of the module’s long axis.

Air Flow

Tref2

Top View

Bottom View

Tref1 (inductor winding)

Figure 32. Tref Temperature measurement location.

The thermal reference point, Tref 1 used in the

specifications of thermal derating curves is shown in

Figure 32. For reliable operation this temperature should

not exceed 125oC.

The output power of the module should not exceed the

rated power of the module (Vo,set x Io,max).

Please refer to the Application Note “Thermal

Characterization Process For Open-Frame Board-

Mounted Power Modules” for a detailed discussion of

thermal aspects including maximum device temperatures.

Figure 33. Thermal Test Set-up.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Thermal derating curves

showing the maximum output current that can be

delivered by various module versus local ambient

temperature (TA) for natural convection and up to 1m/s

(200 ft./min) are shown in the Characteristics Curves

section.

flow

Power Module

ind Tunnel

PWBs

7.24_

(0.285)

76.2_

(3.0)

Probe Location

for measuring

airflow and

ambient

temperature

25.4_

(1.0)

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 16

Mechanical Outline

Dimensions are in millimeters and (inches).

Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]

x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)

Top View

Side View

Bottom View

PIN FUNCTION

1 On/Off

2 VIN

3 SEQ

4 GND

5 Trim

6 VOUT

Co-planarity (max): 0.102 [0.004]

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 17

Recommended Pad Layout

Dimensions are in millimeters and (inches).

Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]

x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)

Surface Mount Pad Layout – Component side view.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 18

Packaging Details

The Austin MicroLynxTM II SMT versions are supplied in tape & reel as standard. Modules are shipped in quantities

of 400 modules per reel.

All Dimensions are in millimeters and (in inches).

Reel Dimensions

Outside Dimensions: 330.2 mm (13.00)

Inside Dimensions: 177.8 mm (7.00”)

Width 44.0 mm (1.73”)

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 19

Surface Mount Information

Pick and Place

The Austin MicroLynxTM II SMT modules use an open

frame construction and are designed for a fully

automated assembly process. The modules are fitted

with a label designed to provide a large surface area

for pick and placing. The label meets all the

requirements for surface mount processing, as well as

safety standards and is able to withstand maximum

reflow temperature. The label also carries product

information such as product code, serial number and

location of manufacture.

Figure 34. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by

using open frame construction. Even so, these

modules have a relatively large mass when compared

to conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and pick &

placement speed should be considered to optimize

this process. The minimum recommended nozzle

diameter for reliable operation is 3mm. The maximum

nozzle outer diameter, which will safely fit within the

allowable component spacing, is 8 mm max.

Tin Lead Soldering

The Austin MicroLynxTM II SMT power modules are

lead free modules and can be soldered either in a

lead-free solder process or in a conventional Tin/Lead

(Sn/Pb) process. It is recommended that the

customer review data sheets in order to customize the

solder reflow profile for each application board

assembly. The following instructions must be

observed when soldering these units. Failure to

observe these instructions may result in the failure of

or cause damage to the modules, and can adversely

affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process

peak reflow temperatures are limited to less than

235oC. Typically, the eutectic solder melts at 183oC,

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

the plating on the connection to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convection, IR (radiant

infrared), or a combination of convection/IR. For

reliable soldering the solder reflow profile should be

established by accurately measuring the modules CP

connector temperatures.

REFLOW TEMP (°C)

10 0

15 0

200

250

300

Preheat zone

max 4oCs-1

Soak zone

30-240s

Heat zone

max 4oCs-1

Peak Temp 235oC

Co o ling

zo ne

1- 4 oCs-1

lim

above

205

REFLOW TIME (S)

Figure 35. Reflow Profile for Tin/Lead (Sn/Pb)

process.

MAX TEMP SOLDER (°C)

200

205

210

215

220

225

230

235

240

0 102030405060

Figure 36. Time Limit Curve Above 205oC for

Tin/Lead (Sn/Pb) process.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 20

Surface Mount Information (continued)

Lead Free Soldering

The –Z version Austin MicroLynx II SMT modules are

lead-free (Pb-free) and RoHS compliant and are both

forward and backward compatible in a Pb-free and a

SnPb soldering process. Failure to observe the

instructions below may result in the failure of or cause

damage to the modules and can adversely affect

long-term reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C

(Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices) for

both Pb-free solder profiles and MSL classification

procedures. This standard provides a recommended

forced-air-convection reflow profile based on the

volume and thickness of the package (table 4-2). The

suggested Pb-free solder paste is Sn/Ag/Cu (SAC).

The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in Figure. 37.

MSL Rating

The Austin MicroLynx II modules have a MSL rating of

2a.

Storage and Handling

The recommended storage environment and handling

procedures for moisture-sensitive surface mount

packages is detailed in J-STD-033 Rev. A (Handling,

Packing, Shipping and Use of Moisture/Reflow

Sensitive Surface Mount Devices). Moisture barrier

bags (MBB) with desiccant are required for MSL

ratings of 2 or greater. These sealed packages

should not be broken until time of use. Once the

original package is broken, the floor life of the product

at conditions of ≤ 30°C and 60% relative humidity

varies according to the MSL rating (see J-STD-033A).

The shelf life for dry packed SMT packages will be a

minimum of 12 months from the bag seal date, when

stored at the following conditions: < 40° C, < 90%

relative humidity.

Post Solder Cleaning and Drying

Considerations

Post solder cleaning is usually the final circuit-board

assembly process prior to electrical board testing. The

result of inadequate cleaning and drying can affect

both the reliability of a power module and the

testability of the finished circuit-board assembly. For

guidance on appropriate soldering, cleaning and

drying procedures, refer to Board Mounted Power

Modules: Soldering and Cleaning Application Note

(AN04-001).

Per J-STD-020 Rev. C

100

150

200

250

300

Reflow Time (Seconds)

Reflow Temp (°C)

Heating Zone

1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Seconds

Cooling

Zone

Figure 37. Recommended linear reflow profile

using Sn/Ag/Cu solder.

Data Sheet

September 10, 2013

Austin MicroLynxTM II SMT Non-isolated Power Modules:

2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current

LINEAGE POWER 21

Document No: DS03-107 ver. 1.05

PDF name: microlynx_II_smt_ds.pdf

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 2. Device Codes

Device Code Input

Voltage Range

Output

Voltage

Output

Current

Efficiency

3.3V@ 6A

On/Off

Logic

Connector

Type Comcodes

ATH006A0X-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT 108988358

ATH006A0X-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT CC109104535

ATH006A0X4-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108988366

ATH006A0X4-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108996708

-Z refers to RoHS compliant parts

World Wide Headquarters

Lineage Power Corporation

601 Shiloh Road, Plano, TX 75074, USA

+1-800-526-7819

(Outside U.S.A.: +1-972-244-9428)

www.lineagepower.com

e-mail: techsupport1@lineagepower.com

Asia-Pacific Headquarters

Tel: +65 6593 7211

Europe, Middle-East and Africa Headquarters

Tel: +49 898 780 672 80

India Headquarters

Tel: +91 80 28411633

Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or

pplication. No rights under any pate nt accompany the sale of an y such product(s) or information.

Lineage Power DC-DC products are protected under various patents. Informa tion on these patents is available at www.lineagepower.com/patents.

2009 Linea

e Power Cor

oration

(

Plano

Texas

)

All Inte rnational Ri

hts Reserved.