GS74116ATP/J/X
256K x 16
4Mb Asynchronous SRAM
8, 10, 12 ns
3.3 V VDD
Center VDD and VSS
SOJ, TSOP, FP-BGA
Commercial Temp
Industrial Temp
Rev: 1.06 12/2004 1/15 © 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Features
• Fast access time: 8, 10, 12 ns
• CMOS low power operation: 130/105/95 mA at minimum
cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: –40° to 85°C
• Package line up
J: 400 mil, 44-pin SOJ package
TP: 400 mil, 44-pin TSOP Type II package
GP: Pb-Free 400 mil, 44-pin TSOP Type II package
X: 6 mm x 10 mm Fine Pitch Ball Grid Array package
GX: Pb-Free 6 mm x 10 mm Fine Pitch Ball Grid Array
package
• Pb-Free TSOP-II and FP-BGA packages available
Description
The GS74116A is a high speed CMOS Static RAM organized
as 262,144 words by 16 bits. Static design eliminates the need
for external clocks or timing strobes. The GS operates on a
single 3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS74116A is available in a 6 x 10 mm Fine
Pitch BGA package, 400 mil SOJ and 400 mil TSOP Type-II
packages.
SOJ 256K x 16-Pin Configuration (Package J)
FP-BGA 256K x 16 Bump Configuration (Package X)
6 x 10 mm Bump Pitch
Top View
Pin Descriptions
Symbol Description
A0–A17 Address input
DQ1–DQ16 Data input/output
CE Chip enable input
LB Lower byte enable input
(DQ1 to DQ8)
UB Upper byte enable input
(DQ9 to DQ16)
WE Write enable input
OE Output enable input
VDD +3.3 V power supply
VSS Ground
NC No connect
123456
ALB
OE A0A1A2NC
BDQ16 UB A3A4CE DQ1
CDQ14 DQ15 A5A6DQ2DQ3
DVSS DQ13 A17 A7DQ4VDD
EVDD DQ12 NC A16 DQ5VSS
FDQ11 DQ10 A8A9DQ7DQ6
GDQ9NC A10 A11 WE DQ8
HNCA12 A13 A14 A15 NC
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A4
A3
A2
A1
A0
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
A8
A9
A10
Top view
21
22
24
23
A12 A11
44-pin
SOJ
A17A16
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 2/15 © 2001, GSI Technology
TSOP-II 256K x 16 Pin Configuration (Package TP)
Block Diagram
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A4
A3
A2
A1
A0
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
A8
A9
A10
Top view
21
22
24
23
A12 A11
44 pin
TSOP II
A17A16
Memory Array
Row
Decoder
Column
Decoder
Address
Input
Buffer
Control I/O Buffer
A0
CE
WE
OE
DQ1
A17
DQ16
UB _____
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 3/15 © 2001, GSI Technology
Note:
X: “H” or “L”
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended
Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Truth Table
CE OE WE LB UB DQ1 to DQ8DQ9 to DQ16 VDD Current
H X X X X Not Selected Not Selected ISB1, ISB2
LLH
L L Read Read
IDD
L H Read High Z
H L High Z Read
LXL
LL Write Write
L H Write Not Write, High Z
H L Not Write, High Z Write
L H H X X High Z High Z
L X X H H High Z High Z
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply Voltage VDD –0.5 to +4.6 V
Input Voltage VIN –0.5 to VDD +0.5
(≤ 4.6 V max.) V
Output Voltage VOUT –0.5 to VDD +0.5
(≤ 4.6 V max.) V
Allowable power dissipation PD 0.7 W
Storage temperature TSTG –55 to 150 oC
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 4/15 © 2001, GSI Technology
Notes:
1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns.
Notes:
1. Tested at TA = 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage for -8/-10/-12 VDD 3.0 3.3 3.6 V
Input High Voltage VIH 2.0 — VDD +0.3 V
Input Low Voltage VIL –0.3 — 0.8 V
Ambient Temperature,
Commercial Range TAc 0—70
oC
Ambient Temperature,
Industrial Range TAI–40 — 85 oC
Capacitance
Parameter Symbol Test Condition Max Unit
Input Capacitance CIN VIN = 0 V 5 pF
Output Capacitance COUT VOUT = 0 V 7 pF
DC I/O Pin Characteristics
Parameter Symbol Test Conditions Min Max
Input Leakage
Current IIL VIN = 0 to VDD – 1 uA 1 uA
Output Leakage
Current ILO Output High Z
VOUT = 0 to VDD –1 uA 1 uA
Output High Voltage VOH IOH = –4 mA 2.4 —
Output Low Voltage VOL ILO = +4 mA — 0.4 V
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 5/15 © 2001, GSI Technology
AC Test Conditions
Power Supply Currents
Parameter Symbol Test Conditions
0 to 70°C –40 to 85°C
Unit
8 ns 10 ns 12 ns 8 ns 10 ns 12 ns
Operating
Supply
Current
IDD
CE ≤ VIL
All other inputs
≥ VIH or ≤ VIL
Min. cycle time
IOUT = 0 mA
130 105 90 140 115 100 mA
Standby
Current ISB1
CE ≥ VIH
All other inputs
≥ VIH or ≤ VIL
Min. cycle time
30 25 25 40 35 35 mA
Standby
Current ISB2
CE ≥ VDD – 0.2V
All other inputs
≥ VDD – 0.2 V or ≤ 0.2 V
10 20 mA
DQ
VT = 1.4 V
50Ω30pF1
DQ
3.3 V
Output Load 1
Output Load 2
589Ω
434Ω
5pF1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
Parameter Conditions
Input high level VIH = 2.4 V
Input low level VIL = 0.4 V
Input rise time tr = 1 V/ns
Input fall time tf = 1 V/ns
Input reference level 1.4 V
Output reference level 1.4 V
Output load Fig. 1& 2
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 6/15 © 2001, GSI Technology
AC Characteristics
* These parameters are sampled and are not 100% tested.
Read Cycle 1: CE = OE = VIL, WE = VIH, UB and, or LB = VIL
Read Cycle
Parameter Symbol
-8 -10 -12
Unit
MinMaxMinMaxMinMax
Read cycle time tRC 8 — 10 — 12 — ns
Address access time tAA — 8 — 10 — 12 ns
Chip enable access time (CE)tAC — 8 — 10 — 12 ns
Byte enable access time (UB, LB)tAB —3.5—4—5 ns
Output enable to output valid (OE)tOE —3.5—4—5 ns
Output hold from address change tOH 3—3—3—ns
Chip enable to output in low Z (CE)tLZ*3—3—3—ns
Output enable to output in low Z (OE)tOLZ*0—0—0—ns
Byte enable to output in low Z (UB, LB)tBLZ*0—0—0—ns
Chip disable to output in High Z (CE)tHZ*—4—5—6 ns
Output disable to output in High Z (OE)tOHZ*—3.5—4—5 ns
Byte disable to output in High Z (UB, LB)tBHZ*—3.5—4—5 ns
tAA
tOH
tRC
Address
Data Out Previous Data Data valid
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 7/15 © 2001, GSI Technology
Read Cycle 2: WE = VIH
* These parameters are sampled and are not 100% tested.
Write Cycle
Parameter Symbol
-8 -10 -12
Unit
Min Max Min Max Min Max
Write cycle time tWC 8 — 10 — 12 — ns
Address valid to end of write tAW 5.5 — 7 — 8 — ns
Chip enable to end of write tCW 5.5 — 7 — 8 — ns
Byte enable to end of write tBW 5.5 — 7 — 8 — ns
Data set up time tDW 4 — 4.5 — 6 — ns
Data hold time tDH 0 — 0 — 0 — ns
Write pulse width tWP 5.5 — 7 — 8 — ns
Address set up time tAS 0 — 0 — 0 — ns
Write recovery time (WE) tWR 0—0—0—ns
Write recovery time (CE)tWR10—0—0—ns
Output Low Z from end of write tWLZ*3—3—3—ns
Write to output in High Z tWHZ*—3.5— 4 — 5 ns
tAA
tRC
Address
tAC
tLZ
tAB
tBLZ
tOE
tOLZ
CE
UB, LB
OE
Data Out
tHZ
tBHZ
tOHZ
Data valid
High impedance
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 8/15 © 2001, GSI Technology
Write Cycle 1: WE control
Write Cycle 2: CE control
tWC
Address
CE
UB, LB
WE
Data In
OE
Data Out
tAW
tCW
tBW
tAS tWP
tWR
tDW tDH
tWLZtWHZ
Data valid
High impedance
tWC
Address
CE
UB, LB
WE
Data In
OE
Data Out
tAW
tWP
tAS tCW
tWR1
tDW tDH
Data valid
High impedance
tBW
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 9/15 © 2001, GSI Technology
Write Cycle 3: UB, LB control
tWC
Address
CE
UB, LB
WE
Data In
OE
Data Out
tAW
tWP
tAS tCW
tWR1
tDW tDH
Data valid
High impedance
tBW
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 10/15 © 2001, GSI Technology
44-Pin, 400 mil SOJ
122
2344
e
B1
D
A1 A2
y
E
HE
Q
c
L
GE
Detail A
A
B
A
Notes:
1. Dimension D& E do not include interlead flash
2. Dimension B1 does not include dambar protrusion / intrusion
3. Controlling dimension: inches
Symbol Dimension in inch Dimension in mm
min nom max min nom max
A — — 0.148 — — 3.759
A1 0.025 — — 0.635 — —
A2 0.105 0.110 0.115 2.667 2.794 2.921
B — 0.018 — — 0.457 —
B1 0.026 0.028 0.032 0.660 0.711 0.813
c — 0.008 — — 0.203 —
D 1.120 1.125 1.130 28.44 28.58 28.70
E 0.395 0.400 0.405 10.033 10.160 10.287
e — 0.05 — — 1.27 —
HE0.435 0.440 0.445 11.049 11.176 11.303
GE0.360 0.370 0.380 9.144 9.398 9.652
L 0.082 0.087 0.106 2.083 2.210 2.70
y — — 0.004 — — 0.102
Q0o—7o0o—7o
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 11/15 © 2001, GSI Technology
44-Pin, 400 mil TSOP-II
D
122
2344
eB
Q
A
A1 A2
y
c
Detail A
E
HE
L
L1
A
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Controlling dimension: mm
Symbol
Dimension in inch Dimension in mm
min nom max min nom max
A — — 0.047 — — 1.20
A1 0.002 — — 0.05 — —
A2 0.037 0.039 0.041 0.95 1.00 1.05
B 0.01 0.014 0.018 0.25 0.35 0.45
c — 0.006 — — 0.15 —
D 0.721 0.725 0.729 18.31 18.41 18.51
E 0.396 0.400 0.404 10.06 10.16 10.26
e — 0.031 — — 0.80 —
HE0.455 0.463 0.471 11.56 11.76 11.96
L 0.016 0.020 0.024 0.40 0.50 0.60
L1 — 0.031 — — 0.80 —
y — — 0.004 — — 0.10
Q0o—5o0o—5o
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 12/15 © 2001, GSI Technology
6 mm x 10 mm FP-BGA
Pin A1
Index
A1
E
Top View
Side View
D
A
aaa
Pin A1
Index
E1
Bottom View
D1
c
e
e
Solder Ballfb
Symbol Unit: mm
A 1.10±0.10
A1 0.20~0.30
fbf0.30~0.40
c 0.36(TYP)
D 10.0±0.05
D1 5.25
E 6.0±0.05
E1 3.75
e 0.75(TYP)
aaa 0.10
A B C D E F G H
1
2
3
4
5
6
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 13/15 © 2001, GSI Technology
Ordering Information
Part Number*Package Access Time Temp. Range Status
GS74116ATP-8 400 mil TSOP-II 8 ns Commercial
GS74116ATP-10 400 mil TSOP-II 10 ns Commercial
GS74116ATP-12 400 mil TSOP-II 12 ns Commercial
GS74116ATP-8I 400 mil TSOP-II 8 ns Industrial
GS74116ATP-10I 400 mil TSOP-II 10 ns Industrial
GS74116ATP-12I 400 mil TSOP-II 12 ns Industrial
GS74116AGP-8 Pb-free 400 mil TSOP-II 8 ns Commercial
GS74116AGP-10 Pb-free 400 mil TSOP-II 10 ns Commercial
GS74116AGP-12 Pb-free 400 mil TSOP-II 12 ns Commercial
GS74116AGP-8I Pb-free 400 mil TSOP-II 8 ns Industrial
GS74116AGP-10I Pb-free 400 mil TSOP-II 10 ns Industrial
GS74116AGP-12I Pb-free 400 mil TSOP-II 12 ns Industrial
GS74116AJ-8 400 mil SOJ 8 ns Commercial
GS74116AJ-10 400 mil SOJ 10 ns Commercial
GS74116AJ-12 400 mil SOJ 12 ns Commercial
GS74116AJ-8I 400 mil SOJ 8 ns Industrial
GS74116AJ-10I 400 mil SOJ 10 ns Industrial
GS74116AJ-12I 400 mil SOJ 12 ns Industrial
GS74116AX-8 Fine Pitch BGA 8 ns Commercial
GS74116AX-10 Fine Pitch BGA 10 ns Commercial
GS74116AX-12 Fine Pitch BGA 12 ns Commercial
GS74116AX-8I Fine Pitch BGA 8 ns Industrial
GS74116AX-10I Fine Pitch BGA 10 ns Industrial
GS74116AX-12I Fine Pitch BGA 12 ns Industrial
GS74116AGX-8 Pb-free Fine Pitch BGA 8 ns Commercial
GS74116AGX-10 Pb-free Fine Pitch BGA 10 ns Commercial
GS74116AGX-12 Pb-free Fine Pitch BGA 12 ns Commercial
GS74116AGX-8I Pb-free Fine Pitch BGA 8 ns Industrial
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 14/15 © 2001, GSI Technology
* Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS74116ATP-8T
GS74116AGX-10I Pb-free Fine Pitch BGA 10 ns Industrial
GS74116AGX-12I Pb-free Fine Pitch BGA 12 ns Industrial
Ordering Information
Part Number*Package Access Time Temp. Range Status
GS74116ATP/J/X
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 12/2004 15/15 © 2001, GSI Technology
4Mb Asynchronous Datasheet Revision History
Rev. Code: Old;
New
Types of Changes
Format or Content Page #/Revisions/Reason
74116A_r1 Format/Content • Created new datasheet
74116A_r1; 74116A_r1_01 Content
• Added 6 ns and 7 ns speed bins
• Updated power numbers
• Changed FPBGA package size from 7.2 x 11.65 mm to 6 x 10 mm
• Changed package designator from “U” to “X” for FPBGA
• Changed D3 on FPBGA pinout to A17 and E3 to NC
74116A_r1_01; 74116A_r1_02 Content • Updated Recommended Operating Conditions on page 4
• Updated Read Cycle and Write Cycle AC Characteristics tables
74116A_r1_02; 74116A_r1_03 Content • Removed 6 ns speed bin from entire document
74116A_r1_03; 74116A_r1_04 Content • Removed 7 ns speed bin from entire document
74116A_r1_04; 74116A_r1_05 Content/Format • Updated format
• Added Pb-free information for TSOP
74116A_r1_05; 74116A_r1_06 Content/Format • Added Pb-free information for FP-BGA
