Intel® Server Board
SE7320VP2
Technical Product Specification
Intel order number C91056-002
Revision 2.1
October, 2006
Enterprise Platforms and Services Division – Marketing
Revision History Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
ii
Revision History
Date Revision
Number Modifications
May 2004 0.5 Preliminary Release based off of the SE7520JR2 Technical Product
Specification revision 0.5.
September 2004 0.9 Updated and added many diagrams, removed support for the Active Riser,
added support and documentation for the low-profile riser slot, updated the
riser card and add-in card support sections, added support and documentation
for a second channel IDE, updated BIOS Setup tables to match the latest
BIOS, updated the entire Server Management section, corrected connector
designations, updated the “Integration and Usage Tips” section, removed all
references to the IMM and removed supported features of the IMM (IMM is not
supported on this Server Board), updated the baseboard jumper sections.
October 2004 1.0 Removed Preliminary and Confidential labels, removed requirement of Full-
height Riser slots to be populated before low-profile slot, updated Server
Management diagrams to allow them to be printed, updated the jumper block
diagrams and pin assignments, removed “J3K4” connector, corrected
miscellaneous typos, and added document order number.
March 2005 1.9 Added references for the DDR2 version of the Server Board SE7320VP2,
removed references to “Memory Mirroring” (as it is not supported on the
Server Board SE7320VP2), changed references to SATA-100 to SATA-150,
made other minor edits.
April 2005 2.0 Released version
October 2006 2.1 Revise: BIOS supports Console Redirection.
Intel® Server Board SE7320VP2 Disclaimers
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Intel order number C91056-002 iii
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except
as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel
products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for
use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and
product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility
whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Server Board SE7320VP2 may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.
Intel Corporation server boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended
thermal requirements of these components when the fully integrated system is used together. It is the
responsibility of the system integrator that chooses not to use Intel developed server building blocks to
consult vendor datasheets and operating parameters to determine the amount of air flow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible if
components fail or the server board does not operate correctly when used outside any of their published
operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2004, 2005. All rights reserved.
Table of Contents Intel® Server Board SE7320VP2
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Table of Contents
1. Introduction ........................................................................................................................15
1.1 Chapter Outline...................................................................................................... 15
1.2 Server Board Use Disclaimer ................................................................................15
2. Server Board Overview......................................................................................................16
2.1 Server Board SE7320VP2 SKU Availability........................................................... 16
2.2 Server Board SE7320VP2 Feature Set ................................................................. 16
3. Functional Architecture.....................................................................................................21
3.1 Processor Sub-system........................................................................................... 21
3.1.1 Processor VRD ...................................................................................................... 22
3.1.2 Reset Configuration Logic .....................................................................................22
3.1.3 Processor Module Presence Detection ................................................................. 22
3.1.4 GTL2006................................................................................................................ 22
3.1.5 Common Enabling Kit (CEK) Design Support........................................................ 23
3.1.6 Processor Support ................................................................................................. 23
3.1.7 Multiple Processor Initialization ............................................................................. 26
3.1.8 CPU Thermal Sensors........................................................................................... 26
3.1.9 Processor Thermal Control Sensor ....................................................................... 26
3.1.10 Processor Thermal Trip Shutdown ........................................................................ 26
3.1.11 Processor IERR ..................................................................................................... 26
3.2 Intel® E7320 chipset............................................................................................... 27
3.2.1 E7320 Memory Controller Hub (MCH)...................................................................27
3.2.2 I/O Controller Hub (6300ESB ICH) ........................................................................ 28
3.3 Memory Sub-System .............................................................................................31
3.3.1 Memory Sizing .......................................................................................................31
3.3.2 Memory Population................................................................................................ 33
3.3.3 ECC Memory Initialization ..................................................................................... 35
3.3.4 Memory Test.......................................................................................................... 35
3.3.5 Memory Monitoring ................................................................................................ 36
3.3.6 Memory RASUM Features..................................................................................... 36
3.4 I/O Sub-System ..................................................................................................... 39
3.4.1 PCI Subsystem ...................................................................................................... 39
3.4.2 Interrupt Routing .................................................................................................... 43
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3.4.3 IDE Support ...........................................................................................................46
3.4.4 SATA Support........................................................................................................ 46
3.4.5 Video Support ........................................................................................................ 47
3.4.6 Marvell* 88E8050 – PCI Express Network Interface Controller............................. 50
3.4.7 Intel® 82541PI – PCI Network Interface Controller ................................................ 50
3.4.8 USB 2.0 Support.................................................................................................... 50
3.4.9 Super I/O Chip ....................................................................................................... 50
3.4.10 BIOS Flash ............................................................................................................ 55
3.5 Configuration and Initialization............................................................................... 55
3.5.1 Memory Space.......................................................................................................55
3.5.2 I/O Map .................................................................................................................. 62
3.5.3 Accessing Configuration Space............................................................................. 64
3.6 Clock Generation and Distribution .........................................................................65
4. System BIOS.......................................................................................................................66
4.1 BIOS Identification String....................................................................................... 66
4.2 BIOS Power-on Self Test (POST).......................................................................... 67
4.2.1 User Interface ........................................................................................................67
4.2.2 System Diagnostic Screen..................................................................................... 68
4.2.3 Quiet Boot / OEM Splash Screen .......................................................................... 68
4.2.4 BIOS Boot Popup Menu ........................................................................................ 69
4.3 BIOS Setup Utility .................................................................................................. 69
4.3.1 Localization............................................................................................................ 69
4.3.2 Console Redirection .............................................................................................. 69
4.3.3 Configuration Reset ............................................................................................... 69
4.3.4 Keyboard Commands ............................................................................................ 70
4.3.5 Entering BIOS Setup .............................................................................................71
4.4 Flash Architecture and Flash Update Utility...........................................................88
4.4.1 Rolling BIOS and On-line Updates ........................................................................88
4.4.2 Flash Update Utility................................................................................................ 88
4.4.3 Flash BIOS ............................................................................................................88
4.4.4 User Binary Area ................................................................................................... 88
4.4.5 Recovery Mode...................................................................................................... 89
4.4.6 Update OEM Logo ................................................................................................. 90
4.5 OEM Binary ...........................................................................................................91
4.6 Security.................................................................................................................. 91
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4.6.1 Operating Model .................................................................................................... 92
4.6.2 Administrator/User Passwords and F2 Setup Usage Model..................................92
4.6.3 Password Clear Jumper ........................................................................................ 94
4.7 Extensible Firmware Interface (EFI) ......................................................................94
4.7.1 EFI Shell ................................................................................................................94
4.8 Operating System Boot, Sleep, and Wake ............................................................ 95
4.8.1 Microsoft* Windows* Compatibility ........................................................................ 95
4.8.2 Advanced Configuration and Power Interface (ACPI) ........................................... 95
4.8.3 Sleep and Wake Functionality ............................................................................... 96
5. Platform Management........................................................................................................99
5.1 Platform Management Architecture Overview ..................................................... 100
5.1.1 5V Standby ..........................................................................................................101
5.1.2 IPMI Messaging, Commands, and Abstractions .................................................. 101
5.1.3 IPMI ‘Sensor Model’............................................................................................. 101
5.1.4 Management Controllers ..................................................................................... 102
5.2 On-Board Platform Management Features and Functionality.............................. 104
5.2.1 Server Management I2C Buses ........................................................................... 105
5.2.2 Power Control Interfaces ..................................................................................... 105
5.2.3 mBMC Hardware Architecture .............................................................................106
5.2.4 Power Supply Interface Signals........................................................................... 107
5.2.5 Power Control Sources........................................................................................ 108
5.2.6 Power-up Sequence ............................................................................................ 109
5.2.7 Power-down Sequence........................................................................................ 109
5.2.8 System Reset Control.......................................................................................... 109
5.2.9 Control Panel User Interface ............................................................................... 110
5.2.10 Baseboard Fan Control........................................................................................ 113
5.2.11 mBMC Peripheral SMBus.................................................................................... 114
5.2.12 Watchdog Timer .................................................................................................. 114
5.2.13 System Event Log (SEL) ..................................................................................... 114
5.2.14 Sensor Data Record (SDR) Repository ............................................................... 115
5.2.15 Field Replaceable Unit (FRU) Inventory Devices ................................................ 115
5.2.16 NMI Generation ................................................................................................... 116
5.2.17 SMI Generation.................................................................................................... 116
5.2.18 Event Message Reception................................................................................... 116
5.2.19 mBMC Self Test................................................................................................... 116
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5.2.20 Messaging Interfaces...........................................................................................116
5.2.21 Event Filtering and Alerting.................................................................................. 119
5.2.22 mBMC Sensor Support........................................................................................ 120
5.3 Console Redirection ............................................................................................ 122
5.4 Wired For Management (WFM) ........................................................................... 122
5.5 Vital Product Data (VPD) ..................................................................................... 123
5.6 PXE BIOS Support ..............................................................................................123
5.7 System Management BIOS (SMBIOS)................................................................ 123
6. Error Reporting and Handling.........................................................................................124
6.1 Fault Resilient Booting (FRB) ..............................................................................124
6.1.1 FRB1 – BSP Self-Test Failures ........................................................................... 124
6.1.2 FRB2 – BSP POST Failures................................................................................ 124
6.1.3 FRB3 – BSP Reset Failures ................................................................................125
6.1.4 OS Watchdog Timer - Operating System Load Failures...................................... 125
6.1.5 Treatment of Failed Processors........................................................................... 126
6.2 Memory Error Handling........................................................................................126
6.2.1 Memory Error Handling in RAS Mode.................................................................. 126
6.2.2 Memory Error Handling in non-RAS Mode .......................................................... 127
6.2.3 DIMM Enabling ....................................................................................................127
6.2.4 Single-bit ECC Error Throttling Prevention .......................................................... 127
6.3 Error Logging ....................................................................................................... 128
6.3.1 SMI Handler......................................................................................................... 128
6.4 Error Messages and Error Codes ........................................................................ 130
6.4.1 POST Error Messages......................................................................................... 130
6.4.2 POST Error Codes...............................................................................................134
6.4.3 BIOS Generated POST Error Beep Codes.......................................................... 137
6.4.4 Boot Block Error Beep Codes.............................................................................. 138
6.5 Checkpoints ......................................................................................................... 139
6.5.1 System ROM BIOS POST Task Test Point (Port 80h Code)............................... 139
6.5.2 Diagnostic LEDs .................................................................................................. 139
6.5.3 POST Code Checkpoints..................................................................................... 140
6.5.4 Bootblock Initialization Code Checkpoints........................................................... 142
6.5.5 Bootblock Recovery Code Checkpoint ................................................................ 143
6.5.6 DIM Code Checkpoints........................................................................................ 144
6.5.7 ACPI Runtime Checkpoints ................................................................................. 145
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6.5.8 Memory Error Codes ........................................................................................... 145
6.6 Light Guided Diagnostics..................................................................................... 146
7. Connectors and Jumper Blocks ................ ......................... ......................... ............ .......147
7.1 Power Connectors ............................................................................................... 147
7.2 Riser Slots ...........................................................................................................148
7.2.1 Low-profile PCI-X Riser Slot ................................................................................ 148
7.2.2 Full-height PCI-X, Intel® Adaptive Slot................................................................. 151
7.3 Front Panel Connectors....................................................................................... 155
7.3.1 Front Panel Connectors....................................................................................... 156
7.3.2 SSI Compliant 34-pin Front Panel Connector...................................................... 158
7.4 I/O Connectors..................................................................................................... 158
7.4.1 VGA Connector.................................................................................................... 158
7.4.2 NIC Connectors ................................................................................................... 159
7.4.3 ATA-100 Connector ............................................................................................. 160
7.4.4 SATA Connectors ................................................................................................ 161
7.4.5 Floppy Controller Connector................................................................................ 161
7.4.6 Serial Port Connectors......................................................................................... 162
7.4.7 Keyboard and Mouse Connector ......................................................................... 163
7.4.8 USB Connector.................................................................................................... 163
7.5 Fan Headers ........................................................................................................ 164
7.6 Configuration Jumpers......................................................................................... 166
7.6.1 System Recovery and Update Jumpers .............................................................. 166
7.6.2 BIOS Select Jumper ............................................................................................167
7.6.3 External RJ45 Serial Port Jumper Block.............................................................. 167
8. Design and Environmental Specifications.....................................................................168
8.1 Server Board SE7320VP2 Design Specification ................................................. 168
8.2 Power Supply Requirements ...............................................................................168
8.2.1 Output Connectors............................................................................................... 169
8.2.2 Grounding ............................................................................................................ 171
8.2.3 Remote Sense .....................................................................................................172
8.2.4 Standby Outputs .................................................................................................. 172
8.2.5 Voltage Regulation .............................................................................................. 172
8.2.6 Dynamic Loading ................................................................................................. 173
8.2.7 Capacitive Loading .............................................................................................. 173
8.2.8 Closed Loop Stability ........................................................................................... 173
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8.2.9 Common Mode Noise ..........................................................................................173
8.2.10 Ripple / Noise ...................................................................................................... 174
8.2.11 Soft Starting .........................................................................................................174
8.2.12 Zero Load Stability Requirements ....................................................................... 174
8.2.13 Timing Requirements........................................................................................... 174
8.2.14 Residual Voltage Immunity in Standby Mode ...................................................... 176
8.3 Product Regulatory Compliance .......................................................................... 177
8.3.1 Product Safety Compliance ................................................................................. 177
8.3.2 Product EMC Compliance ................................................................................... 177
8.3.3 Product Regulatory Compliance Markings .......................................................... 178
8.4 Electromagnetic Compatibility Notices ................................................................ 178
8.4.1 FCC (USA)........................................................................................................... 178
8.4.2 Industry Canada (ICES-003) ............................................................................... 179
8.4.3 Europe (CE Declaration of Conformity) ............................................................... 179
8.4.4 Taiwan Declaration of Conformity........................................................................179
8.4.5 Korean RRL Compliance ..................................................................................... 180
8.4.6 Australia / New Zealand....................................................................................... 180
Appendix A: Integration and Usage Tips..............................................................................181
Glossary...................................................................................................................................182
Reference Documents................... ............. ............ ............. ............ ............. ............ ............ ..185
List of Figures Intel® Server Board SE7320VP2
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List of Figures
Figure 1. Server Board SE7320VP2 Board Layout..................................................................... 18
Figure 2. Server Board Dimensions............................................................................................ 20
Figure 3. Server Board SE7320VP2 Block Diagram...................................................................21
Figure 4. CEK Processor Mounting ............................................................................................ 23
Figure 5. Identifying Banks of Memory ....................................................................................... 33
Figure 6. Interrupt Routing Diagram ...........................................................................................45
Figure 7. Serial Port Configuration Jumper Location ..................................................................53
Figure 8. Intel® Xeon™ Processor Memory Address Space....................................................... 56
Figure 9. DOS Compatibility Region ........................................................................................... 57
Figure 10. Extended Memory Map.............................................................................................. 59
Figure 11. CONFIG_ADDRES Register......................................................................................65
Figure 12. BIOS Identification String...........................................................................................66
Figure 13. mBMC in a Server Management System................................................................. 104
Figure 14. External Interfaces to mBMC................................................................................... 106
Figure 15. Typical mBMC Block Diagram .................................................................................107
Figure 16. Power Supply Control Signals ................................................................................. 108
Figure 17. Location of Diagnostic LEDs on Baseboard ............................................................ 140
Figure 18. Server Board SE7320VP2 Configuration Jumpers (J1H2, J1H3, J1H5) ................. 166
Figure 19. BIOS Select Jumper (J1A4)..................................................................................... 167
Figure 20. Power Harness Specification Drawing..................................................................... 169
Figure 21. Output Voltage Timing ............................................................................................. 175
Figure 22. Turn On/Off Timing (Power Supply Signals)............................................................ 176
Intel® Server Board SE7320VP2 List of Tables
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Intel order number C91056-002 xi
List of Tables
Table 1. Baseboard Layout Reference ....................................................................................... 19
Table 2. Processor Support Matrix .............................................................................................24
Table 3. DIMM Module Capacities.............................................................................................. 32
Table 4. Supported DDR-266 DIMM Populations ....................................................................... 34
Table 5. Supported DDR-333 DIMM Populations ....................................................................... 34
Table 6. Supported DDR2-400 DIMM Populations ..................................................................... 35
Table 7. Memory Monitoring Support.......................................................................................... 36
Table 8. PCI Bus Segment Characteristics................................................................................. 39
Table 9. PCI Configuration IDs and Device Numbers................................................................. 41
Table 10. PCI Interrupt Routing/Sharing..................................................................................... 43
Table 11. Interrupt Definitions..................................................................................................... 44
Table 12. Video Modes ............................................................................................................... 48
Table 13. Video Memory Interface..............................................................................................49
Table 14. Super I/O GPIO Usage Table ..................................................................................... 51
Table 15. Serial A Header Pinout ............................................................................................... 52
Table 16. Serial Port Configuration Jumper [J8A3]..................................................................... 53
Table 17. Rear Serial B Port Adapter Pinout ..............................................................................54
Table 18. SMM Space Table ......................................................................................................61
Table 19. I/O Map ....................................................................................................................... 62
Table 20. Sample BIOS Popup Menu......................................................................................... 69
Table 21. BIOS Setup Keyboard Command Bar Options ........................................................... 70
Table 22. BIOS Setup, Main Menu Options................................................................................ 71
Table 23. BIOS Setup, Advanced Menu Options........................................................................ 72
Table 24. BIOS Setup, Processor Configuration Sub-menu Options ......................................... 72
Table 25. BIOS Setup IDE Configuration Menu Options ............................................................ 73
Table 26. Mixed P-ATA-S-ATA Configuration with only Primary P-ATA..................................... 75
Table 27. BIOS Setup, IDE Device Configuration Sub-menu Selections ...................................75
Table 28. BIOS Setup, Floppy Configuration Sub-menu Selections........................................... 76
Table 29. BIOS Setup, Super I/O Configuration Sub-menu........................................................ 77
Table 30. BIOS Setup, USB Configuration Sub-menu Selections .............................................. 77
Table 31. BIOS Setup, USB Mass Storage Device Configuration Sub-menu Selections ........... 78
Table 32. BIOS Setup, PCI Configuration Sub-menu Selections ...............................................78
List of Tables Intel® Server Board SE7320VP2
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Table 33. BIOS Setup, Memory Configuration Sub-menu Selections......................................... 79
Table 34. BIOS Setup, Boot Menu Selections ............................................................................80
Table 35. BIOS Setup, Boot Settings Configuration Sub-menu Selections ................................ 81
Table 36. BIOS Setup, Boot Device Priority Sub-menu Selections ............................................ 81
Table 37. BIOS Setup, Hard Disk Drive Sub-Menu Selections................................................... 82
Table 38. BIOS Setup, Removable Drives Sub-menu Selections............................................... 82
Table 39. BIOS Setup, CD/DVD Drives Sub-menu Selections................................................... 82
Table 40. BIOS Setup, Security Menu Options...........................................................................82
Table 41. BIOS Setup, Server Menu Selections......................................................................... 84
Table 42. BIOS Setup, System Management Sub-menu Selections .......................................... 85
Table 43. BIOS Setup, Serial Console Features Sub-menu Selections ..................................... 86
Table 44. BIOS Setup, Event Log Configuration Sub-menu Selections ..................................... 87
Table 45. BIOS Setup, Exit Menu Selections ............................................................................. 87
Table 46. Security Features Operating Model ............................................................................92
Table 47. Supported Wake Events ............................................................................................. 98
Table 48. On-Board Supported Management Features.............................................................. 99
Table 49. Server Management I2C Bus ID Assignments ..........................................................105
Table 50. Power Control Initiators.............................................................................................108
Table 51. System Reset Sources and Actions..........................................................................109
Table 52. SSI Power LED Operation ........................................................................................111
Table 53. Fault / Status LED..................................................................................................... 111
Table 54. Chassis ID LED......................................................................................................... 112
Table 55. Suported Channel Assignments ...............................................................................117
Table 56. LAN Channel Capacity.............................................................................................. 118
Table 57. PEF Action Priorities ................................................................................................. 120
Table 58. Platform Sensors for On-Board Platform Instrumentation ........................................ 121
Table 59. Memory Error Handling mBMC................................................................................. 126
Table 60. Memory Error Handling in Non-RAS mode............................................................... 127
Table 61. Memory BIOS Messages .......................................................................................... 130
Table 62. Boot BIOS Messages................................................................................................ 130
Table 63. Storage Device BIOS Messages ..............................................................................131
Table 64. Virus Related BIOS Messages ................................................................................. 132
Table 65. System Configuration BIOS Messages..................................................................... 133
Table 66. CMOS BIOS Messages ............................................................................................ 133
Table 67. Miscellaneous BIOS Messages ................................................................................ 134
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Table 68. USB BIOS Error Messages....................................................................................... 134
Table 69. SMBIOS BIOS Error Messages ................................................................................ 134
Table 70. Error Codes and Messages ...................................................................................... 135
Table 71. BIOS Generated Beep Codes................................................................................... 137
Table 72. Troubleshooting BIOS Beep Codes.......................................................................... 138
Table 73. Boot Block Error Beep Codes ................................................................................... 138
Table 74. POST Progress Code LED Example ........................................................................139
Table 75. POST Code Checkpoints.......................................................................................... 140
Table 76. Bootblock Initialization Code Checkpoints ................................................................ 142
Table 77. Bootblock Recovery Code Checkpoint ..................................................................... 143
Table 78. DIM Code Checkpoints ............................................................................................. 144
Table 79. ACPI Runtime Checkpoints ...................................................................................... 145
Table 80. Memory Error Codes................................................................................................. 145
Table 81. Power Connector (J3K6) Pinout ............................................................................... 147
Table 82. 12V Power Connector (J4J1).................................................................................... 147
Table 83. Power Supply Signal Connector (J1G2) ................................................................... 148
Table 84. Low-profile Riser Slot (J5F1) Pinout ......................................................................... 148
Table 85. Full-height Riser Slot (J4F1) Pinout .......................................................................... 151
Table 86. High-density Front Panel 100-pin Header Pinout (J2J1) .......................................... 156
Table 87. 50-pin Front Panel Connector (J1J2)........................................................................ 157
Table 88. Front Panel SSI Standard 34-pin Connector (J1J1) ................................................. 158
Table 89. VGA Connector Pinout (J6A1) ..................................................................................158
Table 90. RJ-45 10/100/1000 NIC Connector Pinout (J8A1, J8A2).......................................... 159
Table 91. ATA-100 40-pin Connector Pinout (J3K1) ................................................................ 160
Table 92. SATA Connector Pinout (J1H1 and J1H4)................................................................ 161
Table 93. Legacy 34-pin Floppy Drive Connector Pinout (J3K2).............................................. 161
Table 94. External RJ-45 Serial B Port Pinout (J9A2) .............................................................. 162
Table 95. Internal 9-pin Serial A Header Pinout (J1A3)............................................................ 162
Table 96. Stacked PS/2 Keyboard and Mouse Port Pinout (J9A1)........................................... 163
Table 97. External USB Connector Pinout (J5A1, J6A2).......................................................... 163
Table 98. Internal USB Connector Pinout (J1F1) ..................................................................... 164
Table 99. SSI Fan Connector Pinout (J7F1, J5F2, J3K3)......................................................... 164
Table 100. Intel Server Chassis Fan Header Pinout (J3K5) ..................................................... 165
Table 101. Recovery Jumper [J1H2, J1H3, J1H5].................................................................... 166
Table 102. BIOS Select Jumper [J1A4] .................................................................................... 167
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Table 103. Board Design Specifications ...................................................................................168
Table 104. P1 Main Power Connector ...................................................................................... 170
Table 105. P2 Processor Power Connector.............................................................................. 170
Table 106. P3 Baseboard Signal Connector............................................................................. 171
Table 107. P7 Hard Drive Power Connector............................................................................. 171
Table 108. Voltage Regulation Limits ....................................................................................... 172
Table 109. Transient Load Requirements................................................................................. 173
Table 110. Capacitve Loading Conditions ................................................................................173
Table 111. Ripple and Noise..................................................................................................... 174
Table 112. Output Voltage Timing ............................................................................................ 174
Table 113. Turn On/Off Timing ................................................................................................. 175
Table 114. Product Certification Markings ................................................................................ 178
Intel® Server Board SE7320VP2 Introduction
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1. Introduction
This Technical Product Specification (TPS) provides details about the architecture and feature
set of the Intel® Server Board SE7320VP2. The target audience is anyone wishing to obtain
more in depth detail of the server board than what is available in the board’s Users Guide. This
is a technical document meant to assist people with understanding and learning more about the
specific features of the board.
This is one of several technical documents available for this server board. All of the functional
sub-systems that make up the board are described in this document. However, some low-level
detail of specific sub-systems is not included. Design level information for specific sub-systems
can be obtained by ordering the External Product Specification (EPS) for a given sub-system.
The EPS documents available for this server board include the following:
Intel® Server Board SE7320VP2 BIOS EPS
Intel® mini Baseboard Management Controller (mBMC) Core EPS
These documents are not publicly available and must be ordered by your local Intel
representative.
1.1 Chapter Outline
This document is divided into the following chapters
Chapter 1 – Introduction
Chapter 2 – Product Overview
Chapter 3 – Board Architecture
Chapter 4 – System BIOS
Chapter 5 – Platform Management Architecture
Chapter 6 – Error Reporting and Handling
Chapter 7 – Connector Pinout and Jumper Blocks
Chapter 8 – Environmental Specifications
Chapter 9 – Miscellaneous Board Information
Appendix A – Integration and Usage Tips
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
Server Board Overview Intel® Server Board SE7320VP2
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2. Server Board Overview
The Intel® Server Board SE7320VP2 is a monolithic printed circuit board with features that were
designed to support the high-density 1U and 2U server markets.
2.1 Server Board SE7320VP2 SKU Availability
In this document, the name Server Board SE7320VP2 is used to describe a family of boards
that are made available under a common product name. The core features for each board are
common; however each board has the following distinctions:
Product Code Feature Distinctions
SE7320VP2D2 Onboard SATA (RAID) + DDR2 – 400 MHz
SE7320VP2 Onboard SATA (RAID) + DDR – 266/333 MHz
Throughout this document, references to the Server Board SE7320VP2 refer to both board
SKUs unless otherwise noted. The board you select to use may or may not have all the features
described based on the listed board differences.
2.2 Server Board SE7320VP2 Feature Set
Dual processor slots supporting 800MHz Front Side Bus (FSB) Intel® Xeon™ processors
Intel® E7320 Chipset (MCH, 6300ESB ICH)
Two PCI riser slots
- Full-height riser slot: Intel® Adaptive Slot. Depending on the riser used, this is
capable of supporting full-height PCI-X* 66MHz cards with a passive riser, or one x4
PCI Express card with a PCI Express riser.
- Low-profile riser slot: Capable of supporting one low-profile PCI-X 66MHz card.
Six DIMM slots supporting DDR2-400MHz DIMMs or DDR-266/333 MHz1 DIMMs
Dual 10/100/1000 Network Interface Controllers (NICs) (Intel® 82541PI Network
Interface Controller and Marvell* 88E8050 Network Interface Controller)
On board ATI* Rage XL video controller with 8MB SDRAM
Mini-BMC providing “Essentials” server management
1 The use of DDR2-400 MHz or DDR-266/333 MHz DIMMs depends on which board SKU is used. DDR2 DIMMs
cannot be used on a board designed to support DDR. DDR DIMMs cannot be used on boards designed to support
DDR2.
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External I/O connectors
- Stacked PS/2* ports for keyboard and mouse
- RJ45 Serial B port
- Two RJ45 NIC connectors
- 15-pin video connector
- Two USB 2.0 ports
Internal I/O connectors / headers
- One onboard USB header capable of supporting two USB ports
- One DH10 Serial A header
- Two SATA-150 connectors with integrated chipset RAID 0/1 support
- Two ATA100 connections (one 40-pin legacy connector and one through the 100-pin
high-density front panel connector)
- One floppy connector
- SSI-compliant and custom front panel headers
- SSI-compliant 24-pin main power connector. This supports ATX-12V standard in the
first 20 pins
Port-80 diagnostic LEDs displaying POST codes
The following figure shows the board layout of the Server Board SE7320VP2. Each connector
and major component is identified by a number or letter and is identified in Table 1.
Server Board Overview Intel® Server Board SE7320VP2
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Figure 1. Server Board SE7320VP2 Board Layout
T
Q
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1
M
R
G
P
V
X
S
W
O
N
B
C
E
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8
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6
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K
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Table 1. Ba se bo a r d La yout Reference
Ref # Description Ref # Description
1 (J1A1) 2-pin Chassis Intrusion Header
(J1A2) 2-pin Hard Drive Act LED Header
(J1A4) Rolling BIOS Jumper
I CPU #1 Fan Header
2 10-pin DH10 Serial A Header J 5-pin Power Sense Header
3 USB Port 2 K CPU #2 Socket
4 USB Port 1 L CPU #1 Socket
5 Video Connector M 6300ESB ICH – Chipset Component
6 NIC #2 N SATA Ports
7 NIC #1 O (J1H2) Password Clear Jumper
(J1H3) Recovery Boot Jumper
(J1H5) CMOS Clear Jumper
8 RJ-45 Serial B Port P Legacy ATA-100 connector
9 Stacked PS/2 Keyboard and Mouse Ports Q 50-pin Control Panel Header
A CMOS Battery R 100-pin Control Panel, Floppy, IDE Connector
B Full-height Riser Card Slot S Legacy Floppy Connector
C Low-profile Riser Card Slot T SSI 34-pin Control Panel Header
D DIMM Slots U 8-pin AUX Power Connector
E MCH – Chipset Component V 24-pin Main Power Connector
F 1x10 USB Header W SSI System Fan Header
G ATI RageXL Video Controller X Server Chassis SR1400LC / SR2400 System Fan
Header
H CPU #2 Fan Header Y Processor Voltage Regulator Circuitry
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The following mechanical drawing shows the physical dimensions of the baseboard.
Figure 2. Server Board Dimensions
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3. Functional Architecture
This chapter provides a high-level description of the functionality associated with the
architectural blocks that make up the Intel Server Board SE7320VP2.
Figure 3. Server Board SE7320VP2 Block Diagram
3.1 Processor Sub-system
The support circuitry for the processor sub-system consists of the following:
Dual 604-pin zero insertion force (ZIF) processor sockets
Processor host bus AGTL+ support circuitry
Reset configuration logic
Processor module presence detection logic
BSEL detection capabilities
CPU signal level translation
Common Enabling Kit (CEK) CPU retention support
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3.1.1 Processor VRD
The baseboard has two VRDs (Voltage Regulator Down) providing the appropriate voltages to
the installed processors. Each VRD is compliant with the VRD 10.1 specification and is
designed to support Intel® Xeon™ processors that require up to a sustained maximum of
105 AMPs and peak support of 120A.
The baseboard supports the Flexible Mother Board (FMB) specification for all 800 MHz FSB
Intel® Xeon™ processors with respect to current requirements and processor speed
requirements. FMB is an estimation of the maximum values the 800 MHz FSB versions of the
Intel® Xeon™ processors will have over their lifetime. The value is only an estimate and actual
specifications for future processors may differ. At present, the current demand per FMB is a
sustained maximum of a 105 Amps and peak support of 120 Amps.
3.1.2 Reset Configuration Logic
The BIOS determines the processor stepping, cache size, etc through the CPUID instruction. All
processors in the system must operate at the same frequency; have the same cache sizes; and
same VID. No mixing of product families is supported. Processors run at a fixed speed and
cannot be programmed to operate at a lower or higher speed.
3.1.3 Processor Module Presence Detection
Logic is provided on the baseboard to detect the presence and identity of installed processors.
In dual-processor configurations, the on-board mini Baseboard Management Controller (mBMC)
must read the processor voltage identification (VID) bits for each processor before turning on
the VRD. If the VIDs of the two processors are not identical, then the mBMC will not turn on the
VRD. Prior to enabling the embedded VRD, circuitry on the baseboard ensures that the
following criteria are met:
In a uni-processor configuration, CPU 1 is installed
Only supported processors are installed in the system to prevent damage to the MCH
In dual-processor configurations, both processors support the same FSB frequency
3.1.4 GTL2006
The GTL2006 is a 13-bit translator designed for 3.3V to GTL/GTL+ translations to the system
bus. The translator incorporates all the level shifting and logic functions required to interface
between the processor subsystem and the rest of the system.
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3.1.5 Common Enabling Kit (CEK) Design Support
The baseboard complies with Intel’s Common Enabling Kit (CEK) processor mounting and heat
sink retention solution. The baseboard ships with a CEK spring snapped onto the bottom side of
the board beneath each processor socket. The CEK spring is removable, allowing for the use of
non-Intel heat sink retention solutions.
Figure 4. CEK Processor Mounting
3.1.6 Processor Support
The Server Board SE7320VP2 supports one or two Intel® Xeon™ processors utilizing an
800 MHz front side bus with frequencies starting at 2.8 GHz. Previous generations of the Intel
Xeon processor are not supported on the Server Board SE7320VP2.
The server board is designed to provide up to 120A per processors. Processors with higher
current requirements are not supported.
Heatsink assembly with
inte
g
rated hardware
Thermal Interface
Material (TIM)
Baseboard
CEK Spring
Chassis
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Note: Only Intel Xeon processors that support a 800MHz Front Side Bus are supported on the
Server Board SE7320VP2. See the table below for the supported processors.
Table 2. Processor Support Matrix
Processor Family FSB Frequency Frequency Support
Intel® Xeon™ 533 MHz 2.8 GHz No
Intel Xeon 533 MHz 3.06 GHz No
Intel Xeon 533 MHz 3.2 GHz No
Intel Xeon 800 MHz 2.8 GHz Yes
Intel Xeon 800 MHz 3.0 GHz Yes
Intel Xeon 800 MHz 3.2 GHz Yes
Intel Xeon 800 MHz 3.4 GHz Yes
Intel Xeon 800 MHz 3.6 GHz Yes
3.1.6.1 Processor Mis-population Detection
The processors must be populated in the correct order for the processor front-side bus to be
correctly terminated. Baseboard logic will prevent the system from powering up if a single
processor is present but is in the wrong socket. This protects the logic against voltage swings or
unreliable operation that could occur on an incorrectly terminated front-side bus.
If processor mis-population is detected, the mBMC will log a “Configuration Error” error against
processor 1.
3.1.6.2 Mixed Processor Steppings
For optimum system performance, only identical processors should be installed. Processor
steppings can be mixed as long as there is no more than a 1-stepping difference between them.
If the installed processors are more than 1-stepping apart, an error (8080 through 8183) is
logged in the System Event Log (SEL). Acceptable mixed steppings are not reported as errors.
3.1.6.3 Mixed Processor Models
Processor models cannot be mixed. If this condition is detected an error (8196) is logged in the
SEL.
3.1.6.4 Mixed Processor Families
Processor families cannot be mixed in a system. If this condition is detected an error (8194) is
logged in the SEL.
3.1.6.5 Mixed Processor Cache Sizes
If the installed processors have mixed cache sizes, an error (8192) will be logged in the SEL.
The size of all cache levels must match between all installed processors. Mixed cache
processors are not supported.
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3.1.6.6 Jumperless Processor Speed Settings
The Intel® XeonTM processor does not utilize jumpers or switches to set the processor
frequency. The BIOS reads the highest ratio register from all processors in the system. If all
processors are the same speed, the Actual Ratio register is programmed with the value read
from the High Ratio register. If all processors do not match, the highest common value between
High and Low Ratio is determined and programmed to all processors. If no value works for all
installed processors, all processors not capable of speeds supported by the bootstrap processor
(BSP) are disabled and an error is displayed.
3.1.6.7 Microcode
IA-32 processors have the capability of correcting specific errata through the loading of an Intel-
supplied data block (microcode update). The BIOS is responsible for storing the update in
nonvolatile memory and loading it into each processor during POST. The BIOS performs the
recommended update signature verification prior to storing the update in the Flash.
3.1.6.8 Processor Cache
The BIOS enables all levels of processor cache as early as possible during POST. There are no
user options to modify the cache configuration, size or policies. The largest and highest level
cache detected is reported in BIOS Setup.
3.1.6.9 Hyper-Threading Technology
Intel® XeonTM processors support Hyper-Threading Technology. The BIOS detects processors
that support this feature and enables the feature during POST. BIOS Setup provides an option
to selectively enable or disable this feature. The default behavior is enabled.
The BIOS creates additional entries in the ACPI MP tables to describe the virtual processors.
3.1.6.10 Intel SpeedStep® Technology
Intel® Xeon™ processors support the Intel SpeedStep® Technology. This feature changes the
processor operating ratio and voltage similar to the Thermal Monitor 2 (TM2) feature. It must be
used in conjunction with the TM1 or TM2 feature. The BIOS implements the Intel SpeedStep®
Technology feature in conjunction with the TM2 feature.
3.1.6.11 Intel® Extended Memory 64 Technology (Intel® EM64T) Support
The system BIOS on the Server Board SE7320VP2 supports the Intel® Extended Memory 64
Technology (Intel® EM64T) of the Intel® Xeon™ processors. There is no BIOS setup option to
enable or disable this support. The system will be in IA-32 compatibility mode when booting to
an operating system. Operating system specific drivers are then loaded to enable this capability.
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3.1.7 Multiple Processor Initialization
IA-32 processors have a microcode-based BSP-arbitration protocol. On reset, all of the
processors compete to become the bootstrap processor (BSP). If a serious error is detected
during a Built-in Self-Test (BIST), that processor will not participate in the initialization protocol.
A single processor that successfully passes BIST is automatically selected by the hardware as
the BSP and starts executing from the reset vector (F000:FFF0h). A processor that does not
perform the role of BSP is referred to as an application processor (AP).
The BSP is responsible for executing the BIOS power-on self-test (POST) and preparing the
machine to boot the operating system. At boot time, the system is in virtual wire mode and the
BSP alone is programmed to accept local interrupts. INTR is driven by programmable interrupt
controller (PIC) and non-maskable interrupt (NMI). For single processor configurations, the
system is put in the virtual wire mode, which uses the local APIC of the processor.
As a part of the boot process, the BSP wakes each AP. When awakened, an AP programs its
Memory Type Range Registers (MTRRs) to be identical to those of the BSP. All APs execute a
halt instruction with their local interrupts disabled. The System Management Mode (SMM)
handler expects all processors to respond to an SMI. If the BSP determines that an AP exists
that is a lower-featured processor or that has a lower value returned by the CPUID function, the
BSP will switch to the lowest-featured processor in the system.
3.1.8 CPU Thermal Sensors
The CPU temperature will be indirectly measured via the thermal diodes. These are monitored
by the National Semiconductor* LM93 device. The mBMC configures the LM93 device to
monitor these sensors. The temperatures are available via mBMC IPMI sensors.
3.1.9 Processor Thermal Control Sensor
The Intel® XeonTM processors generate a signal indicating throttling due to thermal conditions.
The mBMC implements an IPMI sensor that provides the percentage of time a processor has
been throttling over the last 1.46 seconds. Baseboard management should be able to force a
thermal control condition when reliable system operation requires reduced power consumption
for the system.
3.1.10 Processor Thermal Trip Shutdown
If a thermal overload condition exists (thermal trip) an Intel® Xeon™ processor outputs a digital
signal that is monitored by the mBMC. A thermal trip is a critical condition and indicates that the
processor may become damaged if it continues to run. To help protect the processor, the
management controller automatically powers off the system. In addition it will assert the System
Status LED and generate an event in the System Event Log.
3.1.11 Processor IERR
The IERR signal is asserted by the Intel® Xeon™ processor as the result of an internal error.
The mBMC configures the heceta7 device to monitor this signal. When this signal is asserted,
the mBMC generates a processor IERR event.
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3.2 Intel® E7320 chipset
The architecture of the Server Board SE7320VP2 is designed around the Intel® E7320 chipset.
The chipset consists of two components that together are responsible for providing the interface
between all major sub-systems on the baseboard, including the processor, memory, and I/O
sub-systems. These two components are:
Memory Controller Hub (E7320 MCH)
I/O Controller Hub (6300ESB ICH)
The following sub-sections describe the primary functions and supported features of each
chipset component as they are used on the Server Board SE7320VP2. Later sections provide
more detail on the implementation of the sub-systems.
3.2.1 E7320 Memory Controller Hub (MCH)
The MCH integrates four functions into a single 1077-ball FC-BGA package:
Front Side Bus
Memory Controller
PCI Express Controller
Hub Link Interface
3.2.1.1 Front Side Bus (FSB)
The E7320 MCH supports either single or dual processor configurations using 800MHz FSB
Intel® Xeon™ processors. The MCH supports a base system bus frequency of 200 MHz. The
address and request interface is double pumped to 400 MHz while the 64-bit data interface
(+ parity) is quad pumped to 800 MHz. This provides a matched system bus address and data
bandwidths of 6.4 GB/s
3.2.1.2 MCH Memory Sub-System Ove rvie w
The MCH provides an integrated memory controller for direct connection to two channels of
registered DDR-266, DDR-333, or DDR2-400 memory (stacked or unstacked). Peak theoretical
memory data bandwidth using DDR-266 technology is 4.26 GB/s and 5.33 GB/S for DDR-333
technology. For DDR2-400 technology, this increases to 6.4 GB/s.
Several RASUM (Reliability, Availability, Serviceability, Usability and Manageability) features
are provided by the E7320 MCH memory interface:
DIMM sparing allows one DIMM per channel to be held in reserve and brought on-line if
another DIMM in the channel becomes defective.
Hardware periodic memory scrubbing, including demand scrub support.
Retry on uncorrectable memory errors.
x4 SDDC for memory error detection and correction of any number of bit failures in a
single x4 memory device.
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3.2.1.3 PCI Express*
The Intel E7320 MCH is one of the first Intel chipsets to support the new PCI Express* high-
speed serial I/O interface for superior I/O bandwidth. The scalable PCI Express interface
complies with the PCI Express Interface Specification, Rev 1.0a. On the Server Board
SE7320VP2, the MCH provides two x4 PCI Express interfaces, each with a maximum
theoretical bandwidth of 4 GB/s.
The E7320 MCH is a root class component as defined in the PCI Express Interface
Specification, Rev 1.0a. The PCI Express interfaces of the MCH support connection to a variety
of bridges and devices compliant with the same revision of the specification. See the Server
Board SE7320VP2 Tested Hardware and OS List for the tested add-in cards.
3.2.1.4 Hub Interface
The MCH interfaces with the Intel® 6300ESB I/O Controller Hub via a dedicated hub interface
which supports a peak bandwidth of 266MB/s using a x4 base clock of 66 MHz.
3.2.1.5 Full-height Riser Slot
Using Intel® Adaptive Slot technology, the full-height riser slot is a proprietary 280-pin slot with
both PCI-X signals from the I/O Controller Hub (6300ESB ICH) and PCI Express signals from
the MCH routed to it. Depending on the riser card, the slot supports both PCI-X and/or PCI
Express add-in cards. The placement of this slot allows risers supporting full-height, full-length
add-in cards to be used.
3.2.1.6 Low-profile Riser Slot
The low-profile riser slot is a standard 202-pin slot connector supporting PCI-X signals from the
I/O Controller Hub (6300ESB ICH). Because of available board clearances, riser cards can only
support low-profile add-in cards with this slot.
3.2.2 I/O Controller Hub (6300ESB ICH)
The 6300ESB ICH is a multi-function device providing an upstream hub interface for access to
several embedded I/O functions and features including:
PCI Local Bus Specification, Revision 2.3 with support for 33 MHz PCI operations
ACPI power management logic support
Enhanced DMA controller, interrupt controller, and timer functions
Integrated IDE controller with support for Ultra ATA100/66/33
Integrated SATA controller
USB host interface with support for six USB ports; four UHCI host controllers; one EHCI
high-speed USB 2.0 host controller
Integrated ASF controller
System Management Bus (SMBus) Specification, Version 2.0 with additional support for
I2C devices
Low Pin Count (LPC) interface
Firmware Hub (FWH) interface support
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Each function within the 6300ESB ICH has its own set of configuration registers. Once
configured, each appears to the system as a distinct hardware controller sharing the same PCI
bus interface.
3.2.2.1 PCI Interface
The 6300ESB ICH PCI interface provides a 33MHz, Revision 2.3 compliant implementation. All
PCI signals are 5V tolerant, except for PME#. The 6300ESB ICH integrates a PCI arbiter that
supports up to four external PCI bus masters in addition to the internal 6300ESB ICH requests.
On the Server Board SE7320VP2 this PCI interface supports two on-board PCI devices: the
ATI* video controller and the Intel® 82541PI Network Interface Controller.
3.2.2.2 IDE Interface (Bus Master Capability and Synchronous DMA Mode)
The fast IDE interface supports up to four IDE devices, providing an interface for IDE hard disks
and ATAPI devices. Each IDE device can have independent timings. The IDE interface supports
PIO IDE transfers up to 16 Mbytes/sec and Ultra ATA transfers up 100 Mbytes/sec. It does not
consume ISA DMA resources. The IDE interface integrates 16x32-bit buffers for optimal
transfers. The 6300ESB ICH’s IDE system contains two independent IDE signal channels. They
can be electrically isolated independently. They can be configured to the standard primary and
secondary channels (four devices).
3.2.2.3 SATA Controller
The SATA controller supports two SATA devices, providing an interface for SATA hard disks
and ATAPI devices. The SATA interface supports PIO IDE transfers up to 16 Mb/s and Serial
ATA transfers up to 1.5 Gb/s (150 MB/s). The 6300ESB ICH’s SATA system contains two
independent SATA signal ports. They can be electrically isolated independently. Each SATA
device can have independent timings. They can be configured to the standard primary and
secondary channels. The Server Board SE7320VP supports two SATA connectors for internal
hard disks supporting RAID levels 0 and 1.
3.2.2.4 Low Pin Count (LPC) Interface
The 6300ESB ICH implements an LPC Interface as described in the Low Pin Count Interface
Specification, Revision 1.1. The Low Pin Count (LPC) bridge function of the 6300ESB ICH
resides in PCI Device 31:Function 0. In addition to the LPC bridge interface function, D31:F0
contains other functional units including DMA, interrupt controllers, timers, power management,
system management, GPIO, and RTC.
3.2.2.5 Compatibility Modules (DMA Controller, Timer/Counters, Interrupt
Controller)
The DMA controller incorporates the logic of two 82C37 DMA controllers, with seven
independently programmable channels. Channels 0–3 are hardwired to 8-bit, count-by-byte
transfers, and channels 5–7 are hardwired to 16-bit, count-by-word transfers. Any two of the
seven DMA channels can be programmed to support fast Type-F transfers.
The 6300ESB ICH supports two types of DMA: LPC and PC/PCI. LPC DMA and PC/PCI DMA
use the 6300ESB ICH’s DMA controller. The PC/PCI protocol allows PCI-based peripherals to
initiate DMA cycles by encoding requests and grants via two PC/PC REQ#/GNT# pairs. LPC
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DMA is handled through the use of the LDRQ# lines from peripherals and special encoding on
LAD[3:0] from the host. Single, Demand, Verify, and Increment modes are supported on the
LPC interface. Channels 0–3 are 8 bit channels. Channels 5–7 are 16 bit channels. Channel 4
is reserved as a generic bus master request.
The timer/counter block contains three counters that are equivalent in function to those found in
one 82C54 programmable interval timer. These three counters are combined to provide the
system timer function, and speaker tone. The 14.31818 MHz oscillator input provides the clock
source for these three counters.
The 6300ESB ICH provides an ISA-compatible Programmable Interrupt Controller (PIC) that
incorporates the functionality of two 82C59 interrupt controllers. The two interrupt controllers are
cascaded so 14 external and two internal interrupts are possible. In addition, the 6300ESB ICH
supports a serial interrupt scheme. All of the registers in these modules can be read and
restored. This is required to save and restore the system state after power has been removed
and restored to the platform.
3.2.2.6 Advanced Programmable Interrupt Controller (APIC)
In addition to the standard ISA-compatible PIC described in the previous section, the 6300ESB
ICH incorporates the Advanced Programmable Interrupt Controller (APIC).
3.2.2.7 Universal Serial Bus (USB) Controller
The 6300ESB ICH contains an Enhanced Host Controller Interface (EHCI) specification for
Universal Serial Bus, Revision 1.0-compliant host controller that supports USB high-speed
signaling. The high-speed USB 2.0 allows data transfers up to 480 Mb/s, which is 40 times
faster than full-speed USB.
The 6300ESB ICH also contains four Universal Host Controller Interface (UHCI) controllers that
support USB full-speed and low-speed signaling. On the Server Board SE7320VP2, the
6300ESB ICH supports four USB 2.0 ports. All four ports are high-speed, full-speed, and low-
speed capable. 6300ESB ICH’s port-routing logic determines whether a USB port is controlled
by one of the UHCI controllers or by the EHCI controller.
3.2.2.8 RTC
The 6300ESB ICH contains a Motorola* MC146818A-compatible real-time clock with 256 bytes
of battery backed RAM. The real-time clock performs two key functions: keeping track of the
time of day and storing system data, even when the system is powered down. The RTC
operates on a 32.768 KHz crystal and a separate 3V lithium battery.
The RTC supports two lockable memory ranges. By setting bits in the configuration space, two
8-byte ranges can be locked to read and write accesses. This prevents unauthorized reading of
passwords or other system security information.
The RTC supports a date alarm that allows for scheduling a wake up event up to 30 days in
advance. The RTC is designed and verified to meet the following accuracy: +/- 2 seconds/day
for the non-condensing environmental range of temperatures from 10-35ºC.
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3.2.2.9 General Purpose I/O (GPIO)
General-purpose inputs and outputs are provided for custom system design. The number of
inputs and outputs varies depending on the 6300ESB ICH configuration. All unused GPI pins
must be pulled high or low, so that they are at a predefined level and do not cause undue side
effects.
3.2.2.10 Enhanced Power Management
The 6300ESB ICH’s power management functions include enhanced clock control, local and
global monitoring support for 14 individual devices, and various low-power (suspend) states,
such as Suspend-to-DRAM and Suspend-to-Disk. A hardware-based thermal management
circuit permits software-independent entrance to low-power states. The 6300ESB ICH contains
full support for the Advanced Configuration and Power Interface (ACPI) Specification, Revision
2.0b.
3.2.2.11 System Management Bus (SMBus 2.0)
The 6300ESB ICH contains an SMBus host interface that allows the processor to communicate
with SMBus slaves. This interface is compatible with most I2C devices. Special I2C commands
are implemented. The 6300ESB ICH’s SMBus host controller provides a mechanism for the
processor to initiate communications with SMBus peripherals (slaves).
The 6300ESB ICH supports slave functionality, including the Host Notify protocol. Hence, the
host controller supports eight command protocols of the SMBus interface: Quick Command,
Send Byte, Receive Byte, Write Byte/Word, Read Byte/Word, Process Call, Block Read/Write,
and Host Notify. See the System Management Bus (SMBus) Specification, Version 2.0 for more
information.
3.3 Memory Sub-System
The MCH provides an integrated memory controller for direct connection to two channels of
registered DDR-266, DDR-333 or DDR2-400 memory (stacked or unstacked). Peak theoretical
memory data bandwidth using DDR-266 technology is 4.26 GB/s and 5.33 GB/S for DDR-333
technology. For DDR2-400 technology, this increases to 6.4 GB/s.
The MCH supports a burst length of four, whether in single or dual channel mode. In dual
channel mode this results in eight 64-bit chunks (64-byte cache line) from a single read or write.
In single channel mode, two reads or writes are required to access a cache line of data.
3.3.1 Memory Sizing
The memory controller is capable of supporting up to four loads per channel for DDR-333, and
DDR2-400. Memory technologies are classified as being either single rank or dual rank
depending on the number of DRAM devices that are used on any one DIMM. A single rank
DIMM is a single load device. Single rank = one load. Dual rank DIMMs are dual load device.
Dual rank = two loads.
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The Server Board SE7320VP2 provides the following maximum memory capacities based on
the number of DIMM slots provided and maximum supported memory loads by the chipset:
24GB maximum capacity for DDR-266
16GB maximum capacity for DDR-333 and DDR2-400
The minimum memory supported with the system running in single channel memory mode is:
256MB for DDR-266, DDR-333, and DDR2-400
Supported DIMM capacities are as follows:
DDR-266 Memory DIMM sizes include: 256MB, 512MB, 1GB, 2GB, and 4GB
DDR-333 Memory DIMM sizes include: 256MB, 512MB, 1GB, 2GB, and 4GB
DDR2-400 Memory DIMM sizes include: 256MB, 512MB, 1GB, 2GB, and 4GB
Table 3. DIMM Module Capacities
SDRAM Parts / SDRAM Tech nology Used 128Mb 256Mb 512Mb 1Gb
X8, single row 128MB 256MB 512MB 1GB
X8, double row 256MB 512MB 1GB 2GB
X4, single row 256MB 512MB 1GB 2GB
X4, Stacked, double row 512MB 1GB 2GB 4GB
DIMMs on channel A are paired with DIMMs on channel B to configure 2-way interleaving. Each
DIMM pair is referred to as a bank. The bank can be further divided into two rows, based on
single-sided or double-sided DIMMs. If both DIMMs in a bank are single-sided, only one row is
said to be present. For double-sided DIMMs, both rows are said to be present.
The Server Board SE7320VP2 has six DIMM slots, or three DIMM banks. Both DIMMs in a
bank should be identical (same manufacturer, CAS latency, number of rows, columns and
devices, timing parameters etc.). Although DIMMs within a bank must be identical, the BIOS
supports various DIMM sizes and configurations allowing the banks of memory to be different.
Memory sizing and configuration is guaranteed only for qualified DIMMs approved by Intel.
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Figure 5. Identifying Banks of Memory
The BIOS reads the Serial Presence Detect (SPD) SEEPROMs on each installed memory
module to determine the size and timing of the installed memory modules. The memory-sizing
algorithm determines the size of each bank of DIMMs. The BIOS programs the memory
controller in the chipset accordingly. The total amount of configured memory can be found using
BIOS Setup.
3.3.2 Memory Population
Mixing of DDR-266 and DDR-333 DIMMs is supported between banks of memory. However,
when mixing DIMM types, DDR-333 will run at DDR-266 speeds.
Using the following algorithm, BIOS configures the memory controller of the MCH to run in
either dual channel mode or single channel mode:
1. If one or more fully populated DIMM banks are detected, set the memory controller to
dual channel mode. Otherwise, go to step 2.
2. If DIMM 1A is present, set the memory controller to single channel mode A. Otherwise,
go to step 3.
3. If Channel 1B DIMM is present, set the memory controller to single channel mode B.
Otherwise, generate a memory configuration error.
1B1A2B2A3B3A
Bank 1
Bank 2
Bank 3
MCH
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DDR-266 and DDR-333 DIMM population rules are as follows:
DIMM banks must be populated in order, starting with the slots furthest from MCH.
Single rank DIMMs must be populated before dual rank DIMMs.
A maximum of four DIMMs can be populated when all four DIMMs are dual rank DDR-
333 DIMMs.
DDR2 400 DIMM population rules are as follows:
DIMMs banks must be populated in order starting with the slots furthest from MCH.
Dual rank DIMMs are populated before single rank DIMMs.
A maximum of four DIMMs can be populated when all four DIMMs are dual rank
DDR2-400 DIMMs.
The following tables show the supported memory configurations.
S/R = single rank
D/R = dual rank
E = empty
Table 4. Supported DDR-266 DIMM Populations
Bank 3 – DIMMs 3A, 3B Bank 2 – DIMMs 2A, 2B Bank 1 – DIMMs 1A, 1B
S/R S/R S/R
E S/R S/R
E E S/R
D/R D/R D/R
E D/R D/R
E E D/R
D/R S/R S/R
D/R D/R S/R
MCH
E D/R S/R
Table 5. Supported DDR-333 DIMM Populations
Bank 3 – DIMMs 3A, 3B Bank 2 – DIMMs 2A, 2B2 Bank 1 – DIMMs 1A, 1B
S/R S/R S/R
E S/R S/R
E E S/R
E D/R D/R
E E D/R
D/R S/R S/R
MCH
E D/R S/R
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Table 6. Supported DDR2-400 DIMM Populations
Bank 3 – DIMMs 3A, 3B Bank 2 – DIMMs 2A, 2B Bank 1 – DIMMs 1A, 1B
S/R S/R S/R
E S/R S/R
E E S/R
E D/R D/R
E E D/R
E S/R D/R
MCH
S/R S/R D/R
Notes:
On the Server Board SE7320VP2, when using all dual rank DDR-333 or DDR2-400
DIMMs, a total of four DIMMs can be populated. Configuring more than four dual rank
DDR-333 or DDR2-400 DIMMs will result in the BIOS generating a memory
configuration error.
Memory between 4GB and 4GB, minus 512MB, is not accessible for use by the
operating system and may be lost to the user. This area is reserved for BIOS, APIC
configuration space, PCI adapter interface, and virtual video memory space. This means
that if 4GB of memory is installed, 3.5GB of this memory is usable. The chipset should
allow the remapping of unused memory above the 4GB address, but this memory may
not be accessible to an operating system that has a 4GB memory limit.
3.3.3 ECC Memory Initialization
ECC memory must be initialized by the BIOS before it can be used. The BIOS must initialize all
memory locations before using them. The BIOS uses the auto-initialize feature of the MCH to
initialize ECC. ECC memory initialization cannot be aborted and may result in a noticeable delay
in the boot process depending on the amount of memory installed in the system.
3.3.4 Memory Test
System memory is classified as base and extended memory. Base memory is memory that is
required for POST. Extended memory is the remaining memory in the system. Extended
memory may be contiguous or may have one or more holes. The BIOS memory test accesses
all memory except for memory holes.
Memory testing consists of separate base and extended memory tests. The base memory test
runs before video is initialized to verify memory required for POST. The BIOS enables video as
early as possible during POST to provide a visual indication that the system is functional. At
some time after video output has been enabled, BIOS executes the extended memory test. The
status of the extended memory test is displayed on the console. The status of base and
extended memory tests are also displayed on the LCD control panel if present.
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The extended memory test is configured using the BIOS Setup Utility. The coverage of the test
can be configured to one of the following:
Test every location (Extensive)
Test one interleave width per kilo-byte of memory (Sparse)
Test one interleave width per mega-byte of memory (Quick)
The “interleave width” of a memory subsystem is dependent on the chipset configuration. By
default, both the base and extended memory tests are configured to the Disabled setting. The
extended memory test can be aborted by pressing the <Space> key during the test.
3.3.5 Memory Monitoring
Both the baseboard management controller and the BIOS provide support for memory failure
LEDs, and failure/state transition events. The following table shows which memory monitoring
features are supported on the Server Board SE7320VP2.
Table 7. Memory Monitoring Support
Memory Feature Supported
Inventory No
Correctable Error Reporting No
Uncorrectable Error Reporting Yes
DIMM failure can be detected at BIOS POST or during system operation. POST detected DIMM
failures or mis-configuration (incompatible DIMM sizes/speeds/etc) cause the BIOS to disable
the failed/affected DIMMs and generate IPMI SEL events, which are sent to the BMC in use.
The BIOS is responsible for DIMM FRU LED management and illuminates the LEDs associated
with failed or disabled DIMMs.
3.3.6 Memory RASUM Features
The Intel E7320 MCH supports several memory RASUM (Reliability, Availability, Serviceability,
Usability, and Manageability) features. These features include the Intel® x4 Single Device Data
Correction (Intel® x4 SDDC) for memory error detection and correction, Memory Scrubbing,
Retry on Correctable Errors, Integrated Memory Initialization, and DIMM Sparing. The following
sections describe how each is supported.
Note: The operation of the memory RASUM features listed below are supported on the Server
Board SE7320VP2. However, the system has limited memory monitoring and logging
capabilities. It is possible for a RASUM feature to be initiated without notification that the action
has occurred.
3.3.6.1 DRAM ECC – Intel® x4 Single Device Data Correction (Intel® x4 SDDC)
The DRAM interface uses two different ECC algorithms. The first is a standard SEC/DED ECC
across a 64-bit data quantity. The second ECC method is a distributed, 144-bit S4EC-D4ED
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mechanism, which provides x4 SDDC protection for DIMMS that utilize x4 devices. Bits from x4
parts are presented in an interleaved fashion such that each bit from a particular part is
represented in a different ECC word. DIMMs that use x8 devices, can use the same algorithm
but will not have x4 SDDC protection, since at most only four bits can be corrected with this
method. The algorithm does provide enhanced protection for the x8 parts over a standard SEC-
DED implementation. With two memory channels, either ECC method can be utilized with equal
performance, although single-channel mode only supports standard SEC/DED.
3.3.6.2 Integrated Memory Scrub Engine
The Intel E7320 MCH includes an integrated engine to walk the populated memory space
proactively seeking out soft errors in the memory subsystem. In the case of a single bit
correctable error, this hardware detects, logs, and corrects the data except when an incoming
write to the same memory address is detected. For any uncorrectable errors detected, the scrub
engine logs the failure. Both types of errors may be reported via multiple alternate mechanisms
under configuration control. The scrub hardware will also execute “demand scrub” writes when
correctable errors are encountered during normal operation (on demand reads, rather than
scrub-initiated reads). This functionality provides incremental protection against time-based
deterioration of soft memory errors from correctable to uncorrectable.
Using this method, a 16GB system can be completely scrubbed in less than one day. The effect
of the scrub writes do not cause any noticeable degradation to memory bandwidth, although
they will cause a greater latency for that one very infrequent read that is delayed due to the
scrub write cycle.
An uncorrectable error encountered by the memory scrub engine is a “speculative error.” This
designation is applied because no system agent has specifically requested use of the corrupt
data, and no real error condition exists in the system until that occurs. It is possible that the
error resides in an unmodified page of memory that will be simply dropped on a swap back to
disk. Were that to occur, the speculative error would simply “vanish” from the system
undetected without adverse consequences.
3.3.6.3 Retry on Uncorrectable Error
The Intel E7320 MCH includes specialized hardware to resubmit a memory read request upon
detection of an uncorrectable error. When a demand fetch (as opposed to a scrub) of memory
encounters an uncorrectable error as determined by the enabled ECC algorithm, the memory
control hardware will cause a (single) full resubmission of the entire cache line request from
memory to verify the existence of corrupt data. This feature is expected to greatly reduce or
eliminate the reporting of false or transient uncorrectable errors in the DRAM array.
Any given read request will only be retried once on behalf of this error detection mechanism. If
the uncorrectable error is repeated, it will be logged and escalated as directed by device
configuration.
3.3.6.4 Integrated Memory Initialization Engine
The Intel E7320 MCH provides hardware managed ECC auto-initialization of all populated
DRAM space under software control. Once internal configuration has been updated to reflect
the types and sizes of populated DIMM devices, the MCH will traverse the populated address
space initializing all locations with good ECC. This not only speeds the mandatory memory
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initialization step, but also frees the processor to pursue other machine initialization and
configuration tasks.
Additional features have been added to the initialization engine to support high-speed
population and verification of a programmable memory range with one of four known data
patterns (0/F, A/5, 3/C, and 6/9). This function facilitates a limited, very high speed memory test,
as well as provides a BIOS accessible memory zeroing capability for use by the operating
system.
3.3.6.5 DIMM Sparing Function
To provide a more fault tolerant system, the Intel E7320 MCH includes specialized hardware to
support fail-over to a spare DIMM device in case a primary DIMM exceeds a specified threshold
of runtime errors. One of the DIMMs installed per channel, greater than or equal in size than all
installed, will not be used but is kept in reserve. If a significant failure occurs in a particular
DIMM, that DIMM and its corresponding partner in the other channel (if applicable), will, over
time, have its data copied to the spare DIMM(s). When all data has been copied, the reserve
DIMM(s) will be put into service and the failing DIMM will be removed from service. Only one
sparing cycle is supported. If this feature is not enabled, then all DIMMs will be visible in normal
address space.
Note: The DIMM Sparing feature requires that the spare DIMM be at least the size of the largest
primary DIMM in use.
Hardware additions for this feature include the implementation of tracking register per DIMM to
maintain a history of error occurrence, and a programmable register to hold the fail-over error
threshold level. The operational model is straightforward: if the fail-over threshold register is set
to a non-zero value, the feature is enabled, and if the count of errors on any DIMM exceeds that
value, fail-over will commence. The tracking registers themselves are implemented as “leaky
buckets,” such that they do not contain an absolute cumulative count of all errors since power-
on; rather, they contain an aggregate count of the number of errors received over a running time
period. The “drip rate” of the bucket is selectable by software, so it is possible to set the
threshold to a value that will never be reached by a “healthy” memory subsystem experiencing
the rate of errors expected for the size and type of memory devices in use.
The fail-over mechanism is slightly more complex. Once fail-over has been initiated the MCH
must execute every write twice; once to the primary DIMM, and once to the spare. The MCH will
also begin tracking the progress of its built-in memory scrub engine. Once the scrub engine has
covered every location in the primary DIMM, the duplicate write function will have copied every
data location to the spare. At that point, the MCH can switch the spare into primary use, and
take the failing DIMM off-line.
Until the threshold detection has been triggered to request a data copy this mechanism requires
no software support once it has been programmed and enabled. Hardware will detect the
threshold initiating fail-over and escalate the occurrence of that event as directed (signal an
SMI, generate an interrupt, or wait to be discovered via polling). A software routine responding
to the threshold detection must select a victim DIMM (if multiple DIMMs have crossed the
threshold prior to sparing invocation) and initiate the memory copy. Hardware will automatically
isolate the “failed” DIMM after the copy has completed. The data copy is accomplished by
address aliasing within the DDR control interface, thus it does not require reprogramming of the
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DRAM row boundary (DRB) registers, nor does it require notification to the operating system
that anything has occurred in memory.
3.4 I/O Sub-System
The I/O sub-system is made up of several components:
The E7320 MCH provides the PCI Express interface to the full-height riser slot, and the
PCI Express interface to one of the on-board Ethernet controllers.
The 6300ESB ICH provides the PCI-X interface to the full-height riser slot, low-profile
riser slot, and the PCI interface to the onboard video controller, super I/O chip, one of
the Ethernet controllers, and the management sub-system
This section describes the function of each I/O interface and how they operate on the Server
Board SE7320VP2.
3.4.1 PCI Subsystem
The primary I/O interface for the Server Board SE7320VP2 is PCI, with four independent PCI
bus segments.
One PCI 33MHz/32-bit bus segment (P32-A) is controlled through the 6300ESB ICH.
One PCI-X 66MHz/64-bit bus segment (P64-A) is controlled through the 6300ESB ICH.
One x4 PCI Express (P64-Express-A) bus segment is controlled from the E7320 MCH.
One x1 PCI Express (P64-Express-B) bus segment is controlled from the E7320 MCH.
The table below lists the characteristics of the four PCI bus segments.
Table 8. PCI Bus Segment Characteristics
PCI Bus Segment Voltage Width Speed Type PCI I/O Card Slots
P32-A 5V 32 bits 33 MHz PCI None. Internal component use only.
P64-A 3.3V 64 bits 66 MHz PCI-X
One full-height riser connector, Intel®
Adaptive Slot capable of supporting up to
three full-length PCI-X add-in cards. One low-
profile riser connector capable of supporting
one low-profile PCI-X add-in card.
P64-Express-A Differential 64 bits One x4 PCI-E
One full-height riser connector, Intel®
Adaptive Slot capable of supporting one full-
length PCI Express add-in card.
P64-Express-B Differential 64 bits One x1 PCI-E None. Internal component use only.
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3.4.1.1 P32-A: 32-bit, 33MHz PCI Subsystem
All 32-bit, 33MHz PCI I/O is directed through the 6300ESB ICH. The 32-bit, 33MHz PCI
segment created by the 6300ESB ICH is known as the P32-A segment. The P32-A segment
supports the following embedded devices:
2D/3D Graphics Accelerator: ATI Rage XL Video Controller
SIO Chip: National Semiconductor* PC87417 Super I/O
Hardware monitoring sub-system: SMBUS
NIC Chip: Intel® 82541PI Network Interface Controller
3.4.1.2 P64-A: 64-bit, 66MHz PCI Subsystem
One 64-bit PCI-X bus segment is directed through the 6300ESB ICH. This PCI-X segment, P64-
A, supports up to three PCI add-in cards on the full-height riser card, and one PCI add-in card
on the low-profile riser card.
3.4.1.3 P64-Express-A: One x4 PCI Express Bus Segment
One x4 PCI Express bus segment is directed through the E7320 MCH. This PCI Express
segment, P64-Express-A, supports one x4 PCI Express add-in card.
3.4.1.4 P64-Express-B: One x1 PCI Express Bus Segment
One x1 PCI Express bus segment is directed through the E7320 MCH. This PCI Express
segment, P64-Express-B, supports the Marvell* 88E8050 Network Interface Controller.
3.4.1.5 PCI Riser Slots
The Server Board SE7320VP2 has two riser slots capable of supporting riser cards for both 1U
and 2U system configurations. Because of board placement resulting in different pin
orientations, and expanded technology support associated with the full-height riser, the riser
slots are not the same and require different riser cards.
The low-profile riser slot (J5F1) utilizes a 202-pin connector. It is capable of supporting one low-
profile PCI-X add-in card. The P64-A bus can support bus speeds of up to 66MHz. The bus will
match the card speed of the lowest speed card on the bus. In other words, if any of the add-
cards installed on the P64-A bus supports a maximum of 33MHz, the entire bus will throttle
down to 33MHz to match the supported frequency of that card. When using a three slot riser
card with the low-profile slot, a single PCI-X add-in card must be installed in the bottom PCI slot.
Only one add-in card is supported with the low-profile slot, regardless of whether a one slot or
three slot riser card is used with it. These population rules must be followed to maintain the
signal integrity of the bus.
The full-height riser slot implements an Intel® Adaptive Slot. This 280-pin connector is capable
of supporting riser cards that meet either the PCI-X or PCI Express technology specifications.
As a PCI-X only bus, the P64-A bus can support bus speeds of up to 66MHz with up to three
PCI-X cards installed in the full-height riser slot. The bus speed will match the card speed of the
lowest speed card on the bus. In other words, if any of the add-cards installed on the P64-A bus
supports a maximum of 33MHz, the entire bus will throttle down to 33MHz to match the
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supported frequency of that card. When populating add-in cards in the PCI-X riser card, the
add-in cards must be installed starting with the bottom PCI slot. A second add-in card must be
installed in the middle slot, and so on. These population rules must be followed to maintain the
signal integrity of the bus.
When configured with a riser card supporting PCI Express technology, the full-height riser can
support either one x4 PCI Express card, in the 1U riser card or one x4 PCI Express card and
one PCI-X card, in the 2U riser card. The top PCI Express slot in the 2U riser card is not usable
by the Server Board SE7320VP2. The maximum supported bus speed is 66MHz with the 2U
riser card with the PCI-X slot. Population rules are similar to those of the PCI-X risers. These
population rules must be followed to maintain the signal integrity of the bus.
3.4.1.6 Scan Order
The BIOS assigns PCI bus numbers in a depth-first hierarchy, in accordance with the PCI Local
Bus Specification. When a bridge device is located, the bus number is incremented in exception
of a bridge device in the chipsets. Scanning continues on the secondary side of the bridge until
all subordinate buses are defined. PCI bus numbers may change when PCI-PCI bridges are
added or removed. If a bridge is inserted in a PCI bus, all subsequent PCI bus numbers below
the current bus are increased by one.
3.4.1.7 PCI Bus Numbering
PCI configuration space protocol requires that all PCI buses in a system be assigned a bus
number. Bus numbers must be assigned in ascending order within hierarchical buses. Each PCI
bridge has registers containing its PCI bus number and subordinate PCI bus number, which
must be loaded by POST code. The subordinate PCI bus number is the bus number of the last
hierarchical PCI bus under the current bridge. The PCI bus number and the subordinate PCI
bus number are the same in the last hierarchical bridge.
3.4.1.8 Device Number and IDSEL Mapping
Each device under a PCI bridge has its IDSEL input connected to one bit out of the PCI bus
address/data signals AD[31::11] for the PCI bus. Each IDSEL-mapped AD bit acts as a chip
select for each device on PCI. The host bridge responds to a unique PCI device ID value that,
along with the bus number, cause the assertion of IDSEL for a particular device during
configuration cycles. The following table shows the correspondence between IDSEL values and
PCI device numbers for the PCI bus. The lower five bits of the device number are used in
CONFIG_ADDRESS bits [15::11].
Table 9. PCI Configuration IDs and Device Numbers
PCI Device IDSEL Bus# / Device# / Function#
MCH host-HI bridge/DRAM controller 00 / 00 / 0
MCH DRAM Controller Error Reporting 00/00/1
MCH DMA controller 00/01/00
MCH EXP Bridge A0 00/02/00
MCH EXP Bridge A1 00/03/00
MCH EXP Bridge B0 00/04/00
MCH EXP Bridge B1 00/05/00
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PCI Device IDSEL Bus# / Device# / Function#
MCH EXP Bridge C0 00/06/00
MCH EXP Bridge C1 00/07/00
MCH Extended Configuration 00/08/00
ICH Hub Interface to PCI bridge 00 / 30 / 00
ICH PCI to LPC bridge 00 / 31 / 00
ICH IDE controller 00 / 31 / 01
ICH Serial ATA 00 / 31 / 02
ICH SMBus controller 00 / 31 / 03
ICH USB controller #1 00 / 29 / 00
ICH USB controller #2 00 / 29 / 01
ICH Watchdog Timer 00 / 29 / 04
ICH I/O APIC 00 / 29 / 05
ICH USB 2.0 controller 00 / 29 / 07
ICH Hub Interface to PCI-X bridge 00 / 28 / 00
ATI Rage XL (PCI VGA) PC_AD18 / 12 /00
3.4.1.9 Resource Assignment
The resource manager assigns the PIC-mode interrupt for the devices that will be accessed by
the legacy code. The BIOS ensures the PCI BAR registers and the command register for all
devices are correctly set up to match the behavior of the legacy BIOS. Code cannot make
assumptions about the scan order of devices or the order in which resources will be allocated to
them. The BIOS supports the INT 1Ah PCI BIOS interface calls.
3.4.1.10 Automatic IRQ Assignment
The BIOS automatically assigns IRQs to devices in the system for legacy compatibility. No
method is provided to manually configure the IRQs for devices.
3.4.1.11 Option ROM Support
The option ROM support code in the BIOS dispatches the option ROMs in available memory
space in the address range 0c0000h-0e7fffh and follows all rules with respect to the option
ROM space. The BIOS integrates option ROMs for the Intel® 82541PI Network Interface
Controller, Marvell* 88E8050 Network Interface Controller, and the ATI* Rage XL Video
Controller.
3.4.1.12 PCI APIs
The system BIOS supports the INT 1Ah, AH = B1h functions as defined in the PCI BIOS
Specification. The system BIOS supports the real mode interfaces and does not support the
protected mode interfaces.
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3.4.2 Interrupt Routing
The Server Board SE7320VP2 interrupt architecture accommodates both PC-compatible PIC
mode and APIC mode interrupts through use of the integrated I/O APICs in the 6300ESB ICH.
3.4.2.1 Legacy Interrupt Routing
For PC-compatible mode, the 6300ESB ICH provides two 82C59-compatible interrupt
controllers. The two controllers are cascaded with interrupt levels 8-15 entering on level 2 of the
primary interrupt controller (standard PC configuration). A single interrupt signal is presented to
the processors, to which only one processor will respond for servicing. The 6300ESB ICH
contains configuration registers that define which interrupt source logically maps to I/O APIC
INTx pins.
Both PCI and IRQ types of interrupts are handled by the 6300ESB ICH. The 6300ESB ICH
translates these to the APIC bus. The numbers in the table below indicate the 6300ESB ICH
PCI interrupt input pin to which the associated device interrupt (INTA, INTB, INTC, INTD) is
connected. The 6300ESB ICH I/O APIC exists on the I/O APIC bus with the processors.
Table 10. PCI Interrupt Routing/Sharing
Interrupt INT A INT B INT C INT D
Intel® 82541PI NIC ICH_PIRQA
Video ICH_PIRQB
SIO ICH_SERIRQ
Legacy IDE (Primary) ICH_PIRQ14
Legacy IDE (Secondary) ICH_PIRQ15
FH Riser TCK and TCO P64A_IRQ0 P64A_IRQ1 P64A_IRQ2 P64A_IRQ3
P64-A Slot 1 P64A_IRQ0 P64A_IRQ1 P64A_IRQ2 P64A_IRQ3
P64-A Slot 2 P64A_IRQ1 P64A_IRQ2 P64A_IRQ3 P64A_IRQ0
P64-A Slot 3 P64A_IRQ2 P64A_IRQ3 P64A_IRQ0 P64A_IRQ1
3.4.2.2 APIC Interrupt Routing
For APIC mode, the Server Board SE7320VP2 interrupt architecture incorporates two Intel I/O
APIC devices to manage and broadcast interrupts to local APICs in each processor. The Intel
I/O APICs monitor each interrupt on each PCI device including PCI slots in addition to the ISA
compatibility interrupts IRQ(0-15). When an interrupt occurs, a message corresponding to the
interrupt is sent across a three-wire serial interface to the local APICs. The APIC bus minimizes
interrupt latency time for compatibility interrupt sources. The I/O APICs can also supply greater
than 16 interrupt levels to the processor(s). This APIC bus consists of an APIC clock and two
bidirectional data lines.
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3.4.2.3 Legacy Interrupt Sources
The table below recommends the logical interrupt mapping of interrupt sources on the Server
Board SE7320VP2. The actual interrupt map is defined using configuration registers in the
6300ESB ICH.
Table 11. Interrupt Definitions
ISA Interrupt Description
IRQ0 8254 Counter 0, MMT#0
IRQ1 Keyboard
IRQ2 8259 #2 cascade (In APIC mode 8254 Counter 0)
IRQ3 Serial port A
IRQ4 Serial port B
IRQ5 Parallel Port (Not implemented)
IRQ6 Floppy
IRQ7 Parallel port, generic (Not implemented)
IRQ8 RTC, MMT#1
IRQ9 Option for PIRQx, SCI, TCO, boot interrupt
IRQ10 Option for PIRQx, SCI, TCO
IRQ11 Option for PIRQx, SCI, TCO, MMT#2
IRQ12 PS2 Mouse
IRQ13 FERR# Logic
IRQ14 Primary IDE (legacy mode)
IRQ15 Secondary IDE (legacy mode)
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3.4.2.4 Serialized IRQ Support
The Server Board SE7320VP2 supports a serialized interrupt delivery mechanism. Serialized
Interrupt Requests (SERIRQ) consists of a start frame, a minimum of 17 IRQ / data channels,
and a stop frame. Any slave device in quiet mode may initiate the start frame. While in
continuous mode, the start frame is initiated by the host controller.
Figure 6. Interrupt Routing Diagram
PIR
Q
PIR
Q
PIR
Q
Super I/O
Tim
er
Keyboar
Se
ri
a
l
Se
ri
a
l
I
S
A
Fl
oppy/
I
I
S
A
RT
C
SC
I
/
I
S
A
I
S
A
I
S
A
M
ouse/
I
Cop
r
ocesso
r
PIDE
/
I
S
N
ot
Cascade
Serialized IRQ Interface
SERI
6300ESB ICH Interrupt Routing
S
ERIR
Q
Intel® 82541PI NIC
Video
USB 1.1 Controller 1, IDE & SATA
PIR
Q
PIR
Q
PIR
Q
PIR
Q
PIR
Q
USB 1.1 Controller 2
PIRQx, SCI, TCO, boot interrupt
PIRQx, SCI, TCO
PIRQx, SCI, TCO, MMT#2
USB 2.0 EHCI Controller #1, PIRQx,
SCI, TCO, MMT#2
Functional Architecture Intel® Server Board SE7320VP2
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Intel order number C91056-002
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3.4.3 IDE Support
The integrated IDE controller of the 6300ESB ICH provides two IDE channels. These IDE
channels are capable of supporting up to two drives for each channel. A standard 40-pin IDE
connector on the baseboard interfaces with the primary IDE channel signals. The signals of the
secondary IDE channel are routed to the high-density 100-pin front panel/floppy/IDE connector
for use in either the Intel® Server Chassis SR1400 LC (1U chassis) or the Intel® Server Chassis
SR2400 (2U chassis). The IDE channels can be configured and enabled or disabled by
accessing the BIOS Setup Utility during POST.
The BIOS supports the ATA/ATAPI Specification, version 6 or later. It initializes the embedded
IDE controller in the chipset south-bridge and the IDE devices that are connected to these
devices. The BIOS scans the IDE devices and programs the controller and the devices with
their optimum timings. The IDE disk read/write services that are provided by the BIOS use PIO
mode, but the BIOS will program the necessary Ultra DMA registers in the IDE controller so that
the operating system can use the Ultra DMA modes.
The BIOS initializes and supports ATAPI devices such as LS-120/240, CDROM, CD-RW and
DVD.
The BIOS initializes and supports S-ATA devices just like P-ATA devices. It initializes the
embedded the IDE controllers in the chipset and any S-ATA devices that are connected to these
controllers. From a software standpoint, S-ATA controllers present the same register interface
as the P-ATA controllers. Hot plugging S-ATA drives during the boot process is not supported
by the BIOS and may result in undefined behavior
3.4.3.1 Ultra ATA/100
The IDE interfaces of the 6300ESB ICH DMA protocol redefines signals on the IDE cable to
allow both host and target throttling of data and transfer rates of up to 100MB/s.
3.4.3.2 IDE Initialization
The BIOS supports the ATA/ATAPI Specification, version 6 or later. The BIOS initializes the
embedded IDE controller in the chipset (6300ESB ICH) and the IDE devices that are connected
to these devices. The BIOS scans the IDE devices and programs the controller and the devices
with their optimum timings. The IDE disk read/write services that are provided by the BIOS use
PIO mode, but the BIOS programs the necessary Ultra DMA registers in the IDE controller so
that the operating system can use the Ultra DMA Modes.
3.4.4 SATA Support
The integrated Serial ATA (SATA) controller of the 6300ESB provides two SATA ports on the
baseboard. The SATA ports can be enabled/disabled and/or configured by accessing the BIOS
Setup Utility during POST.
The SATA function in the 6300ESB has dual modes of operation to support different operating
system conditions. In the case of native IDE-enabled operating systems, the 6300ESB has
separate PCI functions for serial and parallel ATA. To support legacy operating systems, there
is only one PCI function for both the serial and parallel ATA ports. The MAP register provides
the ability to share PCI functions. When sharing is enabled, all decode of I/O is done through
the SATA registers. A software write to the Function Disable Register (D31, F0, offset F2h, bit 1)
Intel® Server Board SE7320VP2 Functional Architecture
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Intel order number C91056-002 47
causes Device 31, Function 1 (IDE controller) to hidden, and its configuration registers are not
used. The SATA Capability Pointer Register (offset 34h) will change to indicate that MSI is not
supported in combined mode.
The 6300ESB SATA controller features two sets of interface signals that can be independently
enabled or disabled. Each interface is supported by an independent DMA controller. The
6300ESB SATA controller interacts with an attached mass storage device through a register
interface that is equivalent to that presented by a traditional IDE host adapter. The host software
follows existing standards and conventions when accessing the register interface and follows
standard command protocol conventions.
SATA interface transfer rates are independent of UDMA mode settings. SATA interface transfer
rates will operate at the bus’s maximum speed, regardless of the UDMA mode reported by the
SATA device or the system BIOS.
3.4.4.1 SATA RAID
The Intel® Embedded RAID Technology solution, available with the 6300ESB ICH, offers data
stripping for higher performance (RAID Level 0), alleviating disk bottlenecks by taking
advantage of the dual independent SATA controllers integrated in the 6300ESB ICH. There is
no loss of PCI resources (request/grant pair) or add-in card slot.
Intel® Embedded RAID Technology functionality requires the following items:
6300ESB ICH
Intel Embedded RAID Technology Option ROM must be on the platform
Intel® Application Accelerator RAID Edition drivers, most recent revision
Two SATA hard disk drives
Intel Embedded RAID Technology is not available in the following configurations:
The SATA controller in compatible mode
Intel Embedded RAID Technology has been disabled
3.4.4.2 Intel® Embedded RAID Technology Option ROM
The Intel Embedded RAID Technology for SATA Option ROM provides a pre-OS user interface
for the Intel Embedded RAID Technology implementation and provides the ability for an Intel
Embedded RAID Technology volume to be used as a boot disk as well as to detect any faults in
the Intel Embedded RAID Technology volume(s) attached to the Intel® RAID controller.
3.4.5 Video Support
The Server Board SE7320VP2 provides an ATI* Rage XL PCI graphics accelerator, along with
8 MB of video SDRAM and support circuitry for an embedded SVGA video subsystem. The ATI
Rage XL chip contains a SVGA video controller, clock generator, 2D and 3D engine, and
RAMDAC in a 272-pin PBGA. One 2Mx32 SDRAM chip provides 8 MB of video memory.
The SVGA subsystem supports a variety of modes, up to 1600 x 1200 resolution in 8/16/24/32
bpp modes under 2D, and up to 1024 x 768 resolution in 8/16/24/32 bpp modes under 3D. It
also supports both CRT and LCD monitors up to 100 Hz vertical refresh rate.
Functional Architecture Intel® Server Board SE7320VP2
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Video is accessed using a standard 15-pin VGA connector found on the back edge of the server
board. Video signals are also made available through the 100-pin control Panel / floppy / IDE
connector allowing for an optional video connector to be present on the platform’s control panel.
Video is routed to the rear video connector by default. Circuitry on the baseboard disables the
rear video connector when a monitor is plugged in to the control panel video connector. Hot
plugging the video while the system is still running is supported.
On-board video can be disabled using the BIOS Setup Utility or when an add-in video card is
installed. System BIOS also provides the option for dual video operation when an add-in video
card is configured in the system.
3.4.5.1 Video Modes
The Rage XL chip supports all standard IBM VGA modes. The following table shows the 2D/3D
modes supported for both CRT and LCD.
Table 12. Video Modes
2D Video Mode Support 2D Mode Refresh Rate (Hz) 8 bpp 16 bpp 24 bpp 32 bpp
640x480 60, 72, 75, 90, 100 Supported Supported Supported Supported
800x600 60, 70, 75, 90, 100 Supported Supported Supported Supported
1024x768 60, 72, 75, 90, 100 Supported Supported Supported Supported
1280x1024 43, 60 Supported Supported Supported Supported
1280x1024 70, 72 Supported – Supported Supported
1600x1200 60, 66 Supported Supported Supported Supported
1600x1200 76, 85 Supported Supported Supported –
3D Video Mode Support with Z Buffer Enabled 3D Mode Refresh Rate (Hz) 8 bpp 16 bpp 24 bpp 32 bpp
640x480 60,72,75,90,100 Supported Supported Supported Supported
800x600 60,70,75,90,100 Supported Supported Supported Supported
1024x768 60,72,75,90,100 Supported Supported Supported Supported
1280x1024 43,60,70,72 Supported Supported – –
1600x1200 60,66,76,85 Supported – – –
3D Video Mode Support with Z Bu ffer Disabled 3D Mode Refresh Rate (Hz) 8 bpp 16 bpp 24 bpp 32 bpp
640x480 60,72,75,90,100 Supported Supported Supported Supported
800x600 60,70,75,90,100 Supported Supported Supported Supported
1024x768 60,72,75,90,100 Supported Supported Supported Supported
1280x1024 43,60,70,72 Supported Supported Supported –
1600x1200 60,66,76,85 Supported Supported – –
Intel® Server Board SE7320VP2 Functional Architecture
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3.4.5.2 Video Memory Interface
The memory controller subsystem of the Rage XL arbitrates requests from direct memory
interface, the VGA graphics controller, the drawing coprocessor, the display controller, the video
scalar, and hardware cursor. Requests are serviced in a manner that ensures display integrity
and maximum CPU/coprocessor drawing performance.
The Server Board SE7320VP2 supports an 8MB (512Kx32bitx4 Banks) SDRAM device for
video memory. The following table shows the video memory interface signals:
Table 13. Video Memory Interface
Signal Name I/O Type Description
CAS# O Column Address Select
CKE O Clock Enable for Memory
CS#[1..0] O Chip Select for Memory
DQM[7..0] O Memory Data Byte Mask
DSF O Memory Special Function Enable
HCLK O Memory Clock
[11..0] O Memory Address Bus
MD[31..0] I/O Memory Data Bus
RAS# O Row Address Select
WE# O Write Enable
3.4.5.3 Dual Video
The BIOS supports single and dual video modes. The dual video mode is enabled by default.
In single mode (Dual Monitor Video=Disabled), the onboard video controller is disabled
when an add-in video card is detected.
In dual mode (Onboard Video=Enabled, Dual Monitor Video=Enabled), the onboard
video controller is enabled and will be the primary video device. The external video card
will be allocated resources and is considered the secondary video device. BIOS Setup
provides user options to configure the feature as follows:
Video is routed to the rear video connector by default. When a monitor is plugged in to the front
panel video connector, the video is routed to it and the rear connector is disabled. This can be
done by hot plugging the video connector.
Onboard Video Enabled
Disabled
Dual Monitor Video Enabled
Disabled
Shaded if onboard video is set to "Disabled"
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3.4.6 Marvell* 88E8050 – PCI Express Network Interface Controller
The Marvell* 88E8050 Gigabit Ethernet controller is a single, compact component with
integrated Gigabit Ethernet Media Access Control (MAC) and physical layer (PHY) functions.
This device uses PCI Express architecture (Revision 1.0a). The Marvell 88E8050 provides a
standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-T
applications (802.3, 802.3u, and 802.3ab). In addition to managing MAC and PHY Ethernet
layer functions, the controller manages PCI Express packet traffic across its transaction link and
physical/logical layers via a x1 PCI Express link. The Marvell 88E8050 is packaged in a 64-pin,
9x9mm QFN package.
3.4.7 Intel® 82541PI – PCI Network Interface Controller
The Intel® 82541PI Gigabit Ethernet is a single, compact component with an integrated Gigabit
Ethernet Media Access Control (MAC) and physical layer (PHY) functions. The 82541PI allows
for Gigabit Ethernet implementation in a very small area. The 82541PI integrates fourth
generation gigabit MAC design with fully integrated, physical layer circuitry to provide a standard
IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-T applications
(802.3, 802.3u, and 802.3ab). The controller is capable of transmitting and receiving data at
rates of 1000 Mbps, 100 Mbps, or 10 Mbps. The device interfaces with the 6300ESB ICH from
the 32-bit PCI 2.3 compliant bus running at 33 MHz.
3.4.7.1 NIC Connector and Status LEDs
Each Network Interface Controller (NIC) drives two LEDs located on each network interface
connector. The link/activity LED (to the left of the connector) indicates network connection when
on, and Transmit/Receive activity when blinking. The speed LED (to the right of the connector)
indicates 1000-Mbps operation when amber, 100-Mbps operation when green, and 10-Mbps
when off.
3.4.8 USB 2.0 Support
The USB controller functionality integrated into 6300ESB ICH provides the baseboard with the
interface for up to four USB 2.0 ports. Two external connectors are located on the back edge of
the baseboard. One internal 1x10 header is provided, capable of supporting an additional two
optional USB 2.0 ports.
3.4.9 Super I/O Chip
Legacy I/O support is provided by using a National Semiconductor* PC87427 Super I/O device.
This chip contains all of the necessary circuitry to control two serial ports, one parallel port,
floppy disk, and PS/2-compatible keyboard and mouse. Of these, the Server Board SE7320VP2
supports the following:
GPIOs
Two serial ports
Floppy controller
Keyboard and mouse controller
Wake up control
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3.4.9.1 GPIOs
The National Semiconductor* PC87427 Super I/O provides nine general-purpose input/output
pins that the Server Board SE7320VP2 utilizes. The following table identifies the pin and the
signal name used in the schematic:
Table 14. Super I/O GPIO Usage Table
Pin Name IO /
GPIO SE7320VP2 Use
124 GPIO00/CLKRUN_L I/O TP
125 GPIO01/KBCLK I/O KB_CLK
126 GPIO02/KBDAT I/O KB_DAT
127 GPIO03/MCLK I/O MS_CLK
128 GPIO04/MDAT I/O MS_DAT
9 GPIO05/XRDY I/O TP
10 GPIO06/XIRQ I/O BMC_SYSIRQ
13 GPIO07/HFCKOUT I/O SIO_CLK_40M_BMC
1 GPIOE10/XA11 I/O,I(E)1 XBUS_A<11>
2 GPIOE11/XA10 I/O,I(E)1 XBUS_A<10>
3 GPIOE12/XA9 I/O,I(E)1 XBUS_A<9>
4 GPIOE13/XA8 I/O,I(E)1 XBUS_A<8>
5 GPIOE14/XA7 I/O,I(E)1 XBUS_A<7>
6 GPIOE15/XA6 I/O,I(E)1 XBUS_A<6>
7 GPIOE16/XA5 I/O,I(E)1 XBUS_A<5>
8 GPIOE17/XA4 I/O,I(E)1 XBUS_A<4>
14 GPIO20/XRD_XEN_L I/O XBUS_XRD_L
15 GPIO21/XWR_XRW_L I/O XBUS_XWR_L
16 GPIO22/XA3 I/O XBUS_A<3>
17 GPIO23/XA2 I/O XBUS_A<2>
18 GPIO24/XA1 I/O XBUS_A<1>
19 GPIO25/XA0 I/O XBUS_A<0>
22 GPIO26/XCS1_L I/O TP
23 GPIO27/XCS0_L I/O XBUS_XCS0_L
24 GPIO30/XD7 I/O XBUS_D<7>
25 GPIO31/XD6 I/O XBUS_D<6>
26 GPIO32/XD5 I/O XBUS_D<5>
27 GPIO33/XD4 I/O XBUS_D<4>
28 GPIO34/XD3 I/O XBUS_D<3>
29 GPIO35/XD2 I/O XBUS_D<2>
30 GPIO36/XD1 I/O XBUS_D<1>
31 GPIO37/XD0 I/O XBUS_D<0>
20 GPIOE40/XCS3_L I/O,I(E)1 TP
21 GPIOE41/XCS2_L I/O,I(E)1 TP
35 GPIOE42/SLBTIN_L I/O,I(E)1 TP
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Pin Name IO /
GPIO SE7320VP2 Use
49 GPIOE43/PWBTOUT_L I/O,I(E)1 ZZ_POST_CLK_LED_L
50 GPIOE44/LED1 I/O,I(E)1 ZZ_BIOS_ROLLING
51 GPIOE45/LED2 I/O,I(E)1 FP_PWR_LED_L
52 GPIOE46/SLPS3_L I/O,I(E)1 TP
53 GPIOE47/SLPS5_L I/O,I(E)1 TP
36 GPIO50/PWBTN_L I/O TP
37 GPIO51/SIOSMI_L I/O TP
38 GPIO52/SIOSCI_L I/O SIO_PME_L
45 GPIO53/LFCKOUT/MSEN0 I/O TP
54 GPIO54/VDDFELL I/O ZZ_POST_DATA_LED_L
56 GPIO55/CLKIN I/O CLK_48M_SIO
32 GPO60/XSTB2/XCNF2_L O PU_XBUS_XCNF2
33 GPO61/XSTB1/XCNF1_L O XBUS_XSTB1_L
34 GPO62/XSTB0/XCNF0_L O PU_XBUS_XCNF0
48 GPO63/ACBSA O PU_SIO_ACBSA
55 GPO64/WDO_L/CKIN48 O PU_SIO_CKIN48
3.4.9.2 Serial Ports
The baseboard provides two serial ports: an external RJ45 Serial port, and an internal DH10
Serial header. The following sub-sections provide details on the use of the serial ports.
3.4.9.2.1 Serial Port A
Serial A is an optional port, accessed through a 9-pin internal DH-10 header. A standard DH10
to DB9 cable can be used to direct Serial A out the back of a chassis. The Serial A interface
follows the standard RS232 pinout as defined in the following table.
Table 15. Serial A Header Pinout
Pin Signal Name Serial Port A Header Pinout
1 DCD
2 DSR
3 RX
4 RTS
5 TX
6 CTS
7 DTR
8 RI
9 GND
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3.4.9.2.2 Serial Port B
Serial B is an external 8-pin RJ45 connector that is located on the back edge of the baseboard.
For those server applications that require an external modem, an RJ45-to-DB9 adapter is
necessary.
3.4.9.2.3 Rear RJ45 Serial B Port Configuration
The rear RJ45 Serial B port is a fully functional serial port that can support any standard serial
device. Using an RJ45 connector for a serial port allows direct support for serial port
concentrators, which typically use RJ45 connectors and are widely used in the high-density
server market. For server applications that use a serial concentrator to access the server
management features of the baseboard, a standard 8-pin CAT-5 cable from the serial
concentrator is plugged directly into the rear RJ45 serial port.
To allow support for either of two serial port configuration standards, a jumper block located
directly behind the rear RJ45 serial port must be configured appropriately according to the
desired standard. For serial concentrators that require a DCD signal, the jumper block must be
configured with the Serial Port jumper and must be over position 1 and 3. For serial
concentrators that require a DSR signal (Default), the jumper block must be configured with the
Serial Port jumper over position 2 and 4. Pin 1 on the jumper is denoted by “*”.
Note: By default, the rear RJ45 serial port is configured to support a DSR signal, which is
compatible with the Cisco* standard.
Figure 7. Serial Port Configuration Jumper Location
Table 16. Serial Port Configuration Jumper [J8A3]
Functional Architecture Intel® Server Board SE7320VP2
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Pins What happens at system reset…
1-3 Serial port is configured for DCD to DTR
2-4 Serial port is configured for DSR to DTR (default)
For server applications that require a DB9 serial connector, an 8-pin RJ45-to-DB9 adapter must
be used. The following table provides the pinout required for the adapter to provide RS232
support. A standard DH10-to-DB 9 cable and 8-pin RJ45 to DB9 DCD and DSR adapters are
available from Intel in the Serial Port Accessory Kit, product code: AXXRJ45DB92.
Table 17. Rear Serial B Port Adapter Pinout
RJ45 Signal Abbreviation DB9
1 Request to Send RTS 7
2 Data Terminal Ready DTR 4
3 Transmitted Data TD 3
4 Signal Ground SGND 5
5 Ring Indicator RI 9
6 Received Data RD 2
7 DCD or DSR DCD/DSR 1 or 6 (see note)
8 Clear To Send CTS 8
Note: The RJ45-to-DB9 adapter should match the configuration of the serial device used. One
of two pinout configurations is used, depending on whether the serial device requires a DSR or
DCD signal. The final adapter configuration should also match the desired pinout of the RJ45
connector, as it can also be configured to support either DSR or DCD.
3.4.9.3 Removable Media Drives
The BIOS supports removable media devices, including 1.44MB floppy removable media
devices and optical devices such as a CD-ROM drive or a read-only DVD-ROM drive. The BIOS
supports booting from USB mass storage devices connected to the chassis USB port, such as a
USB key device.
The BIOS supports USB 2.0 media storage devices that are backward compatible to the USB
1.1 specification.
3.4.9.4 Floppy Disk Support
The floppy disk controller (FDC) in the SIO is functionally compatible with floppy disk controllers
in the DP8473 and N844077. All FDC functions are integrated into the SIO including analog
data separator and 16-byte FIFO. The Server Board SE7320VP2 provides two separate
interfaces for the floppy disk controller. The first is a SSI compliant 36-pin connector, and the
second is routed through the high-density 100-pin floppy / front panel / IDE connector.
Note: Using both interfaces in a common configuration is not supported.
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3.4.9.5 Keyboard and Mouse Support
Dual stacked PS/2 ports, located on the back edge of the baseboard, are provided for keyboard
and mouse support. Either port can support a mouse or keyboard. Neither port supports hot
plugging.
3.4.9.6 Wake-up Control
The Super I/O contains functionality that allows various events to control the power-on and
power-off the system.
3.4.10 BIOS Flash
The BIOS supports the Intel® 28F320C3B flash part. The flash part is a 4-MB flash ROM with
2MB programmable. The flash ROM contains system initialization routines, setup utility, and
runtime support routines. The exact layout is subject to change, as determined by Intel. A 128-
KB block is available for storing OEM code (user binary) and custom logos.
3.5 Configuration and Initialization
This section describes the initial programming environment including address maps for memory
and I/O, techniques and considerations for programming ASIC registers, and hardware options
configuration.
3.5.1 Memory Space
At the highest level, the Intel® Xeon™ processor address space is divided into four regions, as
shown in the following figure. Each region contains the sub-regions that are described in
following sections. Attributes can be independently assigned to regions and sub-regions using
the Intel Server Board SE7320VP2 registers. The Intel E7320 chipset supports 64GB of host-
addressable memory space and 64KB+3 of host-addressable I/O space. The Server Board
SE7320VP2 supports only the main memory up to 24GB for DDR-266 or up to 16GB for
DDR-333 and DDR2-400.
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Figure 8. Intel® Xeon™ Processor Memory Address Space
4GB
Optional ISA Hole
Top of Low Memory (TOLM)
16MB
15MB
1MB
640KB
512KB
0
A
dditional Main
Memory Address
Ran
g
e
Main Memory
A
ddress Range
DOS Legacy
A
ddress Range
Lo PCI Memory
Space Range
TSEG SMRAM Space
64GB
Hi PCI Memory
A
ddress Range
Upper Memory
Ranges
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3.5.1.1 DOS Compatibility Region
The first region of memory below 1 MB was defined for early PCs, and must be maintained for
compatibility. The region is divided into sub-regions as shown in the following figure.
Figure 9. DOS Compatibility Region
= Mappable to PCI or ISA memory
= Main memory only
= PCI only
= Shadowed in main memory
000000h
07FFFFh
080000h
09FFFFh
0A0000h
0BFFFFh
0C0000h
0DFFFFh
0E0000h
0EFFFFh
0F0000h
0FFFFFh 1MB
960KB
896KB
768KB
640KB
512KB
0
System BIOS
Extended
System BIOS
A
dd-in Card BIOS and
Buffer Area
PCI/ISA Video or SMM
A
rea
ISA Window Area
DOS Area
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3.5.1.1.1 DOS Area
The DOS region is 512 KB in the address range 0 to 07FFFFh. This region is fixed and all
accesses go to main memory.
3.5.1.1.2 ISA Window Memory
The ISA Window Memory is 128 KB between the address of 080000h to 09FFFFh. This area
can be mapped to the PCI bus or main memory.
3.5.1.1.3 Video or SMM Memory
The 128 KB Graphics Adapter Memory region at 0A0000h to 0BFFFFh is normally mapped to
the VGA controller on the PCI bus. This region is also the default region for SMM space.
3.5.1.1.4 Add-in Card BIOS and Buffer Area
The 128 KB region between addresses 0C0000h to 0DFFFFh is divided into eight segments of
16 KB segments mapped to ISA memory space, each with programmable attributes, for
expansion cards buffers. Historically, the 32 KB region from 0C0000h to 0C7FFFh has
contained the video BIOS location on the video card
3.5.1.1.5 Extended System BIOS
This 64 KB region from 0E0000h to 0EFFFFh is divided into four blocks of 16 KB each, and may
be mapped with programmable attributes to map to either main memory or to the PCI bus.
Typically this area is used for RAM or ROM. This region can also be used extended SMM
space.
3.5.1.1.6 System BIOS
The 64 KB region from 0F0000h to 0FFFFFh is treated as a single block. By default, this area is
normally read/write disabled with accesses forwarded to the PCI bus. Through manipulation of
read/write attributes, this region can be shadowed into main memory.
3.5.1.2 Extended Memory
Extended memory is defined as all address space greater than 1MB. The extended memory
region covers 8GB maximum of address space from addresses 0100000h to FFFFFFFh, as
shown in the following figure. PCI memory space can be remapped to top of memory (TOM).
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Figure 10. Extended Memory Map
3.5.1.2.1 Main Memory
All installed memory greater than 1MB is mapped to local main memory, up to 8GB of physical
memory. Memory between 1MB to 15MB is considered to be standard ISA extended memory.
1MB of memory starting at 15MB can be optionally mapped to the PCI bus memory space.
The remainder of this space, up to 8GB, is mapped to main memory, unless System
Management Mode (SMM) is used which is just under the Top of Low Memory (TOLM). The
range can be from 128KB till 1MB. 1MB depends on the BIOS setting C SMRAM is used which
limits the top of memory to 256MB. The BIOS occupies 512KB for the 32-bit SMI handler.
Main Memory Address
Region
FFFFFFFFh
FFE00000h
FEC0FFFFh
FEC00000h
Top of Low Memory (TOLM)
Depends on installed DIMMs
16MB
15MB
100000h
High BIOS Area
A
PIC Space
Optional Fixed Memory
Hole
PCI Memory Space
Extended
lntel E7320 chipset
region
512KB Extended System
Management RAM
Top Of Memory (TOM)
64GB
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3.5.1.2.2 PCI Memory Space
Memory addresses below the 4GB range are mapped to the PCI bus. This region is divided into
three sections: High BIOS, APIC configuration space, and general-purpose PCI memory. The
General-purpose PCI memory area is typically used memory-mapped I/O to PCI devices. The
memory address space for each device is set using PCI configuration registers.
3.5.1.2.3 High BIOS
The top 1MB of extended memory under 4GB is reserved for the system BIOS, extended BIOS
for PCI devices, and A20 aliasing by the system BIOS. The lntel® Xeon™ processor begins
executing from the high BIOS region after reset.
3.5.1.2.4 High Memory Gap Reclaiming
The BIOS creates a region immediately below 4 GB to accommodate memory-mapped I/O
regions for the system BIOS Flash, APIC memory and 32-bit PCI devices. Any system memory
in this region is remapped above 4GB.
3.5.1.2.5 I/O APIC Configuration Space
A 64KB block located 20MB below 4GB (0FEC00000 to 0FEC0FFFFh) is reserved for the I/O
APIC configuration space. The first I/O APIC is located at FEC00000h. The second I/O APIC is
located at FEC80000h. The third I/O APIC is located at FEC80100h.
3.5.1.2.6 Extended lntel® Xeon™ Processor Region (above 4GB)
An lntel® Xeon™ processor based system can have up to 64 GB of addressable memory. With
the chipset only supporting 16GB of addressable memory, the BIOS uses an extended
addressing mechanism to use the address ranges.
3.5.1.3 Memory Shadowing
System BIOS and option ROM can be shadowed in main memory. Typically this is done to allow
ROM code to execute more rapidly out of RAM. ROM is designated read-only during the copy
process while RAM at the same address is designated write-only. After copying, the RAM is
designated read-only. After the BIOS is shadowed, the attributes for that memory area are set to
read only so that all writes are forwarded to the expansion bus.
Intel® Server Board SE7320VP2 Functional Architecture
Revision 2.1
Intel order number C91056-002 61
3.5.1.4 System Management Mode Handling
The chipset supports System Management Mode (SMM) operation in one of three modes.
System Management RAM (SMRAM) provides code and data storage space for the SMI_L
handler code, and is made visible to the processor only on entry to SMM, or other conditions
that can be configured using Intel E7320 chipset.
The MCH supports three SMM options:
Compatible SMRAM (C_SMRAM)
High Segment (HSEG)
Top of Memory Segment (TSEG)
Three abbreviations are used later in the table that describes SMM Space Transaction
Handling.
SMM Space
Enabled Transaction Address Space
(Adr) DRAM Space (DRAM)
Compatible (C) A0000h to BFFFFh A0000h to BFFFFh
High (H) 0FEDA0000h TO 0FEDBFFFFh A0000h to BFFFFh
TSEG (T) (TOLM-TSEG_SZ) to TOLM (TOLM-TSEG_SZ) to
TOLM
Notes:
High SMM is different than in previous chipsets. In previous chipsets the high segment
was the 384KB region from A_0000h to F_FFFFh. However, C_0000h to F_FFFFh was
not useful so it is deleted in MCH.
TSEG SMM is different than in previous chipsets. In previous chipsets, the TSEG
address space was offset by 256MB to allow for simpler decoding and the TSEG was
remapped to directly under the TOLM. In the MCH, the TSEG region is not offset by
256MB and it is not remapped.
Table 18. SMM Space Table
Global Enable
G_SMRAME High Enable
H_SMRAME TSEG Enable
TSEG_EN Compatible
(C) Range High (H)
Range TSEG (T)
Range
0 X X Disable Disable Disable
1 0 0 Enable Disable Disable
1 0 1 Enable Disable Enable
1 1 0 Disable Enable Disable
1 1 1 Disable Enable Enable
Functional Architecture Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
62
3.5.2 I/O Map
The baseboard I/O addresses to be mapped to the processor bus or through designated
bridges in a multi-bridge system. Other PCI devices, including the 6300ESB ICH, have built-in
features that support PC-compatible I/O devices and functions, which are mapped to specific
addresses in I/O space. On the Server Board SE7320VP2, the 6300ESB ICH provides the
bridge to ISA functions.
The I/O map in the following table shows the location in I/O space of all direct I/O-accessible
registers. PCI configuration space registers for each device control mapping in I/O and memory
spaces, and other features that may affect the global I/O map.
Table 19. I/O Map
Address(es) Resource Notes
0000h – 000Fh DMA Controller 1
0010h – 001Fh DMA Controller 2 Aliased from 0000h – 000Fh
0020h – 0021h Interrupt Controller 1
0022h – 0023h
0024h – 0025h Interrupt Controller 1 Aliased from 0020 – 0021h
0026h – 0027h
0028h – 0029h Interrupt Controller 1 Aliased from 0020h – 0021h
002Ah – 002Bh
002Ch – 002Dh Interrupt Controller 1 Aliased from 0020h – 0021h
002Eh – 002Fh Super I/O (SIO) index and Data ports
0030h – 0031h Interrupt Controller 1 Aliased from 0020h – 0021h
0032h – 0033h
0034h – 0035h Interrupt Controller 1 Aliased from 0020h – 0021h
0036h – 0037h
0038h – 0039h Interrupt Controller 1 Aliased from 0020h – 0021h
003Ah – 003Bh
003Ch – 003Dh Interrupt Controller 1 Aliased from 0020h – 0021h
003Eh – 003Fh
0040h – 0043h Programmable Timers
0044h – 004Fh
0050h – 0053F Programmable Timers
0054h – 005Fh
0060h, 0064h Keyboard Controller Keyboard chip select from 87417
0061h NMI Status and Control Register
0063h NMI Status and Control Register Aliased
0065h NMI Status and Control Register Aliased
0067h NMI Status and Control Register Aliased
0070h NMI Mask (bit 7) and RTC address (bits 6::0)
0072h NMI Mask (bit 7) and RTC address (bits 6::0) Aliased from 0070h
0074h NMI Mask (bit 7) and RTC address (bits 6::0) Aliased from 0070h
Intel® Server Board SE7320VP2 Functional Architecture
Revision 2.1
Intel order number C91056-002 63
Address(es) Resource Notes
0076h NMI Mask (bit 7) and RTC address (bits 6::0) Aliased from 0070h
0071h RTC Data
0073h RTC Data Aliased from 0071h
0075h RTC Data Aliased from 0071h
0077h RTC Data Aliased from 0071h
0080h – 0081h BIOS Timer
0080h – 008F DMA Low Page Register
0090h – 0091h DMA Low Page Register (aliased)
0092h System Control Port A (PC-AT control Port) (this port not
aliased in DMA range)
0093h – 009Fh DMA Low Page Register (aliased)
0094h Video Display Controller
00A0h – 00A1h Interrupt Controller 2
00A4h – 00A5h Interrupt Controller 2 (aliased)
00A8h – 00A9h Interrupt Controller 2 (aliased)
00ACh – 00ADh Interrupt Controller 2 (aliased)
00B0h – 00B1h Interrupt Controller 2 (aliased)
00B4h – 00B5h Interrupt Controller 2 (aliased)
00B8h – 00B9h Interrupt Controller 2 (aliased)
00BCh – 00BDh Interrupt Controller 2 (aliased)
00C0h – 00DFh DMA Controller 2
00F0h Clear NPX error Resets IRQ13
00F8h – 00FFh X87 Numeric Coprocessor
0102h Video Display Controller
0170h – 0177h Secondary Fixed Disk Controller (IDE)
01F0h – 01F7h Primary Fixed Disk Controller (IDE)
0200h – 0207h Game I/O Port
0220h – 022Fh Serial Port A
0238h – 023Fh Serial Port B
0278h – 027Fh Parallel Port 3
0290h – 0298h NS HW monitor
02E8h – 02EFh Serial Port B
02F8h – 02FFh Serial Port B
0338h – 033Fh Serial Port B
0370h – 0375h Secondary Floppy
0376h Secondary IDE
0377h Secondary IDE/Floppy
0378h – 037Fh Parallel Port 2
03B4h – 03Bah Monochrome Display Port
03BCh – 03BFh Parallel Port 1 (Primary)
03C0h – 03CFh Video Display Controller
03D4h – 03Dah Color Graphics Controller
03E8h – 03Efh Serial Port A
03F0h – 03F5h Floppy Disk Controller
Functional Architecture Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
64
Address(es) Resource Notes
03F6h – 03F7h Primary IDE – Sec Floppy
03F8h – 03FFh Serial Port A (primary)
0400h – 043Fh DMA Controller 1, Extended Mode Registers
0461h Extended NMI / Reset Control
0480h – 048Fh DMA High Page Register
04C0h – 04CFh DMA Controller 2, High Base Register
04D0h – 04D1h Interrupt Controllers 1 and 2 Control Register
04D4h – 04D7h DMA Controller 2, Extended Mode Register
04D8h – 04DFh Reserved
04E0h – 04FFh DMA Channel Stop Registers
051Ch Software NMI (051Ch)
0678h – 067Ah Parallel Port (ECP)
0778h – 077Ah Parallel Port (ECP)
07BCh – 07Beh Parallel Port (ECP)
0CF8h PCI CONFIG_ADDRESS Register
0CF9h Intel® Server Board SE7320VP2 Turbo and Reset
Control
0CFCh PCI CONFIG_DATA Register
3.5.3 Accessing Configuration Space
All PCI devices contain PCI configuration space, accessed using mechanism #1 defined in the
PCI Local Bus Specification. If dual processors are used, only the processor designated as the
Boot Strap Processor (BSP) should perform PCI configuration space accesses. Precautions
must be taken to guarantee that only one processor performs system configuration.
Two Dword I/O registers in the chipset are used for the configuration space register access:
CONFIG_ADDRESS (I/O address 0CF8h)
CONFIG_DATA (I/O address 0CFCh)
When CONFIG_ADDRESS is written to with a 32-bit value selecting the bus number, device on
the bus, and specific configuration register in the device, a subsequent read or write of
CONFIG_DATA initiates the data transfer to/from the selected configuration register. Byte
enables are valid during accesses to CONFIG_DATA; they determine whether the configuration
register is being accessed or not. Only full Dword reads and writes to CONFIG_ADDRESS are
recognized as a configuration access by the chipset. All other I/O accesses to
CONFIG_ADDRESS are treated as normal I/O transactions.
Intel® Server Board SE7320VP2 Functional Architecture
Revision 2.1
Intel order number C91056-002 65
3.5.3.1 CONFIG_ADDRESS Register
CONFIG_ADDRESS is 32 bits wide and contains the field format shown in the following figure.
Bits [23::16] choose a specific bus in the system. Bits [15::11] choose a specific device on the
selected bus. Bits [10:8] choose a specific function in a multi-function device. Bit [8::2] select a
specific register in the configuration space of the selected device or function on the bus.
Figure 11. CONFIG_ADDRES Register
3.6 Clock Generation and Distribution
All buses on the baseboard operate using synchronous clocks. Clock synthesizer/driver circuitry
on the baseboard generates clock frequencies and voltage levels as required, including the
following:
200MHz differential clock at 0.7V logic levels. For Processor 0, Processor 1, Debug Port
and MCH
100MHz differential clock at 0.7V logic levels on CK409B. For DB800 clock buffer
100MHz differential clock at 0.7 Vlogic levels on DB800. For PCI Express Device is
MCH, which includes x4 PCI Express Slot. For SATA is 6300ESB ICH
66MHz at 3.3V logic levels: For E7320 and 6300ESB ICH
48MHz at 3.3V logic levels: For 6300ESB ICH and SIO
33MHz at 3.3V logic levels: For 6300ESB ICH, Video, mBMC and SIO
14.318MHz at 2.5V logic levels: For 6300ESB ICH and video
10Mhz at 5V logic levels: For mBMC
The PCI-X slot speed on the full-length riser card is determined by the riser card in use.
00
Register
0 1 7 8 10 11 15 16 23 24 30 31
Function Device Bus Number Reserved
Enable bit (‘1’ = enabled, ‘0’ = disabled)
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
66
4. System BIOS
The BIOS is implemented as firmware that resides in the Flash ROM. It provides hardware-
specific initialization algorithms and standard PC-compatible basic input/output services, and
standard Intel® Server Board features. The Flash ROM also contains firmware for certain
embedded devices. These embedded device firmware images are supplied by the device
manufacturers and are not specified in this document.
The system BIOS includes the following components:
IA-32 Core – The IA-32 core contains standard services and components such as the
PCI Resource manager, ACPI support, POST, and runtime functionality.
Manageability Extensions – Intel servers build server management into the BIOS
through the Intelligent Platform Management Interface (IPMI) and baseboard
management hardware.
Extensible Firmware Interface – “EFI” provides an abstraction layer between the
operating system and system hardware.
Processor Microcode – BIOS includes microcode for the latest processors.
Option ROMs – BIOS includes option ROMs to enable on-board devices during boot.
4.1 BIOS Identification String
The BIOS Identification string is used to uniquely identify the revision of the BIOS being used on
the system. The string is formatted as illustrated in the following figure.
BoardId.OEMID.BuildType.Major.Minor.BuildID.BuildDateTime.Mod
two di
g
its:
Dxx = Development
Xxx = Power On
Axx = Alpha BIOS
Bxx = Beta BIOS
RCxx= Release Candidate
P = Production
xx = 2 di
g
it number N/A for Production
Four di
g
its:
Increment
on each build
Three characters:
10A = Some OEM, etc.
N character ID:
AN430TX, etc. 86A = Intel DPG
86B = Intel EPG
One digit:
non-zero if any Separately
Updateable
Module has been updated
two di
g
its:
Build Date and time in
MMDDYYYYHHMM format
Figure 12. BIOS Identification String
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 67
The BIOS ID for this server board has the form:
SE7320VP20.86B.P01.01.00.0002.081320031156
4.2 BIOS Power-on Self Test (POST)
4.2.1 User Interface
During the system boot POST process, there are two types of consoles used for displaying the
user interface: graphical or text based. Graphics consoles are in 640x480 mode; text consoles
use 80x25 mode.
The console output is partitioned into three areas: the System Activity/State, Logo/Diagnostic,
and Current Activity windows. The System Activity Window displays information about the
current state of the system. The Logo/Diagnostic Window displays the OEM splash screen logo
or a diagnostic boot screen. The Current Activity Window displays information about the
currently executing portion of POST as well as user prompts and status messages.
System State Window
Current Activity Window
Logo/Diagnostic Window
4.2.1.1 System Activity Window
The top row of the screen is reserved for the system state window. On a graphics console, the
window is 640x48. On a text console, the window is 80x2.
The system state window may be in one of three forms, either an activity bar that scrolls while
the system is busy, a progress bar that measures percent complete for the current task, or an
attention required bar. The attention bar is useful for tasks that require user attention to
continue.
4.2.1.2 Logo/Diagnostic Window
The middle portion of the screen is reserved for the Logo/Diagnostic Window. On a graphics
console, the window is 640x384. On a text console, the window is 80x20.
The Logo/Diagnostic Window may be in one of two forms depending on whether Quiet Boot
Mode is selected in the BIOS Setup. If selected, the BIOS displays a logo splash screen. If not,
the BIOS display’s a system summary and diagnostic screen in verbose mode. The default is to
display the logo in Quiet Boot mode. If no logo is present in the flash ROM, or Quiet Boot mode
is disabled in the system configuration, the summary and diagnostic screen is displayed. If the
user presses <Esc>, the system transfers from the logo screen to the diagnostic screen.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
68
4.2.1.3 Current Activity Window
The bottom portion of the screen is reserved for the Current Activity Window. On a graphics
console, the window is 640x48. On a text console, the window is 80x2.
The Current Activity Window is used to display prompts for hot keys, as well as provide
information on system status.
4.2.2 System Diagnostic Screen
The diagnostic screen is the console where boot information, options and detected hardware
information are displayed.
4.2.2.1 Static Information Display
The Static Information Display area presents the following information:
Copyright message
BIOS ID
Current processor configuration
Installed physical memory size
4.2.3 Quiet Boot / OEM Splash Screen
The BIOS implements Quiet Boot, providing minimal startup display during BIOS POST. System
start-up must only draw the end user’s attention in the event of errors or when there is a need
for user action. By default, the system must be configured so that the local screen does not
display memory counts, device status, etc. It must present a "clean" BIOS start-up. The only
screen display allowed is the OEM splash screen and copyright notices.
The Quiet Boot process is controlled by a Setup Quiet-Boot option. If this option is set, the BIOS
display’s an activity indicator at the top of the screen and a logo splash screen in the middle
section of the screen on the local console. The activity indicator measures POST progress and
continues until the operating system gains control of the system. The splash screen covers up
any diagnostic messages in the middle section of the screen. While the logo is being displayed
on the local console, diagnostic messages are being displayed on the remote text consoles.
Quiet Boot may be disabled by clearing the Setup Quiet-Boot option or by the user pressing the
<Esc> key while in Quiet Boot mode. If Quiet Boot is disabled, the BIOS displays diagnostic
messages in place of the activity indicator and the splash screen.
With the use of an Intel supplied utility, the BIOS allows OEMs to override the standard Intel
logo with one of their own design.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 69
4.2.4 BIOS Boot Popup Menu
The BIOS Boot Specification (BBS) provides for a Boot Menu Popup invoked by pressing the
<Esc> key during POST. The BBS Popup menu displays all available boot devices. The list
order in the popup menu is not the same as the boot order in BIOS setup; it simply lists all the
bootable devices from which the system can be booted.
Table 20. Sample BIOS Popup Menu
Please select boot devi ce:
1st Floppy
Hard Drives
ATAPI CDROM
LAN PXE
EFI Boot Manager
↓and↑ to move selection
Enter to select boot device
ESC to boot using defaults
4.3 BIOS Setup Utility
The BIOS Setup utility is provided to perform system configuration changes and to display
current settings and environment information.
The BIOS Setup utility stores configuration settings in system non-volatile storage. Changes
affected by BIOS Setup will not take effect until the system is rebooted. The BIOS Setup Utility
can be accessed during POST by using the <F2> key.
4.3.1 Localization
The BIOS Setup utility uses the Unicode standard and is capable of displaying setup forms in
English, French, Italian, German, and Spanish. The BIOS supports these languages for console
strings as well.
4.3.2 Console Redirection
The BIOS Setup utility is functional via console redirection over various terminal standards
emulation. This may limit some functionality for compatibility, e.g., usage of colors or some keys
or key sequences or support of pointing devices.
4.3.3 Configuration Reset
Setting the Clear CMOS jumper (board location J1H5) produces a “reset system configuration”
request. When a request is detected, the BIOS loads the default system configuration values
during the next POST.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
70
4.3.4 Keyboard Commands
While in the BIOS Setup utility, the Keyboard Command Bar supports the keys specified in the
following table.
Table 21. BIOS Setup Keyboard Command Bar Options
Key Option Description
Enter Execute Command The <Enter> key is used to activate sub-menus, pick lists, or to select a sub-field. If a
pick list is displayed, the Enter key will select the pick list highlighted item, and pass
that selection in the parent menu.
ESC Exit The <Esc> key provides a mechanism for backing out of any field. This key will undo
the pressing of the <Enter> key. When the <Esc> key is pressed while editing any field
or selecting features of a menu, the parent menu is re-entered.
When the <Esc> key is pressed in any sub-menu, the parent menu is re-entered. When
the <Esc> key is pressed in any major menu, the exit confirmation window is displayed
and the user is asked whether changes can be discarded. If “No” is selected and the
<Enter> key is pressed, or if the <Esc> key is pressed, the user is returned to where
they were before <Esc> was pressed without affecting any existing any settings. If
“Yes” is selected and the <Enter> key is pressed, setup is exited and the BIOS
continues with POST.
↑ Select Item The up arrow is used to select the previous value in a pick list, or the previous options
in a menu item's option list. The selected item must then be activated by pressing the
<Enter> key.
↓ Select Item The down arrow is used to select the next value in a menu item’s option list, or a value
field’s pick list. The selected item must then be activated by pressing the <Enter> key.
↔ Select Menu The left and right arrow keys are used to move between the major menu pages. The
keys have no affect if a sub-menu or pick list is displayed.
Tab Select Field The <Tab> key is used to move between fields. For example, <Tab> can be used to
move from hours to minutes in the time item in the main menu.
- Change Value The minus key on the keypad is used to change the value of the current item to the
previous value. This key scrolls through the values in the associated pick list without
displaying the full list.
+ Change Value The plus key on the keypad is used to change the value of the current menu item to the
next value. This key scrolls through the values in the associated pick list without
displaying the full list. On 106-key Japanese keyboards, the plus key has a different
scan code than the plus key on the other keyboard, but will have the same effect.
F9 Setup Defaults Pressing <F9> causes the following to appear:
Load Setup Defaults?
[OK] [Cancel]
If “OK” is selected and the <Enter> key is pressed, all setup fields are set to their
default values. If “Cancel” is selected and the <Enter> key is pressed, or if the <Esc>
key is pressed, the user is returned to where they were before <F9> was pressed,
without affecting any existing field values.
F7 Discard Changes Pressing <F7> causes the following message to appear:
Discard Changes?
[OK] [Cancel]
If “OK” is selected and the <Enter> key is pressed, all changes are not saved and setup
is exited. If “Cancel” is selected and the <Enter> key is pressed, or the <Esc> key is
pressed, the user is returned to where they were before <F7> was pressed, without
affecting any existing values.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 71
Key Option Description
F10 Save Changes and
Exit
Pressing <F10> causes the following message to appear:
Save configuration changes and exit setup?
[OK] [Cancel]
If “OK” is selected and the <Enter> key is pressed, all changes are saved and setup is
exited. If “Cancel” is selected and the <Enter> key is pressed, or the <Esc> key is
pressed, the user is returned to where they were before <F10> was pressed, without
affecting any existing values.
4.3.5 Entering BIOS Setup
The BIOS Setup utility is accessed by pressing the <F2> key during POST
4.3.5.1 Main Menu
The first screen displayed when entering the BIOS Setup Utility is the Main Menu selection
screen. This screen displays the major menu selections available. The following tables describe
the available options on the top level and lower level menus. Default values are shown in bold
text.
Table 22. BIOS Setup, Main Menu Options
Feature Options Help Text Description
System Overview
AMI BIOS
Version N/A N/A BIOS ID string (excluding the build
time and date)
Build Date N/A N/A BIOS build date
Processor
Type N/A N/A Processor brand ID string
Speed N/A N/A Calculated processor speed
Count N/A N/A Detected number of physical
processors
System Memory
Size N/A N/A Amount of physical memory
detected
System Time HH:MM:SS Use [ENTER], [TAB] or [SHIFT-
TAB] to select a field.
Use [+] or [-] to configure system
time.
Configures the system time on a 24
hour clock. Default is 00:00:00
System Date DAY MM/DD/YYYY Use [ENTER], [TAB] or [SHIFT-
TAB] to select a field.
Use [+] or [-] to configure system
date.
Configures the system date.
Default is [Build Date]. Day of the
week is automatically calculated.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
72
Feature Options Help Text Description
Language English
French
German
Italian
Spanish
Select the current
default language used
by the BIOS.
Select the current default language
used by BIOS.
4.3.5.2 Advanced Menu
Table 23. BIOS Setup, Advanced Menu Options
Feature Options Help Text Description
Advance d Settings
WARNING: Setting wrong values in below sections may cause system to malfunction.
Processor Configuration N/A Configure processors. Selects submenu.
IDE Configuration N/A Configure the IDE device(s). Selects submenu.
Floppy Configuration N/A Configure the Floppy drive(s). Selects submenu.
Super I/O Configuration N/A Configure the Super I/O Chipset. Selects submenu.
USB Configuration N/A Configure the USB support. Selects submenu.
PCI Configuration N/A Configure PCI devices. Selects submenu.
Memory Configuration N/A Configure memory devices. Selects submenu.
4.3.5.2.1 Processor Configuration Sub-menu
Table 24. BIOS Setup, Processor Configuration Sub-menu Options
Feature Options Help Text Description
Configure Adv anced Processor Settings
Manufacturer Intel N/A Displays processor
manufacturer string
Brand String N/A N/A Displays processor brand ID
string
Frequency N/A N/A Displays the calculated
processor speed
FSB Speed N/A N/A Displays the processor front-
side bus speed.
CPU 1
CPUID N/A N/A Displays the CPUID of the
processor.
Cache L1 N/A N/A Displays cache L1 size.
Cache L2 N/A N/A Displays cache L2 size.
Cache L3 N/A N/A Displays cache L3 size. Visible
only if the processor contains
an L3 cache.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 73
Feature Options Help Text Description
CPU 2
CPUID N/A N/A Displays the CPUID of the
processor.
Cache L1 N/A N/A Displays cache L1 size.
Cache L2 N/A N/A Displays cache L2 size.
Cache L3 N/A N/A Displays cache L3 size. Visible
only if the processor contains
an L3 cache.
Max CPUID Value Limit Disabled
Enabled
This should be enabled in
order to boot legacy operating
systems that cannot support
processors with extended
CPUID functions.
Hyper-Threading Technology Disabled
Enabled
Enable Hyper-Threading
Technology only if the
operating system supports it.
Controls the Hyper-Threading
Technology state. Primarily
used to support older operating
systems that do not support
Hyper-Threading Technology.
Intel SpeedStep® Technology Auto
Disabled
Select disabled for maximum
CPU speed. Select enabled to
allow the operating system to
reduce power consumption.
4.3.5.2.2 IDE Configuration Sub-menu
Table 25. BIOS Setup IDE Configuration Menu Options
Feature Options Help Text Description
IDE Configuration
Onboard P-ATA
Channels
Disabled
Primary
Secondary
Both
Disabled: disables the
integrated P-ATA Controller.
Primary: enables only the
Primary P-ATA Controller.
Secondary: enables only the
Secondary P-ATA Controller.
Both: enables both P-ATA
Controllers.
Controls state of integrated P-
ATA controller.
Onboard S-ATA
Channels
Disabled
Enabled
Disabled: disables the
integrated S-ATA Controller.
Enabled: enables the integrated
S-ATA Controller.
Controls state of integrated
S-ATA controller.
Configure S-ATA as
RAID Disabled
Enabled
When enabled the S-ATA
channels are reserved to be
used as RAID.
S-ATA Ports
Definition A1-3rd M/A2-4th M
A1-4th M/A2-3rd M
Defines priority between S-ATA
channels.
Default set the S-ATA Port0 to 3rd
IDE Master channel and Port1 to
4th IDE Master channel.
Otherwise set S-ATA Port0 to 4th
IDE Master channel and Port1 to
3rd IDE Master channel.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
74
Feature Options Help Text Description
Mixed P-ATA / S-ATA N/A Lets you remove a P-ATA and
replace it by S-ATA in a given
channel. Only one channel can
be S-ATA.
Selects submenu for configuring
mixed P-ATA and S-ATA.
Primary IDE Master N/A While entering setup, BIOS auto
detects the presence of IDE
devices. This displays the
status of auto detection of IDE
devices.
Selects submenu with additional
device details.
Primary IDE Slave N/A While entering setup, BIOS auto
detects the presence of IDE
devices. This displays the
status of auto detection of IDE
devices.
Selects submenu with additional
device details.
Secondary IDE
Master
N/A While entering setup, BIOS auto
detects the presence of IDE
devices. This displays the
status of auto detection of IDE
devices.
Selects submenu with additional
device details.
Secondary IDE Slave N/A While entering setup, BIOS auto
detects the presence of IDE
devices. This displays the
status of auto detection of IDE
devices.
Selects submenu with additional
device details.
Third IDE Master N/A While entering setup, BIOS auto
detects the presence of IDE
devices. This displays the
status of auto detection of IDE
devices.
Selects submenu with additional
device details.
Fourth IDE Master N/A While entering setup, BIOS auto
detects the presence of IDE
devices. This displays the
status of auto detection of IDE
devices.
Selects submenu with additional
device details.
Hard Disk Write
Protect Disabled
Enabled
Disable/Enable device write
protection. This will be effective
only if device is accessed
through BIOS.
Primarily used to prevent
unauthorized writes to hard
drives.
IDE Detect Time Out
(Sec)
0
5
10
15
20
25
30
35
Select the time out value for
detecting ATA/ATAPI device(s).
Primarily used with older IDE
devices with longer spin up times.
ATA(PI) 80Pin Cable
Detection Host & Device
Host
Device
Select the mechanism for
detecting 80Pin ATA(PI) Cable.
The 80-pin cable is required for
UDMA-66 and above. BIOS
detects the cable by querying the
host and/or device.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 75
Table 26. Mixed P-ATA-S-ATA Configuration with only Primary P-ATA
Feature Options Help Text Description
Mixed P-ATA / S-ATA
First ATA
Channel P-ATA M-S
S-ATA M-S
Configure this channel to P-ATA or S-
ATA.
P-ATA: Parallel ATA Primary channel.
S-ATA: Serial ATA.
Defines the S-ATA device for
this channel. If the Second
ATA is assigned S-ATA, this
option reverts to P-ATA.
Second ATA
Channel P-ATA M-S
S-ATA M-S
Configure this channel to P-ATA or S-
ATA.
P-ATA: Parallel ATA Primary channel.
S-ATA: Serial ATA.
Defines the S-ATA device for
this channel. If the First ATA is
assigned S-ATA, this option
reverts to P-ATA.
3rd & 4th ATA
Channels A1-3rd M/A2-4th M
A1-4th M/A2-3rd M
None
Configure this channel to P-ATA or S-
ATA.
P-ATA: Parallel ATA Primary channel.
S-ATA: Serial ATA.
Display only. If the First ATA
or Second ATA is assigned S-
ATA, this option reverts to
None.
Table 27. BIOS Setup, IDE Device Configuration Sub-menu Selections
Feature Options Help Text Description
Primary/Secondary/Third/Fourth IDE Master/Slave
Device N/A N/A Display detected device information
Vendor N/A N/A. Display IDE device vendor
Size N/A N/A Display IDE disk size
LBA Mode N/A N/A Display LBA mode
Block Mode N/A N/A Display block mode
PIO Mode N/A N/A Display PIO mode
Async DMA N/A N/A Display Async DMA mode
Ultra DMA N/A N/A Display Ultra DMA mode
S.M.A.R.T. N/A N/A Display S.M.A.R.T. support
Type Not Installed
Auto
CDROM
ARMD
Select the type of device connected
to the system.
The Auto setting is correct in most
cases.
LBA/Large Mode Disabled
Auto
Disabled: Disables LBA Mode.
Auto: Enabled LBA Mode if the
device supports it and the device is
not already formatted with LBA
Mode disabled.
The Auto setting is correct in most
cases.
Block (Multi-Sector
Transfer) Mode
Disabled
Auto
Disabled: The Data transfer from
and to the device occurs one sector
at a time.
Auto: The data transfer from and to
the device occurs multiple sectors at
a time if the device supports it.
The Auto setting is correct in most
cases.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
76
Feature Options Help Text Description
PIO Mode Auto
0
1
2
3
4
Select PIO Mode. The Auto setting is correct in most
cases.
DMA Mode Auto
SWDMA0-0
SWDMA0-1
SWDMA0-2
MWDMA0-0
MWDMA0-1
MWDMA0-2
UWDMA0-0
UWDMA0-1
UWDMA0-2
UWDMA0-3
UWDMA0-4
UWDMA0-5
Select DMA mode
Auto :Auto detected
SWDMA :SinglewordDMAn
MWDMA :MultiwordDMAn
UWDMA :UltraDMAn
The Auto setting is correct in most
cases.
S.M.A.R.T. Auto
Disabled
Enabled
Self-Monitoring, Analysis and
Reporting Technology.
The Auto setting is correct in most
cases.
32Bit Data Transfer Disabled
Enabled
Enable/Disable 32-bit Data Transfer
4.3.5.2.3 Floppy Configuration Sub-menu
Table 28. BIOS Setup, Floppy Configuration Sub-menu Selections
Feature Options Help Text Description
Floppy Configur ation
Floppy A Disabled
720 KB 3 1/2"
1.44 MB 3 1/2"
2.88 MB 3 1/2"
Select the type of floppy drive
connected to the system. Note: Intel no longer
validates 720Kb and
2.88Mb drives.
Onboard Floppy Controller Disabled
Enabled
Allows BIOS to enable or
disable the floppy controller.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 77
4.3.5.2.4 Super I/O Configuration Sub-menu
Table 29. BIOS Setup, Super I/O Configuration Sub-menu
Feature Options Help Text Description
Configure Nat42x Super I/O Chipset
Serial Port A Address Disabled
3F8/IRQ4
2F8/IRQ3
3E8/IRQ4
2E8/IRQ3
Allows BIOS to Select Serial Port A
Base Addresses.
Option that is used by other serial port
is hidden to prevent conflicting
settings.
Serial Port B Address Disabled
3F8/IRQ4
2F8/IRQ3
3E8/IRQ4
2E8/IRQ3
Allows BIOS to Select Serial Port B
Base Addresses.
Option that is used by other serial port
is hidden to prevent conflicting
settings.
4.3.5.2.5 USB Configuration Sub-menu
Table 30. BIOS Setup, USB Configuration Sub-menu Selections
Feature Options Help Text Description
USB Configuration
USB Devices
Enabled
N/A N/A List of USB
devices detected
by BIOS.
USB Function Disabled
Enabled
Enables USB HOST controllers. When set to
disabled, other
USB options are
grayed out.
Legacy USB Support Disabled
Keyboard only
Auto
Keyboard and Mouse
Enables support for legacy USB. AUTO option
disables legacy support if no USB devices are
connected. If disabled, USB Legacy Support will
not be disabled until booting an operating
system.
Port 60/64 Emulation Disabled
Enabled
Enables I/O port 60/64h emulation support. This
should be enabled for the complete USB
keyboard legacy support for non-USB aware
operating systems.
USB 2.0 Controller Disabled
Enabled
N/A
USB 2.0 Controller
mode
FullSpeed
HiSpeed
Configures the USB 2.0 controller in HiSpeed
(480Mbps) or FullSpeed (12Mbps).
USB Mass Storage
Device Configuration
N/A Configure the USB Mass Storage Class
Devices.
Selects submenu
with USB Device
enable.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
78
4.3.5.2.6 USB Mass Storage Device Configuration Sub-menu
Table 31. BIOS Setup, USB Mass Storage Device Configuration Sub-menu Selections
Feature Options Help Text Description
USB Mass Storage Device Configuration
USB Mass Storage
Reset Delay
10 Sec
20 Sec
30 Sec
40 Sec
Number of seconds POST waits for the USB
mass storage device after start unit command.
Device #1 N/A N/A Only displayed if a device
is detected, includes a
DeviceID string returned
by the USB device.
Emulation Type Auto
Floppy
Forced FDD
Hard Disk
CDROM
If Auto, USB devices less than 530MB will be
emulated as Floppy and remaining as hard drive.
Forced FDD option can be used to force a HDD
formatted drive to boot as FDD (Ex. ZIP drive).
Device #n N/A N/A Only displayed if a device
is detected, includes a
DeviceID string returned
by the USB device.
Emulation Type Auto
Floppy
Forced FDD
Hard Disk
CDROM
If Auto, USB devices less than 530MB will be
emulated as Floppy and remaining as hard drive.
Forced FDD option can be used to force a HDD
formatted drive to boot as FDD (Ex. ZIP drive).
4.3.5.2.7 PCI Configuration Sub-menu
This sub-menu provides control over PCI devices and their option ROMs. If the BIOS is
reporting POST error 146, use this menu to disable option ROMs that are not required to boot
the system.
Table 32. BIOS Setup, PCI Configuration Sub-menu Selections
Feature Options Help Text Description
PCI Configuration
Onboard Video Disabled
Enabled
Enable/Disable on board VGA
Controller
Dual Monitor Video Disabled
Enabled
Select which graphics controller to use
as the primary boot device. Enabled
selects the on board device.
Grayed out if Onboard
Video is set to "Disabled."
Onboard NIC 1 (Left) Disabled
Enabled
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 79
Feature Options Help Text Description
Onboard NIC 1 ROM Disabled
Enabled
Grayed out if device is
disabled.
Onboard NIC 2 (Right) Disabled
Enabled
Onboard NIC 2 ROM Disabled
Enabled
Grayed out if device is
disabled.
Slot 1 Option ROM Disabled
Enabled
PCI-X 64/66 Visible only when installed
riser supports this slot.
Slot 2 Option ROM Disabled
Enabled
PCI-X 64/66 Visible only when installed
riser supports this slot.
Slot 3 Option ROM Disabled
Enabled
PCI-X 64/66 Visible only when installed
riser supports this slot.
Slot 4 Option ROM Disabled
Enabled
PCI-X 64/66 Visible only when installed
riser supports this slot.
4.3.5.2.8 Memory Configuration Sub-menu
This sub-menu provides information about the DIMMs detected by the BIOS. The DIMM number
is printed on the baseboard next to each device.
Table 33. BIOS Setup, Memory Configuration Sub-menu Selections
Feature Options Help Text Description
System Memory Settings
DIMM 1A Installed
Not Installed
Disabled
Mirror
Spare
Informational display.
Note: Mirror is not
supported on the Server
Board SE7320VP2
DIMM 1B Installed
Not Installed
Disabled
Mirror
Spare
Informational display.
Note: Mirror is not
supported on the Server
Board SE7320VP2
DIMM 2A Installed
Not Installed
Disabled
Mirror
Spare
Informational display.
Note: Mirror is not
supported on the Server
Board SE7320VP2
DIMM 2B Installed
Not Installed
Disabled
Mirror
Spare
Informational display.
Note: Mirror is not
supported on the Server
Board SE7320VP2
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
80
Feature Options Help Text Description
DIMM 3A Installed
Not Installed
Disabled
Mirror
Spare
Informational display.
Note: Mirror is not
supported on the Server
Board SE7320VP2
DIMM 3B Installed
Not Installed
Disabled
Mirror
Spare
Informational display.
Note: Mirror is not
supported on the Server
Board SE7320VP2
Extended Memory Test 1 MB
1 KB
Every Location
Disabled
Settings for extended memory test
Memory Retest Disabled
Enabled
If "Enabled", BIOS will activate and
retest all DIMMs on the next
system boot.
This option will automactically
reset to "Disabled" on the next
system boot.
Memory Remap Feature Disabled
Enabled Enable: Allow remapping of
overlapped PCI memory above the
total physical memory.
Disable: Do not allow remapping
of memory.
Memory Sparing Disabled
Spare
Disabled provides the most
memory space. Sparing reserves
memory to replace failures.
Sparing is grayed out if the
installed DIMM
configuration does not
support it.
4.3.5.3 Boot Menu
Table 34. BIOS Setup, Boot Menu Selections
Feature Options Help Text Description
Boot Settings
Boot Settings Configuration N/A Configure settings during system boot. Selects submenu.
Boot Device Priority N/A Specifies the boot device priority sequence. Selects submenu.
Hard Disk Drives N/A Specifies the boot device priority sequence from
available hard drives.
Selects submenu.
Removable Drives N/A Specifies the boot device priority sequence from
available removable drives.
Selects submenu.
ATAPI CDROM Drives N/A Specifies the boot device priority sequence from
available ATAPI CDROM drives.
Selects submenu.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 81
4.3.5.3.1 Boot Settings Configuration Sub-menu Selections
Table 35. BIOS Setup, Boot Settings Configuration Sub-menu Selections
Feature Options Help Text Description
Boot Settings Configuration
Quick Boot Disabled
Enabled
Allows BIOS to skip certain tests while booting. This
will decrease the time needed to boot the system.
Quiet Boot Disabled
Enabled
Disabled: Displays normal POST messages.
Enabled: Displays OEM Logo instead of POST
messages.
Bootup Num-Lock Off
On
Select power-on state for Numlock.
PS/2 Mouse Support Disabled
Enabled
Auto
Select support for PS/2 mouse.
POST Error Pause Disabled
Enabled
If enabled, the system will wait for user intervention
on critical POST errors. If disabled, the system will
boot with no intervention, if possible.
Hit ‘F2’ Message Display Disabled
Enabled
Displays "Press ‘F2’ to run Setup" in POST.
Scan User Flash Area Disabled
Enabled
Allows BIOS to scan the Flash ROM for user
binaries.
4.3.5.3.2 Boot Device Priority Sub-menu Selections
Table 36. BIOS Setup, Boot Device Priority Sub-menu Selections
Feature Options Help Text Description
Boot Device Priority
1st Boot Device Varies Specifies the boot sequence from the
available devices.
A device enclosed in parenthesis has
been disabled in the corresponding type
menu.
Number of entries will vary based on
system configuration.
nth Boot Device Varies Specifies the boot sequence from the
available devices.
A device enclosed in parenthesis has
been disabled in the corresponding type
menu.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
82
4.3.5.3.3 Hard Disk Drive Sub-menu Selections
Table 37. BIOS Setup, Hard Disk Drive Sub-Menu Selections
Feature Options Help Text Description
Hard Disk Drives
1st Drive Varies Specifies the boot sequence from the available
devices.
Varies by system configuration.
nth Drive Varies Specifies the boot sequence from the available
devices.
Varies by system configuration.
4.3.5.3.4 Removable Drive Sub-menu Se lections
Table 38. BIOS Setup, Removable Drives Sub-menu Selections
Feature Options Help Text Description
Removable Drives
1st Drive Varies Specifies the boot sequence from the available
devices.
Varies by system configuration.
nth Drive Varies Specifies the boot sequence from the available
devices.
Varies by system configuration.
4.3.5.3.5 ATAPI CDROM drives sub-menu selections
Table 39. BIOS Setup, CD/DVD Drives Sub-menu Selections
Feature Options Help Text Description
CD/DVD Drives
1st Drive Varies Specifies the boot sequence from the available
devices.
Varies by system configuration.
nth Drive Varies Specifies the boot sequence from the available
devices.
Varies by system configuration.
4.3.5.4 Security Menu
Table 40. BIOS Setup, Security Menu Options
Feature Options Help Text Description
Security Settings
Administrator
Password is
N/A Install / Not installed Informational display.
User Password is N/A Install / Not installed Informational display.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 83
Feature Options Help Text Description
Set Admin
Password
N/A Set or clear Admin password Pressing enter twice will clear the
password. This option is grayed
our when entering setup with a
user password.
Set User Password N/A Set or clear User password Pressing enter twice will clear the
password.
User Access Level No Access
View Only
Limited
Full Access
LIMITED: allows only limited fields
to be changed such as Date
and Time.
NO ACCESS: prevents User
access to the Setup Utility.
VIEW ONLY: allows access to the
Setup Utility but the fields can not
be changed.
FULL: allows any field to be
changed.
This node is grayed out and
becomes active only when Admin
password is set.
Clear User
Password
N/A Immediately clears the user
password.
Admin uses this option to clear
User password (Admin password
is used to enter setup is required).
This node is gray if Administrator
password is not installed.
Fixed disk boot
sector protect Disabled
Enabled
Enable/Disable Boot Sector Virus
Protection.
Password On Boot Disabled
Enabled
If enabled, requires password
entry before boot.
This node is grayed out if a user
password is not installed.
Secure Mode Timer 1 minute
2 minutes
5 minutes
10 minutes
20 minutes
60 minutes
120 minutes
Period of key/PS/2 mouse
inactivity specified for Secure
Mode to activate. A password is
required for Secure Mode to
function. Has no effect unless at
least one password is enabled.
This node is grayed out if a user
password is not installed.
Secure Mode Hot
Key (Ctrl-Alt- ) [L]
[Z]
Key assigned to invoke the secure
mode feature. Cannot be enabled
unless at least one password is
enabled. Can be disabled by
entering a new key followed by a
backspace or by entering delete.
This node is grayed out if a user
password is not installed.
Secure Mode Boot Disabled
Enabled
When enabled, allows the host
system to complete the boot
process without a password. The
keyboard will remain locked until a
password is entered. A password
is required to boot from diskette.
This node is grayed out if a user
password is not installed.
Front Panel Switch
Inhibit Disabled
Enabled
Disable the Front Panel Power
Switch when Secure mode is
activated. A password is required
to unlock the system.
This node is grayed out if a user
password is not installed. This
node is hidden if the Intel®
Management Module is not
present. The Intel Management
Module is not supported on the
Server Board SE7320VP2.
NMI Control Disabled
Enabled
Enable / disable NMI control for
the front panel NMI button.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
84
4.3.5.5 Server Menu
Table 41. BIOS Setup, Server Menu Selections
Feature Options Help Text Description
System Management N/A N/A Selects submenu.
Serial Console Features N/A N/A Selects submenu.
Event Log configuration N/A Configures event logging. Selects submenu.
Assert NMI on SERR Disabled
Enabled
If enabled, NMI is generated on
SERR and logged.
Assert NMI on PERR Disabled
Enabled
If enabled, NMI is generated.
SERR option needs to be
enabled to activate this option.
Grayed out if “NMI on
SERR” is disabled.
Resume on AC Power Loss Stays Off
Power On
Last State
Determines the mode of
operation if a power loss occurs.
Stays off, the system will remain
off once power is restored. Power
On, boots the system after power
is restored.
“Last State” is only
displayed if the Intel
Management Module is
present. When displayed,
“Last State” is the
default.
When set to “Stays Off,”
“Power Switch Inhibit” is
disabled. The Intel
Management Module is
not supported on the
Server Board
SE7320VP2.
FRB-2 Policy Disable BSP
Do not disable BSP
Retry on Next Boot
Disable FRB2 Timer
This controls action if the boot
processor will be disabled or not.
“Disable BSP” and “Do
not disable BSP” are only
displayed if the Intel
Management Module is
present. The Intel
Management Module is
not supported on the
Server Board
SE7320VP2.
Late POST Timeout Disabled
5 minutes
10 minutes
15 minutes
20 minutes
This controls the time limit for
add-in card detection. The system
is reset on timeout.
Hard Disk OS Boot Timeout Disabled
5 minutes
10 minutes
15 minutes
20 minutes
This controls the time limit
allowed for booting an operating
system from a Hard disk drive.
The action taken on timeout is
determined by the OS Watchdog
Timer policy setting.
PXE OS Boot Timeout Disabled
5 minutes
10 minutes
15 minutes
20 minutes
This controls the time limit
allowed for booting an operating
system using PXE boot. The
action taken on timeout is
determined by OS Watchdog
Timer policy setting.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 85
Feature Options Help Text Description
OS Watchdog Timer Policy Stay On
Reset
Power Off
Controls the policy upon timeout.
Stay on action will take no overt
action. Reset will force the
system to reset. Power off will
force the system to power off.
Platform Event Filtering Disabled
Enabled
Disable trigger for system sensor
events.
4.3.5.5.1 System Management Sub-menu Selections
Table 42. BIOS Setup, System Management Sub-menu Selections
Feature Options Help Text Description
Server Board Part Number N/A N/A Field contents varies
Server Board Serial Number N/A N/A Field contents varies
NIC 1 MAC Address N/A N/A Field contents varies
NIC 2 MAC Address N/A N/A Field contents varies
System Part Number N/A N/A Field contents varies
System Serial Number N/A N/A Field contents varies
Chassis Part Number N/A N/A Field contents varies
Chassis Serial Number N/A N/A Field contents varies
BIOS Version N/A N/A BIOS ID string (excluding the
build time and date)
BMC Device ID N/A N/A Field contents varies
BMC Firmware Revision N/A N/A Field contents varies
BMC Device Revision N/A N/A Field contents varies
PIA Revision N/A N/A Field contents varies
SDR Revision N/A N/A Field contents varies
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
86
4.3.5.5.2 Serial Console Features Sub-menu Selections
Table 43. BIOS Setup, Serial Console Features Sub-menu Selections
Feature Options Help Text Description
Serial Console Features
If enabled, the BIOS uses the specified serial
port to redirect the console to a remote ANSI
terminal. Enabling this option disables Quiet
Boot.
BIOS Redirection Port Disabled
Serial A
Serial B
If enabled, the BIOS uses the specified serial
port to redirect the console to a remote ANSI
terminal. Enabling this option disables Quiet
Boot. For Serial Over LAN, select Serial B.
Baud Rate 9600
19.2K
38.4K
57.6K
115.2K
N/A
Flow Control No Flow Control
CTS/RTS
XON/XOFF
CTS/RTS + CD
If enabled, it will use the Flow control
selected.
CTS/RTS = Hardware
XON/XOFF = Software
CTS/RTS + CD = Hardware + Carrier Detect
for modem use.
Terminal Type PC-ANSI
VT100+
VT-UTF8
VT100+ selection only works for English as
the selected language. VT-UTF8 uses
Unicode. PC-ANSI is the standard PC-type
terminal.
ACPI Redirection port Disabled
Serial A
Serial B
Enable / Disable the ACPI OS Headless
Console Redirection.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 87
4.3.5.5.3 Event Log Configuration Sub-menu Selections
Table 44. BIOS Setup, Event Log Configuration Sub-menu Selections
Feature Options Help Text Description
Event Log Configuration
Clear All Event Logs Disabled
Enabled
Setting this to Enabled will clear the System
Event Log during the next boot.
BIOS Event Logging Disabled
Enabled
Select enabled to allow logging of BIOS
events.
Enables BIOS to log events
to the SEL. This option
controls BIOS events only.
Critical Event Logging Disabled
Enabled
If enabled, BIOS will detect and log events for
system critical errors. Critical errors are fatal
to system operation. These errors include
PERR, SERR, ECC.
Enable SMM handlers to
detect and log events to
SEL.
ECC Event Logging Disabled
Enabled
Enables or Disables ECC Event Logging. Grayed out if "Critical Event
Logging" option is disabled.
PCI Error Logging Disabled
Enabled
Enables or Disables PCI Error Logging. Grayed out if "Critical Event
Logging" option is disabled.
FSB Error Logging Disabled
Enabled
Enables or Disables Front-Side Bus Error
Logging.
Grayed out if "Critical Event
Logging" option is disabled.
Hublink Error Logging Disabled
Enabled
Enables or Disables Hublink Error Logging. Grayed out if "Critical Event
Logging" option is disabled.
4.3.5.6 Exit Menu
Table 45. BIOS Setup, Exit Menu Selections
Feature Options Help Text
Exit Options
Save Changes
and Exit
N/A Exit system setup after saving the changes.
F10 key can be used for this operation.
Discard
Changes and
Exit
N/A Exit system setup without saving any changes.
ESC key can be used for this operation.
Discard
Changes
N/A Discards any changes made.
F7 key can be used for this operation.
Load Setup
Defaults
N/A Load Setup Default values for all the setup questions.
F9 key can be used for this operation.
Load Custom
Defaults
N/A Load custom defaults.
Save Custom
Defaults
N/A Save custom defaults
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
88
4.4 Flash Archi tecture and Flash Update Utility
The flash ROM contains system initialization routines, the BIOS Setup Utility, and runtime
support routines. The exact layout is subject to change, as determined by Intel. A 64-KB user
block is available for user ROM code or custom logos. The flash ROM also contains initialization
code in compressed form for onboard peripherals, like SCSI, NIC and video controllers. It also
contains support for the rolling single-boot BIOS update feature.
4.4.1 Rolling BIOS and On-line Updates
The online update nomenclature refers to the ability to update the BIOS while the server is
online and in operation, as opposed to taking the server out of operation while performing a
BIOS update. The rolling BIOS nomenclature refers to the capability of having two copies of
BIOS: the current BIOS in use, and a second BIOS to which an updated BIOS version can be
written. When ready, the system can roll forward to the new BIOS. In case of a failure with the
new BIOS version, the system can roll back to the previous version.
The BIOS relies on specialized hardware and additional flash space to accomplish online
update/rolling of the BIOS. The flash is divided into two partitions, primary and secondary. The
active partition from which the system boots is the primary partition. The AMI FLASH update
suite and Intel online updates preserve the existing BIOS image on the primary partition.
BIOS updates are diverted to the secondary partition. After the update is complete, a notification
flag is set. During the next boot, the system first attempts to boot from the primary BIOS
partition. On determining that a BIOS update occurred, the system then attempts to boot from
the new BIOS. If a failure happens while booting to the new BIOS, the specialized hardware on
the system switches to the primary BIOS partition, thus affecting a “roll back”.
4.4.2 Flash Update Utility
Server platforms support a DOS-based firmware update utility. This utility loads a fresh copy of
the BIOS into the flash ROM. The BIOS update may affect the following items:
The system BIOS, including the recovery code, setup utility and strings.
Onboard video BIOS, and other option ROMS for the devices embedded on the server
board.
OEM binary area.
Microcode updates.
4.4.3 Flash BIOS
An afuXXX AMI Firmware Update utility (such as afudos, AFUWIN, afulnx, or AFUEFI) is
required for a BIOS update.
4.4.4 User Binary Area
The baseboard includes an area in flash for implementation-specific OEM add-ons. This OEM
binary area can be updated as part of the system BIOS update or it can be updated
independent of the system BIOS.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 89
4.4.5 Recovery Mode
Three conditions can cause the system to enter recovery mode:
Pressing a hot key
Setting the recovery jumper (J1H3, labeled RCVR BOOT) to pins 1-2
Damaging the ROM image, which will cause the system to enter recovery and update
the system ROM without the boot block.
4.4.5.1 BIOS Recovery
The BIOS has a ROM image size of 2MB. A standard 1.44MB floppy diskette cannot hold the
entire ROM file due to the large file size. To compensate for this, a multi-disk recovery method
is available for BIOS recovery.
The BIOS contains a primary and secondary partition, and can support rolling BIOS updates.
The recovery process performs an update on the secondary partition in the same fashion that
the normal flash update process updates the secondary partition. After recovery is complete and
the power is cycled to the system, the BIOS partitions switch and the code executing POST will
be the code that was just flashed from the recovery media.
The BIOS is made up of a boot block recovery section, a main BIOS section, an OEM logo/user
binary section, and an NVRAM section. The NVRAM section will either be preserved or
destroyed based on a hot-key press during invocation of the recovery. All the other sections of
the secondary BIOS will be updated during the recovery process. If an OEM wishes to preserve
the OEM section across an update, it is recommended that the OEM modify the provided
AMIBOOT.ROM file with the user binary or OEM logo tools before performing the recovery.
A BIOS recovery can be accomplished from one of the following devices: a standard 1.44 or
2.88 MB floppy drive, an USB Disk-On-Key, an ATAPI CD-ROM/DVD, an ATAPI ZIP drive, or a
LS-120/LS-240 removable drive.
The recovery media must include the BIOS image file, AMIBOOT.ROM.
The recovery mode procedure is as follows:
1. Insert or plug-in the recovery media with the AMIBOOT.ROM file.
2. Power on the system. When progress code E9 is displayed on port 80h, the system will
detect the recovery media (if there is no image file present, the system will cycle through
progress code F1 to EF).
3. When F3 is displayed on port 80h, the system will read the BIOS image file.
4. The screen will display flash progress and indicate whether the NVRAM and CMOS
have been destroyed.
5. When recovery mode is complete, the system will halt and the system can be powered
off.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
90
Note: Three different hot-keys can be invoked:
<Ctrl+Home>: Recovery with CMOS destroyed and NVRAM preserved
<Ctrl+PageDown>: Recovery with both CMOS and NVRAM preserved
<Ctrl+PageUp>: Recovery with both CMOS and NVRAM destroyed
4.4.5.2 Multi-disk Recovery
The multi-disk recovery method is available to support ROM images greater than 1MB when
performing a BIOS recovery from multiple floppy disks.
Do the following to perform a multi-disk BIOS recovery:
1. Use the SPLIT.EXE utility to split the ROM image.
2. Execute the following command at the command prompt:
split <File Name To Be Split> <New File Name> <File Size in KB>
Example: C:\split AMIBOOT.ROM AMIBOOT 1024
This command will create files of size 1 MB each (1024 KB) with the names
AMIBOOT.000, AMIBOOT.001... and so on. The number of files (or floppy disks) will
depend upon the size of the AMIBOOT.ROM file.
3. Load the first disk with the AMIBOOT.000 file into the system.
4. After reading the file, the system will increment the file extension and begin searching for
the second file, AMIBOOT.001, on the same floppy disk. If the system cannot find the
file on the floppy disk, it will beep once for one second and then search again. At this
point, load the second floppy disk.
5. The system will continue reading and searching for files in this fashion. Once a file has
been read, the system will increment the file extension and then begin searching for the
next file. If searching for the AMIBOOT.002 file, the system will beep twice (each beep 1
second long with a 0.5 sec gap between beeps). If searching for the AMIBOOT.003 file,
the system will beep three times with a 0.5 sec gap between beeps.
6. This process continues until the total file size read in is equal to the size of the ROM
image.
Limitation:
The maximum number of files supported by the Multi-disk Recovery method is 1,000 files
(AMIBOOT.000 through AMIBOOT.999).
4.4.6 Update OEM Logo
An Intel-supplied utility package is used to change the OEM logo in ROM. The OEM logo can
then be updated by flashing the ROM.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 91
4.5 OEM Binary
System customers can supply 16 KB of code and data for use during POST and at run-time.
Individual platforms may support a larger user binary. User binary code is executed at several
defined hook points during POST.
The user binary code is stored in the system flash. If no run-time code is added, the BIOS
temporarily allocates a code. If run-time code is present, the BIOS shadows the entire block as
though it were an option ROM. The BIOS leaves this region writeable to allow the user binary to
update any data structures it defines. System software can locate a run-time user binary by
searching for it like an option ROM. The system vendor can place a signature within the user
binary to distinguish it from other option ROMs.
4.6 Security
The BIOS provides a number of security features. This section describes the security features
and operating model.
The BIOS uses passwords to prevent unauthorized tampering with the system. Once secure
mode is entered, access to the system is allowed only after the correct password(s) has been
entered. Both user and administrator passwords are supported by the BIOS. To set a user
password, an administrator password must be entered during system configuration using the
BIOS setup menu. The maximum length of the password is seven characters. The password
cannot have characters other than alphanumeric (a-z, A-Z, 0-9).
Once set, a password can be cleared by entering the password change mode and pressing
enter twice without inputting a string. All setup fields can be modified when entering the
administrator password. The “user access level” setting in the BIOS setup Security menu
controls the user access level. The administrator can choose “No Access” to block the user from
accessing any setup features. “Limited Access” will allow only the date/time fields and the user
password to be changed. “View Only” allows the user to enter BIOS setup, but not change any
settings.
The Administrator has control over all fields in the setup, including the ability to clear the user
password.
If the user enters three wrong passwords in a row during the boot sequence, the system will be
placed into a halt state. This feature makes it difficult to break the password by “trial and error.”
The BIOS Setup may provide an option for setting the Emergency Management Port (EMP)
password. However, the EMP password is only utilized by the mBMC; this password does not
affect the BIOS security in any way, nor does the BIOS security engine provide any validation
services for this password. EMP security is handled primarily through the mBMC and EMP
utilities.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
92
4.6.1 Operating Model
The following table summarizes the operation of security features supported by the BIOS.
Some security features require the Intel® Management Module (IMM) to be installed (which is
not supported on the Intel® Server Board SE7320VP2). These include “Diskette Write Protect”,
“Video Blanking”, and “Power Switch inhibit.”
Table 46. Security Features Operating Model
Mode Entry
Method/
Event
Entry Criteria Behavior Exit Criteria After Exit
Secure boot Power
On/Reset
User Password
and Secure Boot
Enabled
Prompts for password if
booting from drive A.
Enters secure mode just
before scanning option
ROMs as indicated by
flashing LEDs on the
keyboard. Disables the
NMI switch on the front
panel if enabled in Setup.
Accepts no input from
PS/2* mouse or PS/2
keyboard; however, the
mouse driver is allowed
to load before a
password is required. If
booting from drive A and
the user enters correct
password, the system
boots normally.
User
Password
Admin
Password
Floppy writes are re-
enabled. Front panel
switches are re-enabled.
PS/2 keyboard and PS/2
mouse inputs are
accepted. System
attempts to boot from drive
A. If the user enters
correct password, and
drive A is bootable, the
system boots normally
Password
on boot
Power
On/Reset
User Password
set and
password on
boot enabled
and Secure Boot
Disabled in
setup
System halts for user
Password before
scanning option ROMs.
The system is not in
secure mode. No mouse
or keyboard input is
accepted except the
password.
User
Password
Admin
Password
Front panel switches are
re-enabled. PS/2 keyboard
and PS/2 mouse inputs
are accepted. The system
boots normally. Boot
sequence is determined by
setup options.
Fixed disk
boot sector
Power
On/Reset
Set feature to
Write Protect in
Setup
Will write protect the
master boot record of the
IDE hard drives only if the
system boots from a
floppy. The BIOS will also
write protect the boot
sector of the drive C: if it
is an IDE drive.
Set feature
to Normal in
Setup
Hard drive will behave
normally.
4.6.2 Administrator/User Passwords and F2 Setup Usage Model
Notes:
Visible=option string is active and changeable
Hidden=option string is inactive and not visible
Shaded=option string is gray-out and view-only
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 93
There are three possible password scenarios:
Scenario #1
Administrator Password Is Not Installed
User Password Is Not Installed
Login Type: N/A
Set Admin Password (visible)
Set User Password (visible)
User Access Level [Full]** (shaded)
Clear User Password (hidden)
** User Access Level option will be Full and Shaded as long as the administrator/supervisor
password is not installed.
Scenario #2
Administrator Password Is Installed
User Password Is Installed
Login Type: Admin/Supervisor
Set Admin Password (visible)
Set User Password (visible)
User Access Level [Full] (visible)
Clear User Password (visible)
Login Type: User
Set Admin Password (hidden)
Set User Password (visible)
User Access Level [Full] (Shaded)
Clear User Password (hidden)
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
94
Scenario #3
Administrator Password Is Installed
User Password Is Not Installed
Login Type: Supervisor
Set Admin Password (visible)
Set User Password (visible)
User Access Level [Full] (visible)
Clear User Password (hidden)
Login Type: <Enter>
Set Admin Password (hidden)
Set User Password (visible)
User Access Level [Full] (Shaded)
Clear User Password (hidden)
4.6.3 Password Clear Jumper
If the user or administrator password(s) is lost or forgotten, moving the password clear jumper
(board location J1H2) to the clear position will clear both passwords. The BIOS determines if
the password clear jumper is in the clear position during BIOS POST and clears any passwords
if present. The password clear jumper must be restored to its original position before a new
password(s) can be set.
4.7 Extensible Firmware Interface (EFI)
When EFI is selected as a boot option, the BIOS will support an EFI Specification 1.10-
compliant environment. More details on EFI are available at
http://developer.intel.com/technology/efi/index.htm
4.7.1 EFI Shell
The EFI Shell is a special type of EFI application that allows EFI commands and other EFI
applications to be launched. The BIOS implements an EFI shell in flash and the shell can be
invoked from the BIOS provided EFI environment. The EFI shell provided in flash implements all
the commands specified in the EFI1.1ShellCommands.pdf document that comes with the
EFI sample implementation, revision 1.10.14.62 (available from
http://developer.intel.com/technology/efi/main_sample.htm ).
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 95
4.8 Operating System Boot, Sleep, and Wake
The IPMI 1.5 specification, section 22.10 and 22.11, has provisions for server management
devices to set certain boot parameters by setting boot flags. Among the boot flags, parameter
#5 in the IPMI specification, the BIOS checks data 1-3 for forced boot options.
The BIOS supports force boots from: PXE, HDD, FDD, and CD.
On each boot, the BIOS determines what changes to boot options have been set by invoking
the Get System Boot Options command, takes appropriate action, and clears these settings.
4.8.1 Microsoft* Windows* Compati bi li ty
Intel Corporation and Microsoft Corporation co-author design guides for system designers using
Intel® processors and Microsoft* operating systems. These documents are updated yearly to
address new requirements and current trends.
PC200x specifications are intended for systems that are designed to work with Windows* 2000
and Windows XP class operating systems. The Hardware Design Guide (HDG) for the Windows
XP platform is intended for systems that are designed to work with Windows XP class operating
systems. Each specification classifies the systems further and has requirements based on the
intended usage for that system. For example, a server system that will be used in small
home/office environments has different requirements than one used for enterprise applications.
The BIOS supports HDG 3.0.
4.8.2 Advanced Configuration and Power Interface (ACPI)
The BIOS is ACPI 2.0c-compliant. The primary role of the BIOS is to provide ACPI tables.
During POST, the BIOS creates the ACPI tables and locates them in extended memory (above
1MB). The location of these tables is conveyed to the ACPI-aware operating system through a
series of tables located throughout memory. The format and location of these tables is
documented in the publicly available ACPI specification.
To prevent conflicts with a non-ACPI-aware operating system, the memory used for the ACPI
tables is marked as “reserved”.
As described in the ACPI specification, an ACPI-aware operating system generates an SMI to
request that the system be switched into ACPI mode. The BIOS responds by setting up all
system (chipset) specific configuration required to support ACPI, and sets the SCI_EN bit as
defined by the ACPI specification. The system automatically returns to legacy mode on hard
reset or power-on reset.
The BIOS supports S0, S1, S4, and S5 states. S1 and S4 are considered sleep states. The
ACPI specification defines the sleep states and requires the system to support at least one of
them.
While entering the S4 state, the operating system saves the context to the disk and most of the
system is powered off. The system can wake on a power button press, or a signal received from
a wake-on-LAN compliant LAN card (or onboard LAN), modem ring, PCI power management
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
96
interrupt, or RTC alarm. The BIOS performs complete POST upon wake up from S4, and
initializes the platform.
The system can wake from the S1 state using a PS/2 keyboard, mouse, or USB device, in
addition to the sources described above.
The wake sources are enabled by the ACPI operating systems with cooperation from the
drivers; the BIOS has no direct control over the wakeup sources when an ACPI operating
system is loaded. The role of the BIOS is limited to describing the wakeup sources to the
operating system and controlling secondary control/status bits via the DSDT table.
The S5 state is equivalent to operating system shutdown. No system context is saved.
4.8.3 Sleep and Wake Functionality
The BIOS supports a control panel power button. The power button is a request that is
forwarded by the mBMC to the ACPI power state machines in the chipset. It is monitored by the
mBMC and does not directly control power on the power supply.
The BIOS supports a control panel sleep button. The sleep button may not be provided on all
control panel designs. On systems where the sleep button is optional, a system configuration
option will be provided to enable or disable the sleep button. The ACPI tables will be updated to
indicate the presence or absence of the sleep button. Removal of the sleep button does not
prevent an ACPI OS from entering a sleep state.
The sleep button has no effect unless an operating system is running. If the operating system is
running, pressing the sleep button causes an event. The operating system will cause the
system to transition to the appropriate ACPI system state depending on the current user
settings.
The platform supports a control panel reset button. The reset button is a request that is
forwarded by the mBMC to the chipset. The BIOS does not affect the behavior of the reset
button.
The BIOS supports a control panel NMI button. The NMI button may not be provided on all
control panel designs. The NMI button is a request that causes the mBMC to generate an NMI
(non-maskable interrupt). The NMI is captured by the BIOS during Boot Services time or the
operating system during runtime. The BIOS will halt the system upon detection of the NMI.
4.8.3.1 Power Switch Off to On
The chipset may be configured to generate wakeup events for several different system events:
Wake on LAN, PCI Power Management Interrupt (PMI), and Real Time Clock Alarm are
examples of these events. The operating system will program the wake sources before
shutdown. A transition from either source results in the mBMC starting the power-up sequence.
Since the processors are not executing, the BIOS does not participate in this sequence. The
hardware receives power good and reset from the mBMC and then transitions to an On state.
Intel® Server Board SE7320VP2 System BIOS
Revision 2.1
Intel order number C91056-002 97
4.8.3.2 On to Off (Operating System Absent)
The SCI interrupt is masked. The firmware polls the power button status bit in the ACPI
hardware registers and sets the state of the machine in the chipset to the OFF state. The
mBMC monitors power state signals from the chipset and de-asserts PS_PWR_ON to the
power supply. As a safety mechanism, the mBMC automatically powers off the system in 4-5
seconds if the BIOS fails to service the request.
4.8.3.3 On to Off (Operating System Present)
If an operating system is loaded, the power button generates a request (via SCI) to the
operating system to shutdown the system. The operating system retains control of the system,
and OS policy determines into which sleep state(s) the system can transition.
4.8.3.4 On to Sleep (ACPI)
If an operating system is loaded, the sleep button generates a request (via SCI) to the operating
system to place the system in “sleep” mode. The operating system retains control of the system,
and OS policy determines into which sleep state(s) the system can transition.
4.8.3.5 Sleep to On (ACPI)
If an operating system is loaded, the sleep button generates a wake event to the ACPI chipset
and a request (via SCI) to the operating system to place the system in the On state. The
operating system retains control of the system, and OS policy determines from which sleep
state(s) and sleep source(s) the system can wake.
4.8.3.6 System Sleep States
The platform supports the following ACPI System Sleep States:
ACPI S0 (working) state
ACPI S1 (sleep) state
ACPI S4 (suspend to disk) state
ACPI S5 (soft-off) state
The platform supports the following wake up sources in an ACPI environment. As noted above,
the operating system controls the enabling and disabling of these wake sources.
Devices that are connected to all USB ports, such as USB mice and keyboards can
wake the system up from the S1 sleep state.
PS/2 keyboards and mice can wake up the system from the S1 sleep state.
Both serial ports can be configured to wake up the system from the S1 sleep state.
PCI cards, such as LAN cards, can wake up the system from the S1 or S4 sleep state.
The PCI card must have the necessary hardware for this to work.
As required by the ACPI Specification, the power button can always wake up the system
from the S1 or S4 state.
System BIOS Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
98
Additionally, if an ACPI operating system is loaded, the following can cause the system to wake:
the PME, RTC, or Wake-on-LAN*.
Table 47. Supported Wake Events
Wake Event Supported via ACPI (by sleep state) Supported
Via Legacy
Wake
Power Button Always wakes system. Always
wakes
system
Ring indicate from Serial A Wakes from S1 and S4. Yes
Ring indicate from Serial B Wakes from S1 and S4. If Serial-B (COM2) is used for
Emergency Management Port, Serial-B wakeup is
disabled.
Yes
PME from PCI cards Wakes from S1 and S4. Yes
RTC Alarm Wakes from S1. Always wakes the system up from S4. No
Mouse Wakes from S1. No
Keyboard Wakes from S1. No
USB Wakes from S1. No
Intel® Server Board SE7320VP2 Platform Management
Revision 2.1
Intel order number C91056-002 99
5. Platform Management
The platform management sub-system on the Server Board SE7320VP2 consists of a micro-
controller, communication buses, sensors, system BIOS, and server management firmware.
The On-Board Platform Instrumentation is based around the National Semiconductor*
PC87431M mini-Baseboard Management Controller (mBMC.
The following table summarizes the supported features for the On-board Platform
Instrumentation:
Table 48. On-Board Supported Management Features
Element On-Board Platform
Instrumentation
IPMI Messaging, Commands, and Abstractions Yes
Baseboard Management Controller (BMC) Yes
Sensors Limited
Sensor Data Records (SDRs) and SDR Repository Limited
FRU Information Limited
Autonomous Event Logging Yes
System Event Log (SEL) 92 Entries
BMC Watchdog Timer, covering BIOS and run-time software Limited
IPMI Channels, and Sessions Limited
EMP (Emergency Management Port) - IPMI Messaging over Serial/Modem. This feature is
also referred to as DPC (Direct Platform Control) over serial/modem. No
Serial/Modem Paging No
Serial/Modem Alerting over PPP using the Platform Event Trap (PET) format No
DPC (Direct Platform Control) - IPMI Messaging over LAN (available via both on-board
network controllers) Yes
LAN Alerting using PET Yes
Platform Event Filtering (PEF) Yes
ICMB (Intelligent Chassis Management Bus) - IPMI Messaging between chassis No
PCI SMBus support No
Fault Resilient Booting Limited
BIOS logging of POST progress and POST errors Errors Only
Integration with BIOS console redirection via IPMI v2.0 Serial Port Sharing No
Access via web browser No
SNMP access No
Telnet access No
DNS support No
DHCP support (dedicated NIC only) No
Memory Sparing/Mirroring sensor support No
Alerting via Email No
Keyboard, Video, Mouse (KVM) redirection via LAN No
High speed access to dedicated NIC No
Platform Management Intel® Server Board SE7320VP2
Revision 2.1
Intel order number C91056-002
100
This chapter will provide an overview of the On-board Platform Instrumentation architecture and
details of it features and functionality including BIOS interactions and support.
5.1 Platform Management Architecture Overview
CPU2
PC87427
SIO
Chassis
FANIN1
FANIN2
Security
LM 93
Tach1
Tach2
PWM1
PWM2
CPU1 Thermal Diode
CPU2Thermal Diode
P1_VID[5:0]
P2_VID[5:0]
+12V1
+12V2
+12V3
FSB_Vtt
Chipset_Core
ICH_Core
CPU1_Vccp
CPU2_Vccp
3.3V
+5V
SCSI_Core
Mem_Core
Mem_Vtt
GBIT _Core
-12V
+ 3 .3 S /B V c c
SCSI_term1
SCSI_term2
RTD (1)
RTD (2)
P12V_SCALED
P_VTT
P5V
P12V_CPU_SCALED
DDR Core
DDR Vtt
Gb LAN Core
VID_CPU0[5:0]
VID_CPU1[5:0]
P3V3_ STBY
P1V5
P3V3
P_VCCP0
P_VCCP1
P1V8_SCSI
N12V_SCALED
Zone2
Zone 1
Not Used
Not Used
SCSIB_TERMPWR
SCSIA_TERMPWR
Tach3
Tach4
SECURE_MODE_K
B
CHA SSIS INTRUS ION
1 W IRE Bus
LED PWR_LED
Front Panel Connector
SECURE_MODE_KB
FP_ID_BTN_
N
FP_ID_LED_N
FP_SYS_FLT_LED_A
FP_PWR_BTN
FP_RST_BTN
ICH_PWR_BTN
ICH_RST_BTN
FP_NMI_BTN
SYS_NMI
CPU2_SEL
CPU1_SEL
CPU_CFG_ERR_
N
FRB3_TMR_HALT_N
PS_PWR_GD
FP_SYS_FLT_LED_C
SYS_SMI
FANIN3
ProcHot
Therm Trip
CPU1
IE R R
CPU
Fan CPU
Fan Fan
Fan Fan
Fan
Me
m
Fan
Temp
PC87431
mBMC
Conf i g
Check Lo
g
ic
Intel® Server Board SE7320VP2 Platform Management
Revision 2.1
Intel order number C91056-002 101
5.1.1 5V Standby
The power supply must provide a 5V Standby power source for the platform to provide any
management functionality. 5V Standby is a low power 5V supply that is active whenever the
system is plugged into AC power. 5V Standby is used by the following onboard management
devices:
Management Controller (mBMC) and associated RAM, Flash, and SEEPROM which are
used to monitor the various system power control sources including the front panel
Power Button, the baseboard RTC alarm signal, and power on request messages from
the auxiliary IPMB connector and PCI SMBus.
On-board NICs that support IPMI-over-LAN and LAN Alerting, Wake-On LAN, and Magic
Packet* operation.
System Status LED on the front panel
System Identify LED
5.1.2 IPMI Messaging, Commands, and Abstractions
The IPMI specification defines a standardized, abstracted, message-based interface between
software and the platform management subsystem, and a common set of messages
(commands) for performing operations such as accessing temperature, voltage, and fan
sensors, setting thresholds, logging events, controlling a watchdog timer, etc.
IPMI includes a set of records called Sensor Data Records (SDRs) that make the platform
management subsystem self-descriptive to system management software. The SDRs include
software information such as how many sensors are present, what type they are and what
events they generate. The SDRs also include information such as minimum and maximum
ranges, sensor type, accuracy and tolerance, etc., that guides software in interpreting and
presenting sensor data.
Together, IPMI Messaging and the SDRs provide a self-descriptive, abstracted platform
interface that allows management software to automatically configure itself to the number and
types of platform management features on the system. In turn, this enables one piece of
management software to be used on multiple systems. Since the same IPMI messages are
used over the serial/modem and LAN interfaces, a software stack designed for in-band (local)
management access can readily be re-used as an out-of-band remote management stack by
changing the underlying communications layer for IPMI messaging.
5.1.3 IPMI ‘Sensor Model’
An IPMI-compatible ‘Sensor Model’ is used to unify the way that temperature, voltage, and other
platform management status and control is represented and accessed. The implementation of
this model is done according to command and data formats defined in the Intelligent Platform
Management Interface Specification.
The majority of monitored platform elements are accessed as logical Sensors under this model.
This access is accomplished using an abstracted, message-based interface (IPMI messages).
Instead of having system software access the platform monitoring and control hardware
registers directly, it sends commands, such as the Get Sensor Reading command, for sensor
Platform Management Intel® Server Board SE7320VP2
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Intel order number C91056-002
102
access. The message-based interface isolates software from the particular hardware
implementation.
System Management Software discovers the platform’s sensor capabilities by reading the
Sensor Data Records from a Sensor Data Record Repository managed by the management
controller. Sensor Data Records provide a list of the sensors, their characteristics, location,
type, and associated Sensor Number, for sensors in a particular system. The Sensor Data
Records also hold default threshold values (if the sensor has threshold based events), factors
for converting a sensor reading into the appropriate units (mV, rpm, degrees Celsius, etc.), and
information on the types of events that a sensor can generate.
Sensor Data Records also provide information on where Field Replaceable Unit (FRU)
information is located, and information to link sensors with the entity and/or FRU they’re
associated with.
Information in the SDRs is also used for configuring and restoring sensor thresholds and event
generation whenever the system powers up or is reset. This is accomplished via a process
called the ‘initialization agent’. The mBMC reads the SDRs and based on bit settings, writes the
threshold data. Then it enables event generation for the various sensors it.
System Management Software uses the data contained in the Sensor Data Record information
to locate sensors in order to poll them, interpret, and present their data readings, adjust
thresholds, interpret SEL entries, and alter event generation settings.
5.1.4 Management Controllers
At the heart of platform management is a management controller. The Server Board
SE7320VP2 supports the PC87431M mini-Baseboard Management Controller (mBMC) from
National Semiconductor.
The management controller is a microcontroller that provides the intelligence at the heart of the
Intelligent Platform Management architecture. The primary purpose of the management
controller is to autonomously monitor system sensors for system platform management events,
such as over-temperature, out-of-range voltages, etc., and log their occurrence in the non-
volatile System Event Log. This includes events such as over-temperature and over-voltage
conditions, fan failures, etc. The management controller also provides the interface to the
sensors and SEL so System Management Software can poll and retrieve the present status of
the platform. The contents of the log can be retrieved ‘post mortem’ to provide failure analysis
information to field service personnel. It is also accessible by System Management Software,
such as Intel® Server Management (ISM), running under the operating system.
The management controller includes the ability to generate a selectable action, such as a
system power-off or reset, when a match occurs to one of a configurable set of events. This
capability is called Platform Event Filtering, or PEF.
The management controller includes recovery control functions that allow local or remote
software to request actions such as power on/off, power cycle, and system hard resets, plus an
IPMI Watchdog Timer that can be used by BIOS and/or run-time management software as a
way to detect software hangs.
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The management controller provides ‘out-of-band’ remote management interfaces providing
access to the platform health, event log, and recovery control features via LAN. This interface
remains active on standby power, providing a mechanism where the SEL, SDR, and recovery
control features can be accessed even when the system is powered down.
Because the management controller operates independently from the main processor(s), the
management controller monitoring and logging functions, and the out-of-band interfaces can
remain operative even under failure conditions that cause the main processors, operating
system, or local system software to stop.
The management controller also provides the interface to the non-volatile Sensor Data Record
(SDR) repository. IPMI Sensor Data Records provide a set of information that system
management software can use to automatically configure itself for the number and type of IPMI
sensors (e.g. temperature sensors, voltage sensors, etc.) in the system. This information allows
management software to automatically adapt itself to the particular system, enabling the
development of management software that can work on multiple platforms without requiring the
software to be modified.
The following is a list of the major functions that are managed by the mBMC.
Sensors and Sensor Polling
FRU Information Access. FRU (Field Replaceable Unit) information is non-volatile
storage for serial number, part number, asset tag and other inventory information for the
baseboard and chassis. The FRU implementation on Server Board SE7320VP2 includes
write support for OEM-specific records.
Autonomous Event Logging. The management controller autonomously polls baseboard
sensors and generates IPMI Platform Events, also called Event Messages, when an
event condition is detected. The events are automatically logged to the System Event
Log (SEL).
System Event Log (SEL). Non-volatile storage for platform health events. Events can be
autonomously logged by the mBMC.
Sensor Data Record (SDR) Repository. Non-volatile storage holding records describing
the number and type of management sensors on the baseboard and in the chassis.
Includes write support for OEM-specific records and sensors.
SDR/SEL Timestamp Clock. A clock internally maintained by the management controller
that is used for time-stamping events and recording when SDR and SEL contents have
changed.
Watchdog Timer with selectable timeout actions (power off, power cycle, reset, or NMI)
and automatic logging of timeout event
Direct Platform Control (DPC) LAN Remote Management Connection
LAN Alerting via PET (Platform Event Trap) format SNMP trap
Platform Event Filtering (PEF)
SMBus IPMI-System Interface
Remote Boot Control
Local and Remote Power On/Off/Reset Control
Local and Remote Diagnostic Interrupt (NMI) Control
Fault-Resilient Booting
Control Panel LED Control
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Updateable mBMC Firmware
System Management Power Control (including providing Sleep/Wake and power push-
button interfaces)
Platform Event Filtering (PEF)
Baseboard Fan Speed Control and Failure Monitoring
Baseboard FRU Information interface
Diagnostic Interrupt (Control Panel NMI) Handling
Secure Mode Control: front panel lock/unlock initiation
5.2 On-Board Platform Management Features and Functionality
The National Semiconductor PC87431M mini-Baseboard Management Controller (mBMC) is an
Application Specific Integrated Circuit (ASIC) with a Reduced Instruction Set Computer (RISC)-
based processor and many peripheral devices embedded into it. It is targeted for a wide range
of remote-controlled platforms, such as servers, workstations, hubs, and printers.
The mBMC contains the logic needed for executing the firmware, controlling the system,
monitoring sensors, and communicating with other systems and devices via various external
interfaces.
The following figure illustrates the block diagram of the mBMC, as it is used in a server
management system. The external interface blocks to the mBMC are the discrete hardware
peripheral device interface modules shown as blocks outside of the mBMC ASIC.
Figure 13. mBMC in a Server Management System
SMBus
mBMC ASIC
Bus Interface
Unit GP I O Pins
SMBus Host
Interfaces
Flash Me m o ry
LAN on
Motherboard
(LOM) Interface
General purpose
Output and
Digital Input
Front Panel and
Power Stat
Signal
ChipSet
Processor
Interrupt PinsSMBusSensor devices
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5.2.1 Server Management I2C Buses
The table below describes the server management I2C bus assignments and lists the devices
that are connected to the indicated bus. The column labeled “I2C Bus ID” represents the
physical I2C bus connected to the mBMC. Only the Peripheral SMBus is available for use with
the Write-Read I2C IPMI command.
Table 49. Server Management I2C Bus ID Assignments
I2C Bus ID Bus Name Devices Connected
1 Host SMBus SMBus, PCI slots, 6300ESB ICH, mBMC, DIMM FRU
2 Peripheral SMBus
SMLink, 6300ESB ICH, mBMC, SIO 3, LM93, control panel,
PDB, Baseboard Temp Sensor, BMC FRU
4 Private Bus 4 – PB4 Network Interface Chipset
5.2.2 Power Control Interfaces
The mBMC is placed between the power button and the chipset so it can implement the Secure
Mode feature of disabling the power button, and add additional power control sources to the
system. In addition to the mandatory chassis controls, such as power-down and power-up, the
mBMC supports power cycle and pulse diagnostic interrupt.
The mBMC Chassis Control command supports the following power behavior.
Power down (0h – Chassis Control command): This option asserts a 4s override to the
chipset
Soft Shutdown (5h – Chassis Control command): This option generates a 200ms pulse
of the chipset power button
The following figure shows the data/control flow to and within the functional modules of the
mBMC. External interfaces, namely the host system, Lan-On-Motherboard (LOM), and
peripherals interact with the mBMC through the corresponding interface modules.
Power supply control functions and control panel control functions are built into the mBMC. The
mBMC communicates with the internal modules using its private SMBus. External devices and
sensors interact with the mBMC using the peripheral SMBus. LOM communicates through the
LOM SMBus.
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Figure 14. External Interfaces to mBMC
5.2.3 mBMC Hardware Architecture
The following figure shows an example of the internal functional modules of the mBMC in a
block diagram. The mBMC controls various server management functions, such as the system
power/reset control, a variety of types of sensor monitoring, system initialization, fault resilient
booting (FRB).
The memory subsystem consists of flash memory to hold the mBMC operation code, firmware
update code, System Event Log (SEL), Sensor Data Record (SDR) repository, and mBMC
persistent data.
A private SMBus provides the mBMC with access to various sensors located in the server
system.
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Figure 15. Typical mBMC Block Diagram
5.2.4 Power Supply Interface Signals
The mBMC supports two power supply control signals: Power On and Power Good. The Power
On signal connects to the chassis power subsystem through the chipset and is used to request
power state changes (asserted = request Power On). Power Good is a signal from the chassis
power subsystem indicating current power state (asserted = power is on).
The following figure shows the power supply control signals and their sources. To turn on the
system, the mBMC asserts the Power On signal and waits for the Power Good signal to assert
in response, indicating that DC power is on.
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Figure 16. Power Supply Control Signals
The mBMC uses the Power Good signal to monitor whether the power supply is on and
operational, and to confirm whether the actual system power state matches the intended system
on/off power state that was commanded with the Power On signal.
De-assertion of the Power Good signal generates an interrupt. The mBMC uses this to detect
either power subsystem failure or loss of AC power. If AC power is suddenly lost, the mBMC:
1. Immediately asserts a system reset.
2. Powers down the system.
3. Waits for configured system off time, then attempts to power the system back up,
depending on system power restore policy.
5.2.5 Power Control Sources
The sources listed in the following table can initiate power-up and/or power-down activity.
Table 50. Power Control Initiators
Source External Signal Name or
Internal Subsystem Capabilities
Power button Front control power button Turns power on or off
mBMC Watchdog Timer Internal mBMC timer Turns power off or power cycle
Platform Event Filtering PEF Turns power off or power cycle
Command Routed through command processor Turns power on or off, or power cycle
Power state retention Implemented via mBMC internal logic Turns power on when AC power returns
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5.2.6 Power-up Sequence
When turning on the system power after one of the event occurrences, the mBMC executes the
following procedure:
1. The mBMC asserts Power Supply (PS) Power On via the chipset and waits for the
power subsystem to assert Power Good. The system is reset.
2. The mBMC initializes all sensors to their Power On initialization states. The Init Agent is
run.
3. The mBMC attempts to boot the system by running the FRB algorithm, if FRB is
enabled.
5.2.7 Power-down Sequence
To power down the system, the mBMC effectively performs the sequence of power-up steps in
reverse order. It occurs as follows:
1. The mBMC asserts system reset.
2. The mBMC de-asserts the Power On signal via the chipset.
3. The power subsystem turns off system power upon de-assertion of the Power On signal.
5.2.8 System Reset Control
5.2.8.1 Reset Signal Output
The mBMC asserts the System Reset signal on the baseboard to perform a system reset. The
mBMC asserts the System Reset signal before powering the system up. After power is stable as
indicated by the power subsystem Power Good signal, the mBMC sets the processor enable
state as appropriate and de-asserts the System Reset signal, taking the system out of reset.
The system reset signal responds to the control panel or IPMI commands.
5.2.8.2 Reset Control Sources
The following table shows the reset sources and the actions taken by the system.
Table 51. System Reset Source s and Action s
Reset Source System Reset? mBMC Reset
Standby power comes up No (no DC power) Yes
DC power comes up Yes No
Reset button or in-target probe (ITP) reset Yes No
Warm boot (DOS ctrl-alt-del, for example) Yes No
Command to reset the system Yes No
Set Processor State command Yes No
Watchdog timer configured for reset Yes No
FRB3 failure Yes No
PEF action Optional No
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5.2.8.3 Control Panel System Reset
The reset button is a momentary contact button on the control panel. Its signal is routed through
the control panel connector to the mBMC, which monitors and de-bounces it. The signal must
be stable for at least 25 ms before a state change is recognized.
If Secure Mode is enabled or the button is forced protected, the reset button does not reset the
system. A Platform Security Violation Attempt event message is instead generated.
5.2.9 Control Panel User Interface
The mBMC acts as the control panel controller2, processing signals from the control panel
switches and LEDs.
The mBMC supports three control panel events.
Power button assertion
A low-level signal at PWBTIN indicates that the power button is being pressed. This
input is bridged to the PWBTOUT output if Control Panel Lockout is disabled. The
“Control Panel Power Button pressed” event is logged in the SEL.
Reset button assertion
A low-level signal at RSTIN indicates that the reset button is being pressed. This input is
bridged to the RSTOUT output if Control Panel Lockout is disabled. The “Control Panel
Reset Button pressed” event is logged in the SEL.
Combined power and reset button assertion
If DC power is off, an assertion of the PWBTIN while the RSTIN is asserted generates
an OEM-specific Control Panel event to PEF. The event attributes are: Sensor Type
code - 14h (Button) and Sensor Specific offset - 07h. This PEF action initiates a BIOS
CMOS clear request to the system BIOS.
The user interface of the control panel consists of the following indicators:
Power LED
Fault/Status LED
Chassis ID LED
For user input, the standard control panel can provide the following buttons/switches:
Reset button
Power button
NMI button
Chassis ID button
Chassis intrusion switch (optional)
2 The Intel® Local Control Panel with LCD, is not supported with on-board platform management (mBMC).
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5.2.9.1 Control Panel Indicators
The mBMC is capable of supporting three control panel indicators: Power LED, Fault/Status
LED, and Chassis ID LED. The states of these indicators and how they relate to the
mBMC/chassis state are detailed below.
5.2.9.1.1 Power LED
The BIOS controls the control panel Power LED as described in the table below.
Table 52. SSI Power LED Operation
State Power Mode LED Description
Power Off Non-ACPI OFF System power is off, and the BIOS has not initialized the chipset.
Power On Non-ACPI ON System power is on, but the BIOS has not yet initialized the chipset.
5.2.9.1.2 Fault / Status LED
The following table shows mapping of sensors/faults to the LED state.
Table 53. Fault / Status LED
Color Condition When
Solid System ready
Green Blink System ready, but degraded: CPU disabled (not supported with the Server Board
SE7320VP2)
Solid Critical failure: critical fan, voltage, or temperature state
Amber Blink Non-critical failure: non-critical fan, voltage, or temperature state
Off Solid System not ready: POST error / NMI event / CPU or terminator missing
Critical Condition - Any critical or non-recoverable threshold crossing associated with the
following events:
Temperature, voltage, or fan critical threshold crossing
Critical Event Logging errors, including System Memory Uncorrectable ECC errors and
FSB Bus errors
Non-Critical Condition
Temperature, voltage, or fan non-critical threshold crossing
Chassis intrusion
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Degraded Condition
One or more processors are disabled by Fault Resilient Boot (FRB) (not supported by
the Server Board SE7320VP2)
5.2.9.1.3 Chassis ID LED
The Chassis ID LED provides a visual indication of a system being serviced. The state of the
Chassis ID LED is toggled by the chassis ID button or it can be controlled by the Chassis
Identify command.
Table 54. Chassis ID LED
Color Condition When
Off Ok
Blue Blink Identify button pressed or Chassis Identify command executed
5.2.9.2 Control Panel Inputs
The mBMC monitors the control panel switches and other chassis signals. The control panel
input buttons are momentary contact switches, which are de-bounced by the mBMC processor
firmware. The de-bounce time is 25 ms.
5.2.9.2.1 Chassis Intrusion
Some platforms support chassis intrusion detection. On those platforms, the mBMC monitors
chassis intrusion by polling the server input/output (SIO) device. The state of the chassis
intrusion input is provided by the status register of the SIO device. A Chassis Intrusion event is
logged in the System Event Log when a change in the input state is detected.
5.2.9.2.2 Power Button
The Power Button signal toggles system power. The Power Button signal to the mBMC is
activated by a momentary contact switch on the control panel assembly.
The mBMC de-bounces the signal. After de-bouncing the signal, the mBMC routes it directly to
the chipset via the Power Button signal. If the chipset has been initialized by the BIOS, the
chipset responds to the assertion of the signal. It reacts to the press of the switch, not the
release of it.
If the system is in Secure Mode or if the Power Button is forced protected, then when the power
switch is pressed, a Platform Security Violation Attempt event message is generated. No power
control action is taken.
In the case of simultaneous button presses, the Power Button action takes priority over all other
buttons. Due to the routing of the de-bounced Power Button signal to the chipset, the power
signal action overrides the action of the other switch signals.
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5.2.9.2.3 Reset Button
An assertion of the control panel Reset signal to the mBMC causes the mBMC to start the reset
and reboot process. This is immediate and without the cooperation of any software or operating
system running on the system.
The reset button is a momentary contact button on the control panel. Its signal is routed through
the control panel connector to the mBMC, which monitors and de-bounces it.
If Secure Mode is enabled or if the button is forced protected, the reset button does not reset
the system, but instead a Platform Security Violation Attempt event message is generated.
5.2.9.2.4 Diagnostic Interrupt Button (Control Panel NMI)
As stated in the IPMI 1.5 Specification, a diagnostic interrupt is a non-maskable interrupt or
signal for generating diagnostic traces and ‘core dumps’ from the operating system. The mBMC
generates NMIs and can be used for an OEM-specific diagnostic control panel interface.
The diagnostic interrupt button is connected to the mBMC through the control panel connector.
A diagnostic interrupt button press causes the mBMC to generate a SEL entry that will trigger
an NMI PEF OEM action. The event attributes are: Sensor Type code - 13h (Critical Interrupt)
and Sensor Specific offset - 0h.
5.2.9.2.5 Chassis Identify Button
The chassis identify button on the control panel toggles the state of the Chassis ID LED. If the
Chassis ID LED is off, pressing this button causes the LED to blink for 15 seconds. After this
time, the LED will turn off. If the LED is on, a button press or IPMI Chassis Identify command
turns off the LED.
Upon assertion of the chassis identify button, a SEL event is generated by the chassis identity
sensor button. The event attributes are: Sensor Type code - 14h (Button) and Sensor Specific
offset - 1h.
5.2.9.3 Secure Mode Operation
The mBMC handles the secure mode feature, which allows the control panel power and reset
buttons to be protected against unauthorized use or access. Secure mode is a signal from the
keyboard controller and is asserted when the keyboard controller is in a locked state. Power
and reset buttons are locked and a security violation event is generated if these buttons are
pressed while secure mode is active.
Secure Mode state is cleared whenever the System is powered down, the Set Chassis
Capabilities command is issued to change the Secure Mode state, or the FP_LOCK signal is
de-asserted.
5.2.10 Baseboard Fan Control
Fan control is performed by two pulse width modulator (PWM) outputs on the LM93. The 3-pin
CPU fan headers (J5F2, J7F1) are not controlled. These operate at a constant speed. The
mBMC initializes the LM93 to control fan speeds based on temperature.
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The LM93 controls the actual fan speeds based on temperature measurements according to a
built-in table. The table itself is loaded as part of the SDR package according to which system
configuration is used. In addition, BIOS passes in certain temperature data to the LM93 during
POST.
5.2.11 mBMC Peripheral SMBus
The mBMC implements a single private SMBus called the peripheral SMBus. The mBMC
supports master-only mode for this SMBus. External agents must use the mBMC’s Master
Write/Read I2C command if they require direct communication with a device on this bus.
5.2.12 Watchdog Timer
The mBMC implements a fully IPMI 1.5 compatible watchdog timer. See the IPMI 1.5
specification for details on watchdog timer configuration.
5.2.13 System Event Log (SEL)
The mBMC implements the logical System Event Log device as specified in the Intelligent
Platform Management Interface Specification, Version 1.5. The SEL is accessible via all
channels. In this way, the SEL information can be accessed through out-of-band interfaces
while the system is down. The mBMC supports a maximum SEL size of 92 entries.
5.2.13.1 SEL Erasure
It can take up to one minute to clear a System Event Log based upon other concurrent mBMC
operations.
5.2.13.2 Timestamp Clock
The mBMC maintains a four-byte internal timestamp clock used by the SEL and SDR
subsystems. This clock is incremented once per second and is read and set using the Get SEL
Time and Set SEL Time commands, respectively. The Get SDR Time command can also be
used to read the timestamp clock. These commands are specified in the Intell igent Platform
Management Interface Specification, Version 1.5.
The mBMC SEL timestamp is initialized by the BIOS prior to booting to the operating system
using the IPMI command Set SEL Time.
After a mBMC reset, the mBMC sets the initial value of the timestamp clock to 0x00000000. It is
incremented once per second after that. A SEL event containing a timestamp from 0x00000000
to 0x140000000 has a timestamp value that is relative to mBMC initialization.
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During POST, the BIOS tells the mBMC the current real-time clock (RTC) time via the Set SEL
Time command. The mBMC maintains this time, incrementing it once per second, until the
mBMC is reset or until the time is changed via another Set SEL Time command.
System Management Software is responsible for keeping the mBMC and system time synchronized.
5.2.14 Sensor Data Record (SDR) Repository
The mBMC includes built-in Sensor Data Records (SDRs) that provide platform management
capabilities (sensor types, locations, event generation and access information). The SDR
Repository is stored in the non-volatile storage area (flash) of the mBMC. The SDR Repository
is accessible via all channels. This way, out-of-band interfaces can be used to access SDR
Repository information while the system is down. See Table 58 for additional sensor support.
The mBMC supports 2176 bytes of storage for SDR records The SDR defines the type of
sensor, thresholds, hysteresis values and event configuration. The mBMC supports up to six
threshold values for thre shol d-base d full sensor records, and up to 15 events for non thresho ld-
based full and compact sensor records. The mBMC supports both low-going and high-going sensor
devices.
5.2.14.1 Initialization Agent
The mBMC implements the internal sensor initialization agent functionality specified in the
Intelligent Platform Management Interface Specification, Version 1.5. When the mBMC is
initialized, or a system is rebooted, the initialization agent scans the SDR repository and
configures the mBMC sensors referenced by the SDRs. This includes setting sensor thresholds,
enabling/disabling sensor event message scanning, and enabling/disabling sensor event
messages.
5.2.15 Field Replaceable Unit (FRU) Inventory Devices
An enterprise-class system typically has FRU information for each major system board,
(processor board, memory board, I/O board, etc.). The FRU data includes information such as
serial number, part number, model, and asset tag. This information can be accessed in two
ways: through IPMI FRU commands or by using Master Write-Read commands.
The mBMC provides FRU device command access to its own FRU device. The mBMC
implements the interface for logical FRU inventory devices as specified in the Intelligent
Platform Management Interface Specification, Version 1.5. This functionality provides
commands used for accessing and managing the FRU inventory information associated with the
mBMC (FRU ID 0). These commands can be delivered over the Host and LAN channel
interfaces.
5.2.15.1 mBMC FRU Inventory Area Format
The mBMC FRU inventory area format follows the Platform Management FRU Information
Storage Definition. See the Platform Management FRU Information Storage Definition, Version
1.0 for details.
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The mBMC provides only low-level access to the FRU inventory area storage. It does not
validate or interpret the data that is written. This includes the common header area. Applications
cannot relocate or resize any FRU inventory areas.
5.2.16 NMI Generation
The mBMC-generated NMI pulse duration is 200 ms. The following may cause the mBMC to
generate an NMI pulse:
Receiving a Chassis Control command issued from one of the command interfaces. Use
of this command will not cause an event to be logged in the SEL.
Detecting that the control panel Diagnostic Interrupt button has been pressed. Use of
this command will cause a button event to be logged into the SEL Type code - 13h
(Critical Interrupt), Sensor Specific offset – 6Fh
A PEF table entry matching an event where the filter entry has the NMI action indicated.
Watchdog timer pre-timeout expiration with NMI pre-timeout action enabled.
Once an NMI has been generated by the mBMC, the mBMC will not generate another until the
system has been reset or powered down.
5.2.17 SMI Generation
The mBMC can be configured to generate an SMI due to Watchdog timer pre-timeout expiration
with SMI pre-timeout interrupt specified.
5.2.18 Event Message Reception
The mBMC supports externally (e.g., BIOS) generated events via the Platform Event Message
command. Events received via this command will be logged to the SEL and processed by PEF.
5.2.19 mBMC Self Test
The mBMC performs various tests as part of its initialization. If a failure is determined (e.g.,
corrupt mBMC FRU, SDR, or SEL), the mBMC stores the error internally.
5.2.20 Messaging Interfaces
This section describes the supported mBMC communication interfaces:
Host SMS Interface via SMBus interface
LAN interface using the LOM SMBus
These specifications are defined in the following subsections.
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5.2.20.1 Channel Management
The mBMC supports two channels:
System interface
802.3 LAN
Table 55. Suported Channel Assignments
Channel ID Media Type Interface Supports Sessions
1 802.3 LAN IPMB 1.0 Multi-sessions
2 System Interface IPMI-SMBus Session-less
5.2.20.2 User Model
The mBMC supports one anonymous user (null user name) with a settable password. The IPMI
Set User Password command is supported.
5.2.20.3 Request/Response Protocol
All of the protocols used in the above mentioned interfaces are Request/Response protocols. A
Request Message is issued to an intelligent device, to which the device responds with a
Response Message.
As an example, with respect to the IPMB interface, both Request Messages and Response
Messages are transmitted on the bus using SMBus Master Write transfers. In other words, a
Request Message is issued from an intelligent device acting as an SMBus master, and is
received by an intelligent device as an SMBus slave. The corresponding Response Message is
issued from the responding intelligent device as an SMBus master, and is received by the
request originator as an SMBus slave.
5.2.20.4 Host to mBMC Communication Interface
The host communicates with the mBMC via the System Management Bus (SMBus). The
interface consists of three signals:
SMBus clock signal (SCLH)
SMBus data signal (SDAH)
Optional SMBus alert signal (SMBAH). The signal notifies the host that the PC87431x
has data to provide.
When the system main power is off (PWRGD signal is low), the host interface signals are in
TRI-STATE to perform “passive” bus isolation between the mBMC SCLH, SDAH and SMBAH
signals and the SMBus controller signals. The passive bus isolation can be disabled by host
SMBus isolation control (offset 05h;) to support various system designs.
The mBMC is a slave device on the bus. The host interface is designed to support polled
operations. Host applications can optionally handle an SMBus alert interrupt, in case the mBMC
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is unable to respond immediately to a host request. In this case, “Not Ready” is indicated in one
of two ways:
The host interface bandwidth is limited by the bus clock and mBMC latency. To meet the
device latency, the mBMC slows the bus periodically by extending the SMBus clock low
interval (SCLH). It is recommended to have a point-to-point connection between the host
and mBMC.
If the mBMC is in the middle of a LAN or peripheral device communication, or if a
response to the host request is not yet ready, the mBMC does not acknowledge the
device address (“NACK”). This forces the host software to stop and restart the session.
The minimum interval between two sessions should be 500 microseconds.
5.2.20.5 LAN Interface
The IPMI Specification v1.5 defines how IPMI messages, encapsulated in RMCP packet format,
can be sent to and from the mBMC. This capability allows a remote console application to
access the mBMC and perform the following operations:
Chassis Control, e.g., get chassis status, reset chassis, power-up chassis, power-down
chassis
Get system sensor status
Get and set system boot options
Get Field Replaceable Unit (FRU) information
Get System Event Log (SEL) entries
Get Sensor Data Records (SDR)
Set Platform Event Filtering (PEF)
Set LAN configurations
In addition, the mBMC supports LAN alerting in the form of SNMP traps that conform to the IPMI
Platform Event Trap (PET) format.
Table 56. LAN Channel Capacity
LAN Channel Capability Options
Number of Sessions 1
Number of Users 1
User Name NULL (anonymous)
User Password Configurable
Privilege Levels User, Operator, Administrator
Authentication Types None, Straight Password, MD5
Number of LAN Alert Destinations 1
Address Resolution Protocol (ARP) Gratuitous ARP
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5.2.21 Event Filtering and Alerting
The mBMC implements most of the IPMI 1.5 alerting features. The following features are supported:
PEF
Alert over LAN
5.2.21.1 Platform Event Filtering (PEF)
The mBMC monitors platform health and logs failure events into the SEL. The Platform Event
Filtering (PEF) feature provides a configurable mechanism to allow events to trigger alert
actions. PEF provides a flexible, general mechanism that enables the mBMC to perform
selectable actions triggered by a configurable set of platform events. The mBMC supports the
following IPMI PEF actions:
Power-down
Soft-shutdown (pulse ACPI power button signal)
Power cycle
Reset
Diagnostic Interrupt
Alert
In addition, the mBMC supports the following OEM actions:
Fault LED action
Identification LED action
Device feedback (Generate specified transaction on peripheral SMBus, or change level
of DEIO pins)
The power-down, soft-shutdown, power cycle and reset actions can be delayed by a specified
number of 100ms up to the maximum PEF delay defined in the IPMI 1.5 specification.
The mBMC maintains an Event Filter table with 30 entries that are used to select which actions
to perform and one fixed/read-only Alert Policy Table entry. No alert strings are supported.
Note: All Fault/Status LED and ID LED behaviors are driven off of PEF. PEF should not be
disabled and the default entry configuration should not be modified or else those behaviors will
be changed.
Each time the PEF module receives an event message, either externally or internally generated,
it compares the event data against the entries in the Event Filter table. The mBMC scans all
entries in the table and determines a set of actions to be performed according to the entries that
were matched. Actions are then executed in order of priority. If there is a combination of power
down, power cycle, and/or reset actions, the actions are performed according to PEF Action
Priorities.
Note: An action that has changed from delayed to non-delayed, or an action whose delay time
has been reduced automatically has higher priority. The mBMC can be configured to log PEF
actions as SEL events.
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Table 57. PEF Action Priorities
Action Priority Delayed Type Note
Power-Down 1 Yes PEF Action
Soft-shutdown 2 Yes OEM PEF Action Not executed if a power-down action was
also selected
Power cycle 3 Yes PEF Action Not executed if a power-down action was
also selected
Reset 4 Yes PEF Action Not executed if a power-down action was
also selected
Diagnostic Interrupt 5 No PEF Action Not executed if a power-down action was
also selected
PET Alert 6 No PEF Action When selected, always occurs immediately
after detection of a critical event.
Sensor feedback 7 No OEM PEF Action When selected, always occurs immediately
after detection of a critical event.
IPMB message event 8 No OEM PEF Action When selected, always occurs immediately
after detection of a critical event.
Fault LED action 9 No OEM PEF Action When selected, always occurs immediately
after detection of a critical event, and is
stopped after the de-assertion of all critical
events that requested LED blinking.
Identification LED action 10 No OEM PEF Action When selected, always occurs immediately
after detection of a critical event.
5.2.21.2 Alert over LAN
LAN alerts are sent as SNMP traps in ASF formatted Platform Event Traps (PET) to a specified
alert destination. The Alert over LAN feature is used to send either PET alerts or directed events
to a remote system management application, regardless of the state of the host’s operating
system.
LAN alerts may be sent over any of the LAN channels supported by a platform. LAN alerts can
be used by PEF to send out alerts to selected destination whenever an event matches an event
filter table entry. For more information on LAN alerts, see the IPMI specifications v1.5
5.2.22 mBMC Sensor Support
The following tables are for the built-in and the external sensors for the platform. There is a
management controller locator record as a built-in SDR besides the given below.
mBMC sensors 01h – 08h are internal sensors to the mBMC and are used for event generation
only. These sensors are not for use with the ‘Get Sensor Reading’ IPMI command and may
return an error when read.
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Table 58. Platform Sensors for On-Board Platform Instrumentation
Sensor Name Sensor
# Event Offset Triggers Readable Value /
Offsets EventData
Physical Security Violation 01 LAN Leash Lost LAN Leash Lost Trig Offset
Platform Security Violation 02 Out-of-band access password
violation
– Trig Offset
Power Unit Status 03 Power On/Off
Power cycle
AC Lost
– Trig Offset
Button 04h Power Button
Reset Button
– Trig Offset
Watchdog 05h Timer Expired
Hard Reset
Power Down
Power cycle
Timer Interrupt
– Trig Offset
System Boot 06h Initiated by power up
Initiated by hard reset
Initiated by warm reset
– Trig Offset
System PEF Event 07h PEF Action – Trig Offset
Platform Alert 08h Platform Event Trap generated – Trig Offset
Sensor Name Sensor # PEF Ac tion
Physical Security Violation 09h –
CPU1 12v 0Ah Fault LED Action
CPU2 12v 0Bh Fault LED Action
BB +1.5V 0Ch Fault LED Action
BB +3.3V 0Dh Fault LED Action
BB +5V 0Eh Fault LED Action
BB +12V 0Fh Fault LED Action
BB -12V 10h Fault LED Action
FSB Vtt 11h Fault LED Action
Mem Core(+2.5v) 12h Fault LED Action
GBit Core 13h Fault LED Action
BB +3.3V Aux 14h Fault LED Action
Processor1 VCCP 15h Fault LED Action
Processor2 VCCP 16h Fault LED Action
BB Temp 17h Fault LED Action
Processor1 Core Temp 18h Fault LED Action
Processor2 Core Temp 19h Fault LED Action
Tach Fan 1 1Ah Fault LED Action
Tach Fan 2 1Bh Fault LED Action
Tach Fan 3 1Ch Fault LED Action
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Sensor Name Sensor # PEF Ac tion
Tach Fan 4 1Dh Fault LED Action
Tach Fan 5 1Eh Fault LED Action
Tach Fan 6 1Fh Fault LED Action
Tach Fan 7 20h Fault LED Action
Tach Fan 8 21h Fault LED Action
Tach Fan 9 22h Fault LED Action
Processor1 Fan 23h Fault LED Action
Processor2 Fan 24h Fault LED Action
Processor1 IERR 25h –
Processor2 IERR 26h –
Processor1 Thermal trip 27h Fault LED Action
Processor2 Thermal trip 28h Fault LED Action
Diagnostic Interrupt Button 29h NMI Pulse
Chassis Identify Button 2Ah ID LED Action
Processor1 Thermal Control 2Bh Fault LED Action
Processor2 Thermal Control 2Ch Fault LED Action
5.3 Console Redirection
The BIOS supports Console Redirection. The BIOS supports redirection of both video and
keyboard via a serial link (Serial A or Serial B). When console redirection is enabled, the local
(host server) keyboard input and video output are passed both to the local keyboard and video
connections, as well as to the remote console via the serial link. Keyboard inputs from both
sources are valid and video is displayed to both outputs. As an option, the system can be
operated without a keyboard or monitor attached to the host system and can run entirely from
the remote console. Setup and any other text-based utilities can be accessed through console
redirection.
The BIOS maps the setup values for Serial console redirection to the ACPI Serial Port Console
Redirection tables. BIOS Console Redirection terminates before giving control to an operating
system. The operating system is responsible for continuing the Console Redirection after that
point. BIOS console redirection is a text-based console and any graphical data, such as a logo,
is not redirected.
BIOS Console Redirection is intended to accomplish the implementation of VT-UTF8 console
redirection support in Intel® server BIOS products. That implementation will meet the functional
requirements set forth in the Microsoft Whistler WHQL requirements for headless operation of
servers, as well as maintain a necessary degree of backward compatibility with existing Intel
server BIOS products, and meet the architectural requirements of Intel server products currently
in development.
The server BIOS has a “console” that is intended to interact with a display and keyboard
combination. The BIOS displays data in the form of BIOS Setup screens, Boot Manager
screens, Power On Self Test (POST) informational messages and hotkey/escape sequence
action requests.
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5.4 Wired For Management (WFM)
Wired for Management (WMF) is an industry-wide initiative that increases the overall
manageability and reduces the total cost of ownership. WFM allows a server to be managed
over a network. The system BIOS supports the SMBIOS to help higher-level instrumentation
software meet the WFM requirements. Higher-level software can use the information provided
by SMBIOS to instrument the desktop management interface (DMI) that are specified in the
WFM specification.
5.5 Vital Product Data (VPD)
Vital Product Data (VDP) is product-specific data used for product and product component
identification. It is stored in non-volatile memory and preserved through power cycles. The VPD
contains information such as Product Serial Number, Product Model Number, Manufacturer
Identification, etc.
The VPD is programmed during manufacturing. A user can update certain user-specific VPD
information by using the Flash Update utility. The BIOS uses this data and displays it in
SMBIOS structures and in BIOS Setup.
5.6 PXE BIOS Support
The BIOS will support PXE-compliant implementations that:
Locate and configure all PXE-capable boot devices (UNDI Option ROMs) in the system,
both built-in and add-ins.
Supply a PXE according to the specification if the system includes a built-in network
device.
Meet the following specifications: System Management BIOS (SMBIOS) Reference
Specification v2.2 or later. The requirements defined in Sections 3 and 4 of the BIOS
Boot Specification (BBS) v1.01or later, to support network adapters as boot devices.
Also, supply a valid UUID and Wake-up Source value for the system via the SMBIOS
structure table.
5.7 System Management BIOS (SMBIOS)
The BIOS provides support for the SMBIOS specification to create a standardized interface for
manageable attributes that are expected to be supported by DMI-enabled computer systems.
The BIOS provides this interface via data structures through which the system attributes are
reported. Using SMBIOS, a system administrator can obtain the types, capabilities, operational
status, installation date and other information about the system components.
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6. Error Reporting and Handling
This section defines how errors are handled. Also discussed is the role of the BIOS in error
handling and the interaction between the BIOS, platform hardware, and server management
firmware with regard to error handling. In addition, error-logging techniques are described and
beep codes and POST messages are defined.
6.1 Fault Resilient Booting (FRB)
Fault Resilient Booting (FRB) is a set of BIOS and BMC algorithms and hardware support that
allow a multiprocessor system to boot in case of failure of the bootstrap processor (BSP) under
certain conditions.
With on-board platform instrumentation, should a processor failure be detected during POST,
the mBMC does not have the ability to disable the failed or failing processor. Therefore the
system may or may not continue to boot. An FRB-2 error will be logged in the System Event Log
(SEL) and an error will be displayed at POST. FRB2 is a BIOS-based algorithm that uses the
mBMC IPMI watchdog timer to protect against BIOS hangs during the POST process
6.1.1 FRB1 – BSP Self-Test Failures
The BIOS provides an FRB1 timer. Early in POST, the BIOS checks the Built-in Self Test (BIST)
results of the BSP. If the BSP fails BIST, the BIOS will notify the user that the BIST failed; no
processors will be disabled.
The BIST failure is displayed during POST and an error is logged to the SEL.
6.1.2 FRB2 – BSP POST Failures
A second timer (FRB2) is set to several minutes by BIOS and is designed to guarantee that the
system completes POST. The FRB2 timer is enabled just before the FRB3 timer is disabled to
prevent any “unprotected” window of time. Near the end of POST, the BIOS disables the FRB2
timer. If the system contains more than 1 GB of memory and the user chooses to test every
DWORD of memory, the watchdog timer is extended before the extended memory test starts,
because the memory test can exceed the timer duration. The BIOS will also disable the
watchdog timer before prompting the user for a boot password. If the system hangs during
POST, before the BIOS disables the FRB2 timer, the appropriate event will be logged in the
System Event Log (SEL), and displayed to the user.
The BIOS provides options to control the policy applied to FRB2 failures. These options are not
supported by the Server Board SE7320VP2, and mBMC does not support the option to disable
the BSP.
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6.1.3 FRB3 – BSP Reset Failures
The BIOS and firmware provide a feature to guarantee that the system boots, even if one or
more processors fail during POST. The mBMC contains one watchdog timer that can be
configured to reset the system upon time-out. The first timer (FRB3) starts counting down
whenever the system comes out of hard reset. If the BSP successfully resets and begins
executing, the BIOS disables the FRB-3 timer in the mBMC and the system continues executing
POST.
If the timer expires because of the BSP’s failure to fetch or execute BIOS code, the mBMC
resets the system, changes the bootstrap processor, and the tries again to execute the BIOS
code and disable the FRB3 timer. It will continue to cycle until it finds a good processor. The
process of cycling through all the processors is repeated upon system reset or power cycle. Soft
resets do not affect the FRB3 timer. The duration of the FRB3 timer is set by system firmware.
The mBMC generates beep codes on the system speaker if it fails to find a good processor. The
mBMC supports the algorithm described above, but does not disable the processor and the
failure will be logged as an FRB2 failure.
6.1.4 OS Watchdog Timer - Operating System Load Failures
The OS Watchdog Timer feature is designed to allow watchdog timer protection of the operating
system load process. This is done in conjunction with an operating system-present device driver
or application that will disable the watchdog timer once the operating system has successfully
loaded. If the operating system load process fails, the mBMC will reset the system.
The BIOS shall disable the OS Watchdog Timer before handing control to the OS Loader if it is
determined to be booting from removable media or the BIOS cannot determine the media type.
If the BIOS is going to boot to a known hard drive, it will read a user option for the OS Watchdog
Timer for HDD Boots. If this is disabled, the BIOS will ensure the watchdog timer is disabled and
boot. Otherwise the BIOS will read the enabled time value from the option and set the OS
Watchdog timer for that value (5, 10, 15, or 20 minutes) before trying to load the operating
system. If the OS Watchdog Timer is enabled, the timer is repurposed as an OS Watchdog
timer and is referred to by that title as well. WARNING: The BIOS may incorrectly determine that
a removable media is a hard drive if the media emulates a hard drive. In this case, the OS
Watchdog timer will not be automatically disabled.
If the BIOS is going to boot to a known PXE-compliant device, then the BIOS reads a user
option for OS Watchdog Timer for PXE Boots and either disables the timer or enables the timer
with a value read from the option (5, 10, 15, or 20 minutes). If the OS Watchdog Timer is
enabled, the timer is repurposed as an OS Watchdog Timer and is referred to by that title as
well.
If the OS Watchdog Timer is enabled and if a boot password is enabled, the BIOS will disable
the OS Watchdog Timer before prompting the user for a boot password regardless of the OS
Watchdog Timer option setting. Also, if the user has chosen to enter BIOS setup, the timer will
be disabled regardless of option settings. The mBMC retains status bits that can be read by the
BIOS later in the POST for the purpose of logging the appropriate event into the SEL, and
displaying an appropriate error message to the user. As the timer may be repurposed, the BIOS
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and BMC will also keep track of which timer expired (early FRB2, late FRB2, or OS Watchdog)
and display the appropriate error message to the user.
All of the user options are intended to allow a system administrator to set up a system such that
during a normal boot no gap exists during POST that is not covered by the watchdog timer.
Options are provided by the BIOS to control the policy applied to OS Watchdog timer failures.
By default, an OS Watchdog Timer failure will not cause any action. Other options provided by
the BIOS are for the system to reset or power off watchdog timer failure.
6.1.5 Treatment of Failed Processors
All the failures (FRB3, FRB2, and FRB1), including the failing processor, are recorded into the
system event log (SEL). The FRB-3 failure is recorded automatically by the mBMC while the
FRB2, and FRB1 failures are logged to the SEL by the BIOS. In the case of an FRB2 failure,
some systems will log additional information into the OEM data byte fields of the SEL entry. This
additional data indicates the last POST task that was executed before the FRB2 timer expired.
This information may be useful for failure analysis.
6.2 Memory Error Handling
The chipset will detect and correct single-bit errors and will detect all double-bit memory errors.
The chipset supports 4-bit single device data correction (SDDC) when in dual channel mode.
Both single-bit and double-bit memory errors are reported to baseboard management by the
BIOS, which handles SMI events generated by the MCH.
Memory Error Handling can be enabled or disabled in system BIOS Setup.
6.2.1 Memory Error Handling in RAS Mode
The MCH supports the Sparing memory RAS mode. Use BIOS Setup to configure the memory
RAS mode.
The following table shows memory error handling with the mBMC.
Table 59. Memory Error Handling mBMC
Memory with RAS mode Server Board SE7320VP2
Sparing mode When sparing occurs:
- The BIOS will not report memory RAS configuration to mBMC.
- The BIOS will light the faulty DIMM LED.
DIMMs that go offline during operating system runtime will be
back online on the next system reboot without user intervention.
Sparing states are not sticky across system reset.
Note: The BIOS does not support the Memory Data Scrubber Error.
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6.2.2 Memory Error Handling in non-RAS Mode
If the memory RAS feature is not enabled in BIOS Setup, the BIOS will apply the “10 SBE errors
in one hour” implementation (memory error logging will be disabled if (10) SBE’s occur in one
hour). Enabling this implementation and RAS feature are mutually-exclusive and automatically
handled by system BIOS.
In non-RAS mode, BIOS maintains a counter for Single Bit ECC (SBE) errors. If ten SBE errors
occur within an hour, BIOS will disable SBE detection in the chipset to prevent the System
Event Log (SEL) from being filled up, and the operating system from being halted.
In non-RAS mode, BIOS will assert a Non-Maskable-Interrupt (NMI) on the first double-bit ECC
(DBE) error.
Table 60. Memory Error Handling in Non-RAS mode
Non-RAS mode Server Board SE7320VP2
Single Bit ECC (SBE) errors SBE error events will not be logged.
On the 10th SBE error, BIOS will:
- Disable SBE detection in chipset.
- Light the faulty DIMM LED.
Double Bit ECC (DBE) errors On the 1st DBE error, BIOS will:
- Log DBE record to the SEL.
- Light the faulty DIMM LED.
- Generate NMI.
6.2.3 DIMM Enabling
Setting the “Memory Retest” option to “Enabled” in BIOS Setup will bring all DIMM(s) back on
line regardless of current states. After replacing faulty DIMM(s), the “Memory Retest” option
must be set to “Enabled”.
Note: This step is not required if faulty DIMM(s) is not taken off-line.
6.2.4 Single-bit ECC Error Throttling Prevention
The system detects, corrects, and logs correctable errors. As long as these errors occur
infrequently, the system should continue to operate without a problem.
Occasionally, correctable errors are caused by a persistent failure of a single component. For
example, a broken data line on a DIMM would exhibit repeated errors until replaced. Although
these errors are correctable, continual calls to the error logger can throttle the system,
preventing any further useful work.
For this reason, the system counts certain types of correctable errors and disables reporting if
they occur too frequently. Correction remains enabled but calls to the error handler are
disabled. This allows the system to continue running, despite a persistent correctable failure.
The BIOS adds an entry to the event log to indicate that logging for that type of error has been
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disabled. Such an entry indicates a serious hardware problem that must be repaired at the
earliest possible time.
The system BIOS implements this feature for two types of errors, correctable memory errors
and correctable bus errors. If ten errors occur in a single wall-clock hour, the corresponding
error handler disables further reporting of that type of error. A unique counter is used for each
type of error; i.e., an overrun of memory errors does not affect bus error reporting.
The BIOS re-enables logging and SMIs the next time the system is rebooted.
6.3 Error Logging
This section defines how errors are handled by the system BIOS. Also discussed is the role of
the BIOS in error handling and the interaction between the BIOS, platform hardware, and server
management firmware with regard to error handling. In addition, error-logging techniques are
described and beep codes for errors are defined.
One of the major requirements of server management is to correctly and consistently handle
system errors. System error sources can be categorized as follows:
PCI bus
Memory multi-bit errors (single-bit errors are not logged)
Sensors
Processor internal errors, bus/address errors, thermal trip errors, temperatures and
voltages, and GTL voltage levels
Errors detected during POST, logged as POST errors
Sensors are managed by the mBMC. The mBMC is capable of receiving event messages from
individual sensors and logging system events
6.3.1 SMI Handler
The SMI handler handles and logs system-level events that are not visible to the server
management firmware. If SEL error logging is disabled in the BIOS Setup utility, no SMI signals
are generated on system errors. If error logging is enabled, the SMI handler preprocesses all
system errors, even those that are normally considered to generate an NMI.
The SMI handler sends a command to the mBMC to log the event and provides the data to be
logged. For example, The BIOS programs the hardware to generate an SMI on a single-bit
memory error and logs the location of the failed DIMM in the system event log.
6.3.1.1 PCI Bus Error
The PCI bus defines two error pins, PERR# and SERR#, for reporting PCI parity errors and
system errors, respectively. The BIOS can be instructed to enable or disable reporting the
PERR# and SERR# through NMI. Disabling NMI for PERR# and/or SERR# also disables
logging of the corresponding event. In the case of PERR#, the PCI bus master has the option to
retry the offending transaction, or to report it using SERR#. All other PCI-related errors are
reported by SERR#. All the PCI-to-PCI bridges are configured so that they generate a SERR#
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on the primary interface whenever there is a SERR# on the secondary side, if SERR# has been
enabled through Setup. The same is true for PERR#.
6.3.1.2 Processor Bus Error
If the chipset supports ECC on the processor bus then the BIOS enables the error correction
and detection capabilities of the processors by setting appropriate bits in the processor model
specific register (MSR) and appropriate bits inside the chipset.
In the case of irrecoverable errors on the host processor bus, proper execution of the
asynchronous error handler (usually SMI) cannot be guaranteed and the handler cannot be
relied upon to log such conditions. The handler will record the error to the SEL only if the
system has not experienced a catastrophic failure that compromises the integrity of the handler.
6.3.1.3 Memory Bus Error
The hardware is programmed to generate an SMI on single-bit data errors in the memory array
if ECC memory is installed. The SMI handler records the error and the DIMM location to the
system event log. Double-bit errors in the memory array are mapped to the SMI because the
mBMC cannot determine the location of the bad DIMM. The double-bit errors may have
corrupted the contents of SMRAM. The SMI handler will log the failing DIMM number to the
mBMC if the SMRAM contents are still valid. The ability to isolate the failure down to a single
DIMM may not be available on certain platforms, and/or during early POST.
6.3.1.4 System Limit Error
The mBMC monitors system operational limits. It manages the A/D converter, defining voltage
and temperature limits as well as fan sensors and chassis intrusion. Any sensor values outside
of specified limits are fully handled by the mBMC. The BIOS does not generate an SMI to the
host processor for these types of system events.
6.3.1.5 Processor Failure
The BIOS detects any processor BIST failures and logs the event. The failed processor can be
identified by the first OEM data byte field in the log. For example, if processor 0 fails, the first
OEM data byte will be 0. The BIOS depends upon the mBMC to log the watchdog timer reset
event.
If an operating system device driver is using the watchdog timer to detect software or hardware
failures and that timer expires, an Asynchronous Reset (ASR) is generated, which is equivalent
to a hard reset. The POST portion of the BIOS can query the BMC for a watchdog reset event
as the system reboots, and then log this event in the SEL.
6.3.1.6 Boot Event
The BIOS downloads the system date and time to the mBMC during POST and logs a boot
event. This record does not indicate an error, and software that parses the event log should
treat it as such.
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6.4 Error Messages and Error Codes
The BIOS indicates the current testing phase during POST by writing a hex code to I/O location
80h. If errors are encountered, error messages or codes will either be displayed to the video
screen, or if an error has occurred prior to video initialization, errors will be reported through a
series of audio beep codes.
6.4.1 POST Error Messages
Table 61. Memory BIOS Messages
Message
Disp layed Description
Gate20 Error The BIOS is unable to properly control the server board’s Gate A20 function, which controls access
of memory over 1 MB. This may indicate a problem with the server board.
Multi-Bit ECC
Error
This message will only occur on systems using ECC enabled memory modules. ECC memory has
the ability to correct single-bit errors that may occur from faulty memory modules.
A multiple bit corruption of memory has occurred, and the ECC memory algorithm cannot correct it.
This may indicate a defective memory module.
Parity Error Fatal Memory Parity Error. System halts after displaying this message.
Table 62. Boot BIOS Messages
Message Displayed Description
Boot Failure ... This is a generic message indicating the BIOS could not boot from a particular
device. This message is usually followed by other information concerning the
device.
Invalid Boot Diskette A diskette was found in the drive, but it is not configured as a bootable diskette.
Drive Not Ready The BIOS was unable to access the drive because it indicated it was not ready
for data transfer. This is often reported by drives when no media is present.
A: Drive Error The BIOS attempted to configure the A: drive during POST, but was unable to
properly configure the device. This may be due to a bad cable or faulty diskette
drive.
B: Drive Error The BIOS attempted to configure the B: drive during POST, but was unable to
properly configure the device. This may be due to a bad cable or faulty diskette
drive.
Insert BOOT diskette in A: The BIOS attempted to boot from the A: drive, but could not find a proper boot
diskette.
Reboot and Select proper Boot
device or Insert Boot Media in
selected Boot device
BIOS could not find a bootable device in the system and/or removable media
drive does not contain media.
NO ROM BASIC This message occurs on some systems when no bootable device can be
detected.
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Table 63. Storage Device BIOS Messages
Message Displayed Description
Primary Master Hard Disk Error The IDE/ATAPI device configured as Primary Master could not be properly
initialized by the BIOS. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
Primary Slave Hard Disk Error The IDE/ATAPI device configured as Primary Slave could not be properly
initialized by the BIOS. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
Secondary Master Hard Disk Error The IDE/ATAPI device configured as Secondary Master could not be properly
initialized by the BIOS. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
Secondary Slave Hard Disk Error The IDE/ATAPI device configured as Secondary Slave could not be properly
initialized by the BIOS. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
3rd Master Hard Disk Error The IDE/ATAPI device configured as Master in the 3rd IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
3rd Slave Hard Disk Error The IDE/ATAPI device configured as Slave in the 3rd IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
4th Master Hard Disk Error The IDE/ATAPI device configured as Master in the 4th IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
4th Slave Hard Disk Error The IDE/ATAPI device configured as Slave in the 4th IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
5th Master Hard Disk Error The IDE/ATAPI device configured as Master in the 5th IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
5th Slave Hard Disk Error The IDE/ATAPI device configured as Slave in the 5th IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
6th Master Hard Disk Error The IDE/ATAPI device configured as Master in the 6th IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
6th Slave Hard Disk Error The IDE/ATAPI device configured as Slave in the 6th IDE controller could not
be properly initialized by the BIOS. This message is typically displayed when
the BIOS is trying to detect and configure IDE/ATAPI devices in POST.
Primary Master Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Primary Master failed an ATAPI
compatibility test. This message is typically displayed when the BIOS is trying
to detect and configure IDE/ATAPI devices in POST.
Primary Slave Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Primary Slave failed an ATAPI
compatibility test. This message is typically displayed when the BIOS is trying
to detect and configure IDE/ATAPI devices in POST.
Secondary Master Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Secondary Master failed an ATAPI
compatibility test. This message is typically displayed when the BIOS is trying
to detect and configure IDE/ATAPI devices in POST.
Secondary Slave Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Secondary Slave failed an ATAPI
compatibility test. This message is typically displayed when the BIOS is trying
to detect and configure IDE/ATAPI devices in POST.
3rd Master Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Master in the 3rd IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
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Message Displayed Description
3rd Slave Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Slave in the 3rd IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
4th Master Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Master in the 4th IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
4th Slave Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Slave in the 4th IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
5th Master Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Master in the 5th IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
5th Slave Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Slave in the 5th IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
6th Master Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Master in the 6th IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
6th Slave Drive - ATAPI
Incompatible
The IDE/ATAPI device configured as Slave in the 6th IDE controller failed an
ATAPI compatibility test. This message is typically displayed when the BIOS is
trying to detect and configure IDE/ATAPI devices in POST.
S.M.A.R.T. Capable but Command
Failed
The BIOS tried to send a S.M.A.R.T. message to a hard disk, but the command
transaction failed.
This message can be reported by an ATAPI device using the S.M.A.R.T. error
reporting standard. S.M.A.R.T. failure messages may indicate the need to
replace the hard disk.
S.M.A.R.T. Command Failed The BIOS tried to send a S.M.A.R.T. message to a hard disk, but the command
transaction failed.
This message can be reported by an ATAPI device using the S.M.A.R.T. error
reporting standard. S.M.A.R.T. failure messages may indicate the need to
replace the hard disk.
S.M.A.R.T. Status BAD, Backup
and Replace
A S.M.A.R.T. capable hard disk sends this message when it detects an
imminent failure.
This message can be reported by an ATAPI device using the S.M.A.R.T. error
reporting standard. S.M.A.R.T. failure messages may indicate the need to
replace the hard disk.
S.M.A.R.T. Capable and Status
BAD
A S.M.A.R.T. capable hard disk sends this message when it detects an
imminent failure.
This message can be reported by an ATAPI device using the S.M.A.R.T. error
reporting standard. S.M.A.R.T. failure messages may indicate the need to
replace the hard disk.
Table 64. Virus Related BIOS Messages
Message Displayed Description
BootSector Write !! The BIOS has detected software attempting to write to a drive’s boot sector. This is
flagged as possible virus activity. This message will only be displayed if Virus Detection
is enabled in AMIBIOS setup.
VIRUS: Continue (Y/N)? If the BIOS detects possible virus activity, it will prompt the user. This message will only
be displayed if Virus Detection is enabled in AMIBIOS setup.
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Table 65. System Configuration BIOS Messages
Message Displayed Description
DMA-2 Error Error initializing secondary DMA controller. This is a fatal error, often indication a
problem with system hardware.
DMA Controller Error POST error while trying to initialize the DMA controller. This is a fatal error, often
indication a problem with system hardware.
Checking NVRAM..Update
Failed
BIOS could not write to the NVRAM block. This message appears when the FLASH part
is write-protected or if there is no FLASH part (System uses a PROM or EPROM).
Microcode Error BIOS could not find or load the CPU Microcode Update to the CPU. This message only
applies to INTEL CPUs. The message is most likely to appear when a brand new CPU is
installed in a motherboard with an outdated BIOS. In this case, the BIOS must be
updated to include the Microcode Update for the new CPU.
NVRAM Checksum Bad,
NVRAM Cleared
There was an error in while validating the NVRAM data. This causes POST to clear the
NVRAM data.
Resource Conflict More than one system device is trying to use the same non-shareable resources
(Memory or I/O).
NVRAM Ignored The NVRAM data used to store Plug’n’Play (PnP) data was not used for system
configuration in POST.
NVRAM Bad The NVRAM data used to store Plug’n’Play (PnP) data was not used for system
configuration in POST due to a data error.
Static Resource Conflict Two or more Static Devices are trying to use the same resource space (usually Memory
or I/O).
PCI I/O conflict A PCI adapter generated an I/O resource conflict when configured by BIOS POST.
PCI ROM conflict A PCI adapter generated an I/O resource conflict when configured by BIOS POST.
PCI IRQ conflict A PCI adapter generated an I/O resource conflict when configured by BIOS POST.
PCI IRQ routing table error BIOS POST (DIM code) found a PCI device in the system but was unable to figure out
how to route an IRQ to the device. Usually this error is causing by an incomplete
description of the PCI Interrupt Routing of the system.
Timer Error Indicates an error while programming the count register of channel 2 of the 8254 timer.
This may indicate a problem with system hardware.
Interrupt Controller-1 error BIOS POST could not initialize the Master Interrupt Controller. This may indicate a
problem with system hardware.
Interrupt Controller-2 error BIOS POST could not initialize the Slave Interrupt Controller. This may indicate a
problem with system hardware.
Table 66. CMOS BIOS Messages
Message Displayed Description
CMOS Date/Time Not Set The CMOS Date and/or Time are invalid. This error can be resolved by readjusting the
system time in AMIBIOS Setup.
CMOS Battery Low CMOS Battery is low. This message usually indicates that the CMOS battery needs to
be replaced. It could also appear when the user intentionally discharges the CMOS
battery.
CMOS Settings Wrong CMOS settings are invalid. This error can be resolved by using AMIBIOS Setup.
CMOS Checksum Bad CMOS contents failed the Checksum check. Indicates that the CMOS data has been
changed by a program other than the BIOS or that the CMOS is not retaining its data
due to malfunction. This error can typically be resolved by using AMIBIOS Setup.
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Table 67. Miscellaneous BIOS Messages
Message Displayed Description
Keyboard Error Keyboard is not present or the hardware is not responding when the keyboard controller
is initialized.
PS2 Keyboard not found PS2 Keyboard support is enabled in the BIOS setup but the device is not detected.
PS2 Mouse not found PS2 Mouse support is enabled in the BIOS setup but the device is not detected.
Keyboard/Interface Error Keyboard Controller failure. This may indicate a problem with system hardware.
Unlock Keyboard PS2 keyboard is locked. User needs to unlock the keyboard to continue the BIOS POST.
System Halted The system has been halted. A reset or power cycle is required to reboot the machine.
This message appears after a fatal error has been detected.
Table 68. USB BIOS Error Messages
Messa ge Displayed Description
Warning! Unsupported USB device found and disabled! This message is displayed when a non-bootable USB
device is enumerated and disabled by the BIOS.
Warning! Port 60h/64h emulation is not supported by this
USB Host Controller!
This message is displayed to indicate that port 60h/64h
emulation mode cannot be enabled for this USB host
controller. This condition occurs if USB KBC emulation
option is set for non-SMI mode.
Warning! EHCI controller disabled. It requires 64bit data
support in the BIOS.
This message is displayed to indicate that EHCI controller
is disabled because of incorrect data structure. This
condition will occur if the USB host controller needs 64-bit
data structure while the USB is ported with 32-bit data
structure.
Table 69. SMBIOS BIOS Error Messages
Messa ge Displayed Description
Not enough space in Runtime area!!. SMBIOS data will
not be available.
This message is displayed when the size of the SMBIOS
data exceeds the available SMBIOS runtime storage size.
6.4.2 POST Error Codes
During POST and after the video has been initialized, the BIOS outputs the current boot
progress codes on the video screen. Progress codes are 32-bit quantities plus optional data.
The 32- bit numbers include class, subclass, and operation information. Class and subclass
point to the type of the hardware that is being initialized. Operation represents the specific
initialization activity.
Based on the data bit availability to display the progress code, a progress code can be
customized to fit the data width. The higher the data bit, higher the granularity of allowable
information. Progress codes may be reported by system BIOS or option ROMs.
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The response section in the following table is divided into three types:
Warning: The message is displayed on screen and the error is logged to the SEL. The
system will continue booting with a degraded state.
Pause: The message is displayed on the screen and the boot process is paused until
the appropriate input is given to either continue the boot process or take corrective
action.
Halt: The message is displayed on the screen, an error is logged to the SEL, and the
system cannot boot unless the error is corrected.
The error codes are defined by Intel and whenever possible are backward compatible with error
codes used on earlier platforms.
All POST error codes are logged in the System Event Log.
Table 70. Error Codes and Messages
Error Code Error Message Response
0000 Timer Error Pause
0003 CMOS Battery Low Pause
0004 CMOS Settings Wrong Pause
0005 CMOS Checksum Bad Pause
0008 Unlock Keyboard Halt
0009 PS2 Keyboard not found Not an error
000A KBC BAT Test failed Halt
000B CMOS memory size different Pause
000C RAM R/W test failed Pause
000E A: Drive Error Pause
000F B: Drive Error Pause
0010 Floppy Controller Failure Pause
0012 CMOS time not set Pause
0014 PS2 Mouse not found Not an error
0040 Refresh timer test failed Halt
0041 Display memory test failed Pause
0042 CMOS Display Type Wrong Pause
0043 ~<INS> Pressed Pause
0044 DMA Controller Error Halt
0045 DMA-1 Error Halt
0046 DMA-2 Error Halt
0047 Unknown BIOS error. Error code = 147 (this is really a PMM_MEM_ALLOC_ERR) Halt
0048 Password check failed Halt
0049 Unknown BIOS error. Error code = 149 (this is really SEGMENT_REG_ERR) Halt
004A Unknown BIOS error. Error code = 14A (this is really ADM_MODULE_ERR) Pause
004B Unknown BIOS error. Error code = 14B (this is really LANGUAGE_MODULE_ERR) Pause
004C Keyboard/Interface Error Pause
004D Primary Master Hard Disk Error Pause
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Error Code Error Message Response
004E Primary Slave Hard Disk Error Pause
004F Secondary Master Hard Disk Error Pause
0050 Secondary Slave Hard Disk Error Pause
0055 Primary Master Drive - ATAPI Incompatible Pause
0056 Primary Slave Drive - ATAPI Incompatible Pause
0057 Secondary Master Drive - ATAPI Incompatible Pause
0058 Secondary Slave Drive - ATAPI Incompatible Pause
0059 Third Master Device Error Pause
005B Fourth Master Device Error Pause
005D S.M.A.R.T. Status BAD, Backup and Replace Pause
005E Password check failed Pause
0120 Thermal Trip Failure Pause
0146 Insufficient Memory to Shadow PCI ROM Pause
0150 BSP Processor failed BIST Pause
0160 Processor missing microcode – P0 Pause
0161 Processor missing microcode – P1 Pause
0180 BIOS does not support current stepping – P0 Pause
0181 BIOS does not support current stepping – P1 Pause
0192 L2 cache size mismatch Pause
0193 CPUID, Processor stepping are different Pause
0194 CPUID, Processor family are different Pause
0195 Front side bus mismatch. Pause
0196 CPUID, Processor Model are different Pause
0197 Processor speeds mismatched Pause
5120 CMOS Cleared By Jumper Pause
5121 Password cleared by jumper Pause
5122 CMOS Cleared By BMC Request Pause
8104 Warning! Port 60h/64h emulation is not supported by this USB Host Controller !!! Warning
8105 Warning! EHCI controller disabled. It requires 64bit data support in the BIOS. Warning
8110 Processor 01 Internal error (IERR) Warning
8111 Processor 02 Internal error (IERR) Warning
8120 Processor 01 Thermal Trip error Warning
8121 Processor 02 Thermal Trip error Warning
8130 Processor 01 disabled Warning
8131 Processor 02 disabled Warning
8140 Processor 01 failed FRB-3 timer Warning
8141 Processor 02 failed FRB-3 timer Warning
8150 Processor 01 failed initialization on last boot. Warning
8151 Processor 02 failed initialization on last boot. Warning
8160 Processor 01 unable to apply BIOS update Pause
8161 Processor 02 unable to apply BIOS update Pause
8170 Processor 01 failed BIST Pause
8171 Processor 02 failed BIST Pause
8180 BIOS does not support current stepping for Processor 1 Pause
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Error Code Error Message Response
8181 BIOS does not support current stepping for Processor 2 Pause
8190 Watchdog timer failed on last boot Warning
8198 OS boot watchdog timer failure Pause
8300 BaseBoard Management Controller failed Self Test Pause
8301 Not enough space in Runtime area!!. SMBIOS data will not be available. Pause
8305 Primary Hot swap Controller failed to function Pause
84F1 BIST failed for all available processors Halt
84F2 BaseBoard Management Controller failed to respond Pause
84F3 BaseBoard Management Controller in Update Mode Pause
84F4 Sensor Data Record Empty Pause
84FF System Event Log Full Warning
8500 Bad or missing memory in slot 3A Pause
8501 Bad or missing memory in slot 2A Pause
8502 Bad or missing memory in slot 1A Pause
8504 Bad or missing memory in slot 3B Pause
8505 Bad or missing memory in slot 2B Pause
8506 Bad or missing memory in slot 1B Pause
8600 Primary and Secondary BIOS ID's don't match. Pause
8601 Override Jumper is set to force boot from lower bank of flash ROM. Pause
8602 WatchDog Timer Expired(Secondary BIOS maybe bad!). Pause
8603 Secondary BIOS CheckSum fail. Pause
6.4.3 BIOS Generated POST Error Beep Codes
The following table lists POST error beep codes. Prior to system video initialization, the BIOS
uses these beep codes to communicate error conditions.
Table 7 1. BIOS Generated Beep Codes
Number of Beeps Description
1 Memory refresh timer error
2 Parity error in base memory (first 64KB block)
3 Base memory read / write test error
4 Motherboard timer not operational
5 Processor error
6 8042 Gate A20 test error (cannot switch to protected mode)
7 General exception error (processor exception error)
8 Display memory error (system video adapter)
9 ROM checksum error
10 CMOS shutdown register read/write error
11 Cache memory test failed
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Table 72. Troubleshooting BIOS Beep Codes
Number of Beeps Troubleshooting Action
1, 2 or 3 Reseat the memory, or replace with known good modules.
4-7, 9-11 Fatal error indicating a serious problem with the system. Consult your system manufacturer.
Before declaring the motherboard beyond all hope, eliminate the possibility of interference by a
malfunctioning add-in card. Remove all expansion cards except the video adapter.
If the beep codes are generated even when all other expansion cards are absent, the
motherboard has a serious problem. Consult your system manufacturer.
If the beep codes are not generated when all other expansion cards are absent, one of the add-
in cards is causing the malfunction. Insert the cards back into the system one at a time until the
problem happens again. This will reveal the malfunctioning add-in card.
8 If the system video adapter is an add-in card, replace or reseat the video adapter. If the video
adapter is an integrated part of the system board, the board may be faulty.
6.4.4 Boot Block Error Beep Codes
The following table defines beep codes that may occur if a failure occurs while performing a
BIOS Boot Block Update.
Table 73. Boot Block Error Beep Codes
Number of Beeps Description
1 Insert diskette in floppy drive A:
2 ‘AMIBOOT.ROM’ file not found in root directory of diskette in A:
3 Base Memory error
4 Flash Programming successful
5 Floppy read error
6 Keyboard controller BAT command failed
7 No Flash EPROM detected
8 Floppy controller failure
9 Boot Block BIOS checksum error
10 Flash Erase error
11 Flash Program error
12 ‘AMIBOOT.ROM’ file size error
13 BIOS ROM image mismatch (file layout does not match image present in flash device)
1 long beep Insert diskette with AMIBOOT.001 File for Multi-Disk Recovery
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6.5 Checkpoints
6.5.1 System ROM BIOS POST Task Test Point (Port 80h Code)
The BIOS sends a 1-byte hex code to port 80 before each task. The port 80 codes provide a
troubleshooting method in the event of a system hang during POST. Table 73 provides a list of
the Port 80 codes and the corresponding task description.
6.5.2 Diagnostic LEDs
All port 80 codes are displayed using the Diagnostic LEDs found on the back edge of the
baseboard. The diagnostic LED feature consists of a hardware decoder and four dual color
LEDs. During POST, the LEDs will display all normal POST codes representing the progress of
the BIOS POST. Each code will be represented by a combination of colors from the four LEDs.
The LEDs are capable of displaying three colors: Green, Red, and Amber. The POST codes are
divided into two nibbles, an upper nibble and a lower nibble. Each bit in the upper nibble is
represented by a Red LED and each bit in the lower nibble is represented by a green LED. If
both bits are set in the upper and lower nibbles then both Red and Green LEDs are lit, resulting
in an Amber color. If both bits are clear, then the LED is off.
In the below example, BIOS sends a value of ACh to the Diagnostic LED decoder. The LEDs
are decoded as follows:
Red bits = 1010b = Ah
Green bits = 1100b = Ch
Since the red bits correspond to the upper nibble and the green bits correspond to the lower
nibble, the two are concatenated to be ACh.
Table 74. POST Progress Code LED Example
LEDs Red Green Red Green Red Green Red Green
Ach 1 1 0 1 1 0 0 0
Result Amber Green Red Off
MSB LSB
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Figure 17. Location of Diagnostic LEDs on Baseboard
6.5.3 POST Code Checkpoints
Table 75. POST Code Checkpoints
Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
03 OFF OFF G G
Disable NMI, parity, video for EGA, and DMA controllers. Initialize
BIOS, POST, Run-time data area. Initialize BIOS modules on POST
entry and GPNV area. Initialized CMOS as mentioned in the Kernel
Variable "wCMOSFlags."
04 OFF G OFF OFF
Check CMOS diagnostic byte to determine if battery power is OK and
CMOS checksum is OK. Verify CMOS checksum manually by reading
storage area. If the CMOS checksum is bad, update CMOS with
power-on default values and clear passwords. Initialize status register
A.
Initializes data variables that are based on CMOS setup questions.
Initializes both the 8259 compatible PICs in the system
05 OFF G OFF G
Initializes the interrupt controlling hardware (generally PIC) and
interrupt vector table.
06 OFF G G OFF
Do R/W test to CH-2 count reg. Initialize CH-0 as system timer. Install
the POSTINT1Ch handler. Enable IRQ-0 in PIC for system timer
interrupt.
Traps INT1Ch vector to "POSTINT1ChHandlerBlock."
08 G OFF OFF OFF
Initializes the CPU. The BAT test is being done on KBC. Program the
keyboard controller command byte is being done after Auto detection
of KB/MS using AMI KB-5.
C0 R R OFF OFF Early CPU Init Start -- Disable Cache - Init Local APIC
C1 R R OFF G Set up boot strap processor Information
C2 R R G OFF Set up boot strap processor for POST
C5 R A OFF G Enumerate and set up application processors
C6 R A G OFF Re-enable cache for boot strap processor
C7 R A G G Early CPU Init Exit
0A G OFF G OFF Initializes the 8042 compatible Key Board Controller.
0B G OFF G G Detects the presence of PS/2 mouse.
0C G G OFF OFF Detects the presence of Keyboard in KBC port.
LSB MSB
Diagnostic LEDs
Back edge of baseboard
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Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
0E G G G OFF
Testing and initialization of different Input Devices. Also, update the
Kernel Variables.
Traps the INT09h vector, so that the POST INT09h handler gets
control for IRQ1. Uncompress all available language, BIOS logo, and
Silent logo modules.
13 OFF OFF G A Early POST initialization of chipset registers.
24 OFF G R OFF Uncompress and initialize any platform specific BIOS modules.
30 OFF OFF R R Initialize System Management Interrupt.
2A G OFF A OFF Initializes different devices through DIM.
See DIM Code Checkpoints section of document for more information.
2C G G R OFF Initializes different devices. Detects and initializes the video adapter
installed in the system that have optional ROMs.
2E G G A OFF Initializes all the output devices.
31 OFF OFF R A
Allocate memory for ADM module and uncompress it. Give control to
ADM module for initialization. Initialize language and font modules for
ADM. Activate ADM module.
33 OFF OFF A A Initializes the silent boot module. Set the window for displaying text
information.
37 OFF G A A Displaying sign-on message, CPU information, setup key message,
and any OEM specific information.
38 G OFF R R Initializes different devices through DIM. See DIM Code Checkpoints
section of document for more information.
39 G OFF R A Initializes DMAC-1 and DMAC-2.
3A G OFF A R Initialize RTC date/time.
3B G OFF R A Test for total memory installed in the system. Also, Check for DEL or
ESC keys to limit memory test. Display total memory in the system.
3C G G R R Mid POST initialization of chipset registers.
40 OFF R OFF OFF
Detect different devices (Parallel ports, serial ports, and coprocessor
in CPU, … etc.) successfully installed in the system and update the
BDA, EBDA…etc.
50 OFF R OFF R Programming the memory hole or any kind of implementation that
needs an adjustment in system RAM size if needed.
52 OFF R G R
Updates CMOS memory size from memory found in memory test.
Allocates memory for Extended BIOS Data Area from base memory.
60 OFF R R OFF Initializes NUM-LOCK status and programs the KBD typematic rate.
75 OFF A R A Initialize Int-13 and prepare for IPL detection.
78 G R R R Initializes IPL devices controlled by BIOS and option ROMs.
7A G R A R Initializes remaining option ROMs.
7C G A R R Generate and write contents of ESCD in NVRam.
84 R G OFF OFF Log errors encountered during POST.
85 R G OFF G Display errors to the user and gets the user response for error.
87 R G G G Execute BIOS setup if needed / requested.
8C A G OFF OFF Late POST initialization of chipset registers.
8D A G OFF G Build ACPI tables (if ACPI is supported)
8E A G G OFF Program the peripheral parameters. Enable/Disable NMI as selected
90 R OFF OFF R Late POST initialization of system management interrupt.
A0 R OFF R OFF Check boot password if installed.
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Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
A1 R OFF R G Clean-up work needed before booting to operating system.
A2 R OFF A OFF
Takes care of runtime image preparation for different BIOS modules.
Fill the free area in F000h segment with 0FFh. Initializes the Microsoft
IRQ Routing Table. Prepares the runtime language module. Disables
the system configuration display if needed.
A4 R G R OFF Initialize runtime language module.
A7 R G A G Displays the system configuration screen if enabled. Initialize the
CPU’s before boot, which includes the programming of the MTRR’s.
A8 A OFF R OFF Prepare CPU for operating system boot including final MTRR values.
A9 A OFF R G Wait for user input at config display if needed.
AA A OFF A OFF Uninstall POST INT1Ch vector and INT09h vector. Deinitializes the
ADM module.
AB A OFF A G Prepare BBS for Int 19 boot.
AC A G R OFF End of POST initialization of chipset registers.
B1 R OFF R A Save system context for ACPI.
00 OFF OFF OFF OFF Passes control to OS Loader (typically INT19h).
6.5.4 Bootblock Initialization Code Checkpoints
The Bootblock initialization code sets up the chipset, memory and other components before
system memory is available. The following table describes the type of checkpoints that may
occur during the bootblock initialization portion of the BIOS:
Table 76. Bootblock Initialization Code Checkpoints
Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
Before D1 Early chipset initialization is done. Early super I/O initialization is done
including RTC and keyboard controller. NMI is disabled.
D1 R R OFF A
Perform keyboard controller BAT test. Check if waking up from power
management suspend state. Save power-on CPUID value in scratch
CMOS.
D0 R R OFF R Go to flat mode with 4GB limit and GA20 enabled. Verify the
bootblock checksum.
D2 R R G R
Disable CACHE before memory detection. Execute full memory sizing
module. Verify that flat mode is enabled.
D3 R R G A
If memory sizing module not executed, start memory refresh and do
memory sizing in Bootblock code. Do additional chipset initialization.
Re-enable CACHE. Verify that flat mode is enabled.
D4 R A OFF R Test base 512KB memory. Adjust policies and cache first 8MB. Set
stack.
D5 R A OFF A Bootblock code is copied from ROM to lower system memory and
control is given to it. BIOS now executes out of RAM.
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Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
D6 R A G R
Both key sequence and OEM specific method is checked to determine
if BIOS recovery is forced. Main BIOS checksum is tested. If BIOS
recovery is necessary, control flows to checkpoint E0. See Bootblock
Recovery Code Checkpoints section of document for more
information.
D7 R A G A
Restore CPUID value back into register. The Bootblock-Runtime
interface module is moved to system memory and control is given to
it. Determine whether to execute serial flash.
D8 A R OFF R The Runtime module is uncompressed into memory. CPUID
information is stored in memory.
D9 A R OFF A
Store the Uncompressed pointer for future use in PMM. Copying Main
BIOS into memory. Leaves all RAM below 1MB Read-Write including
E000 and F000 shadow areas but closing SMRAM.
DA A R G R
Restore CPUID value back into register. Give control to BIOS POST
(ExecutePOSTKernel). See POST Code Checkpoints section of
document for more information.
6.5.5 Bootblock Recovery Code Checkpoint
The Bootblock recovery code gets control when the BIOS determines that a BIOS recovery
needs to occur because the user has forced the update or the BIOS checksum is corrupt. The
following table describes the type of checkpoints that may occur during the Bootblock recovery
portion of the BIOS:
Table 77. Bootblock Recovery Code Checkpoint
Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
E0 R R R OFF
Initialize the floppy controller in the super I/O. Some interrupt vectors
are initialized. DMA controller is initialized. 8259 interrupt controller is
initialized. L1 cache is enabled.
E9 A R R G Set up floppy controller and data. Attempt to read from floppy.
Determine information about root directory of recovery media.
EA A R A OFF Enable ATAPI hardware. Attempt to read from ARMD and ATAPI CD-
ROM. Determine information about root directory of recovery media.
EB A R A G Disable ATAPI hardware. Jump back to checkpoint E9.
EF A A A G Read error occurred on media. Jump back to checkpoint EB.
F0 R R R R Search for pre-defined recovery file name in root directory.
F1 R R R A Recovery file not found.
F2 R R A R
Start reading FAT table and analyze FAT to find the clusters occupied
by the recovery file.
F3 R R A A Start reading the recovery file cluster by cluster.
F5 R A R A Disable L1 cache.
FA A R A R
Check the validity of the recovery file configuration to the current
configuration of the flash part.
Error Reporting and Handling Intel® Server Board SE7320VP2
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Diagnostic LED Deco der
G=Green, R=Red, A=Amber
Checkpoint MSB LSB
Description
FB A R A A
Make flash write enabled through chipset and OEM specific method.
Detect proper flash part. Verify that the found flash part size equals
the recovery file size.
F4 R A R R The recovery file size does not equal the found flash part size.
FC A A R R Erase the flash part.
FD A A R A Program the flash part.
FF A A A A
The flash has been updated successfully. Make flash write disabled.
Disable ATAPI hardware. Restore CPUID value back into register.
Give control to F000 ROM at F000:FFF0h.
6.5.6 DIM Code Checkpoints
The Device Initialization Manager (DIM) module gets control at various times during BIOS
POST to initialize different Buses. The following table describes the main checkpoints where the
DIM module is accessed:
Table 78. DIM Code Checkpoints
Checkpoint Description
2A Initialize different buses and perform the following functions:
Reset, Detect, and Disable (function 0). Function 0 disables all device nodes, PCI devices,
and PnP ISA cards. It also assigns PCI bus numbers.
Static Device Initialization (function 1). Function 1 initializes all static devices that include
manual configured onboard peripherals, memory and I/O decode windows in PCI-PCI
bridges, and noncompliant PCI devices. Static resources are also reserved.
Boot Output Device Initialization (function 2). Function 2 searches for and initializes any
PnP, PCI, or AGP video devices.
38 Initialize different buses and perform the following functions:
Boot Input Device Initialization (function 3). Function 3 searches for and configures PCI
input devices and detects if system has standard keyboard controller.
IPL Device Initialization (function 4). Function 4 searches for and configures all PnP and
PCI boot devices.
General Device Initialization (function 5). Function 5 configures all onboard peripherals that
are set to an automatic configuration and configures all remaining PnP and PCI devices.
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6.5.7 ACPI Runtime Checkpoints
ACPI checkpoints are displayed when an ACPI capable operating system either enters or
leaves a sleep state. The following table describes the type of checkpoints that may occur
during ACPI sleep or wake events:
Table 79. ACPI Runtime Checkpoints
Checkpoint Description
AC First ASL check point. Indicates the system is running in ACPI mode.
AA System is running in APIC mode.
01, 02, 03, 04, 05 Entering sleep state S1, S2, S3, S4, or S5.
10, 20, 30, 40, 50 Waking from sleep state S1, S2, S3, S4, or S5.
6.5.8 Memory Error Codes
Table 80. Memory Error Codes
Tpoint Description
001h MEM_ERR_CHANNEL_B_OFF
(DIMM mismatch forced Channel B disabled)
002h MEM_ERR_CK_PAIR_OFF
(Slow DIMM(s) forced clock pair disabled)
0E1h MEM_ERR_NO_DEVICE
(No memory installed)
0E2h MEM_ERR_TYPE_MISMATCH
0E3h MEM_ERR_UNSUPPORTED_DIMM
(Unsupported DIMM type)
0E4h MEM_ERR_CHL_MISMATCH
0E5h MEM_ERR_SIZE_MISMATCH
0E6h MEM_ERR_ECC_MISMATCH
0E8h MEM_ERR_ROW_ADDR_BITS
0E9h MEM_ERR_INTERNAL_BANKS
0EAh MEM_ERR_TIMING
0EBh MEM_ERR_INST_ORDER_ERR
0ECh MEM_ERR_NONREG_MIX
0EDh MEM_ERR_LATENCY
0EEh MEM_ERR_NOT_SUPPORTED
0EFh MEM_ERR_CONFIG_NOT_SUPPORTED
0F0h SYS_FREQ_ERR
(Flag for Unsupported System Bus Freq)
0F1h DIMM_ERR_CFG_MIX
(Usupported DIMM mix)
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Tpoint Description
0F2h DQS_FAILURE
(indicates DQS failure)
0F3h MEM_ERR_MEM_TEST_FAILURE
(Error code for unsuccessful Memory Test)
0F4h MEM_ERR_ECC_INIT_FAILURE
(Error code for unsuccessful ECC and Memory Initialization)
6.6 Light Guided Diagnostics
The baseboard provides system fault/status LEDs in several areas of the board. There are fault
LEDs for each DIMM slot, and status LEDs for 5V stand-by and system state.
DIMM fault LEDs are lit by BIOS whenever BIOS disables a specific DIMM.
The 5V stand-by LED is always lit when 5-volt stand-by is present.
The System Status LED displays the state of the system. It mirrors the state of the
Standard Control Panel Status LED. Valid states include: solid green, blinking green,
blinking amber, solid amber, and off
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7. Connectors and Jumper Blocks
7.1 Power Connectors
The main power supply connection is obtained using a SSI Compliant 2x12 pin connector
(J3K6). In addition, there are two additional power related connectors; one SSI compliant 2x4
pin power connector (J4J1) providing support for additional 12V, one SSI compliant 1x5 pin
connector (J1G2) providing I2C monitoring of the power supply. The following tables define their
pinouts.
Table 81. Power Connector (J3K6) Pinout
Pin Signal Color Pin Signal Color
1 +3.3Vdc Orange 13 +3.3Vdc Orange
2 +3.3Vdc Orange 14 -12Vdc Blue
3 GND Black 15 GND Black
4 +5Vdc Red 16 PS_ON# Green
5 GND Black 17 GND Black
6 +5Vdc Red 18 GND Black
7 GND Black 19 GND Black
8 PWR_OK Gray 20 RSVD_(-5V) White
9 5VSB Purple 21 +5Vdc Red
10 +12Vdc Yellow 22 +5Vdc Red
11 +12Vdc Yellow 23 +5Vdc Red
12 +3.3Vdc Orange 24 GND Black
Table 82. 12V Power Connector (J4J1)
Pin Signal Color
1 GND Black
2 GND Black
3 GND Black
4 GND Black
5 +12Vdc Yellow
6 +12Vdc Yellow
7 +12Vdc Yellow
8 +12Vdc Yellow
Connectors and Jumper Blocks Intel® Server Board SE7320VP2
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Table 83. Power Supply Signal Connector (J1G2)
Pin Signal Color
1 5VSB_SCL Orange
2 5VSB_SDA Black
3 PS_ALTER_L, Not used Red
4 3.3V SENSE- Yellow
5 3.3V SENSE+ Green
7.2 Riser Slots
The baseboard provides one riser slot providing both PCI-X and PCI Express signals to a riser
card capable of supporting full-height add-in cards. The baseboard also provides one riser slot
providing PCI-X signals to a riser card capable of supporting low-profile add-in cards. The
following table shows the pinout for these riser slots.
7.2.1 Low-profile PCI-X Riser Slot
The low-profile riser slot (J5F1) pin assignments are shown below. On a given riser card, the
PCI add-in slot closest to the baseboard will always have device ID 17. On a three-slot riser
card the middle PCI add-in slot (not supported on the Server Board SE7320VP2) will have
device ID 18, and the top slot (not supported on the Server Board SE7320VP2) will have device
ID 19. The interrupts on the PCI add-in slots should be rotated following the PCI bridge
specification 1.0. To prevent anyone from putting a PCI add-in card directly into the riser slot,
the connector has been pinned out so that Pin 1 is furthest from the board edge. Side B should
be closest to the memory DIMMs.
Table 84. Low-profile Riser Slot (J5F1) Pinout
Pin-
Side
B
PCI Spec
Signal Description Pin-
Side A PCI Spec
Signal Description
101 -12V 101 RSVD
100 RSVD 100 +12V
99 GND 99 RSVD
98 RSVD 98 +5V
97 +5V 97 +5V
96 +5V 96 INTA# This pin will be connected on the 2U
riser to INT_A# of the bottom PCI
slot (not supported on the Server
Board SE7320VP2), INT_D# of the
middle slot and INT_C# of the top
slot (not supported on the Server
Board SE7320VP2).
95 INTB# This pin will be connected on
the 2U riser to INT_B# of the
bottom PCI slot, INT_A# of the
middle slot (not supported on
95 INTC# This pin will be used by 1U/2U riser
to bring the INT_C# interrupt on the
bottom PCI slot down to the
baseboard.
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Pin-
Side
B
PCI Spec
Signal Description Pin-
Side A PCI Spec
Signal Description
the Server Board
SE7320VP2)and INT_D# of the
top slot (not supported on the
Server Board SE7320VP2).
94 INTD# This pin will be used by 1U/2U
riser to bring the INT_D#
interrupt on the bottom PCI slot
down to the baseboard.
94 +5V
93 +5V 93 GND
92 GND 92 REQ3# Highest PCI Slot (SLOT3)
91 CLK3 Highest PCI Slot (SLOT3) 91 GND
90 GND 90 GNT3# Highest PCI Slot (SLOT3)
89 CLK2 Middle PCI Slot (SLOT2) 89 +5V Was GND
88 GND 88 RSVD
87 REQ2# Middle PCI Slot (SLOT2) 87 +5V Was GND
86 GND 86 LECC4
85 LECC5 85 GND Was Vio 3.3V or 1.5V
84 GND 84 LECC3
83 +3.3V 83 GNT2#
82 LECC2 82 3.3VAUX 3 slots at 375ma
81 GND 81 RST#
80 CLK1 Lowest PCI slot (SLOT1) 80 +3.3V Was VIO 3.3V or 1.5V
79 GND 79 GNT1# Lowest PCI slot (SLOT1)
78 REQ1# Lowest PCI slot (SLOT1) 78 GND
77 +3.3V Was 3.3V or 1.5V 77 PME#
76 AD[31] 76 AD[30]
75 AD[29] 75 +3.3V
74 GND 74 AD[28]
73 AD[27] 73 AD[26]
72 AD[25] 72 GND
71 +3.3V 71 AD[24]
70 C/BE[3]# 70 RSVD Lower slot IDSEL=AD17 Middle
Slot=AD18, Top slot=AD19
69 AD[23] 69 +3.3V
68 GND 68 AD[22]
67 AD[21] 67 AD[20]
66 AD[19] 66 GND
65 +3.3V 65 AD[18]
64 AD[17] 64 AD[16]
63 C/BE[2]# 63 +3.3V
62 GND 62 FRAME#
61 IRDY# 61 GND
KEYWAY KEYWAY
KEYWAY KEYWAY
Connectors and Jumper Blocks Intel® Server Board SE7320VP2
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Pin-
Side
B
PCI Spec
Signal Description Pin-
Side A PCI Spec
Signal Description
60 +3.3V 60 TRDY#
59 DEVSEL# 59 GND
58 PCI-XCAP 58 STOP#
57 LOCK# 57 +3.3V
56 PERR# 56 SMBD Daisy chain to all slots
55 +3.3V 55 SMBCLK Daisy chain to all slots
54 SERR# 54 GND
53 +3.3V 53 PAR
/ECC0
52 C/BE[1]# 52 AD[15]
51 AD[14] 51 +3.3V
50 GND 50 AD[13]
49 AD[12] 49 AD[11]
47 AD[10] 47 GND
47 M66EN 47 AD[09]
46 Mode 2 46 C/BE[0]#
45 GND 45 +3.3V Was GND
44 AD[08] 44 +3.3V
43 AD[07] 43 +3.3V
42 +3.3V 42 AD[06]
41 AD[05] 41 AD[04]
40 AD[03] 40 GND
39 GND 39 AD[02]
38 AD[01] 38 AD[00]
37 +3.3V Was Vio 3.3V or 1.5V 37 +3.3V Was Vio 3.3V or 1.5V
36 ACK64#
/ECC1
36 REQ64#
/ECC6
35 +5V 35 +5V
34 +5V 34 +5V
33 RSVD 33 GND
32 GND 32 C/BE[7]#
31 C/BE[6]# 31 C/BE[5]#
30 C/BE4# 30 V (I/O) 3.3V or 1.5V
29 GND 29 PAR64
/ECC7
28 AD[63] 28 AD[62]
27 AD[61] 27 GND
26 V (I/O) 3.3V or 1.5V 26 AD[60]
25 AD[59] 25 AD[58]
24 AD[57] 24 GND
23 GND 23 AD[56]
22 AD[55] 22 AD[54]
21 AD[53] 21 V (I/O) 3.3V or 1.5V
20 GND 20 AD[52]
Intel® Server Board SE7320VP2 Connectors and Jumper Blocks
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Pin-
Side
B
PCI Spec
Signal Description Pin-
Side A PCI Spec
Signal Description
19 AD[51] 19 AD[50]
18 AD[49] 18 GND
17 V (I/O) 3.3V or 1.5V 17 AD[48]
16 AD[47] 16 AD[46]
15 AD[45] 15 GND
14 GND 14 AD[44]
13 AD[43] 13 AD[42]
12 AD[41] 12 V (I/O) 3.3V or 1.5V
KEYWAY KEYWAY
KEYWAY KEYWAY
11 GND 11 AD[40]
10 AD[39] 10 AD[38]
9 AD[37] 9 GND
8 V (I/O) 3.3V or 1.5V 8 AD[36]
7 AD[35] 7 AD[34]
6 AD[33] 6 GND
5 GND 5 AD[32]
4 4
3 PRSNT_N 0=Riser Present 3 GND
2 GND 2
1 Size 0=1U, 1= 2U 1 GND
5V = 12 = 12 or 6 amps 3 slots needs 6 amps for (3) 10W boards
3.3V= 19 = 19 or 9.5 amps 3 slots needs 9 amps for (3) 10W boards
202-pin connector length = 139.45mm=5.49”
7.2.2 Full-height PCI-X, Intel® Adaptive Slot
The full-height / full-length PCI-X riser slot (J4F1) is implemented using a 280-pin PCI Express
style connector with the following pinout. The lowest slot will always have device ID of 17 and
on a three-slot riser the device ID will increment. In other words, the middle slot will have device
ID 18 and top slot will have device ID 19. The interrupts on the PCI slots should be rotated
following the PCI bridge specification 1.0.
Table 85. Full-height Riser Slot (J4F1) Pinout
Pin-Side
B PCI Spec
Signal Description Pin-Side
A PCI Spec
Signal Description
140 12V 140 12V
139 12V 139 12V
138 Ground 138 GND
137 -12V 137 3.3VAux 375ma per slot and 3 slots
136 12V 136 Wake#
135 GND 135 12V Two slots = 4 amps
Connectors and Jumper Blocks Intel® Server Board SE7320VP2
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Pin-Side
B PCI Spec
Signal Description Pin-Side
A PCI Spec
Signal Description
134 REFCLK2
+
134 3.3V
133 REFCLK2
+
133 PERST_N
132 GND 132 GND 1 amp per pin
131 GND 131 REFCLK1
+
130 HSOp(0) 130 REFCLK1
+
129 HSOn(0) 129 GND
128 GND 128 HSIp(0)
127 GND 127 HSIn(0)
126 HSOp(1) 126 GND
125 HSOn(1) 125 GND
124 GND 124 HSIp(1)
123 GND 123 HSIn(1)
122 HSOp(2) 122 GND
121 HSOn(2) 121 GND
120 GND 120 HSIp(2)
119 GND 119 HSIn(2)
118 HSOp(3) 118 GND
117 HSOn(3) 117 GND
116 GND 116 HSIp(3)
115 GND 115 HSIn(3)
114 HSOp(4) 114 GND
113 HSOn(4) 113 GND
112 GND 112 HSIp(4)
111 GND 111 HSIn(4)
110 HSOp(5) 110 GND
109 HSOn(6) 109 GND
108 GND 108 HSIp(5)
107 GND 107 HSIn(5)
106 HSOp(6) 106 GND
105 HSOn(6) 105 GND
104 GND 104 HSIp(6)
103 GND 103 HSIn(6)
102 HSOp(7) 102 GND
101 HSOn(7) 101 GND
100 GND 100 HSIp(7)
99 +5V 99 HSIn(7)
98 INTB# This pin will be connected on
the 2U riser to INT_B# of the
bottom PCI slot, INT_A# of the
middle slot and INT_D# of the
top slot.
98 GND
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Pin-Side
B PCI Spec
Signal Description Pin-Side
A PCI Spec
Signal Description
97 INTD# This pin will be used by 2U
riser to bring the INT_B#
interrupt from the top and
INT_C# from the middle PCI
slot down to the baseboard.
97 ZCR_PRS
NT_L
Not used
96 +5V 96 +5V
95 Reserved SLOT_ID_FL, not required as
the risers are unique.
95 +5V
94 +5V 94 ZCR_MSKI
D_L
Not used
93 IOP INTA SCSI Interrupt A to ZCR. This
pin will be used by 1U/2U riser
to bring the INT_C# interrupt
on the bottom PCI slot down to
the baseboard, Not used
93 +5V
92 IOP INTB SCSI Interrupt B to ZCR. This
pin will be used by 1U/2U riser
to bring the INT_D# interrupt
on the bottom PCI slot down to
the baseboard, Not used
92 INTA# This pin will be connected on the
2U riser to INT_A# of the bottom
PCI slot, INT_D# of the middle
slot and INT_C# of the top slot.
91 GND 91 INTC# This pin will be used by 2U riser to
bring the INT_A# interrupt from
the top and INT_B# from the
middle PCI slot down to the
baseboard.
90 CLK3 Highest PCI Slot (SLOT3) 90 GND
89 GND 89 REQ3# Highest PCI Slot (SLOT3)
88 CLK2 Middle PCI Slot (SLOT2) 88 GND
87 GND 87 GNT3# Highest PCI Slot (SLOT3)
86 REQ2# Middle PCI Slot (SLOT2) 86 GND
85 GND 85 RST#
84 Reserved 84 GND
83 GND 83 Reserved
KEY KEY
KEY End of x16 PCI Express
connector
KEY
82 Reserved 82 +5V Was Vio 3.3V or 1.5V
81 GND 81 Reserved
80 CLK1 Lowest PCI slot (SLOT1) 80 GND
79 Ground 79 GNT2# Middle PCI Slot (SLOT2)
78 REQ1# Lowest PCI slot (SLOT1) 78 +3.3V Was Vio 3.3V or 1.5V
77 +3.3V Was Vio 3.3V or 1.5V 77 GNT1# Lowest PCI slot (SLOT1)
76 PME2# Active riser only, PME needed
per PCI segment, reserved for
passive riser, Not used on the
Server Board SE7320VP2
76 Ground
75 AD[31] 75 PME1# For passive slots on both passive
and active riser
74 AD[29] 74 PME3# Active riser only, PME needed per
PCI segment reserved for passive
Connectors and Jumper Blocks Intel® Server Board SE7320VP2
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154
Pin-Side
B PCI Spec
Signal Description Pin-Side
A PCI Spec
Signal Description
riser, Not used on the Server
Board SE7320VP2
73 Ground 73 AD[30] AD[31]
72 AD[27] 72 +3.3V
71 AD[25] 71 AD[28]
70 +3.3V 70 AD[26]
69 C/BE[3]# 69 Ground
68 AD[23] 68 AD[24]
67 Ground 67 RSVRD Reserved
66 AD[21] 66 +3.3V
65 AD[19] 65 AD[22]
64 +3.3V 64 AD[20]
63 AD[17] 63 Ground
62 C/BE[2]# 62 AD[18]
61 Ground 61 AD[16]
60 IRDY# 60 +3.3V
59 +3.3V 59 FRAME#
58 DEVSEL# 58 Ground
57 PCI-XCAP 57 TRDY#
56 LOCK# 56 Ground
55 PERR# 55 STOP#
54 +3.3V 54 +3.3V
53 SERR# 53 SMBD Daisy chain to all slots
52 +3.3V 52 SMBCLK Daisy chain to all slots
51 C/BE[1]# 51 Ground
50 AD[14] 50 PAR
49 Ground 49 AD[15]
48 AD[12] 48 +3.3V
47 AD[10] 47 AD[13]
46 M66EN 46 AD[11]
45 Ground 45 Ground
44 Ground 44 AD[09]
43 AD[08] 43 C/BE[0]#
42 AD[07] 42 +3.3V
41 +3.3V 41 AD[06]
40 AD[05] 40 AD[04]
39 AD[03] 39 Ground
38 Ground 38 AD[02]
37 AD[01] 37 AD[00]
36 +3.3V Was Vio 3.3V or 1.5V 36 +3.3V Was Vio 3.3V or 1.5V
35 ACK64# 35 REQ64#
34 +5V 34 +5V
33 +5V 33 +5V
Intel® Server Board SE7320VP2 Connectors and Jumper Blocks
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Pin-Side
B PCI Spec
Signal Description Pin-Side
A PCI Spec
Signal Description
32 Reserved 32 +5V Was gnd
31 Ground 31 C/BE[7]#
30 C/BE[6]# 30 C/BE[5]#
29 C/BE[4]# 29 Ground Was VIO
28 Ground 28 PAR64
27 AD[63] 27 AD[62]
26 AD[61] 26 3.3V Was GND
25 3.3V 25 AD[60]
24 AD[59] 24 AD[58]
23 AD[57] 23 Ground
22 Ground 22 AD[56]
21 AD[55] 21 AD[54]
20 AD[53] 20 3.3V
19 Ground 19 AD[52]
18 AD[51] 18 AD[50]
17 AD[49] 17 Ground
16 3.3V 16 AD[48]
15 AD[47] 15 AD[46]
14 AD[45] 14 Ground
13 Ground 13 AD[44]
12 AD[43] 12 AD[42]
KEY Reversed PCI Express KEY
KEY Reversed PCI Express KEY
11 AD[41] 11 3.3V V
10 Ground 10 AD[40]
9 AD[39] 9 AD[38]
8 AD[37] 8 Ground
7 3.3V 7 AD[36]
6 AD[35] 6 AD[34]
5 AD[33] 5 Ground
4 Ground 4 AD[32]
3 Type1 Type(1:0)
(1U)00 = PCI Express
(1U)01 = PCI
(1U)10 = N/A
(1U)11 = N/A
3 PXH_RST
_N
Input to reset the PXH on the
active Riser, Not used on the
Server Board SE7320VP2
2 Type0 (2U)00=2xPCI Express+PCI
(2U)01=3x PCI
(2U)10=PXH 3 PCI-X-D
(2U)11=No Riser
2 Ground
1 Size 0=1U, 1 = 2U 1 PXH_PWR
OK
Input to indicate to PXH on active
riser that baseboard power is OK,
Not used on the Server Board
SE7320VP2
Connectors and Jumper Blocks Intel® Server Board SE7320VP2
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Intel order number C91056-002
156
7.3 Front Panel Connectors
The Server Board SE7320VP2 provides three front panel connectors: a high-density 100-pin
connector (J2J1) for use in the Intel® Server Chassis SR1400 LC 1U and SR2400 2U with
backplane installed, a 50-pin front panel connector (J1J2) used in Intel’s chassis with no
backplane installed, and a SSI standard 34-pin connector (J1J1) for use in third-party reference
chassis. The following tables provide the pinouts for each connector.
7.3.1 Front Panel Connectors
Table 86. High-density Front Panel 100-pin Header Pinout (J2J1)
Pin Signal Name Pin Signal Name
A1 GND B1 V_IO_VSYNC_BUFF_FP_L
A2 V_IO_RED_CONN_FP B2 V_IO_HSYNC_BUFF_FP_L
A3 V_IO_GREEN_CONN_FP B3 TEMP_PWM_R
A4 V_IO_BLUE_CONN_FP B4 SPB_DCD_L
A5 VIDEO_IN_USE B5 SPB_CTS_L
A6 SPB_DTR_L B6 SPB_SOUT_L
A7 SPB_RTS _L B7 SPB_EN_L
A8 SPB_SIN B8 LAN_ACT_B_L
A9 SPB_DSR B9 LAN_LINKB_R
A10 FP_NMI_BTN_L B10 FP_CHASSIS_INTRU
A11 GND B11 PS_I2C_5VSB_SCL
A12 FP_ID_BTN_L B12 PS_I2C_5VSB_SDA
A13 P5V_STBY B13 LAN_ACT_A_L
A14 FP_RST_BTN_L B14 LAN_LINKA_R
A15 HDD_FAULT_LED_L B15 FP_ID_LED_R
A16 FP_PWR_BTN_L B16 IPMB_I2C_5VSB_SCL
A17 HDD_LED_ACT_L B17 P5V_STBY
A18 P3V3 B18 FP_STATUS_LED2_R
A19 IPMB_I2C_5VSB_SDA B19 FP_STATUS_LED1_R
A20 GND B20 FP_PWR_LED_L
A21 P5V_STBY B21 RST_IDE_S_L
A22 RST_IDE_L B22 FD_HDSEL_L
A23 FD_DSKCHG_L B23 FD_RDATA_L
A24 FD_WPD_L B24 FD_WDATA_L
A25 FD_TRK0_L B25 FD_STEP_L
A26 FD_WGATE_L B26 FD_MTR0_L
A27 FD_DIR_L B27 FD_DENSEL0
A28 FD_DS0_L B28 FD_INDEX_L
A29 GND B29 IDE_SDD_8
A30 IDE_SDD_7 B30 IDE_SDD_9
A31 IDE_SDD_6 B31 IDE_SDD_10
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Pin Signal Name Pin Signal Name
A32 IDE_SDD_5 B32 IDE_SDD_11
A33 IDE_SDD_4 B33 IDE_SDD_12
A34 IDE_SDD_3 B34 IDE_SDD_13
A35 IDE_SDD_2 B35 IDE_SDD_14
A36 IDE_SDD_1 B36 IDE_SDD_15
A37 IDE_SDD_0 B37 IDE_SDDREQ
A38 GND B38 IDE_SDIOW_L
A39 IDE_SDDACK_L B39 IDE_SDIOR_L
A40 IDE_SDA_1 B40 IDE_SIORDY
A41 IDE_SDA_0 B41 IRQ_IDE_S
A42 IDE_SDCS1_L B42 IDE_SDA_2
A43 IDE_SEC_HD_ACT_L B43 IDE_SDCS3_L
A44 GND B44 FAN_SPEED_CNTL1
A45 FAN_TACH5 B45 R_FAN_PRESENT
A46 FAN_TACH6 B46 BB_LED_FAN5_R
A47 FAN_TACH7 B47 BB_LED_FAN6_R
A48 FAN_TACH8 B48 BB_LED_FAN7_R
A49 FAN_SPEED_CNTL2 B49 BB_LED_FAN8_R
A50 P5V_STBY B50 GND
Table 87. 50-pin Front Panel Connector (J1J2)
Pin# Signal Name Pin # Signal Name
1 PWR_LCD_5VSB 2 PWR_LCD_5VSB
3 TP_J1H5_3 4 HDD_LED_ACT_L
5 FP_STATUS_LED1_L 6 RST_IDE_L
7 FP_STATUS_LED2_L 8 5VSTBY
9 5VSTBY 10 FP_PWR_LED_L
11 3.3V 12 IPMB_I2C_5VSB_SDA
13 GND 14 IPMB_I2C_5VSB_SCL
15 FP_ID_LED_L 16 FP_PWR_BTN_L
17 LAN_LINKB_L 18 HDD_FAULT_LED_L
19 LAN_ACT_B_L 20 FP_RST_BTN_L
21 PS_I2C_5VSB_SDA 22 GND
23 PS_I2C_5VSB_SCL 24 FP_ID_BTN_L
25 FP_CHASSIS_INTRU 26 TP_J1H5_26
27 LAN_LINKA_L 28 LAN_ACT_A_L
29 GND 30 FP_NMI_BTN_L
31 SPB_EN_L 32 SPB_DSR
33 SPB_SOUT 34 SPB_SIN
35 SPB_CTS_L 36 SPB_RTS_L
37 SPB_DCD_L 38 SPB:DTR_L
39 TEMP_PWM_R 40 VIDEO_IN_USE
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41 GND 42 V_IO_VSYNC_BUFF_FP_L
43 GND 44 V_IO_HSYNC_BUFF_FP_L
45 GND 46 V_IO_BLUE_CONN_FP
47 GND 48 V_IO_GREEN_CONN_FP_L
49 GND 50 V_IO_RED_CONN_FP_L
7.3.2 SSI Compliant 34-pin Front Panel Connector
Table 88. Front Panel SSI Standard 34-pin Connector (J1J1)
Pin Signal Name Front Panel Pinout Pin Signal Name
1 P5V 2 P5V_STBY
3 Key 4 P5V_STBY
5 FP_PWR_LED_L 6 FP_COOL_FLT_LED_R
7 P5V 8 P5V_STBY
9 HDD_LED_ACT_R 10 FP_STATUS_LED2_R
11 FP_PWR_BTN_L 12 LAN_ACT_A_L
13 GND 14 LAN_LINKA_L
15 Reset Button 16 PS_I2C_5VSB_SDA
17 GND 18 PS_I2C_5VSB_SCL
19 FP_SLP_BTN_L 20 FP_CHASSIS_INTRU
21 GND 22 LAN_ACT_B_L
23 FP_NMI_BTN_L 24 LAN_LINKB_L
25 Key 26 Key
27 P5V_STBY 28 P5V_STBY
29 FP_ID_LED_L 30 FP_STATUS_LED1_R
31 FP_ID_BTN_L 32 P5V
33 GND 34 FP_HDD_FLT_LED_R
7.4 I/O Connectors
7.4.1 VGA Connector
The following table details the pinout definition of the VGA connector (J6A1).
Table 89. VGA Connector Pinout (J6A1)
Pin Signal Name
1 Red (analog color signal R)
2 Green (analog color signal G)
3 Blue (analog color signal B)
4 No connection
5 GND
6 GND
7 GND
O O
O
O O
O O
O O
O O
O O
O O
O O
O O Intruder
O O
NMI O O
O O
O O
O O
O O
SMBus
LAN A
Link / Act
System
Fault
Front Panel Pinout
Sleep
Button
ID LED
ID Button
Power
LED Cool Fault
HDD
LED
Power
Button
Reset
Button
LAN B
Link / Act
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Pin Signal Name
8 GND
9 Fused VCC (+5V)
10 GND
11 No connection
12 DDCDAT
13 HSYNC (horizontal sync)
14 VSYNC (vertical sync)
15 DDCCLK
7.4.2 NIC Connectors
The Server Board SE7320VP2 provides two RJ45 NIC connectors oriented side by side on the
back edge of the board (J8A1, J8A2). The pinout for each connector is identical and is defined
in the following table:
Table 90. RJ-45 10/100/1000 NIC Connector Pinout (J8A1, J8A2)
Pin Signal Name
1
2 LAN_MID0P
3 LAN_MID0N
4 LAN_MID1P
5 LAN_MID2P
6 LAN_MID2N
7 LAN_MID1N
8 LAN_MID3P
9 LAN_MID3N
10 P2V5_NIC
11 LAN_LINK_1000_L (LED)
12 LAN_LINK_100_L_R (LED)
13 LAN_ACT_L (LED)
14 LAN_LINK_L_R (LED)
15 GND
16 GND
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7.4.3 ATA-100 Connector
The Server Board SE7320VP2 provides one legacy ATA-100 40-pin connector (J3K1). The
pinout is defined in the following table. Its signals are not tied to the ATA functionality embedded
into the high-density 100-pin front panel connector. Each connector is configured to a separate
ATA port embedded in the 6300ESB ICH.
Table 91. ATA-100 40-pin Connector Pinout (J3K1)
Pin Signal Name Pin Signal Name
1 RST_IDE_P_L 2 GND
3 IDE_PDD_7 4 IDE_PDD_8
5 IDE_PDD_6 6 IDE_PDD_9
7 IDE_PDD_5 8 IDE_PDD_10
9 IDE_PDD_4 10 IDE_PDD_11
11 IDE_PDD_3 12 IDE_PDD_12
13 IDE_PDD_2 14 IDE_PDD_13
15 IDE_PDD_1 16 IDE_PDD_14
17 IDE_PDD_0 18 IDE_PDD_15
19 GND 20 KEY
21 IDE_PDDREQ 22 GND
23 IDE_PDIOW_L 24 GND
25 IDE_PDIOR_L 26 GND
27 IDE_PIORDY 28 GND
29 IDE_PDDACK_L 30 GND
31 IRQ_IDE_P 32 Test Point
33 IDE_PDA1 34 IDE_CBL_DET_P
35 IDE_PDA0 36 IDE_PDA2
37 IDE_PDCS1_L 38 IDE_PDCS3_L
39 IDE_PRI_HD_ACT_L 40 GND
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7.4.4 SATA Connectors
The Server Board SE7320VP2 provides two SATA (Serial ATA) connectors: SATA-0 (J1H1)
and SATA-1 (J1H4), for use with an internal SATA backplane. The pin configuration for each
connector is identical and is defined in the following table.
Table 92. SATA Connector Pinout (J1H1 and J1H4)
Pin Signal Name
1 GND1
2 S_ATA#_TX_P
3 S_ATA#_TX_N
4 GND2
5 S_ATA#_RX_N
6 S_ATA#_RX_P
7 GND3
8 GND4
9 GND5
7.4.5 Floppy Controller Connector
The following table details the pinout of the 34-pin legacy floppy drive connector (J3K2). These
signals are common to those used in the high-density 100-pin front panel connector. Concurrent
use of these connectors is not supported.
Table 93. Legacy 34-pin Floppy Drive Connector Pinout (J3K2)
Pin Signal Name Pin Signal Name
1 GND 2 FD_DENSEL0
3 GND 4 Test Point
5 KEY 6 FD_DENSEL1
7 GND 8 FD_INDEX_L
9 GND 10 FD_MTR0_L
11 GND 12 FD_DS1_L
13 GND 14 FD_DS0_L
15 GND 16 FD_MTR1_L
17 Test Point 18 FD_DIR_L
19 GND 20 FD_STEP_L
21 GND 22 FD_WDATA_L
23 GND 24 FD_WGATE_L
25 GND 26 FD_TRK0_L
27 Test Point 28 VCC
29 GND 30 FD_RDATA_L
31 GND 32 FD_HDSEL_L
33 GND 34 FD_DSKCHG_L
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7.4.6 Serial Port Connectors
The Server Board SE7320VP2 provides one external RJ45 Serial B port (J9A2) and one internal
9-pin Serial A header (J1A3). The following tables define the pinouts for each.
Table 94. External RJ-45 Serial B Port Pinout (J9A2)
Pin Signal Name Description
1 RTS Request To Send
2 DTR Data Terminal Ready
3 TXD Transmit Data
4 GND Ground
5 RI Ring Indicate
6 RXD Receive Data
7 DSR / DCD Data Set Ready / Data Carrier Detect1
8 CTS Clear To Send
Note:
1. A jumper block on the server board will determine whether DSR or DCD is routed to
pin 7. The board will have the jumper block configured with DSR enabled at
production.
Table 95. Internal 9-pin Serial A Header Pinout (J1A3)
Pin Signal Name
1 DCD (carrier detect)
2 DSR (data set ready)
3 RXD (receive data)
4 RTS (request to send)
5 TXD (Transmit data)
6 CTS (clear to send)
7 DTR (Data terminal ready)
8 RI (Ring Indicate)
9 Ground
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7.4.7 Keyboard and Mouse Connector
Two stacked PS/2 ports (J9A1) are provided to support both a keyboard and a mouse. Either
PS/2 port can support a mouse or keyboard. The following table details the pinout of the PS/2
connector.
Table 96. Stacked PS/2 Keyboard and Mouse Port Pinout (J9A1)
Pin Signal Name
1 Keyboard Data
2 Test point – keyboard
3 GND
4 Keyboard / mouse power
5 Keyboard Clock
6 Test point – keyboard / mouse
7 Mouse Data
8 Test point – keyboard / mouse
9 GND
10 Keyboard / mouse power
11 Mouse Clock
12 Test point – keyboard / mouse
13 GND
14 GND
15 GND
16 GND
17 GND
7.4.8 USB Connector
The following table details the pinout of the external USB connectors (J5A1, J6A2) found on the
back edge of the server board.
Table 97. External USB Connector Pinout (J5A1, J6A2)
Pin Signal Name
1 USB_PWR
2 DATAL0 (Differential data line paired with DATAH0)
3 DATAH0 (Differential data line paired with DATAL0)
4 GND
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One 1x10 connector on the baseboard (J1F1) provides an option to support an additional two
USB ports. The pinout of the connector is detailed in the following table.
Table 98. Internal USB Connector Pinout (J1F1)
Pin Signal name Description
1 USB_PWR USB Power (Ports 0,1)
2 USB_PWR USB Power (Ports 0,1)
3 USB_BCK4_L USB Port 0 Negative Signal
4 USB_BCK4 USB Port 0 Positive Signal
5 USB_BCK5_L USB Port 1 Negative Signal
6 USB_BCK5 USB Port 1 Positive Signal
7 Ground
8 Ground
9 TP_USB2PIN_P9 TEST POINT
10 TP_USB2PIN_P10 TEST POINT
7.5 Fan Headers
The baseboard provides three SSI compliant 3-pin fan connectors. Two designated as
processor cooling fans: CPU1 Fan (J7F1) and CPU2 Fan (J5F2), and one designated as a PCI
Fan Connector (J3K3)
Table 99. SSI Fan Connector Pinout (J7F1, J5F2, J3K3)
Pin Signal Name Type Description
1 Fan Tach Out FAN_TACH signal is connected to the BMC to monitor the FAN speed
2 12V Power Power Supply 12V
3 Ground GND GROUND is the power supply ground
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In addition to the standard SSI fan headers to support the system fans, the baseboard includes
a proprietary 24-pin fan connector (J3K5) to power and monitor system fans used in the Intel
Server Chassis SR1400 and SR2400. The following table provides the pinout for this connector.
Table 100. Intel Server Chassis Fan Header Pinout (J3K5)
Pin Signal Name Type Description
1 BB_LED_FAN4_R IN
2 BB_LED_FAN2_R IN
3 BB_LED_FAN3_R IN
4 BB_LED_FAN1_R IN
5 FAN_TACH8 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
6 FAN_TACH4 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
7 FAN_TACH7 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
8 FAN_TACH3 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
9 FAN_TACH6 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
10 FAN_TACH2 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
11 FAN_TACH5 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
12 FAN_TACH1 OUT FAN_TACH signal is connected to the BMC to monitor the FAN speed
13 GND GROUND
14 GND GROUND
15 GND GROUND
16 GND GROUND
17 FAN_SPEED_CNTL2 POWER Power supplied through fan speed control circuitry
18 FAN_SPEED_CNTL1 POWER Power supplied through fan speed control circuitry
19 FAN_SPEED_CNTL2 POWER Power supplied through fan speed control circuitry
20 FAN_SPEED_CNTL2 POWER Power supplied through fan speed control circuitry
21 BB_LED_FAN7_R IN
22 BB_LED_FAN5_R IN
23 BB_LED_FAN8_R IN
24 BB_LED_FAN6_R IN
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7.6 Configuration Jumpers
7.6.1 System Recovery and Update Jumpers
The Server Board SE7320VP2 provides three 3-pin headers (J1H2, J1H3, J1H5), that are used
to configure several system recovery and update options. Pin 1 on the jumper is denoted by “*”.
Figure 18. Server Board SE7320VP2 Configuration Jumpers (J1H2, J1H3, J1H5)
Table 101. Recovery Jumper [J1H2, J1H3, J1H5]
Jumper Name Pins What happens at system reset…
1-2 These pins should be jumpered for normal system operation. J1H2: Password
Clear 2-3 If these pins are jumpered, administrator and user passwords will be cleared on the
next reset. These pins should not be jumpered for normal operation.
1-2 These pins should be jumpered for normal system operation. J1H3: Recovery
Boot 2-3 If these pins are jumpered, the system will attempt to recover the BIOS by loading the
BIOS code into the flash device from a floppy disk. his jumper is typically used when
the BIOS has become corrupted. These pins should not be jumpered for normal
operation.
1-2 These pins should be jumpered for normal system operation. J1H5: CMOS
Clear 2-3 If these pins are jumpered, the CMOS settings will be cleared on the next reset. These
pins should not be jumpered for normal operation.
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7.6.2 BIOS Select Jumper
The jumper block J1A4, located just to the left of the Serial A port header, is used to select
which BIOS image the system will boot using. Pin 1 on the jumper is denoted by “*”.
Figure 19. BIOS Select Jumper (J1A4)
Table 102. BIOS Select Jumper [J1A4]
Pins What happens at system reset…
1-2 System is configured for normal operation
2-3 Force BIOS to lower bank
7.6.3 External RJ45 Serial Port Jumper Block
The jumper block J8A3, located directly behind the external low-profile RJ45 serial port, is used
to configure either a DSR or a DCD signal to the connector. See Section 3.4.9.2.3 for additional
information on serial port usage.
Design and Environmental Specifications Intel® Server Board SE7320VP2
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8. Design and Environmental Specifications
8.1 Server Board SE7320VP2 Design Specification
Operation of the Server Board SE7320VP2 at conditions beyond those shown in the following
table may cause permanent damage to the system. Exposure to absolute maximum rating
conditions for extended periods may affect system reliability.
Table 103. Board Design Specifications
Operating Temperature 5º C to 50º C 1
Non-Operating Temperature -40º C to 70º C (-40º F to 158º F)
DC Voltage ± 5% of all nominal voltages
Shock (Unpackaged) Trapezoidal, 50 g, 170 inches/sec
Shock (Packaged) (≥ 40 lbs to < 80 lbs) 24 inches
Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
Note:
1. Chassis design must provide proper airflow to avoid exceeding Intel® Xeon™ processor
maximum case temperature.
Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
8.2 Power Supply Requirements
Note: The information provided in this section was derived from Intel’s 450W power supply
specification designed for use in the Intel® Server Chassis SR1400 LC. The figures provided
and the values in the tables are meant for reference purposes only and are based on a 1U rack
server configuration. Variations in system configurations may produce different values.
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8.2.1 Output Connectors
Listed or recognized component appliance wiring material (AVLV2), CN, rated min 105°C,
300Vdc shall be used for all output wiring.
Note: The following diagram shows the power harness spec drawing as defined for use in Intel
server chassis. Reference chassis designs may or may not require all of the connectors shown
and different wiring material may be needed to meet specific platform requirements.
Figure 20. Power Harness Specification Drawing
Notes:
1. ALL DIMENSIONS ARE IN MM
2. ALL TOLERANCES ARE +10 MM / -0 MM
3. INSTALL 1 TIE WRAP WITHIN 12MM OF THE PSU CAGE
4. MARK REFERENCE DESIGNATOR ON EACH CONNECTOR
5. TIE WRAP EACH HARNESS AT APPROX. MID POINT
6. TIE WRAP P1 WITH 2 TIES AT APPROXIMATELY 15M SPACING.
7. P4 HARNESS IS ARESERVED FOR THE FUTURE ONLY, NO
8. PLEMENTATION IS NEEDED CURRENTLY.
9. TIE WRAP P1 AND P2 TOGETHER AT THIS POINT.
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P1 Main Power Connector
Connector housing: 24-pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent
Contact: Molex Mini-Fit, HCS, female, crimp 44476 or equivalent
Table 104. P1 Main Power Connector
Pin SIgnal 18 AWG Color Pin SIgnal 18 AWG Color
1 +3.3 VDC Orange 13 +3.3 VDC Orange
2 +3.3 VDC Orange 14 -12 VDC Blue
3 COM Black 15 COM Black
4 +5 VDC* Red 16 PSON# Green
5 COM Black 17 COM Black
6 +5 VDC Red 18 COM Black
7 COM Black 19 COM Black
8 PWR OK Gray 20 Reserved N.C.
9 5VSB Purple 21 +5 VDC Red
10 +12V3 Yellow/Blue Stripe 22 +5 VDC Red
11 +12V3 Yellow/Blue Stripe 23 +5 VDC Red
12 +3.3 VDC Orange 24 COM Black
Notes:
5V Remote Sense Double Crimped into pin 4.
3.3V Locate Sense Double Crimped into pin 2.
P2 Processor Power Connector
Connector housing: 8-pin Molex 39-01-2085 or equivalent
Contact: Molex 44476-1111 or equivalent
Table 105. P2 Processor Power Connector
Pin SIgnal 18 AWG Color Pin SIgnal 18 AWG Color
1 COM Black 5 +12V1 Yellow
2 COM Black 6 +12V1 Yellow
3 COM Black 7 +12V2 Yellow/Black Stripe
4 COM Black 8 +12V2 Yellow/Black Stripe
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P3 Power Signal Connector
Connector housing: 5-pin Molex 50-57-9705 or equivalent
Contacts: Molex 16-02-0087 or equivalent
Table 106. P3 Baseboard Signal Connector
Pin SIgnal 24 AWG Color
1 I2C Clock White/Green Stripe
2 I2C Data White/Yellow Stripe
3 Alert# White
4 COM Black
5 3.3RS White/Brown Stripe
P7 Hard Drive Back Plane Power Connector
Connector housing: 6-pin Molex Mini-Fit Jr. PN# 39-01-2065 or equivalent
Contact: Molex Mini-Fit, HCS, female, crimp 44476 or equivalent
Table 107. P7 Hard Drive Power Connector
Pin Signal 18 AWG Color
1 Ground Black
2 Ground Black
3 5V Red
4 +12V3 Yellow/Blue Stripe
5 +12V3 Yellow/Blue Stripe
6 5VSB Purple
8.2.2 Grounding
The ground of the pins of the power supply output connector provides the power return path.
The output connector ground pins shall be connected to safety ground (power supply
enclosure). This grounding must be designed to ensure passing the maximum allowed
Common Mode Noise levels.
The power supply shall be provided with a reliable protective earth ground. All secondary
circuits shall be connected to protective earth ground. Resistance of the ground returns to
chassis shall not exceed 1.0 mΩ. This path may be used to carry DC current.
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8.2.3 Remote Sense
The power supply has remote sense return (ReturnS) to regulate out ground drops for all output
voltages; +3.3V, +5V, +12V1, +12V2, +12V3, -12V, and 5VSB. The power supply uses remote
sense (3.3VS) to regulate out drops in the system for the +3.3V output. The +5V, +12V1,
+12V2, +12V3, –12V, and 5VSB outputs only use remote sense referenced to the ReturnS
signal.
The remote sense input impedance to the power supply must be greater than 200Ω on 3.3VS,
5VS. This is the value of the resistor connecting the remote sense to the output voltage internal
to the power supply. Remote sense must be able to regulate out a minimum of 200mV drop on
the +3.3V output. The remote sense return (ReturnS) must be able to regulate out a minimum of
200mV drop in the power ground return. The current in any remote sense line shall be less than
5mA to prevent voltage sensing errors.
The power supply must operate within specification over the full range of voltage drops from the
power supply’s output connector to the remote sense points.
8.2.4 Standby Outputs
The 5VSB output shall be present when an AC input greater than the power supply turn on
voltage is applied.
8.2.5 Voltage Regulation
The power supply output voltages must stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise.
All outputs are measured with reference to the return remote sense signal (ReturnS). The 5V,
12V1, 12V2, +12V3, –12V and 5VSB outputs are measured at the power supply connectors
referenced to ReturnS. The +3.3V is measured at it remote sense signal (3.3VS) located at the
signal connector.
Table 108. V o lta ge Re gu lation Limits
Parameter Tolerance Minimum Nominal Maximum Units
+ 3.3V - 5% / +5% +3.14 +3.30 +3.46 Vrms
+ 5V - 5% / +5% +4.75 +5.00 +5.25 Vrms
+ 12V1 - 5% / +5% +11.40 +12.00 +12.60 Vrms
+ 12V2 - 5% / +5% +11.40 +12.00 +12.60 Vrms
+ 12V3 - 5% / +5% +11.40 +12.00 +12.60 Vrms
- 12V - 5% / +9% -11.40 -12.00 -13.08 Vrms
+ 5VSB - 5% / +5% +4.75 +5.00 +5.25 Vrms
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8.2.6 Dynamic Loading
The output voltages shall remain within limits specified for the step loading and capacitive
loading specified in the table below. The load transient repetition rate shall be tested between
50Hz and 5kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only
a test specification. The ∆ step load may occur anywhere within the MIN load to the MAX load
conditions.
Table 109. Transient Load Requirements
Output ∆ Step Load Size
(See note 2) Load Slew Rate Test Capacitive Load
+3.3V 5.0A 0.25 A/µsec 250 µF
+5V 4.0A
0.25 A/µsec 400 µF
12V1+12V2+12V3 20.0A 0.25 A/µsec 2200 µF 1, 3
+5VSB 0.5A 0.25 A/µsec 20 µF
Notes
1. Step loads on each 12V output may happen simultaneously.
2. For Load Range 2 (light system loading), the tested step load size should be 60% of those listed.
3. The +12V should be tested with 1000µF evenly split between the three +12V rails.
8.2.7 Capacitive Loading
The power supply shall be stable and meet all requirements with the following capacitive
loading ranges.
Table 110. Capacitve Loading Conditions
Output MIN MAX Units
+3.3V 250 6,800 µF
+5V 400 4,700 µF
+12V(1, 2, 3) 500 each 11,000 µF
-12V 1 350 µF
+5VSB 20 350 µF
8.2.8 Closed Loop Stability
The power supply shall be unconditionally stable under all line/load/transient load conditions
including capacitive load ranges. A minimum of: 45 degrees phase margin and -10dB-gain
margin is required. Closed-loop stability must be ensured at the maximum and minimum loads
as applicable.
8.2.9 Common Mode Noise
The Common Mode noise on any output shall not exceed 350mV pk-pk over the frequency
band of 10Hz to 30MHz.
Design and Environmental Specifications Intel® Server Board SE7320VP2
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8.2.10 Ripple / Noise
The maximum allowed ripple/noise output of the power supply is defined in the following table.
This is measured over a bandwidth of 0Hz to 20MHz at the power supply output connectors.
Table 111. Ripple and Noise
+3.3V +5V +12V1/2 -12V +5VSB
50mVp-p 50mVp-p 120mVp-p 120mVp-p 50mVp-p
8.2.11 Soft Starting
The power supply shall contain a control circuit that provides monotonic soft start for its outputs
without overstress of the AC line or any power supply components at any specified AC line or
load conditions. There is no requirement for rise time on the 5V Standby but the turn on/off shall
be monotonic.
8.2.12 Zero Load Stability Requirements
When the power subsystem operates in a no load condition, it does not need to meet the output
regulation specification, but it must operate without any tripping of over-voltage or other fault
circuitry. When the power subsystem is subsequently loaded, it must begin to regulate and
source current without fault. Each output voltage may not be internally diode isolated. At the
same time failure in the primary side of one power supply doesn’t cause the other to shut down.
8.2.13 Timing Requirements
These are the timing requirements for the power supply operation. The output voltages must
rise from 10% to within regulation limits (Tvout_rise) within 5 to 70ms, except for 5VSB - it is
allowed to rise from 1.0 to 70ms. The +3.3V, +5V and +12V output voltages should start to rise
approximately at the same time. All outputs must rise monotonically. The +5V output needs
to be greater than the +3.3V output during any point of the voltage rise. The +5V output must
never be greater than the +3.3V output by more than 2.25V. Each output voltage shall reach
regulation within 50ms (Tvout_on) of each other during turn on of the power supply. Each output
voltage shall fall out of regulation within 400msec (Tvout_off) of each other during turn off. The
following figures show the timing requirements for the power supply being turned on and off via
the AC input, with PSON held low and the PSON signal, with the AC input applied.
Table 112. Output Voltage Timing
Item Description Minimum Maximum Units
Tvout_rise Output voltage rise time from each main output. 5.0 * 70 * msec
Tvout_on All main outputs must be within regulation of each
other within this time. 50
msec
T vout_off All main outputs must leave regulation within this
time. 400
msec
Note:
The 5VSB output voltage rise time shall be from 1.0ms to 25.0ms
Intel® Server Board SE7320VP2 Design and Environmental Specifications
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Figure 21. Output Voltage Timing
Table 113. Turn On/Off Timing
Item Description Minimum Maximum Units
Tsb_on_delay Delay from AC being applied to 5VSB being within regulation. 1500
msec
T ac_on_delay Delay from AC being applied to all output voltages being
within regulation. 2500
msec
Tvout_holdup Time all output voltages stay within regulation after loss of
AC. 21 msec
Tpwok_holdup Delay from loss of AC to de-assertion of PWOK 20 msec
Tpson_on_delay Delay from PSON# active to output voltages within regulation
limits. 5 400
msec
T pson_pwok Delay from PSON# deactive to PWOK being de-asserted. 50
msec
Tpwok_on Delay from output voltages within regulation limits to PWOK
asserted at turn on. 100 1000 msec
T pwok_off Delay from PWOK de-asserted to output voltages (3.3V, 5V,
12V, -12V) dropping out of regulation limits. 1 msec
Tpwok_low Duration of PWOK being in the de-asserted state during an
off/on cycle using AC or the PSON signal. 100 msec
Tsb_vout Delay from 5VSB being in regulation to O/Ps being in
regulation at AC turn on. 50 1000
msec
T5VSB_holdup Time the 5VSB output voltage stays within regulation after
loss of AC. 70 msec
Vout
10%
Vout
Tvout rise
Tvout_on
Tvout_off
V1
V2
V3
V4
Design and Environmental Specifications Intel® Server Board SE7320VP2
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Figure 22. Turn On/Off Timing (Power Supply Signals)
8.2.14 Residual Voltage Immunity in Standby Mode
The power supply should be immune to any residual voltage placed on its outputs (Typically a
leakage voltage through the system from standby output) up to 500mV. There shall be no
additional heat generated, nor stress of any internal components with this voltage applied to any
individual output, and all outputs simultaneously. It also should not trip the protection circuits
during turn on.
The residual voltage at the power supply outputs for no load condition shall not exceed 100mV
when AC voltage is applied.
AC Input
Vout
PWOK
5VSB
PSON
T
sb_on_delay
T
AC_on_delay
T
pwok_on
Tvout_holdup
T
pwok_holdup
T
pson_on_delay
Tsb_on_delay T
pwok_on
Tpwok_off Tpwok_off
Tpson_pwok
Tpwok_low
T
sb_vout
AC turn on/off cycle
PSON turn on/off cycle
T5VSB_holdup
Intel® Server Board SE7320VP2 Design and Environmental Specifications
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8.3 Product Regulatory Compliance
8.3.1 Product Safety Compliance
The Server Board SE7320VP2 complies with the following safety requirements:
UL 1950 - CSA 950 (US/Canada)
EN 60 950 (European Union)
IEC60 950 (International)
CE – Low Voltage Directive (73/23/EEC) (European Union)
EMKO-TSE (74-SEC) 207/94 (Nordics)
GOST R 50377-92 (Russia)
8.3.2 Product EMC Compliance
The Server Board SE7320VP2 has been tested and verified to comply with the following
electromagnetic compatibility (EMC) regulations when installed a compatible Intel® host system.
For information on compatible host system(s) refer to Intel’s Server Builder Web site or contact
your local Intel representative.
FCC (Class A Verification) – Radiated and Conducted Emissions (USA)
ICES-003 (Class A) – Radiated and Conducted Emissions (Canada)
CISPR 22, 3rd Edition (Class A) – Radiated and Conducted Emissions (International)
EN55022 (Class A) – Radiated and Conducted Emissions (European Union)
EN55024 (Immunity) (European Union)
CE – EMC Directive (89/336/EEC) (European Union)
VCCI (Class A) – Radiated and Conducted Emissions (Japan)
AS/NZS 3548 (Class A) – Radiated and Conducted Emissions (Australia / New Zealand)
RRL (Class A) Radiated and Conducted Emissions (Korea)
BSMI CNS13438 (Class A) Radiated and Conducted Emissions (Taiwan)
GOST R 29216-91 (Class A) Radiated and Conducted Emissions (Russia)
GOST R 50628-95 (Immunity) (Russia)
Design and Environmental Specifications Intel® Server Board SE7320VP2
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8.3.3 Product Regulatory Compliance Markings
This product is marked with the following Product Certification Markings:
Table 114. Product Certification Markings
UL Recognition Mark
CE Mark
Russian GOST Mark
Australian C-Tick Mark
BSMI DOC Marking
BSMI EMC Warning
RRL MIC Mark
8.4 Electromagnetic Compatibility Notices
8.4.1 FCC (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
Intel® Server Board SE7320VP2 Design and Environmental Specifications
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Intel order number C91056-002 179
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment to an outlet on a circuit other than the one to which the receiver
is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void
the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class A or B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with
cables, connected to peripherals, that are not shielded and grounded may result in interference
to radio and TV reception.
8.4.2 Industry Canada (ICES-003)
This digital apparatus does not exceed the Class A limits for radio noise emissions from digital
apparatus set out in the interference-causing equipment standard entitled: “Digital Apparatus,”
ICES-003 of the Canadian Department of Communications.
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils
numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Apparelis
Numériques”, NMB-003 édictee par le Ministre Canadian des Communications.
8.4.3 Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
8.4.4 Taiwan Declaration of Conformity
This product has been tested and complies with CNS13438. The product has been marked with
the BSMI DOC mark to illustrate compliance.
Design and Environmental Specifications Intel® Server Board SE7320VP2
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8.4.5 Korean RRL Compliance
This product has been tested and complies with MIC Notices No. 1997-41 and 1997-42. The
product has been marked with the MIC logo to illustrate compliance.
The English translation for the above is as follows:
1. Type of Equipment (Model Name): SE7320VP2
2. Certification No.: Contact Intel Representative
3. Name of Certification Recipient: Intel
4. Date of Manuf acturer: Marked on Product
5. Manufacturer / Nation : Intel
8.4.6 Australia / New Zealand
This product has been tested and complies with AS/NZS 3548. The product has been marked
with the C-Tick mark to illustrate compliance.
Intel® Server Board SE7320VP2 Appendix A: Integration and Usage Tips
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Intel order number C91056-002 181
Appendix A: Integration and Usage Tips
The Server Board SE7320VP2, as integrated into the Server Chassis SR1400 LC to
form the Server Platform SR1435VP2 or in the Server Chassis SR2400, will support
FCC Class A with 3dB of margin. The margin of compliance can be greatly improved if
shielded Ethernet cables are used.
When adding or removing components or peripherals from the server board, AC power
must be removed. With AC plugged in to the server board, 5-volt standby is still present
even though the server board is powered off.
Processors must be installed in order. CPU 1 is located near the edge of the server
board and must be populated to operate the board.
On the back edge of the server board are four diagnostic LEDs which display a
sequence of Red, Green, or Amber POST codes during the boot process. Should your
server board hang during POST, the LEDs will display the last POST event run before
the hang. The decoder for these POST code LED sequences can be found in section 6.5
of this document.
The active riser card is not supported on the Intel® Server Board SE7320VP2.
Slots in the full-height riser should be populated bottom to top in the 2U system.
Glossary Intel® Server Board SE7320VP2
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Glossary
This appendix contains important terms used in the preceding chapters. For ease of use,
numeric entries are listed first (e.g., “82460GX”) with alpha entries following (e.g., “AGP 4x”).
Acronyms are then entered in their respective place, with non-acronyms following.
Term Definition
ACPI Advanced Configuration and Power Interface
AP Application Processor
APIC Advanced Programmable Interrupt Control
ASIC Application Specific Integrated Circuit
BIOS Basic Input/Output System
BIST Built-In Self Test
BMC Baseboard Management Controller
Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP Bootstrap Processor
byte 8-bit quantity.
CBC Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK Common Enabling Kit
CHAP Challenge Handshake Authentication Protocol
CMOS In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the baseboard.
DPC Direct Platform Control
EEPROM Electrically Erasable Programmable Read-Only Memory
EHCI Enhanced Host Controller Interface
EMP Emergency Management Port
EPS External Product Specification
FMB Flexible Mother Board
FMC Flex Management Connector
FMM Flex Management Module
FRB Fault Resilient Booting
FRU Field Replaceable Unit
FSB Front Side Bus
GB 1024 MB
GPIO General Purpose I/O
GTL Gunning Transceiver Logic
HSC Hot-Swap Controller
Hz Hertz (1 cycle/second)
I2C Inter-Integrated Circuit Bus
IA Intel® Architecture
IBF Input Buffer
ICH I/O Controller Hub
ICMB Intelligent Chassis Management Bus
IERR Internal Error
IFB I/O and Firmware Bridge
Intel® Server Board SE7320VP2 Glossary
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Term Definition
INTR Interrupt
IP Internet Protocol
IPMB Intelligent Platform Management Bus
IPMI Intelligent Platform Management Interface
IR Infrared
ITP In-Target Probe
KB 1024 bytes
KCS Keyboard Controller Style
LAN Local Area Network
LCD Liquid Crystal Display
LED Light Emitting Diode
LPC Low Pin Count
LUN Logical Unit Number
MAC Media Access Control
MB 1024 KB
mBMC National Semiconductor© PC87431x mini BMC
MCH Memory Controller Hub
MD2 Message Digest 2 – Hashing Algorithm
MD5 Message Digest 5 – Hashing Algorithm – Higher Security
ms milliseconds
MTTR Memory Tpe Range Register
Mux Multiplexor
NIC Network Interface Controller
NMI Nonmaskable Interrupt
OBF Output Buffer
OEM Original Equipment Manufacturer
Ohm Unit of electrical resistance
PEF Platform Event Filtering
PEP Platform Event Paging
PIA Platform Information Area (This feature configures the firmware for the platform hardware)
PLD Programmable Logic Device
PMI Platform Management Interrupt
POST Power-On Self Test
PSMI Power Supply Management Interface
PWM Pulse-Width Modulation
RAM Random Access Memory
RASUM Reliability, Availability, Serviceability, Usability, and Manageability
RISC Reduced Instruction Set Computing
ROM Read Only Memory
RTC Real-Time Clock (Component of ICH peripheral chip on the baseboard)
SDR Sensor Data Record
SECC Single Edge Connector Cartridge
SEEPROM Serial Electrically Erasable Programmable Read-Only Memory
SEL System Event Log
Glossary Intel® Server Board SE7320VP2
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Term Definition
SIO Server Input/Output
SMI Server Management Interrupt (SMI is the highest priority nonmaskable interrupt)
SMM Server Management Mode
SMS Server Management Software
SNMP Simple Network Management Protocol
TBD To Be Determined
TIM Thermal Interface Material
UART Universal Asynchronous Receiver/Transmitter
UDP User Datagram Protocol
UHCI Universal Host Controller Interface
UTC Universal time coordinare
VID Voltage Identification
VRD Voltage Regulator Down
Word 16-bit quantity
ZIF Zero Insertion Force
Intel® Server Board SE7320VP2 Reference Documents
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Intel order number C91056-002 185
Reference Documents
See the following documents for additional information:
Intel® Server Board SE7320VP2 BIOS External Product Specification. Intel Corporation
Mini Baseboard Management Controller mBMC Core External Product Specification.
Intel Corporation
Intel® Server Chassis SR1400 LC and SR2400 Technical Product Specification, Intel
Corporation.
Advanced Configuration and Power Interface Specification. Intel Corporation, Microsoft
Corporation, Toshiba Corporation.
Intelligent Chassis Management Bus (ICMB) Specification, Version 1.0. Intel
Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.
Intelligent Platform Management Bus Communications Protocol Specification, Version
1.0. 1998. Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell
Computer Corporation.
Intelligent Platform Management Interface Specification, Version 1.5. Intel Corporation,
Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.
Platform Management FRU Information Storage Definition. 1998. Intel Corporation,
Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.
http://developer.intel.com/design/servers/ipmi/spec.htm
The I2C Bus and How to Use It, January 1992. Phillips Semiconductors.
Power Supply Management Interface (PSMI), Revision 1.4, 2003. Intel Corporation
