© Semiconductor Components Industries, LLC, 2015
June, 2015 − Rev. 22 1Publication Order Number:
NCP500/D
NCP500, NCV500
150 mA CMOS Low Noise
Low-Dropout Voltage
Regulator
The NCP500 series of fixed output low dropout linear regulators are
designed for portable battery powered applications which require low
noise operation, fast enable response time, and low dropout. The
device achieves its low noise performance without the need of an
external noise bypass capacitor. Each device contains a voltage
reference unit, an error amplifier, a PMOS power transistor, and
resistors for setting output voltage, and current limit and temperature
limit protection circuits.
The NCP500 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 1.0 mF.
Features
•Ultra−Low Dropout Voltage of 170 mV at 150 mA
•Fast Enable Turn−On Time of 20 msec
•Wide Operating Voltage Range of 1.8 V to 6.0 V
•Excellent Line and Load Regulation
•High Accuracy Output Voltage of 2.5%
•Enable Can Be Driven Directly by 1.0 V Logic
•Typical RMS Noise Voltage 50 mV with No Bypass Capacitor
(BW = 10 Hz to 100 kHz)
•Very Small DFN 2x2.2 Package
•NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These are Pb−Free Devices
Typical Applications
•Noise Sensitive Circuits − VCO’s, RF Stages, etc.
•SMPS Post−Regulation
•Hand−Held Instrumentation
•Camcorders and Cameras
Driver w/
Current
Limit
Vin Vout
Thermal
Shutdown
Enable
GND
OFF
ON
1 (3)
3 (1)
5 (4)
2 (2, 5)
Figure 1. Simplified Block Diagram
NOTE: Pin numbers in parenthesis indicate DFN package.
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
ORDERING INFORMATION
TSOP−5
SN SUFFIX
CASE 483
1
5
PIN CONNECTIONS AND
MARKING DIAGRAMS
1
3N/C
Vin
2GND
Enable 4
Vout
5
xxx = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
(Top View)
TSOP−5
DFN 2x2.2 MM
SQL SUFFIX
CASE 506BA
1
3
N/C
Vin
2
GND
Enable
4Vout
5
6
GND
(Top View)
www.onsemi.com
xxM
xxxAYWG
G
DFN 2x2.2 mm
xx = Specific Device Code
M = Date Code
1
6
NCP500, NCV500
www.onsemi.com
2
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
PIN FUNCTION DESCRIPTION
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
TSOP−5
Pin No.
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
DFN 2x2
Pin No.
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
Pin Name
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Description
ÁÁÁÁ
ÁÁÁÁ
1
ÁÁÁÁ
ÁÁÁÁ
3
ÁÁÁÁ
ÁÁÁÁ
Vin
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Positive power supply input voltage.
ÁÁÁÁ
ÁÁÁÁ
2
ÁÁÁÁ
ÁÁÁÁ
2, 5
ÁÁÁÁ
ÁÁÁÁ
GND
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Power supply ground.
ÁÁÁÁ
ÁÁÁÁ
3
ÁÁÁÁ
ÁÁÁÁ
1
ÁÁÁÁ
ÁÁÁÁ
Enable
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
This input is used to place the device into low−power standby. When this input is pulled to a logic
low, the device is disabled. If this function is not used, Enable should be connected to Vin.
ÁÁÁÁ
ÁÁÁÁ
4
ÁÁÁÁ
ÁÁÁÁ
6
ÁÁÁÁ
ÁÁÁÁ
N/C
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
No internal connection.
ÁÁÁÁ
ÁÁÁÁ
5
ÁÁÁÁ
ÁÁÁÁ
4
ÁÁÁÁ
ÁÁÁÁ
Vout
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Regulated output voltage.
MAXIMUM RATINGS
Rating Symbol Value Unit
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Input Voltage
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
Vin
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
0 to 6.0
ÁÁÁÁ
ÁÁÁÁ
V
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Enable Voltage
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
Von/off
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
−0.3 to Vin +0.3
ÁÁÁÁ
ÁÁÁÁ
V
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Output Voltage
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
Vout
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
−0.3 to Vin +0.3
ÁÁÁÁ
ÁÁÁÁ
V
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Output Short Circuit Duration
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
−
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Infinite
ÁÁÁÁ
ÁÁÁÁ
−
Thermal Resistance, Junction−to−Ambient
TSOP−5
DFN (Note 3)
RqJA 250
225
°C/W
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Operating Junction Temperature
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
TJ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
+125
ÁÁÁÁ
ÁÁÁÁ
°C
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Storage Temperature
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
Tstg
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
−65 to +150
ÁÁÁÁ
ÁÁÁÁ
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V Latch up capability (85°C) "100 mA.
2. Device is internally limited to 160°C by thermal shutdown.
3. For more information, refer to application note, AND8080/D.
ELECTRICAL CHARACTERISTICS (Vin = 2.35 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and
max values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−1.8 V
Output Voltage (TA = −40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 1.755 1.8 1.845 V
Line Regulation (Vin = 2.3 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
140
270
10
200
350
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
175
175
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
NCP500, NCV500
www.onsemi.com
3
ELECTRICAL CHARACTERISTICS (continued) (Vin = 2.35 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and
max values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−1.85 V
Output Voltage (TA = −40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 1.804 1.85 1.896 V
Line Regulation (Vin = 2.3 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
−
−
10
−
−
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
175
175
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
ELECTRICAL CHARACTERISTICS (Vin = 3.0 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max values
TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−2.5 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 2.438 2.5 2.563 V
Line Regulation (Vin = 3.0 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
100
190
10
170
270
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
180
180
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
NCP500, NCV500
www.onsemi.com
4
ELECTRICAL CHARACTERISTICS (Vin = 3.1 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max
values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−2.6 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 2.535 2.6 2.665 V
Line Regulation (Vin = 3.0 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
−
−
10
−
−
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
180
180
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
ELECTRICAL CHARACTERISTICS (Vin = 3.2 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max
values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−2.7 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 2.633 2.7 2.768 V
Line Regulation (Vin = 3.2 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
90
180
10
160
260
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
185
185
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
NCP500, NCV500
www.onsemi.com
5
ELECTRICAL CHARACTERISTICS (Vin = 3.3 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max
values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−2.8 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 2.730 2.8 2.870 V
Line Regulation (Vin = 3.3 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
90
170
10
150
250
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
185
185
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
ELECTRICAL CHARACTERISTICS (Vin = 3.5 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max
values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−3.0 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 2.925 3.0 3.075 V
Line Regulation (Vin = 3.5 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
85
165
10
130
240
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
190
190
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
NCP500, NCV500
www.onsemi.com
6
ELECTRICAL CHARACTERISTICS (Vin = 3.8 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max
values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−3.3 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 3.218 3.3 3.383 V
Line Regulation (Vin = 3.8 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
80
150
10
110
230
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
195
195
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
ELECTRICAL CHARACTERISTICS (Vin = 5.5 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25°C, for min and max
values TA = −40°C to 85°C, Tjmax = 125°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
−5.0 V
Output Voltage
(TA =−40°C to 85°C, Iout = 1.0 mA to 150 mA) Vout 4.875 5.0 5.125 V
Line Regulation (Vin = 5.5 V to 6.0 V, Iout = 1.0 mA) Regline − 1.0 10 mV
Load Regulation (Iout = 1.0 mA to 150 mA) Regload − 15 45 mV
Dropout Voltage (Measured at Vout −2.0%, TA = −40°C to 85°C)
(Iout = 1.0 mA)
(Iout = 75 mA)
(Iout = 150 mA)
Vin−Vout −
−
−
2.0
60
120
10
100
180
mV
Output Short Circuit Current Iout(max) 200 540 700 mA
Ripple Rejection
(Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) RR − 62 − dB
Quiescent Current
(Enable Input = 0 V)
(Enable Input = 0.9 V, Iout = 1.0 mA)
(Enable Input = 0.9 V, Iout = 150 mA)
IQ−
−
−
0.01
210
210
1.0
300
300
mA
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Of f, Logic Low)
Vth(EN) 0.9
−−
−−
0.15
V
Enable Input Bias Current IIB(EN) − 3.0 100 nA
Output Turn On T ime (Enable Input = 0 V to Vin) − − 20 100 ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Maximum package power dissipation limits must be observed.
PD +TJ(max) *TA
RqJA
5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
NCP500, NCV500
www.onsemi.com
7
230
190
250
170
210
150
270
290
310
330
350
160
−50
30
60
50
20
50
75250 100
Temperature (°C)
in
out,
10
40
0−25
Temperature (°C)
Figure 2. Dropout Voltage vs. Temperature Figure 3. Dropout Voltage vs. Temperature
Vin − Vout, Dropout Voltage (mV)
−50
80
70
60
50
5025
0
40
30
20
10
0−25 75 100 125
Figure 4. Dropout Voltage vs. Temperature
Temperature (°C)
Figure 5. Dropout Voltage vs. Temperature
Temperature (°C)
Vin − Vout, Dropout Voltage (mV)
in
out,
Figure 6. Dropout Voltage vs. Temperature
Temperature (°C)
Figure 7. Dropout Voltage vs. Temperature
Temperature (°C)
in
out,
Vin − Vout, Dropout Voltage (mV)
Vout(nom.) = 3.3 V
70
125
−50
120
100
60
80
50250
40
20
0−25 75 100 125
−50 50 75250 100−25 12
160
120
180
100
140
80
200
−50 50 75250 100−25 12
120
180
100
140
80
200
220
−50 50 75250 100−25 12
Vout(nom.) = 2.8 V
Vout(nom.) = 1.8 V
Vout(nom.) = 3.3 V
Vout(nom.) = 2.8 V
Vout(nom.) = 1.8 V
50 mA Load
10 mA Load
1.0 mA Load
150 mA Load
120 mA Load
100 mA Load
150 mA Load
120 mA Load
100 mA Load
150 mA Load
120 mA Load
100 mA Load
50 mA Load
10 mA Load
1.0 mA Load
50 mA Load
10 mA Load
1.0 mA Load
NCP500, NCV500
www.onsemi.com
8
25
2.804
2.802
2.8
2.798
2.796
2.794
2.792
2.790
1.804
1.8035
1.803
1.8025
1.802
1.8015
1.801
1.8005
225
200
175
150
125
100
75
50
0
25
210
200
190
180
170
160
150
−50
3.308
3.306
50
3.304
3.302
75250 100
Temperature (°C)
out,
3.300
3.298
3.296
3.294
3.292 −25
Temperature (°C)
Figure 8. Output Voltage vs. Temperature Figure 9. Output Voltage vs. Temperature
Vout, Output Voltage (V)
Figure 10. Output Voltage vs. Temperature
Temperature (°C)
Figure 11. Quiescent Current vs. Temperature
Temperature (°C)
IQ, Quiescent Current (mA)
out,
Figure 12. Quiescent Current vs. Input Voltage
Input Voltage (V)
Figure 13. Quiescent Current vs. Input Voltage
Input Voltage (V)
Q,
m
IQ, Quiescent Current (mA)
Vout(nom.) = 1.8 V
Iout = 0 mA
TA = 25°C
125 −50 50 75250 100−25 1
−50 50 75250 100−25 125 −50 50 75250 100−25 12
0
225
200
4.0
175
150
5.03.02.0 6.0
125
100
75
50
1.0
0
Vout(nom.) = 3.3 V
Iout = 0 mA
TA = 25°C
Vin = Vout(nom.) +0.5 V
Vout(nom.) = 3.3 V
IO = 1.0 mA
0 4.0 5.03.02.0 6.
1.0
Vin = Vout(nom.) = + 0.5 V
IO = 0 mA Vout(nom.) = 3.3 V
Vout(nom.) = 1.8 V
Vin = Vout(nom.) + 0.5 V
Vout(nom.) = 2.8 V
IO = 1.0 mA
Vin = Vout(nom.) + 0.5 V
Vout(nom.) = 1.8 V
IO = 1.0 mA
NCP500, NCV500
www.onsemi.com
9
150
125
100
75
50
25
0
175
200
225
40
20
0
60
80
100
600
400
200
0
800
1000
400
300
200
100
0
500
600
150
125
100
75
50
25
0
175
200
225
Input Voltage (V)
m
Input Voltage (V)
Figure 14. Ground Pin Current vs. Input Voltage Figure 15. Ground Pin Current vs. Input Voltage
Ground Pin Current (mA)
Figure 16. Current Limit vs. Input Voltage
Input Voltage (V)
Figure 17. Ripple Rejection vs. Frequency
f, Frequency (kHz)
RR, Ripple Rejection (dB)
10 mA
Figure 18. Output Noise Density
f, Frequency (kHz)
Figure 19. Line Transient Response
Time (ms)
out,
Vout(nom.) = 1.8 V
Iout = 50 mA
TA = 25°C
0 4.0 5.03.02.0 6.01.0 0 4.0 5.03.02.0 6.
1.0
0 4.0 5.03.02.0 6.01.0 10
100.1 1.0
0.01 100 1000101.00.1
100
0
−50 6040020
150
3.0
5.0
10080 120 140 16
4.0
200
50
Vout = 1.8 V
Vin = 2.8 V
Iout = 1 mA
Cout = 1 mF
Vout(nom.) = 3.3 V
Iout = 50 mA
TA = 25°C
60 mA
10 mA
Vout = 1.8 V
Vin = 2.8 VDC + 0.5 Vp−p
Cout = 1 mF
Output Voltage
Deviation (mV) Vin, Input Voltage (V)
Vin = 3.8 V to 4.8 V
Vout = 3.3 V
Cout = 1.0 mF
Iout = 1.0 mA
Vout(nom.) = 3.3 V
NCP500, NCV500
www.onsemi.com
10
75
0
200
100
0
150
225
−100
−200
−300
3.0
200
150
100
50
4.0
5.0
0
−50
75
0
50
25
150
225
0
−25
−50
Time (ms) Time (ms)
Figure 20. Line Transient Response Figure 21. Load Transient Response
Figure 22. Load Transient Response
Time (ms)
Figure 23. Turn−off Response
Time (ms)
0 80 1006040 12020 140 160 0 40 503020 6
10
040503020 6010 70 80 90
1.0
0
4.0
3.0
04020 60
2.0
3.0
2.0
1.0
012
80 100
Output Voltage (V) Enable Voltage (V)
Deviation (mV)
out,
Current (mA)
Deviation (mV)
in,
Voltage (V)
Output Voltage
Deviation (mV) Iout, Output
Current (mA)
Cout = 1.0 mF
Cout = 10 mF
Vin = 3.8 V to 4.8 V
Vout = 3.3 V
Cout = 1.0 mF
Iout = 10 mA
Vin = 3.8 V
Vout = 3.3 V
Cout = 1.0 mF
Cin = 1 mF
Vin = 3.8 V
Vout = 3.3 V
Cout = 10 mF
Cin = 1 mF
Vin = 3.8 V
Vout = 3.3 V
TA = 25°C
RL = 3.3 kW
Cin = 1 mF
NCP500, NCV500
www.onsemi.com
11
2
1
2.5
0.5
1.5
0
3
0
1.2
1.8
4
1
1.6
5326
Vin, Input Voltage (V)
Vout, Output Voltage (V)
0.8
1.4
0.6
1
Vin, Input Voltage (V)
Vout, Output Voltage (V)
0
3.5
3
2.5
2
432
1.5
1
0.5
01567
Vin, Input Voltage (V)
Vout, Output Voltage (V)
Cin = 1 mF
Cout = 1 mF
TA = 25°C
VEnable = Vin
2
0453261
0.4
0.2
0
Cin = 1 mF
Cout = 1 mF
TA = 25°C
VEnable = Vin
Cin = 1 mF
Cout = 1 mF
TA = 25°C
VEnable = Vin
Figure 24. Output Voltage vs. Input Voltage
Figure 25. Output Voltage vs. Input Voltage
Figure 26. Output Voltage vs. Input Voltage
NCP500, NCV500
www.onsemi.com
12
DEFINITIONS
Load Regulation
The change in output voltage for a change in output load
current at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. M easured w hen the o utput d rops 2 % below i ts
nominal. The junction temperature, load current, and
minimum i nput s upply r equirements a ffect t he d ropout l evel.
Output Noise Voltage
This is the integrated value of the output noise over a
specified frequency range. Input voltage and output load
current are kept constant during the measurement. Results
are expressed in mVRMS or nV Hz
Ǹ.
Quiescent Current
The current which flows through the ground pin when the
regulator operates without a load on its output: internal IC
operation, bias, etc. When the LDO becomes loaded, this
term is called the Ground current. It is actually the dif ference
between the input current (measured through the LDO input
pin) and the output current.
Line Regulation
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low
dissipation o r b y u s i n g p u l s e t e c h n i q u e s uch that the average
chip temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltage
is excited with a given slope.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature i s exceeded. When activated at typically 160°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Maximum Package Power Dissipation
The power dissipation level at which the junction
temperature reaches its maximum operating value, i.e.
125°C.
APPLICATIONS INFORMATION
The NCP500 series regulators are protected with internal
thermal shutdown and internal current limit. A typical
application circuit is shown in Figure 27.
Input Decoupling (C1)
A 1.0 mF capacitor either ceramic or tantalum is
recommended and should be connected close to the NCP500
package. Higher values and lower ESR will improve the
overall line transient response.
Output Decoupling (C2)
The NCP500 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) or a
minimum output current. The minimum decoupling value is
1.0 mF and can be augmented to fulfill stringent load
transient requirements. The regulator accepts ceramic chip
capacitors as well as tantalum devices. Larger values
improve noise rejection and load regulation transient
response. Figure 29 shows the stability region for a range of
operating conditions and ESR values.
Noise Decoupling
The NCP500 is a low noise regulator without the need of
an e xternal b ypass c apacitor. It t ypically r eaches a n oise l evel
of 5 0 mVRMS o verall noise b etween 1 0 H z a nd 1 00 kHz. T he
classical bypass capacitor impacts the start up phase of
standard LDOs. However, thanks to its low noise
architecture, the NCP500 operates without a bypass element
and thus offers a typical 20 ms start up phase.
Enable Operation
The enable pin will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. The turn−on/turn−off transient
voltage being supplied to the enable pin should exceed a
slew rate of 10 mV/ms to ensure correct operation. If the
enable is not to be used then the pin should be connected
to Vin.
Thermal
As power across the NCP500 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
effect the rate of junction temperature rise for the part. This
is stating that when the NCP500 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
NCP500, NCV500
www.onsemi.com
13
The maximum dissipation the package can handle is
given by:
PD +TJ(max) *TA
RqJA
If TJ is not recommended to exceed 125°C, then the
NCP500 can dissipate up to 400 mW @ 25°C.
The power dissipated by the NCP500 can be calculated
from the following equation:
Ptot +ƪVin *I
gnd (Iout)ƫ)[Vin *Vout]*I
out
or
VinMAX +Ptot )Vout *Iout
Ignd )Iout
If a 150 mA output current is needed the ground current
is extracted from the data sheet curves: 200 mA @ 150 mA.
For a NCP500SN18T1 (1.8 V), the maximum input voltage
will then be 4.4 V, good for a 1 Cell Li−ion battery.
Hints
Please b e sure the V in and GND lines are suf ficiently wide.
When the impedance of these lines is high, there is a chance
to pick up noise or cause the regulator to malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short
as possible.
Package Placement
DFN packages can be placed using standard pick and
place equipment with an accuracy of "0.05 mm.
Component pick and place systems are composed of a vision
system that recognizes and positions the component and a
mechanical system which physically performs the pick and
place operation. Two commonly used types of vision
systems are: (1) a vision system that locates a package
silhouette and (2) a vision system that locates individual
bumps on the interconnect pattern. The latter type renders
more accurate place but tends to be more expensive and time
consuming. Both methods are acceptable since the parts
align due to a self−centering feature of the DFN solder joint
during solder re−flow.
Solder Paste
Type 3 or Type 4 solder paste is acceptable.
Re−flow and Cleaning
The DFN may be assembled using standard IR/IR
convection SMT re−flow processes without any special
considerations. As with other packages, the thermal profile
for specific board locations must be determined. Nitrogen
purge is recommended during solder for no−clean fluxes.
The DFN is qualified for up to three re−flow cycles at 235°C
peak (J−STD−020). The actual temperature of the DFN is a
function of:
•Component density
•Component location on the board
•Size of surrounding components
Figure 27. Typical Application Circuit
Vout
Battery or
Unregulated
Voltage C1 C2
OFF
ON
1
2
3
5
4
+
+
Figure 28. Typical Application Circuit
Vou
Battery or
Unregulated
Voltage +
C1
OFF
1
3
2
4
5
6
+
C2
NCP500, NCV500
www.onsemi.com
14
Output
R
1
2
3
5
4
Input
1.0 mF 1.0 mF
Output
1
2
3
5
4
Input
1.0 mF 1.0 mF
Q2
Q1
R3
R1
R2
The NCP500 series can be current boosted with a PNP transist-
or. Resistor R in conjunction with VBE of the PNP determines
when the pass transistor begins conducting; this circuit is not
short circuit proof. Input/Output differential voltage minimum is
increased by VBE of the pass resistor.
Short circuit current limit is essentially set by the VBE of Q2 and
R1. ISC = ((VBEQ2 − ib * R2) / R1) + IO(max) Regulator
Q1
0
10
1
755025
0.1
0.01 100 125 150
IO, Output Current (mA)
Output Capacitor ESR (W)
Cout = 1 mF to 10 mF
TA = 40°C to 125°C
Vin = up to 6.0 V
UNSTABLE
STABLE
Figure 29. Stability
Figure 30. Current Boost Regulator
Figure 31. Current Boost Regulator with Short
Circuit Limit
NCP500, NCV500
www.onsemi.com
15
Output
1
2
3
5
4
Input
1.0 mF1.0 mF
Q1
R
5.6 V
A regulated output can be achieved with input voltages that ex-
ceed the 6.0 V maximum rating of the NCP500 series with the
addition o f a simple pre−regulator circuit. Care must be taken
to prevent Q1 from overheating when the regulated output
(Vout) is shorted to Gnd.
Output
1
2
3
5
4
Input
1.0 mF1.0 mF
Output
1
2
3
5
4
Enable
1.0 mF 1.0 mF
C
0
3
3
80
2.5
2
904030 110
Time (ms)
Vout, Output Voltage (V)
2
1
1.5
20
4
1
0.5
010070605010
0
Enable Voltage (V)
TA = 25°C
Vin = 3.4 V
Vout = 2.8 V
R = 1.0 MW
C = 1.0 mF
R = 1.0 MW
C = 0.1 mF
No Delay
If a delayed turn−on is needed during power up of several volt-
ages then the above schematic can be used. Resistor R, and
capacitor C, will delay the turn−on of the bottom regulator. A
few values were chosen and the resulting delay can be seen in
Figure 33.
The graph shows the delay between the enable signal and
output turn−on for various resistor and capacitor values.
R
Figure 32. Delayed Turn−on
Figure 33. Delayed Turn−on
Figure 34. Input Voltages Greater than 6.0 V
NCP500, NCV500
www.onsemi.com
16
ORDERING INFORMATION
Device Nominal
Output Voltage Marking Package Shipping†
NCP500SN18T1G 1.8 LCS
TSOP−5
(Pb−Free) 3000 Units/
7″ Tape & Reel
NCP500SN185T1G 1.85 LFL
NCP500SN25T1G 2.5 LCT
NCP500SN26T1G 2.6 LFM
NCP500SN27T1G 2.7 LCU
NCP500SN28T1G 2.8 LCV
NCP500SN30T1G 3.0 LCW
NCP500SN30T2G 3.0 LCW
NCP500SN33T1G 3.3 LCX
NCP500SN50T1G 5.0 LCY
NCV500SN185T1G* 1.85 LFL
NCV500SN18T1G* 1.8 LCS
NCV500SN28T1G* 2.8 LCV
NCV500SN33T1G* 3.3 LCX
NCP500SQL18T1G 1.8 LD
DFN6 2x2.2
(Pb−Free) 3000 Units/
7″ Tape & Reel
NCP500SQL25T1G 2.5 LE
NCP500SQL27T1G 2.7 LF
NCP500SQL28T1G 2.8 LG
NCP500SQL30T1G 3.0 LH
NCP500SQL33T1G 3.3 LJ
NCP500SQL50T1G 5.0 LK
For availability of other output voltages, please contact your local ON Semiconductor Sales Representative.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
NCP500, NCV500
www.onsemi.com
17
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
CASE 483−02
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
AG
B
D
H
CJ
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
NCP500, NCV500
www.onsemi.com
18
PACKAGE DIMENSIONS
DFN6, 2x2.2, 0.65P
SQL SUFFIX
CASE 506BA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉÉ
ÉÉÉ
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
K
6X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
7X
A
A1
0.08 C
0.10 C
CSEATING
PLANE
SIDE VIEW
L
6X 13
46
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
b0.20 0.30
D2.00 BSC
D2 1.10 1.30
E2.20 BSC
E2 0.70 0.90
e0.65 BSC
K0.20 −−−
L0.25 0.35
L1 0.00 0.10
L1
6X
0.58
1.36
0.96
1
0.35 0.65
PITCH
2.50
6X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉ
ÇÇ
ÇÇ
A1
A3
L
ÉÉ
ÉÉ
ÉÉ
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DET AIL A
PACKAGE
OUTLINE
ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent− Marking.pdf. S CILLC r eserves the r ight to make changes without f urther n otice to any product s herein. S CILLC makes n o warranty, representat ion
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all l iabilit y, including without l imitat ion s pecial, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC d ata sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application b y c ust omer’s technical e xperts. SCILLC does not convey a ny license under i ts p atent rights nor t he r ights o f o thers. S CILLC p roducts a re not designed, i nt ended,
or authorized for use as c omponent s i n s yst ems i nt ended f or s urgic al i m plant i nt o the body, or other applications intended t o support or sustain life, o r f or a ny o ther application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC an d it s officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and r easonable a ttorney f ees a rising o ut of, d irectly o r indirectly, any c laim o f personal injury o r d eath a ssociated w ith s uch u nintended o r u nauthorized u se, e ven i f s uch c laim
alleges that SCILLC was negligent regarding the d esign or manufacture of the p art. SCILLC is a n E qual O pport unity/Af firmative A ction E mployer . T his literature i s s ubject t o all applicable
copyright laws and is not for resale in any manner.
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCP500/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
Sales Representative