INTEGRATED CIRCUITS DATA SHEET For 4 complete data sheet, bisase also download: es The iOO8 7ahC/NCT/NCU/NCMOS Logic Farnly Specifications s The [O06 74h T/NCLYNCMOS Logic Package Information e The 106 74hCHOTNCUVNCMOS Logic Package Quilines 74HC/HCT123 Dual retriggerable monostable multivibrator with reset Product specification 1998 Jul 08 Supersedes data of September 1993 File under Integrated Circuits, ICO6 CAE ctor & PHILIPSPhilips Semiconductors Product specification ee Dual retriggerable monostable multivibrator with reset 74HC/HCT123 FEATURES DC triggered from active HIGH or active LOW inputs Retriggerable for very long pulses up to 100% duty factor Direct reset terminates output pulse Schmitt-trigger action on all inputs except for the reset input Output capability: standard (except for nRext/Cext) lec category: MSI GENERAL DESCRIPTION The 74HC/HCT 123 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT123 are dual retriggerable monostable multivibrators with output pulse width control by three methods. The basic pulse time is programmed by selection of an external resistor (Rexq) and capacitor (C_ex7). The external resistor and capacitor are normally connected as shown in Fig.6. Once triggered, the basic output pulse width may be extended by retriggering the gated active LOW-going edge input (nA) or the active HIGH-going edge input (nB). By repeating this process, the output pulse period (nQ = HIGH, nQ = LOW) can be made as long as desired. Alternatively an output delay can be terminated at any time by a LOW-gcing edge on input nRp, which also inhibits the triggering. An internal connection from nRp to the input gates makes it possible to trigger the circuit by a positive-going signal at input nRp as shown in the function table. Figures 7 and 8 illustrate pulse control by retriggering 1998 Jul 08 and early reset. The basic output pulse width is essentially determined by the values of the external timing components Rext and Cext. For pulse widths, when Cey7 < 10 000 pF, see Fig 9. When Cex, > 10 000 pF, the typical output pulse width is defined as: tw = 0.45 x Rey x Cex (typ.), QUICK REFERENCE DATA GND =0 V; Tamp = 25 C; =) =6ns where: tw = pulse width in ns; Rext = external resistor in kQ; Cext = external capacitor in pF. Schmitt-trigger action in the nA and nB inputs, makes the circuit highly tolerant to slower input rise and fall times. The 123 is identical to the 423 but can be triggered via the reset input. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT HC HCT tpH_/ tpLH | propagation delay C_ = 15 pF; nA, nB to nQ, nQ nee = eo 26 26 ns =~ EXT = 3 nRp to n@, nQ Cex = 0 pF 20 23 ns C input capacitance 3.5 3.5 pF Cep power dissipation capacitance per notes 1and2 | 54 58 pF monostable Notes 1. Cpp is used to determine the dynamic power dissipation (Pp in pW): Pp = Cpp x Voc? x fi + L(CL x Veo? x fo} + 0.75 x Cex x Voo? x fg + Dx 16 x Voo where: fi = input frequency in MHz fo = output frequency in MHz D = duty factor in % C, = output load capacitance in pF Voc = supply voltage in V Cext = timing capacitance in pF (CL x Vec? x Ff.) sum of outputs 2. ForHG the condition is V) = GND to Veg For HGT the condition is V; = GND to Vee 1.5 VPhilips Semiconductors Product specification Dual retriggerable monostable _ , 74HC/HCT123 multivibrator with reset ORDERING INFORMATION TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION 74HC123N; DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 74HCOT123N 74HC123D; $016 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HOT123D 74HC123DB; SSOP16 | plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HCT123DB 74HCO123PW; TSSOP16 | plastic thin shrink small outline package; 16 leads; body width 4.4mm | SOT403-1 74HOT123PW PIN DESCRIPTION PIN NO. SYMBOL NAME AND FUNCTION 1,9 1A, 2A trigger inputs (negative-edge triggered) 2,10 1B, 2B trigger inputs (positive-edge triggered) 3,11 1Rp, 2Rp direct reset LOW and trigger action at positive edge 4,12 1Q, 2Q outputs (active LOW) 7 2Rext/Cext external resistor/capacitor connection 8 GND ground (9 V) 13,5 1Q,2Q outputs (active HIGH) 14,6 1Cext, 2Cextr external capacitor connection 15 1 Rexq/Cext external resistor/capacitor connection 16 Voc positive supply voltage x U mo] n} Yoo o Wext 14 2c 6 v8 [Z| PS} Fext!Cexr a tRexr/Cenr 1: 18 Ga] a4] *Cext a 2 tRext/Cext # = 1 5 ale 123 I o}-35-F 2a [a | 12] 24 18 1 10 28 SL 1a 4 2Cext [6 | 3] 2Ap an? 2 12 2Aexr/Cexr (7 | fra] 28 a 18 cna [a | fa} 2k 1 2A 7299286 7299206 ?Z93Z87.1 Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEG logic symbol. 1998 Jul 08 3Philips Semiconductors Dual retriggerable monostable multivibrator with reset FUNCTION TABLE te INPUTS OUTPUTS EXT i+ TRext/Cexr | 16 nRp} nA | nB nQ@ n@ oF 1a] 13 L x x L H 7 oe _ x H x Lit) H(t} | Ap? = X 1X L La) | Ha) 3 4 corte | (4 fe |t) | SLE ur 2Rext/Cext | 7 H Jt JH rLI Lys s ra] 5 * q L H 2 TL} a | mm, 2 | 12 Rp Note 4 1. If the monostable was triggered Traa2e8 before this condition was . . . established, the pulse will Fig.4 Functional diagram. continue as programmed. Product specification 74HC/HOT123 = HIGH voltage level = LOW voltage level don't care LOW-to-HIGH transition = HIGH-to-LOW transition TL = one HIGH level output pulse H L x T 1 LF = one LOW level output pulse ORext!Cexy Yoo Pi (1) For minimum noise generation, itis recommended to ground pins 6 (2C_7} and 14 (1GexT) externally to pin 8 (GND). Fig.6 Logic diagram. 7295282.3 1998 Jul 08Philips Semiconductors Dual retriggerable monostable multivibrator with reset Product specification 74HC/HOT123 7z99200 Yeo Rext T Cex tonCexy tonRex TiCexr [pin 14 or {pin 18 or 7} Fig.6 Timing component connections. DC CHARACTERISTICS FOR 74HC yw E For the DC characteristics see P4hHGHCPNCUNCMOS Looe Faniiy Specifications. Output capability: standard (except for nRext/Cexr) Ico category: MSI 1998 Jul 08 5Philips Semiconductors Product specification Dual retriggerable monostable ' | 74HC/HCT123 multivibrator with reset AC CHARACTERISTICS FOR 74HC GND =0V; }=t=6 ns; CL = 50 pF Tamb (C) TEST CONDITIONS SYMBOL PARAMETER ane UNIT Vee WAVEFORMS/ +25 40 to +85 | -40 to +125 (Vv) NOTES min. | typ. | max. | min. | max. | min. | max. . 83 255 320 385 2.0 propagation delay Cext = 0 pF; tPLH ran = 30 [51 64 77 Ins [45 ~ nRp, nA, nB te nQ oa | 43 5A 65 60 Rext = 5 k&2 . 83 255 320 385 2.0 propagation delay Ceyq = 0 pF; tel _ 30 |51 64 77 |ns |45 ~ nRp, nA, nB to nQ 54 143 5A 65 60 Rext = 6 kQ . 66 |215 270 325 2.0 ; PHL Propege ere 24 43 5A 65 |ns [45 next = ; Pe nRp to nQ (reset) 19 |37 46 55 6.0 | EXT = . 66 |215 270 325 2.0 ; inn [Pagani seer, | Jax fas | Joe | [os fs fas [Serr ek D 19 |37 46 55 6.9 | EXT output transition 19 4% 98 110 20 true / troy ime 7 15 19 22 |ns [45 6 13 16 19 6.0 trigger pulse width 100 | 125 150 2.0 tw a vow 20 |3 25 30 ns |45 | Fig.7 ~ 17 2 21 26 6.0 trigger pulse width 100 17 125 150 20 tw ana NiCd 20 |6 25 30 ns |45 | Fig.7 ~ 17 5 21 26 6.0 reset pulse width 100 | 14 125 150 20 tw a PLOW 20 15 25 30 ns |45 | Fig8 nD = 17 |4 21 26 6.0 output pulse width Cext = 100 nF; tw nQ = HIGH 450 Ls 5.0 | Rex = 10 ke; nQ = LOW Figs 7 and 8 output pulse width Cext = 0 pF; tw n@ = HIGH 75 ns 5.0 | Rey = 5 kQ; n@ = LOW note 1; Figs 7 and 8 Cext = 0 pF; te ad time 110 - - ns |5.0 | Rey =5kaQ: note 2; Fig.7 external timing 10 1000 20]. Rext resistor 2 1000 |~ ~ KO |50 | Fig8 external timing _ _ Cext capacitor no limits pF 5.0 | Fig.9; note 3 1998 Jul 08 6Philips Semiconductors Product specification Dual retriggerable monostable FAHC/HCT123 multivibrator with reset DC CHARACTERISTICS FOR 74HCT For the DC characteristics see 744I0HC PAMCUAICMOS Lowe Farviy Soecticagtons Output capability: standard (except for nRext / Cex) log category: MS! Note to HCT types The value of additional quiescent supply current (Alec) for a unit load of 1 is given in the family specifications. To determine Alcc per input, multiply this value by the unit load coefficient shown in the table below. INPUT UNIT LOAD COEFFICIENT nA, nB 0.35 nRp 0.50 1998 Jul 08 7Philips Semiconductors Product specification Dual retriggerable monostable . ; 74HC/HCT123 multivibrator with reset AC CHARACTERISTICS FOR 74HCT GND =0V; }=t=6 ns; CL = 50 pF Tamb (C) TEST CONDITIONS SYMBOL PARAMETER act UNIT Vec| WAVEFORMS/ +25 40 to +85 | 40 to +125 (Vv) NOTES min. | typ. | max. | min. | max. | min. | max. propagation delay _ Cext =0 pF; {PHL nRp, nA, nB to nQ@ 30/51 64 mM ns 46 Rex = 5k propagation delay Cext = 0 pF; tPLH np, nA, nB to nQ 28 9! 64 7 jms 145 |e = 8 kO propagation delay Cext = 0 pF; PHL nRp to nQ@ (reset) 27 [46 88 69 ns 48 Rext = 5 kQ propagation delay Ceyq = 0 pF; tPLH nRp to nQ@ (reset) 23 [46 88 69 ns 48 Rext = 5 kQ tre / ttt | output transition time 7 15 19 22 ns 45 trigger pulse width . tw nA = LOW 20 [3 25 30 ns 4.5 | Fig.7 trigger pulse width . tw nB = HIGH 20 [5 25 30 ns 45 | Fig.7 reset pulse width . tw np = LOW 20 |7 25 30 ns 45 | Fig.8 output pulse width Cext = 100 nF; tw nQ = HIGH 450 = = ps 5.0 | Rex = 10 kQ; n@Q = LOW Figs 7 and 8 output pulse width Cexz = 0 pF; tw nQ = HIGH 75 ns 5.0 | Rex =5 kQ; n@ = LOW note 1; Figs 7 and 8 . . Cext =0 pF; ta oe 110 - - ns [5.0 | Rexr=5kQ; ' note 2; Fig.7 R external timing 2 1000 | - kQ 5.0 | Fig.9 EXT resistor external timing a a Cext capacitor no limits pF 5.0 | Fig.9; note 3 1998 Jul 08 8Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 Notes to AC characteristics 1. For other Rex and Gex7 combinations see Fig.9. If Cex > 10 nF, the next formula is valid: tw = K x Rext x Cext (typ.) where: tw = output pulse width in ns; Rext = external resistor in kQ; Cex; = external capacitor in pF; K = constant = 0.55 for Vec = 5.0 V and 0.48 for Voc = 2.0 V. The inherent test jig and pin capacitance at pins 15 and 7 (nRex7 / Cexq} is approximately 7 pF. 2. The time to retrigger the monostable multivibrator depends on the values of Rex; and Cex. The output pulse width will only be extended when the time between the active-going edges of the trigger input pulses meets the minimum retrigger time. If Cext > 10 pF, the next formula (at Vee = 5.0 V) for the set-up time of a retrigger pulse is valid: tt = 30 + 0.19 x Reyr x Cexr?? + 13 x Ret! (typ.) where: ty = retrigger time inns; Ceyt = external capacitor in pF; Rex; = external resistor in k&. The inherent test jig and pin capacitance at pins 15 and 7 (nReyq / Cex} is 7 pF. 3. When the device is powered-up, initiate the device via a reset pulse, when Ceyz < 50 pF. 1998 Jul 08 gPhilips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HOT123 AC WAVEFORMS nB INPUT _f f oe! ty Le nA INPUT wel tye le try | nQ OUTPUT i + a lw +t Ww hte ty i 7263201 Fig.? Output pulse control using retrigger pulse; n& INPUT np tNPUT nQ@ OUTPUT FEdIZaT Fig.8 Output pulse control using reset input in nRp; {ns} 105 19 107 197 1 10 a? 103 int Ceyy Inf) Fig.9 Typical output pulse width as a function of the external capacitor values at Voc = 5.0 V and Tamb = 25 C. nRp = HIGH. nA = LOW. 10 Teeazea tw og Fz22187 K' feetor a4 Vectv) 8 Fig.10 HCT typical k factor as a function of Voce; Cy = 10 nF; Rx = 10 kQ to 190 kQ. 1998 Jul 08 10Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HOT123 APPLICATION INFORMATION Power-up considerations When the monostable is powered-up it may produce an output pulse, with a pulse width defined by the values of Ry and Cy, this output pulse can be eliminated using the circuit shown in Fig.11. Cy Ax Sse Voc nCext nReyt/CexT L 4 | | Lio A i B "123" | 1 | rt a | o Loa LL 4 REseT * Yeo > 7222237.9 Fig.11 Power-up output pulse elimination circuit. Power-down considerations A large capacitor (Cy) may cause problems when powering-down the monostable due to the energy stored in this capacitor. When a system containing this device is powered-down or a rapid decrease of Voc to zero occurs, the monostable may substain damage, due to the capacitor discharging through the input protection diodes. To avoid this possibility, use a damping diode (Dx) preferably a germanium or Schottky type diode able to withstand large current surges and connect as shown in Fig.12 dx Yi Cy cc kK Ry Reet /Cext 7272839 Fig.12 Power-down protection circuit. 1998 Jul 08 11Philips Semiconductors Product specification Dual retriggerable monostable a . 74HC/HCT123 multivibrator with reset PACKAGE OUTLINES DIP 16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 at DB ~ > Mp _ 5 | > oo 3 | oo 3 Ap ! g | | tt | + pot" + -__ nd pin 1 index 1 8 0 5 10mm daa scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) A Ay Ao 43 1} zy UNIT | ay | omin. | mie b by c pi E! e e L Me | My w ex. 140 | 053 | 0.32 | 21.8 | 648 39 8.25 95 mm 47) O51 37 | 444 | o38 | o23 | 214 | 620 | 254 | 782 | 34 | 790 | 33 | 0754 |) 22 . 0.055 | 0.021 | 0.013 | o86 | o26 015 | 0.32 | 0.37 inches | 0.19 | 0.020] 0.15 | Kare | gois | ooog | os4 | ona | 219 | 939 | ys | ost | ggg | 201 | 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN VERSION PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT36-1 050G09 MO-001 AE on seat 1998 Jul 08 12Philips Semiconductors Dual retriggerable monostable multivibrator with reset $016: plastic small outline package; 16 leads; body width 3.9 mm Product specification 74HC/HOT123 $SOT109-1 |? 16 AAA AA po LN ef | _ _ _ _ |p Ap | pin 1 index t { | Ly 7 et OL p H H f f | H H H H. Lo oo [a] be ool Lew p 0 2.5 5mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT | wax. | MH Az | As bp c pM) | EM) | e He L Lp Q v w y | Zz) ao 0.25 | 1.45 049 | 0.25 | 100] 40 6.2 1.0 | 07 0.7 mm 1-75) gig | 12519 | oss} o19| a8 | 38 | 17 | 58) 1] o4 | o6 | 975) 975) 91 | 3 | go . 0.010 | 0.057 0.019 /0.0100] 0.39 | 0.16 0.244 0.039 | 0.028 0.028] inches | 0.069 | 9 494 | 9.049 | 9-9! | 0.014 /0.0075| 0.38 | 0.15 | 259] 0.208 | 9-41 | gore | o.020 | 9-07 | 9-01 | 0.004) 4 gy, Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES VERSION PROJECTION | 'SSUEDATE IEC JEDEC EIAJ -95-04-23- SOT109-1 076E07S MS-012AC E} or one 13 1998 Jul 08Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 $@ BP ~t E i [A] way i \ . | wt \ / \ | So ly He 5 a 7 16 | 9 | I | | t | : | Q Ap <> f----}+----} Ay | (Ag) A - | 4 pin 1 index i1_4 } q | i 8 Cy t slike f | P T -t | | I I aie awa [e] PP 0 2.5 5mm scale DIMENSIONS (mm are the original dimensions) UNIT ra A, | Az | Ag | bp | | D|) EM | e@ | He} L | bp | Q v w y | z@) 29 0.21 | 1.80 0.38 | 0.20 | 64 | 54 79 1.03 | 09 1.00 | 8 mm | 20 | gos | 1.65/97 | 025) oo9| 60 52 | 28) 76] 178] oss | o7 | OF | O18) OT | oss | oe Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC FIAJ PROJECTION SOT338-1 MO-150AC -} oe epee 1998 Jul 08 14Philips Semiconductors Product specification Dual retriggerable monostable . . 74HC/HCT123 multivibrator with reset TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm $OT403-1 D 4 ___ +p {a I a __ (EEE I NX uw Gly) + He ele [lv A AAAAR AAR | | \ 4 fAs) si SRY O | 1p OUT TOUT. << | 1 detail X ~) [eet] Pp 0 2.5 5mm La | scale DIMENSIONS (mm are the original dimensions) A UNIT | way. | Ar | Az | As | Bp e pM) | 2) | He L Lp Qa v w y Z| 49 015 | 0.95 0.30 0.2 5.1 45 66 0.75 o4 0.40 & mm 1.10 0.05 | 0.80 0.25 0.19 o4 4.9 43 0.65 6.2 1.0 0.50 0.3 0.2 0.13 o4 0.06 a Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. REFERENCES VERSION pRovecTION | 'SSUE DATE IEC JEDEC EIAJ OOH SOT403-1 MO-153 Ee} 95-04-04 1998 Jul 08 15Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HOT123 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook 1C26; Integrated Circuit Packages (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T sig max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO, SSOP and TSSOP REFLOW SOLDERING Reflow soldering techniques are suitable for all SO, SSOP and TSSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Jul 08 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering can be used for all SO packages. Wave soldering is not recommended for SSOP and TSSOP packages, because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering is used - and cannot be avoided for SSOP and TSSOP packages - the following conditions must be observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions: Only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). * Do not consider wave soldering TSSOP packages with 48 leads or more, that is TSSOP48 (SOT362-1) and TSSOP56 (SOT364-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jul 08 17