Applications:
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
• Solder reflow temperature: J-STD-020D compliant
Packaging:
•Supplied in tape and reel packaging, 600 parts per reel,
13” diameter reel
Description:
• Halogen free
• 125°C maximum total temperature operation
• 7.4 x 7.6 x 7.0mm surface mount package
• Ferrite core material
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 70nH to 220nH
• Current range from 35 to 108 amps
• Frequency range up to 2MHz
• RoHS compliant
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP0807 Series
0908 BU-SB08620 Page 1 of 4 Data Sheet: 4343
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI *10-3,B
p-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0807Rx-Rxx-R
• FP0807 = Product code and size • Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
Product Specifications
Part Number7OCL1± 10% (nH) FLL2Min. (nH) Irms3(Amps) Isat14@ 25°C (Amps) Isat25@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP0807R1-R07-R 70 50 108 79 520
FP0807R1-R10-R 100 72 77 55 520
FP0807R1-R12-R 120 86 66 48 520
FP0807R1-R16-R 160 115 49 48 36 0.50 ± 6% 520
FP0807R1-R18-R 180 129 42 32 520
FP0807R1-R20-R 200 144 38 28 520
FP0807R1-R22-R 220 158 35 25 520
Top View Side View Bottom View Recommended Pad Layout Schematic
1
2
7.0
max
a
b
2.6
2.6
2.0
0807Rx
Rxx
wwllyy R
7.6
max
7.4
max
1.55
+/-0.2
2.0
+/-0.2
3.3
typ.
1
2
1
2
2.7
DDiimmeennssiioonnss -- mmmm
7.0
1.5 dia.
7.7
9.5
4.0
2.0
1.5 dia.
A
A
1.75
7.5 16.0
+/-0.3
7.5
16.0
0807Rx
Rxx
wwllyy R
1
2
Section A-A
User direction of feed
0
10
20
30
40
50
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Total Loss (W )
Temperature Rise(°C)
Part Marking: Coiltronics Logo 0807Rx (Rx = DCR Indicator) Rxx = Inductance value in μH. (R = Decimal point) wwllyy = Date code R = Revision level
The nominal DCR is measured from point “a” to point”b.”
Supplied in tape-and-reel packaging, 600 parts per reel, 13” diameter reel.
Packaging Information - mm
Temperature Rise vs.Total Loss
0908 BU-SB08620 Page 2 of 4 Data Sheet: 4343
0908 BU-SB08620 Page 3 of 4 Data Sheet: 4343
Core Loss vs. B
0.00001
0.0001
0.001
0.01
0.1
1
10
100 1000 10000
B (G auss )
Core Loss (W)
1MHz
500kHz
300kHz
100kHz
p-p
p-p
% of OCL vs. % of I
sat
1
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
0% 20% 40% 60% 80% 100% 120% 140% 160%
% of I
sat
1
% of OCL
+25°C
-40°C
+125°C
Inductance Characteristics
Core Loss
© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
0908 BU-SB08620 Page 4 of 4 Data Sheet: 4343
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
T
a
a
b
b
l
l
e
e
1
1
-
-
S
S
t
t
a
a
n
n
d
d
a
a
r
r
d
d
S
S
n
n
P
P
b
b
S
S
o
o
l
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
Volume Volume
Package mm3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
T
a
a
b
b
l
l
e
e
2
2
-
-
L
L
e
e
a
a
d
d
(
(
P
P
b
b
)
)
F
F
r
r
e
e
e
e
S
S
o
o
l
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
A
verage ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
A
verage ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.