Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
1. Product profile
1.1 General description
Symmetrical silicon N-channel depletion type junction field-effect transistors (FETs) in a
plastic microminiature envelope designed for application in thick and thin-film circuit s. The
transistors are intended for low-power, chopper or switching applications in industrial
service.
1.2 Features and benefits
Interchangeable drain and source connections
Small package
1.3 Applications
Low-power, chopper or switching applications
Thick and thin-film circuits
1.4 Quick reference data
BSR56; BSR57; BSR58
N-channel FETs
Rev. 3 — 25 June 2014 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions BSR56 BSR57 BSR58 Unit
Min Max Min Max Min Max
VDS drain-source voltage - 40 - 40 - 40 V
IDSS drain leakage current VDS = 15 V; VGS =0V;
Tmb = 40 C->50->20- >8mA
- - - <100 - <80 mA
VGSoff gate-source cut-off
voltage VDS = 15 V;
ID = 0.5 nA >4 - >2 - >0.8 - V
<10 - <6 - <4 - V
Crs feedback capacitance VDS =0 V; V
GS =10 V;
f = 1 MHz -<5-<5-<5pF
Switching time (VDD = 10 V; VGS = 0 V)
toff turn-off time ID = 20 mA; VGSM = 10 V - <25 - - - - ns
ID = 10 mA; VGSM = 6 V - - - <50 - - ns
ID = 5 mA; VGSM = 4 V -----<100ns
Ptot total power dissipation Tmb = 40 °C - 250 - 250 - 250 mW
Static characteristics
RDSon drain-source on-state
resistance VGS =0V; I
D= 0 A; f = 1 kHz - <25 - <40 - <60
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 2 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
2. Pinning information
[1] Drain and source are interchangeable.
3. Ordering information
4. Marking
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1drain [1]
2source [1]
3gate
12
3
sym054
d
sg
Table 3. Ordering information
Type number Package
Name Description Version
BSR56 TO-236AB plastic surface-mounted package; 3 leads SOT23
BSR57
BSR58
Table 4. Marking codes
Type number Marking code
BSR56 M4P
BSR57 M5P
BSR58 M6P
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 3 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
5. Limiting values
[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.
6. Thermal characteristics
[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 40 V
VGS gate-source voltage - 40 V
VDG drain-gate voltage - 40 V
IGgate current - 50 mA
Ptot total power dissipation Tamb = 40 C[1] -250mW
Tstg storage temperature 65 +150 C
Tjjunction temperature - 150 C
Fig 1. Power derating curve
0
Tamb (°C)
Ptot
(mW)
300
200
100
0
40 20080 120 160
aaa-013766
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to
ambient [1] 430 K/W
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 4 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
7. Characteristics
Table 7. Characteristics
Tamb = 25
C unless otherwise specified.
Symbol Parameter Conditions BSR56 BSR57 BSR58 Unit
Min Max Min Max Min Max
IGSS gate-source cut-off
current VDS = 0 V;
VGS = 20 V - 1.0 - 1.0 - 1.0 nA
IDSX drain cut-off current VDS = 15 V;
VGS = 10 V - 1.0 - 1.0 - 1.0 nA
V(BR)GSS gate-source breakdown
voltage IG = 1 A;
VDS = 0 V ->40->40->40V
VGSoff gate-source cut-off
voltage VDS =15V;
ID = 0.5 nA >4 - >2 - >0.8 - V
<10 - <6 - <4 - V
IDdrain current VDS =15V; V
GS = 0 V - >50 - >20 - >8 mA
---<100-<80mA
Crs feedback capacit ance VDS =0 V; V
GS =10 V;
f = 1 MHz -<5-<5-<5pF
RDSon drain-source on-state
resistance VGS =0V; I
D=0A;
f = 1 kHz -<25-<40-<60
VDSon drain-source on-state
voltage VGS =0V; I
D= 20 mA - <750 - - - - mV
VGS =0V; I
D=10mA ---<500--mV
VGS =0V; I
D=5mA -----<400mV
Switching times (VDD = 10 V; VGS = 0 V)
tddelay time ID = 20 mA; VGSM = 10 V - <6 - - - - ns
ID = 10 mA; VGSM = 6 V ---<6--ns
ID = 5 mA; VGSM = 4 V - - - - - <10 ns
trrise time ID = 20 mA; VGSM = 10 V - <3 - - - - ns
ID = 10 mA; VGSM = 6 V ---<4--ns
ID = 5 mA; VGSM = 4 V - - - - - <10 ns
toff turn-off time ID = 20 mA; VGSM = 10 V -<25----ns
ID = 10 mA; VGSM = 6 V - - - <50 - - ns
ID = 5 mA; VGSM = 4 V - - - - - <100 ns
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 5 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
Fig 2. Switching times waveforms
(1) BSR56; R = 464
(2) BSR57; R = 953
(3) BSR58; R = 1910
Fig 3. Test circuit
Table 8. Test data
Type Pulse generator Oscilloscope
tr, tfZoCitrRi
BSR56 0.02 1 ns 50 2.5 pF 0.75 ns 1 M
BSR57 0.02 1 ns 50 2.5 pF 0.75 ns 1 M
BSR58 0.02 1 ns 50 2.5 pF 0.75 ns 1 M
aaa-013765
t
r
t
d
0
V
GSM
V
o
V
i
10%
90%
200 ns
t
off
aaa-013764
R
TUT
50 Ω
V
i
V
o
V
DD
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 6 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
8. Package outline
Fig 4. Package outline SOT23 (TO-236AB)
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT023 TO-236AB
sot023_po
06-03-16
14-06-19
Plastic surface-mounted package; 3 leads SOT023
bp
D
A
A1
Lp
Q
HE
E
0 1 2 mm
scale
c
12
3
B
wB
e
e1
vA
AX
Unit
mm
max
nom
min
1.1 0.1 0.15 3.0 1.4
0.2
A
Dimensions (mm are the original dimensions)
A1bp
0.48
cDEee
1
0.95
HELpQvw
0.11.9
2.1 0.150.9 0.09 2.8 1.20.38
2.5 0.45
0.45
0.55
detail X
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 7 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
9. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BSR56_57_58 v.3 20140625 Product data sheet - BSR56_57_58_CNV_2
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
BSR56_57_58_CNV_2 19910401 Product specification - -
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 8 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) d escribed in th is docume nt may have changed since this docume nt was pub lished and may dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full dat a sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environment al
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability rela ted to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BSR56_57_58 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 25 June 2014 9 of 10
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristi cs sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a pri or
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automo tive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
10.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BSR56; BSR57; BSR58
N-channel FETs
© NXP Semiconductors N.V. 2014. All rights rese rved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 June 2014
Document identifier: BS R56_57_58
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
