DS89C21
www.ti.com
SNLS091C JUNE 1998REVISED APRIL 2013
DS89C21 Differential CMOS Line Driver and Receiver Pair
Check for Samples: DS89C21
1FEATURES DESCRIPTION
The DS89C21 is a differential CMOS line driver and
2 Meets TIA/EIA-422-A (RS-422) and CCITT V.11 receiver pair, designed to meet the requirements of
Recommendation TIA/EIA-422-A (RS-422) electrical characteristics
LOW POWER Design—15 mW Typical interface standard. The DS89C21 provides one driver
Guaranteed AC Parameters: and one receiver in a minimum footprint. The device
is offered in an 8-pin SOIC package.
Maximum Driver Skew 2.0 ns The CMOS design minimizes the supply current to 6
Maximum Receiver Skew 4.0 ns mA, making the device ideal for use in battery
Extended Temperature Range: 40°C to powered or power conscious applications.
+85°C The driver features a fast transition time specified at
Available in SOIC Packaging 2.2 ns, and a maximum differential skew of 2 ns
Operates over 20 Mbps making the driver ideal for use in high speed
Receiver OPEN Input Failsafe Feature applications operating above 10 MHz.
The receiver can detect signals as low as 200 mV,
and also incorporates hysteresis for noise rejection.
Skew is specified at 4 ns maximum.
The DS89C21 is compatible with TTL and CMOS
levels (DI and RO).
Connection Diagram
See Package Number D (R-PDSO-G8)
Truth Table Driver
Input Outputs
DI DO DO*
H H L
L L H
Truth Table Receiver
Inputs Output
RI–RI* RO
VDIFF +200 mV H
VDIFF 200 mV L
OPEN(1) H
(1) Non-terminated
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS89C21
SNLS091C JUNE 1998REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)(2)(3)
Supply Voltage (VCC) 7V
Driver Input Voltage (DI) 1.5V to VCC + 1.5V
Driver Output Voltage (DO, DO *)0.5V to +7V
Receiver Input Voltage—V CM
(RI, RI*) ±14V
Differential Receiver Input ±14V
Voltage—VDIFF (RI, RI*)
Receiver Output Voltage (RO) 0.5V to VCC +0.5V
Receiver Output Current (RO) ±25 mA
Storage Temperature Range
(TSTG)65°C to +150°C
Lead Temperature (TL) +260°C
(Soldering 4 sec.)
Maximum Junction Temperature 150°C
Maximum Package Power Dissipation @+25°C
D Package 714 mW
Derate D Package 5.7 mW/°C above +25°C
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The tables of Electrical Characteristics specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) ESD Rating: HBM (1.5 kΩ, 100 pF) all pins 2000V.EIAJ (0Ω, 200 pF) 250V
Recommended Operating Conditions Min Max Units
Supply Voltage (VCC) 4.50 5.50 V
Operating Temperature (TA)40 +85 °C
Input Rise or Fall Time (DI) 500 ns
2Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
www.ti.com
SNLS091C JUNE 1998REVISED APRIL 2013
Electrical Characteristics (1)(2)
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.
Symbol Parameter Conditions Pin Min Typ Max Units
DRIVER CHARACTERISTICS
VIH Input Voltage HIGH 2.0 VCC V
VIL Input Voltage LOW DI GND 0.8 V
IIH, IIL Input Current V IN = VCC, GND, 2.0V, 0.8V 0.05 ±10 μA
VCL Input Clamp Voltage I IN =18 mA 1.5 V
VOD1 Unloaded Output Voltage No Load DO, 4.2 6.0 V
DO*
VOD2 Differential Output Voltage R L= 100Ω2.0 3.0 V
ΔVOD2 Change in Magnitude of V OD2 5.0 400 mV
for Complementary Output States
VOD3 Differential Output Voltage R L= 150Ω2.1 3.1 V
VOD4 Differential Output Voltage R L= 3.9 kΩ4.0 6.0 V
VOC Common Mode Voltage R L= 100Ω2.0 3.0 V
ΔVOC Change in Magnitude of V OC 2.0 400 mV
for Complementary Output States
IOSD Output Short Circuit Current V OUT = 0V 30 115 150 mA
IOFF Output Leakage Current VCC = 0V VOUT = +6V 0.03 +100 μA
VOUT =0.25V 0.08 100 μA
RECEIVER CHARACTERISTICS
VTL, VTH Differential Thresholds V IN = +7V, 0V, 7V RI, 200 ±25 +200 mV
RI*
VHYS Hysteresis V CM = 0V 20 50 mV
RIN Input Impedance V IN =7V, +7V, Other = 0V 5.0 9.5 kΩ
IIN Input Current Other Input = 0V, VIN = +10V +1.0 +1.5 mA
VCC = 5.5V and VIN = +3.0V 0 +0.22 mA
VCC = 0V VIN = +0.5V 0.04 mA
VIN =3V 0 0.41 mA
VIN =10V 1.25 2.5 mA
VOH Output HIGH Voltage IOH =6 mA VDIFF = +1V RO 3.8 4.9 V
VDIFF = OPEN 3.8 4.9 V
VOL Output LOW Voltage I OL = +6 mA, VDIFF =1V 0.08 0.3 V
IOSR Output Short Circuit Current V OUT = 0V 25 85 150 mA
DRIVER AND RECEIVER CHARACTERISTICS
ICC Supply Current No Load DI = VCC or GND VCC 3.0 6 mA
DI = 2.4V or 0.5V 3.8 12 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
(2) All typicals are given for VCC = 5.0V and T A= 25°C.
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS89C21
DS89C21
SNLS091C JUNE 1998REVISED APRIL 2013
www.ti.com
Switching Characteristics (1)(2)
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
tPLHD Propagation Delay LOW to HIGH RL= 100Ω(Figure 2 Figure 3) 2 4.9 10 ns
tPHLD Propagation Delay HIGH to LOW CL= 50 pF 2 4.5 10 ns
tSKD Skew, |tPLHD–t PHLD| 0.4 2.0 ns
tTLH Transition Time LOW to HIGH (Figure 2 Figure 4) 2.2 9 ns
tTHL Transition Time HIGH to LOW 2.1 9 ns
RECEIVER CHARACTERISTICS
tPLH Propagation Delay LOW to HIGH CL= 50 pF (Figure 5 Figure 6) 6 18 30 ns
tPHL Propagation Delay HIGH to LOW VDIFF = 2.5V 6 17.5 30 ns
tSK Skew, |tPLH–t PHL| VCM = 0V 0.5 4.0 ns
trRise Time (Figure 7) 2.5 9 ns
tfFall Time 2.1 9 ns
(1) All typicals are given for VCC = 5.0V and T A= 25°C.
(2) f = 1 MHz, trand tf6 ns.
Parameter Measurement Information
Figure 1. VOD and VOC Test Circuit
f = 1 MHz, tr and tf 6 ns.
Figure 2. Driver Propagation Delay Test Circuit
4Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
www.ti.com
SNLS091C JUNE 1998REVISED APRIL 2013
Figure 3. Driver Differential Propagation Delay Timing
Figure 4. Driver Differential Transition Timing
f = 1 MHz, tr and tf 6 ns.
Figure 5. Receiver Propagation Delay Test Circuit
Figure 6. Receiver Propagation Delay Timing
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS89C21
DS89C21
SNLS091C JUNE 1998REVISED APRIL 2013
www.ti.com
Figure 7. Receiver Rise and Fall Times
6Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS89C21
DS89C21
www.ti.com
SNLS091C JUNE 1998REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: DS89C21
PACKAGE OPTION ADDENDUM
www.ti.com 25-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS89C21TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS89C
21TM
DS89C21TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS89C
21TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Aug-2018
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS89C21TMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Aug-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS89C21TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 10-Aug-2018
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
DS89C21TM DS89C21TM/NOPB DS89C21TMX DS89C21TMX/NOPB