E EricssonInternal Limited Internal TABLE OF CONTENTS PRODUCT SPECIFICATION Prepared (also subject responsible if other) 1/1301 00152-EN/LZT146334 BMR 644Technical 4/M Uen Specification MPM/BY/P Henrik Sundh Approved PMG 4000F series MPM/BY/M [Krister Lundberg] 1 (1) (3) No. Checked Date 2006-02-28 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Rev 2 Reference EN/LZT 146 334 R1C R1B April 2006 2007 A (c) Ericsson Power Modules AB Key Features * * * * * * * 15A output current 2.95-3.65V input voltage range DDR/QDR compatible output voltage VTT tracks VREF in range of 0.55V to 1.8V Industry standard POLATM compatible 34.8 x 15.75 x 9.00 mm (1.37 x 0.62 x 0.354 in.) More than 4.0 million hours MTBF General Characteristics * * * * * * * Operating temperature: -40C to 85C Input under voltage protection Start up into a pre-biased output safe Output short-circuit protection On/Off inhibit control (VTT standby) Highly automated manufacturing ensures quality ISO 9001/14001 certified supplier Safety Approvals Design for Environment Meets requirements in hightemperature lead-free soldering processes. Contents General Information Safety Specification Absolute Maximum Ratings ............................................................. 2 ............................................................. 3 ............................................................. 4 Product Program 0.55-1.8 V/15 A 1.25 V/15 A Electrical Specification Ordering No. PMG 4218VxF ....................................... ............................................................. 5 EMC Specification Operating Information Thermal Consideration Connections Mechanical Information Soldering Information Delivery Information Product Qualification Specification ............................................................. 8 ............................................................. 8 ........................................................... 10 ........................................................... 10 ........................................................... 11 ........................................................... 13 ........................................................... 15 ........................................................... 16 Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) MPM/BY/P Henrik Sundh Approved PMG 4000F series MPM/BY/M [Krister Lundberg] Checked 1/1301 BMR 644Technical 4/M Uen Specification Date 2007-4-2 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Rev Reference 2 EN/LZT 146 334 R1C April 2007 C (c) Ericsson Power Modules AB Compatibility with RoHS requirements) General Information Ordering Information See Contents for individual product ordering numbers. Option Through hole pin SMD pin SMD pin, leadfree reflow temperature capable 2 (3) No. Suffix P S PMG4218VPF PMG4318VSF R PMG4318VSRF The products are compatible with the relevant clauses and requirements of the RoHS directive 2002/95/EC and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in homogeneous materials for cadmium. Reliability The Mean Time Between Failure (MTBF) is calculated at full output power and an operating ambient temperature (TA) of +40C. Different methods could be used to calculate the predicted MTBF and failure rate which may give different results. Ericsson Power Modules currently uses Telcordia SR332. Predicted MTBF for the series is: 4.02 million hours according to Telcordia SR332, issue 1, Black box technique. Telcordia SR332 is a commonly used standard method intended for reliability calculations in IT&T equipment. The parts count procedure used in this method was originally modelled on the methods from MIL-HDBK-217F, Reliability Predictions of Electronic Equipment. It assumes that no reliability data is available on the actual units and devices for which the predictions are to be made, i.e. all predictions are based on generic reliability parameters. Exemptions in the RoHS directive utilized in Ericsson Power Modules products include: Lead in high melting temperature type solder (used to solder the die in semiconductor packages) Lead in glass of electronics components and in electronic ceramic parts (e.g. fill material in chip resistors) Lead as an alloying element in copper alloy containing up to 4% lead by weight (used in connection pins made of Brass) The exemption for lead in solder for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication is only utilized in surface mount products intended for end-users' leaded SnPb Eutectic soldering processes. Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6 (sigma), and SPC are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out and they are subjected to an ATE-based final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. Warranty Warranty period and conditions are defined in Ericsson Power Modules General Terms and Conditions of Sale. Limitation of Liability Ericsson power Modules does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person's health or life). E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 1/1301 BMR 644Technical 4/M Uen Specification MPM/BY/P Henrik Sundh Approved PMG 4000F series MPM/BY/M [Krister Lundberg] 3 (3) No. Checked Date Rev 2006-02-28 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W 3 Reference EN/LZT 146 334 R1C R1B April 2006 2007 A (c) Ericsson Power Modules AB Safety Specification General information Ericsson Power Modules DC/DC converters and DC/DC regulators are designed in accordance with safety standards IEC/EN/UL60950, Safety of Information Technology Equipment. IEC/EN/UL60950 contains requirements to prevent injury or damage due to the following hazards: * * * * * * Electrical shock Energy hazards Fire Mechanical and heat hazards Radiation hazards Chemical hazards On-board DC-DC converters are defined as component power supplies. As components they cannot fully comply with the provisions of any Safety requirements without "Conditions of Acceptability". It is the responsibility of the installer to ensure that the final product housing these components complies with the requirements of all applicable Safety standards and Directives for the final product. Component power supplies for general use should comply with the requirements in IEC60950, EN60950 and UL60950 "Safety of information technology equipment". There are other more product related standards, e.g. IEEE802.3af "Ethernet LAN/MAN Data terminal equipment power", and ETS300132-2 "Power supply interface at the input to telecommunications equipment; part 2: DC", but all of these standards are based on IEC/EN/UL60950 with regards to safety. Ericsson Power Modules DC/DC converters and DC/DC regulators are UL60950 recognized and certified in accordance with EN60950. The flammability rating for all construction parts of the products meets requirements for V-0 class material according to IEC 60695-11-10. The products should be installed in the end-use equipment, in accordance with the requirements of the ultimate application. Normally the output of the DC/DC converter is considered as SELV (Safety Extra Low Voltage) and the input source must be isolated by minimum Double or Reinforced Insulation from the primary circuit (AC mains) in accordance with IEC/EN/UL60950. Isolated DC/DC converters It is recommended that a slow blow fuse with a rating twice the maximum input current per selected product be used at the input of each DC/DC converter. If an input filter is used in the circuit the fuse should be placed in front of the input filter. In the rare event of a component problem in the input filter or in the DC/DC converter that imposes a short circuit on the input source, this fuse will provide the following functions: * * Isolate the faulty DC/DC converter from the input power source so as not to affect the operation of other parts of the system. Protect the distribution wiring from excessive current and power loss thus preventing hazardous overheating. The galvanic isolation is verified in an electric strength test. The test voltage (Viso) between input and output is 1500 Vdc or 2250 Vdc for 60 seconds (refer to product specification). Leakage current is less than 1 A at nominal input voltage. 24 V DC systems The input voltage to the DC/DC converter is SELV (Safety Extra Low Voltage) and the output remains SELV under normal and abnormal operating conditions. 48 and 60 V DC systems If the input voltage to Ericsson Power Modules DC/DC converter is 75 Vdc or less, then the output remains SELV (Safety Extra Low Voltage) under normal and abnormal operating conditions. Single fault testing in the input power supply circuit should be performed with the DC/DC converter connected to demonstrate that the input voltage does not exceed 75 Vdc. If the input power source circuit is a DC power system, the source may be treated as a TNV2 circuit and testing has demonstrated compliance with SELV limits and isolation requirements equivalent to Basic Insulation in accordance with IEC/EN/UL60950. Non-isolated DC/DC regulators The input voltage to the DC/DC regulator is SELV (Safety Extra Low Voltage) and the output remains SELV under normal and abnormal operating conditions. E Limited Internal PRODUCT SPEC. Prepared (also subject responsible if other) 1 (4) No. 4 2/1301-BMR 644Technical 4/M Uen Specification SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series Checked Date Rev ESKEVIN 2006-2-27 Reference EN/LZT 146 334 R1C R1B April 2006 2007 A POL regulator, Input 2.95-3.65 V, Output 15 A/27 W (c) Ericsson Power Modules AB Absolute Maximum Ratings Characteristics min Tref Operating Temperature (see Thermal Consideration section) -40 85 C TS Storage temperature -40 125 C VI Input voltage Vinh Inhibit On/Off pin voltage (see Operating Information section) Vadj Adjust pin voltage (see Operating Information section) 2.95 typ 3.30 max Unit 3.65 V Positive logic option Vin-0.5 Open V Negative logic option N/A N/A V N/A N/A V Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner. Fundamental Circuit Diagram VIN 3 2 1 2 VTT 1 VSEN 3 1 2 GND Auto Track PWM Controller VREF Error Amplifier Ref INH RC Block GND GND GND E Limited Internal PRODUCT SPEC. Prepared (also subject responsible if other) 2 (4) No. 5 2/1301-BMR 644Technical 4/M Uen Specification SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series Checked Date ESKEVIN 2006-2-27 Rev Reference EN/LZT 146 334 R1C R1B April 2006 2007 A POL regulator, Input 2.95-3.65 V, Output 15 A/27 W (c) Ericsson Power Modules AB 1.25 V/15 A Electrical Specification PMG 4218VxF Tref = -40 to +85C, VI = 2.95 to 3.65 V, VREF = 1.25V, unless otherwise specified under conditions. Typical values given at: Tref = +25C, VI= 3.3 V, max IO, unless otherwise specified under conditions. Additional Cin=470uF and Cout=470uF. See Operating Information section for selection of capacitor types. Connect the sense pin, where available, to the output pin. Characteristics Conditions min typ max VI Input voltage range VIoff Turn-off input voltage Decreasing input voltage VIon Turn-on input voltage Increasing input voltage CI Internal input capacitance PO Output power 2.95 2.2 3.65 V 2.8 V 2.40 2.45 V 60 0 F 18.75 50 % of max IO 89.2 max IO 83.7 Unit W Efficiency Pd Power Dissipation max IO 3.6 W Pli Input idling power IO= 0, VI = 3.3 V 210 mW PRC Input standby power VI = 3.3 V (turned off with INHIBIT) 25 mW IS Static Input current VI = 3.3 V, max IO fs Switching frequency 0-100% of max IO VOi Output voltage initial setting and Tref = +25C, VI = 3.3 V, max IO accuracy % 6.8 A 250 300 350 kHz 1.240 1.250 1.260 V 1.240 1.250 1.260 V Output voltage tolerance band 10-100% of max IO Idling voltage IO = 0 1.251 V Line regulation Max IO 10 mV Load regulation VI = 3.3 V, 0-100% of max IO 10 mV Vtr Load transient voltage deviation ttr Load transient recovery time VI = 3.3 V, Load step from -1.5A to +1.5A, di/dt = 15 A/s, see Note 1 VO tr ts tf tInh 30 Ramp-up time (from 10-90 % of VOi) Start-up time 40 mV 30 s 3.0 ms 5.2 ms s max IO (from VI connection to 90% of VOi) Vin shutdown fall time. (From VI off to 10% of VO) Max Io 160 Io = 1A 460 s INHIBIT start-up time Max Io 5.3 ms INHIBIT shutdown fall time (From INHIBIT off to 10% of VO) Max Io 50 s Io = 0.1 A 1.6 ms IO Output current Ilim Current limit threshold Tref < max Tref, VOac Output ripple & noise See ripple & noise section, max IO, VOi 0 Note1: Output filter according to Ripple & Noise section 15 A 27.5 A 20 mVp-p E Limited Internal PRODUCT SPEC. Prepared (also subject responsible if other) 3 (4) No. 6 2/1301-BMR 644Technical 4/M Uen Specification SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series Checked Date Rev ESKEVIN 2006-2-27 Reference EN/LZT 146 334 R1C R1B April 2006 2007 A POL regulator, Input 2.95-3.65 V, Output 15 A/27 W (c) Ericsson Power Modules AB 1.25 V/15 A Typical Characteristics PMG 4218VxF Efficiency Power Dissipation [%] [W] 95 5.00 90 4.00 2.95 V 2.95 V 85 3.00 3.3 V 80 3.3 V 3.65 V 2.00 3.65 V 75 1.00 70 0.00 0 3 6 9 12 15 [A] 0 3 6 9 12 15 [A] Dissipated power vs. load current and input voltage at Tref = +25C Efficiency vs. load current and input voltage at Tref = +25C Output Current Deratings Output Characteristics [V] [A] 18 2.0 m/s 1.30 1.0 m/s 1.25 15 12 2.95 V 3.3 V 9 0.5 m/s 6 Nat. Conv. 3 0 3.65 V 1.20 1.15 1.10 0 20 40 60 80 [C] Available load current vs. ambient air temperature and airflow at VI = 3.3 V, VOUT = 1 V. See Thermal Consideration section. 0 3 6 9 12 15 [A] Output voltage vs. load current at Tref = +25C E Limited Internal PRODUCT SPEC. Prepared (also subject responsible if other) 4 (4) No. 2/1301-BMR 644Technical 4/M Uen Specification SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series Checked Date ESKEVIN 2006-2-27 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Rev EN/LZT 146 334 R1C R1B April 2006 2007 A (c) Ericsson Power Modules AB 1.25 V/15 A Typical Characteristics Start-up Start-up enabled by connecting VI at: Tref = +25C, IO = 15 A resistive load, VI = 3.3 V. PMG 4218VxF Shut-down Top trace: output voltage (0.5 V/div). Bottom trace: input voltage (2 V/div). Time scale: 20 ms/div. Output Ripple & Noise Output voltage ripple (20mV/div) at: Tref = +25C, IO = 15 A resistive load, VI = 3.3 V. Time scale: 2 s/div 7 Reference Shut-down enabled by disconnecting VI at: Tref = +25C, IO = 15 A resistive load, VI = 3.3 V. Top trace: output voltage (0.5 V/div). Bottom trace: input voltage (2 V/div). Time scale: 20 ms/div. Output Load Transient Response See the filter in the Output ripple and noise section (EMC Specification). Output voltage response to load current step- Top trace: Vout-Vtrk (50mV/div). change (-1.5A-1.5A) at: Bottom trace: load current (2 A/div). Tref =+25C, VI = 3.3 V. Time scale: 0.1 ms/div. Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series 1 (4) No. 3/1301-BMR644 Technical 4/M Uen Specification Checked Date ESKEVIN 2006-2-27 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W EMC Specification Rev Reference 8 EN/LZT 146 334 R1C R1B April 2006 2007 A (c) Ericsson Power Modules AB Output ripple and noise Conducted EMI measured according to test set-up. The fundamental switching frequency is 300 kHz for PMG 4218VxF @ VI = 3.3 V, max IO. Output ripple and noise measured according to figure below. See Design Note 022 for detailed information. Conducted EMI Input terminal value (typ) TBD Output ripple and noise test setup EMI without filter Operating information Extended information for POLA products is found in Application Note AN206. Input Voltage The input voltage range 2.95 to 3.65 Vdc makes the product easy to use in intermediate bus applications when powered by a regulated bus converter. TBD Turn-off Input Voltage The DC/DC regulators monitor the input voltage and will turn on and turn off at predetermined levels. The minimum hysteresis between turn on and turn off input voltage is 0.05V. Test set-up Layout recommendation The radiated EMI performance of the DC/DC regulator will depend on the PCB layout and ground layer design. It is also important to consider the stand-off of the DC/DC regulator. If a ground layer is used, it should be connected to the output of the DC/DC regulator and the equipment ground or chassis. A ground layer will increase the stray capacitance in the PCB and improve the high frequency EMC performance. Remote Control {Inhibit} The products are fitted with a remote control (Inhibit) function referenced to the primary negative input connection (- In), positive logic. The INHIBIT function allows the regulator to be turned on/off by an external device like a semiconductor or mechanical switch. The regulator will turn on when the input voltage is applied with the INH pin open. Turn off is achieved by connecting the INH pin to the - In. To ensure safe turn off the voltage difference between INH pin and the - In pin shall be less than 0.6V. The regulator will restart automatically when this connection is opened. Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series 2 (4) No. 3/1301-BMR644 Technical 4/M Uen Specification Checked Date ESKEVIN 2006-2-27 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W External Capacitors Input capacitors: The recommended input capacitors are determined by the 470 F minimum capacitance and 800 mArms minimum ripple current rating. Output capacitors (required): A 470 F low-ESR electrolytic output capacitance Is required to meet specification as defined in the electrical specification. Output capacitors (optional): The recommended output capacitance of 200 F ceramic capacitor will allow the module to meet its transient response specification as defined in the electrical specification. When using one or more non-ceramic capacitors, the calculated equivalent ESR should be no lower than 4 m (Use 7 m as the minimum when using max-ESR values to calculate). Input And Output Impedance The impedance of both the input source and the load will interact with the impedance of the DC/DC regulator. It is important that the input source has low characteristic impedance. The regulators are designed for stable operation without external capacitors connected to the input or output. The performance in some applications can be enhanced by addition of external capacitance as described under External Decoupling Capacitors. If the input voltage source contains significant inductance, the addition of a 100 F capacitor across the input of the regulator will ensure stable operation. The capacitor is not required when powering the DC/DC regulator from an input source with an inductance below 10 H. External Decoupling Capacitors When powering loads with significant dynamic current requirements, the voltage regulation at the point of load can be improved by addition of decoupling capacitors at the load. The most effective technique is to locate low ESR ceramic and electrolytic capacitors as close to the load as possible, using several parallel capacitors to lower the effective ESR. The ceramic capacitors will handle high-frequency dynamic load changes while the electrolytic capacitors are used to handle low frequency dynamic load changes. Ceramic capacitors will also reduce any high frequency noise at the load. It is equally important to use low resistance and low inductance PCB layouts and cabling. External decoupling capacitors will become part of the control loop of the DC/DC regulator and may affect the stability margins. As a "rule of thumb", 100 F/A of output current can be added without any additional analysis. The ESR of the capacitors is a very important parameter. Power Modules guarantee stable operation with a verified ESR value of >10 m across the output connections. For further information please contact your local Ericsson Power Modules representative. Rev Reference 9 EN/LZT 146 334 R1C R1B April 2006 2007 A (c) Ericsson Power Modules AB Remote Sense The DC/DC regulators have remote sense that can be used to compensate for voltage drops between the output and the point of load. The sense traces should be located close to the PCB ground layer to reduce noise susceptibility. The remote sense circuitry will compensate for up to 0.3v voltage drop between output pins and the point of load. If the remote sense is not needed, Vsen can be left open. Over Current Protection (OCP) The regulators include current limiting circuitry for protection at continuous overload. The output voltage will decrease towards zero for output currents in excess of current limit threshold. The regulator will resume normal operation after removal of the overload. The load distribution should be designed for the maximum output short circuit current specified. The current limit operation is a "hick up" mode. Generation of the BusTermination Voltage The voltage at VREF is the reference voltage for the system bus receiver comparators. It is normally set to precisely half the bus driver supply voltage (VDDQ/2), using a resistor divider. The Thevenin impedance of the network driving the VREF pin should not exceed 500 ohm The module senses VREF to regulate the output voltage VTT, the required bus termination supply voltage. VTT is active about 20 ms after a valid VREF input source is applied to the module. Once active VTT will track the voltage applied at VREF. Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) SEC/D ESECZHW Approved PMG 4000F SEC/D LINDA series 3 (4) No. 3/1301-BMR644 Technical 4/M Uen Specification Checked Date Rev ESKEVIN 2006-2-27 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Reference 10 EN/LZT 146 334 R1C R1B April 2006 2007 A (c) Ericsson Power Modules AB Thermal Consideration Thermal Consideration continued General Definition of reference temperature (Tref) The regulators are designed to operate in different thermal environments and sufficient cooling must be provided to ensure reliable operation. Cooling is achieved mainly by conduction, from the pins to the host board, and convection, which is dependant on the airflow across the regulator. Increased airflow enhances the cooling of the regulator. The reference temperature is used to monitor the temperature limits of the product. Temperatures above maximum Tref are not allowed and may cause degradation or permanent damage to the product. Tref is also used to define the temperature range for normal operating conditions. Tref is defined by the design and used to guarantee safety margins, proper operation and high reliability of the module. The Output Current Derating graph found in the Output section for each model provides the available output current vs. ambient air temperature and air velocity at Vin = 3.3 V. Ambient Temperature Calculation The DC/DC regulator is tested on a 254 x 254 mm, 35 m (1 oz), 8-layer test board mounted vertically in a wind tunnel with a cross-section of 305 x 305 mm. TBD Connections Proper cooling of the DC/DC regulator can be verified by measuring the temperature at positions P1, P2 and P3. The temperature at these positions should not exceed the max values provided in the table below. v F Note that the max value is the absolute maximum rating (non destruction) and that the electrical Output data is guaranteed up to Tref +85C. See Design Note 019 for further information. Position Device P1 PCB P2 MOSFET P3 INDUCTOR Designation max value Tref 120 C TOP VIEW 110 C 120 C Pin Designation Function 1 GND Common ground connection for the Vin and VTT power connections. 2 VIN The positive input voltage power node to the module. 3 Inhibit Applying a low-level ground signal to this input disables the module's output. 4 No Connect 5 VoSENSE 6 VTT 7 GND Common ground connection for the Vin and VTT power connections. 8 VREF Reference voltage for the system bus receiver comparators. 9 No Connect 10 No Connect The Vo sense allows the regulation circuit to compensate for voltage drop between the module and load. For optimal voltage accuracy Vo Sense should be connected to VTT. Regulated power output with respect to the GND node and required bus termination supply voltage. E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 4/1301-BMR 644Technical Specification SEC/D EPANHON Approved PMG 4000F series SEC/D (Linad Zhong) 1 (7) No. Checked Date See end 2006-2-14 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Mechanical Information (Surface mount version) Rev Reference EN/LZT 146 334 R1C R1B April 2006 2007 B (c) Ericsson Power Modules AB 11 E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 4/1301-BMR 644Technical Specification SEC/D EPANHON Approved PMG 4000F series SEC/D (Linad Zhong) 2 (7) No. Checked Date See end 2006-2-14 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Mechanical Information (Through hole mount version) Rev Reference EN/LZT 146 334 R1C R1B April 2006 2007 B (c) Ericsson Power Modules AB 12 E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 3 (7) No. 13 4/1301-BMR 644Technical Specification SEC/D EPANHON Approved PMG 4000F series SEC/D (Linad Zhong) Checked Date See end 2006-2-14 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Rev Reference EN/LZT 146 334 R1C R1B April 2006 2007 B (c) Ericsson Power Modules AB Soldering Information - Surface mounting Maximum regulator temperature requirements The surface mount version of the product is intended for convection or vapor phase reflow Pb-free processes. To achieve a good and reliable soldering result, make sure to follow the recommendations from the solder paste supplier, to use state-of-the-art reflow equipment and reflow profiling techniques as well as the following guidelines. To avoid damage or performance degradation of the product, the reflow profile should be optimized to avoid excessive heating. The maximum product temperature shall be monitored by attaching a thermocoupler to the top of the main transformer. A no-clean flux is recommended to avoid entrapment of cleaning fluids in cavities inside of the DC/DC regulator. The cleaning residues may affect long time reliability and isolation voltage. A sufficiently extended preheat time is recommended to ensure an even temperature across the host PCB, for both small and large devices. To reduce the risk of excessive heating is also recommended to reduce the time in the reflow zone as much as possible. Minimum pin temperature recommendations SnPb solder processes Pin number 9 is chosen as reference location for the minimum pin temperature recommendations since this will be the coolest solder joint during the reflow process. For conventional SnPb solder processes, the product is qualified for MSL 1 according to IPC/JEDEC standard J-STD-020C. During reflow, TP must not exceed +225 C at any time. PIN 9 for measurement of minimum solder joint temperature, TPIN Lead-free (Pb-free) solder processes For Pb-free solder processes, the product is qualified for MSL 3 according to IPC/JEDEC standard J-STD-020C. Main transformer for measurement of Max product temperature, TP During reflow, TP must not exceed +260 C at any time. Temperature Ramp-up TP SnPb solder processes Ramp-down (cooling) TL For Pb solder processes, a pin temperature (TPIN) in excess of the solder melting temperature, (TL, +183 C for Sn63/Pb37) for more than 30 seconds, and a peak temperature of +210 C is recommended to ensure a reliable solder joint. Reflow Preheat Lead-free (Pb-free) solder processes For Pb-free solder processes, a pin temperature (TPIN) in excess of the solder melting temperature (TL, +217 to +221 C for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a peak temperature of +235 C on all solder joints is recommended to ensure a reliable solder joint. 25 C Time 25 C to peak Time Profile features Sn/Pb eutectic assembly Average ramp-up rate Pb-free assembly 3 C/s max 3 C/s max TL +183 C +221 C Peak product temperature TP +225 C +260 C Average ramp-down rate 6 C/s max 6 C/s max Time 25 C to peak temperature 6 minutes max 8 minutes max Solder melting temperature (typical) E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 4/1301-BMR 644Technical Specification SEC/D EPANHON Approved PMG 4000F series SEC/D (Linad Zhong) 4 (7) No. Checked Date See end 2006-2-14 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Soldering Information -- Through Hole Mounting The through hole mount version of the product is intended for through hole mounting in a PCB. When wave soldering is used, the temperature on the pins is specified to maximum 260 C for maximum 10 seconds. Maximum preheat rate of 4 C/s and temperature of max 150 C is suggested. When hand soldering, care should be taken to avoid direct contact between the hot soldering iron tip and the pins for more than a few seconds in order to prevent overheating. A no-clean (NC) flux is recommended to avoid entrapment of cleaning fluids in cavities inside of the DC/DC power module. The residues may affect long time reliability and isolation voltage. Rev Reference EN/LZT 146 334 R1C R1B April 2006 2007 B (c) Ericsson Power Modules AB 14 E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 5 (7) No. 4/1301-BMR 644Technical Specification SEC/D EPANHON Approved PMG 4000F series SEC/D (Linad Zhong) Checked Date Rev See end 2006-2-14 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W EN/LZT 146 334 R1C R1B April 2006 2007 B (c) Ericsson Power Modules AB Delivery package information for SMD Carrier tape specifications The products are delivered in antistatic trays (JEDEC standard) or in antistatic carrier tape (EIA standard). Material Polystyrene Surface resistance < 10E5 ohms/square Bake ability The tape can not be baked. Tape width 56 mm [2.205 inch] Tray specifications 15 Reference Material PET Pocket pitch 24 mm [0.945 inch] Surface resistance 10E3 to 10E5 ohms/square Pocket depth 9.57 mm [0.377 inch] Bake ability The trays can not be baked. Reel diameter 380 mm [15 inch] Tray capacity 25 products /tray Reel capacity 250 products /reel Box capacity 125 products/box) Box capacity 250 products (1 reels/box) Weight 210 g/full tray Weight 1.5 kg/full reel Tape feed directions Round holes Elongated holes Dry pack information The products are delivered in trays or tape & reel. These inner shipment containers are dry packed in standard moisture barrier bags according to IPC/JEDEC standard J-STD-033A (Handling, packing, shipping and use of moisture/reflow sensitivity surface mount devices). Using products in high temperature Pb-free soldering processes requires dry pack storage and handling. In case the products have been stored in an uncontrolled environment and no longer can be considered dry, the modules must be baked according to the referred IPC/JEDEC standard. E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 6 (7) No. 4/1301-BMR 644Technical Specification SEC/D EPANHON Approved PMG 4000F series SEC/D (Linad Zhong) Checked Date See end 2006-2-14 POL regulator, Input 2.95-3.65 V, Output 15 A/27 W Rev 16 Reference EN/LZT 146 334 R1C R1B April 2006 2007 B (c) Ericsson Power Modules AB Product Qualification Specification Characteristics Visual inspection JESD22-B101 Temperature cycling JESD22-A104-B Dwell time Transfer time Temperature range Number of cycles 30 min 0-1 min -40 C to +125 C 300 cycles High temperature storage life JESD22-A103-B Temperature Duration 125 C 1000 h Cold (in operation) IEC 68-2-1, test Ad Temperature TA Duration -45 C 72 h Lead integrity JESD22-B105-C Test condition A Weight Duration 1000 g 30 s Solder ability(only apply to through hole version) IEC 68-2-54 Solder immersion depth Duration of immersion (FC time) TA (time for onset of wetting) Time to FB Wetting Strength FB Stability FC /FB 1 mm 15 s <4 s 8s >100 mN/m >0.8 Steady State Temperature Humidity Bias Life Test JESD22-A101-B Temperature Humidity Duration Input Voltage +85 C 85 % RH 1000 hours Maximum Mechanical shock JESD22-B104-B Peak acceleration Duration Number of shocks 200 g 1.5 ms 5 in each of two directions of three axes Vibration, variable freq JESD22-B103-B Frequency range Acceleration amplitude 10-1000 Hz 10 g or displacement amplitude 1.0 mm Random vibration JESD22-B103-B Frequency Acceleration density 2-500 Hz 0.008-0.2 g2/Hz Temperature Load ON OFF Test duration 85 C Maximum 9 min 3 min 1000 h SnPb eutectic MSL 1 225 C Pb free MSL 3 260 C Water Glycol ether Isopropyl alcohol +55 5 C +35 5 C +35 5 C Operational life test Moisture reflow sensitivity classification test J-STD-020C Resistance to cleaning agents IEC 68-2-45 Xa Method 2