
W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
Description
The TS5A3159 is a single-pole double-throw (SPDT)
analog switch that is designed to operate from 1.65 V
to 5.5 V. The device offers a low ON-state resistance
and an excellent ON-resistance, matching with the
break-before-make feature to prevent signal distortion
during the transferring of a signal from one channel to
another. The device has an excellent total harmonic
distortion (THD) performance and consumes very low
power. These features make this device suitable for
portable audio applications.
Applications
DCell Phones
DPDAs
DPortable Instrumentation
SOT-23 OR SC-70 PACKAGE
(TOP VIEW)
1
2
3
6
5
4
NO
GND
NC COM
V+
IN
TS5A3159
FUNCTION TABLE
IN NC TO COM,
COM TO NC NO TO COM,
COM TO NO
L ON OFF
H OFF ON
Features
DSpecified Break-Before-Make Switching
DLow ON-State Resistance (1 W)
DControl Inputs Are 5-V Tolerant
DLow Charge Injection
DExcellent ON-Resistance Matching
DLow Total Harmonic Distortion
D1.65-V to 5.5-V Single-Supply Operation
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
Summary of Characteristics
V+ = 5 V and TA = 25 °C
Configuration 2:1 Multiplexer/
Demultiplexer
(1 × SPDT)
Number of channels 1
ON-state resistance (ron)1.1
ON-state resistance match (ron)0.1
ON-state resistance flatness (ron(flat)) 0.15
Turn on/turn off time (tON/tOFF)20 ns/15 ns
Break-before-make time (tBBM)12 ns
Charge injection (QC)36 pC
Bandwidth (BW) 100 MHz
OFF isolation (OISO)−65 dB at 1 MHz
Crosstalk (XTALK)−65 dB at 1 MHz
Total harmonic distortion (THD) 0.01%
Leakage current (INO(OFF)/INC(OFF))±20 nA
Package option 6-pin DBV or DCK
    !   "#$ %!& %
  "! "! '! !  !( ! %% )*&
% "!+ %!  !!$* $%! !+  $$ "!!&
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
www.ti.com
Copyright 2005, Texas Instruments Incorporated

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
2
ORDERING INFORMATION
TAPACKAGE(1) ORDERABLE PART NUMBER T OP-SIDE MARKING (2)
−40°C to 85°C
SOT (SOT-23) − DBV Tape and reel TS5A3159DBVR JA8_
−40
°
C to 85
°
C
SOT (SC-70) − DCK(2) Tape and reel TS5A3159DCKR JA_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V+Supply voltage range(2) −0.5 6.5 V
VNO, V COM Analog voltage range(2)(3)(4) −0.5 V+ + 0.5 V
II/OK Analog port diode current VNO, VCOM < 0 or VNO, VCOM > V+±50 mA
INO, ICOM ON−state switch current VNO, VCOM = 0 to V+±200 mA
ON−state peak switch current(5) ±400 mA
VIN Digital input voltage range(2)(3) −0.5 6.5 V
IIK Digital input clamp current VIN < 0 −50 mA
Continuous current through V+ or GND ±100 mA
θJA Package thermal impedance(6) 165 °C
Tstg Storage temperature range −65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) This value is limited to 5.5 V maximum.
(5) Pulse at 1 ms duration < 10% duty cycle.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
3
Electrical Characteristics for 5-V Supply
V+ = 4.5 V to 5.5 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Analog Switch
Analog signal range VCOM,
VNO, V NC 0 V+V
Peak ON resistance
rpeak
0
VNO or VNC
V+,
Switch ON,
25°C
4.5 V
1 1.5
Peak ON resistance
r
peak
0 VNO or VNC V+,
ICOM = −30 mA,
Switch ON,
See Figure 11 Full
4.5 V
1.5
ON-state resistance
ron
VNO or VNC = 2.5 V,
Switch ON,
25°C
4.5 V
0.75 1.1
ON-state resistance
r
on
VNO or VNC = 2.5 V,
ICOM = −30 mA,
Switch ON,
See Figure 11 Full
4.5 V
1.1
ON-state resistance
match between
channels ron VNO or VNC = 2.5 V,
ICOM = −30 mA, Switch ON,
See Figure 11 25°C4.5 V 0.1
ON-state resistance
ron(flat)
0 VNO or VNC V+,
ICOM = −30 mA,
Switch ON,
25°C
4.5 V
0.233
ON-state resistance
flatness
r
on(flat) VNO or VNC = 1 V, 1.5 V, 2.5 V,
ICOM = −30 mA,
Switch ON,
See Figure 11 25°C
4.5 V
0.15
NC, NO
INC(OFF),
VNC or VNO = 4.5 V,
Switch OFF,
25°C
5.5 V
−2 0.2 2
nA
NC, NO
OFF leakage current
INC(OFF),
INO(OFF
)
VNC or VNO = 4.5 V,
VCOM = 0,
Switch OFF,
See Figure 12 Full
5.5 V
−20 20
nA
NC, NO
INC(ON),
VNC or VNO = 4.5 V,
Switch ON,
25°C
5.5 V
−4 2.8 4
nA
NC, NO
ON leakage current
INC(ON),
INO(ON)
VNC or VNO = 4.5 V,
VCOM = Open,
Switch ON,
See Figure 13 Full
5.5 V
−40 40
nA
COM
ICOM(ON)
VNC or VNO = 4.5 V or Open,
Switch ON,
25°C
5.5 V
−4 0.47 4
nA
COM
ON leakage current
I
COM(ON
)
VNC or VNO = 4.5 V or Open,
VCOM = 4.5 V,
Switch ON,
See Figure 13 Full
5.5 V
−40 40
nA
Digital Inputs (IN)
Input logic high VIH Full 2.4 5.5 V
Input logic low VIL Full 00.8 V
Input leakage current IIH, IIL VIN = 5.5 V or 0 Full 5.5 V −1 1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
4
Electrical Characteristics for 5-V Supply (continued)
V+ = 4.5 V to 5.5 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Dynamic
tON
VCOM = V+,
CL = 35 pF,
25°C
4.5 V to
20 35
ns
t
ON
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
4.5 V to
5.5 V 40
ns
tOFF
VCOM = V+,
CL = 35 pF,
25°C
4.5 V to
15 20
ns
t
OFF
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
4.5 V to
5.5 V 35
ns
Break-before-make
tBBM
VNC = VNO = V+/2,
CL = 35 pF,
25°C
4.5 V to
1 12 14.5
ns
time
t
BBM
VNC = VNO = V+/2,
RL = 50 ,
CL = 35 pF,
See Figure 16 Full
4.5 V to
5.5 V 1
ns
Charge injection QCCL = 1 nF, VGEN = 0 V, See Figure 20 25°C5 V 36 pC
NC, NO
OFF capacitance CNC(OFF),
CNO(OFF) VNC or VNO = V+ or GND,
Switch O F F, See Figure 14 25°C5 V 23 pF
NC, NO
ON capacitance CNC(ON),
CNO(ON) VNC or VNO = V+ or GND,
Switch ON, See Figure 14 25°C5 V 84 pF
COM
ON capacitance CCOM(ON) VCOM = V+ or GND,
Switch ON, See Figure 14 25°C5 V 84 pF
Digital input
capacitance CIN VIN = V+ or GND, See Figure 14 25°C5 V 2.1 pF
Bandwidth BW RL = 50 ,
Switch ON, See Figure 17 25°C5 V 100 MHz
OFF isolation OISO RL = 50 ,
f = 1 MHz, Switch OFF,
See Figure 18 25°C5 V −65 dB
Crosstalk XTALK RL = 50 ,
f = 1 MHz, Switch ON,
See Figure 19 25°C5 V −65 dB
Total harmonic
distortion THD RL = 600 ,
CL = 50 pF, f = 600 Hz to 20 kHz,
See Figure 21 25°C5 V 0.01 %
Supply
Positive supply
current I+VIN = V+ or GND, Switch ON or OFF Full 5.5 V 0.1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
5
Electrical Characteristics for 3.3-V Supply
V+ = 3 V to 3.6 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Analog Switch
Analog signal range VCOM,
VNO, V NC 0 V+V
Peak
rpeak
0
VNO or VNC
V+,
Switch ON,
25°C
3 V
1.35 2.1
Peak
ON-state resistance
r
peak
0 VNO or VNC V+,
ICOM = −24 mA,
Switch ON,
See Figure 11 Full
3 V
2.1
ON-state resistance
ron
VNO or VNC = 2 V,
Switch ON,
25°C
3 V
1.15 1.5
ON-state resistance
r
on
VNO or VNC = 2 V,
ICOM = −24 mA,
Switch ON,
See Figure 11 Full
3 V
1.5
ON-state resistance
match between
channels ron VNO or VNC = 2 V, 0.8 V,
ICOM = −24 mA, Switch ON,
See Figure 11 25°C3 V 0.11
ON-state resistance
ron(flat)
0 VNO or VNC V+,
ICOM = −24 mA,
Switch ON,
25°C
3 V
0.225
ON-state resistance
flatness
r
on(flat) VNO or VNC = 2 V, 0.8 V,
ICOM = −24 mA,
Switch ON,
See Figure 11 25°C
3 V
0.25
NC, NO
INC(OFF),
VNC or VNO = 3 V,
Switch OFF,
25°C
3.6 V
0.2
nA
NC, NO
OFF leakage current
INC(OFF),
INO(OFF
)
VNC or VNO = 3 V,
VCOM = 0,
Switch OFF,
See Figure 12
25
°
C
3.6 V
0.2
nA
NC, NO
INC(ON),
VNC or VNO = 3 V,
Switch ON,
25°C
3.6 V
2.8
nA
NC, NO
ON leakage current
INC(ON),
INO(ON)
VNC or VNO = 3 V,
VCOM = Open,
Switch ON,
See Figure 13
25
°
C
3.6 V
2.8
nA
COM
ICOM(ON)
VNC or VNO = 3 V or Open,
Switch ON,
25°C
3.6 V
0.47
nA
COM
ON leakage current
I
COM(ON
)
VNC or VNO = 3 V or Open,
VCOM = 3 V,
Switch ON,
See Figure 13
25
°
C
3.6 V
0.47
nA
Digital Inputs (IN)
Input logic high VIH Full 2 5.5 V
Input logic low VIL Full 0 0.6 V
Input leakage current IIH, IIL VIN = 5.5 V or 0 Full 3.6 V −1 1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
6
Electrical Characteristics for 3.3-V Supply (continued)
(V+ = 3 V to 3.6 V and TA = −40 °C to 85 °C) (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Dynamic
tON
VCOM = V+,
CL = 35 pF,
25°C
3 V to
30 40
ns
t
ON
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
3 V to
3.6 V 55
ns
tOFF
VCOM = V+,
CL = 35 pF,
25°C
3 V to
20 25
ns
t
OFF
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
3 V to
3.6 V 40
ns
Break-before-make
tBBM
VNC = VNO = V+/2,
CL = 35 pF,
25°C
3 V to
1 21 29
ns
time
t
BBM
VNC = VNO = V+/2,
RL = 50 ,
CL = 35 pF,
See Figure 16 Full
3 V to
3.6 V 1
ns
Charge injection QCCL = 1 nF, VGEN = 0 V, See Figure 20 25°C3.3 V 20 pC
NC, NO
OFF capacitance CNC(OFF),
CNO(OFF) VNC or VNO = V+ or GND,
Switch O F F, See Figure 14 25°C3.3 V 23 pF
NC, NO
ON capacitance CNC(ON),
CNO(ON) VNC or VNO = V+ or GND,
Switch ON, See Figure 14 25°C 3.3V 84 pF
COM
ON capacitance CCOM(ON) VCOM = V+ or GND,
Switch ON, See Figure 14 25°C3.3 V 84 pF
Digital input
capacitance CIN VIN = V+ or GND, See Figure 14 25°C3.3 V 2.1 pF
Bandwidth BW RL = 50 ,
Switch ON, See Figure 17 25°C3.3 V 100 MHz
OFF isolation OISO RL = 50 ,
f = 1 MHz, Switch OFF,
See Figure 18 25°C3.3 V −65 dB
Crosstalk XTALK RL = 50 ,
f = 1 MHz, Switch ON,
See Figure 19 25°C3.3 V −65 dB
Total harmonic
distortion THD RL = 600 ,
CL = 50 pF, f = 600 Hz to 20 kHz,
See Figure 21 25°C3.3 V 0.015 %
Supply
Positive supply
current I+VIN = V+ or GND, Switch ON or OFF Full 3.6 V 0.1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
7
Electrical Characteristics for 2.5-V Supply
V+ = 2.3 V to 2.7 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Analog Switch
Analog signal range VCOM,
VNO, V NC 0 V+V
Peak
rpeak
0
VNO or VNC
V+,
Switch ON,
25°C
2.5 V
1.7 2.7
Peak
ON-state resistance
r
peak
0 VNO or VNC V+,
ICOM = −8 mA,
Switch ON,
See Figure 11 Full
2.5 V
2.7
ON-state resistance
ron
VNO or VNC = 1.8 V,
Switch ON,
25°C
2.5 V
1.45 2
ON-state resistance
r
on
VNO or VNC = 1.8 V,
ICOM = −8 mA,
Switch ON,
See Figure 11 Full
2.5 V
2
ON-state resistance
match between
channels ron VNO or VNC = 0.8 V, 1.8 V,
ICOM = −8 mA, Switch ON,
See Figure 11 25°C2.5 V 0.7
ON-state resistance
ron(flat)
0 VNO or VNC V+,
ICOM = −8 mA,
Switch ON,
25°C
2.5 V
0.5
ON-state resistance
flatness
r
on(flat) VNO or VNC = 0.8 V, 1.8 V,
ICOM = −8 mA,
Switch ON,
See Figure 11 25°C
2.5 V
0.45
NC, NO
INC(OFF),
VNC or VNO = 2.3 V,
Switch OFF,
25°C
2.7 V
0.2
nA
NC, NO
Off leakage current
INC(OFF),
INO(OFF
)
VNC or VNO = 2.3 V,
VCOM = 0,
Switch OFF,
See Figure 12
25
°
C
2.7 V
0.2
nA
NC, NO
INC(ON),
VNC or VNO = 2.3 V,
Switch ON,
25°C
2.7 V
2.8
nA
NC, NO
On leakage current
INC(ON),
INO(ON)
VNC or VNO = 2.3 V,
VCOM = Open,
Switch ON,
See Figure 13
25
°
C
2.7 V
2.8
nA
COM
ICOM(ON)
VNC or VNO = 2.3 V or Open,
Switch ON,
25°C
2.7 V
0.47
nA
COM
On leakage current
I
COM(ON
)
VNC or VNO = 2.3 V or Open,
VCOM = 2.3 V,
Switch ON,
See Figure 13
25
°
C
2.7 V
0.47
nA
Digital Inputs (IN)
Input logic high VIH Full 1.8 5.5 V
Input logic low VIL Full 0 0.6 V
Input leakage current IIH, IIL VIN = 5.5 V or 0 Full 2.7 V −1 1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
8
Electrical Characteristics for 2.5-V Supply (continued)
V+ = 2.3 V to 2.7 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Dynamic
tON
VCOM = V+,
CL = 35 pF,
25°C
2.3 V to
40 55
ns
t
ON
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
2.3 V to
2.7 V 70
ns
tOFF
VCOM = V+,
CL = 35 pF,
25°C
2.3 V to
30 40
ns
t
OFF
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
2.3 V to
2.7 V 55
ns
Break-before-make
tBBM
VNC = VNO = V+/2,
CL = 35 pF,
25°C
2.3 V to
1 33 39
ns
time
t
BBM
VNC = VNO = V+/2,
RL = 50 ,
CL = 35 pF,
See Figure 16 Full
2.3 V to
2.7 V 1
ns
Charge injection QCCL = 1 nF, VGEN = 0 V, See Figure 20 25°C2.5 V 13 pC
NC, NO
OFF capacitance CNC(OFF),
CNO(OFF) VNC or VNO = V+ or GND,
Switch O F F, See Figure 14 25°C2.5 V 23 pF
NC, NO
ON capacitance CNC(ON),
CNO(ON) VNC or VNO = V+ or GND,
Switch ON, See Figure 14 25°C 2.5V 84 pF
COM
ON capacitance CCOM(ON) VCOM = V+ or GND,
Switch ON, See Figure 14 25°C2.5 V 84 pF
Digital input
capacitance CIN VIN = V+ or GND, See Figure 14 25°C2.5 V 2.1 pF
Bandwidth BW RL = 50 ,
Switch ON, See Figure 17 25°C2.5 V 100 MHz
OFF isolation OISO RL = 50 ,
f = 1 MHz, Switch OFF,
See Figure 18 25°C2.5 V −64 dB
Crosstalk XTALK RL = 50 ,
f = 1 MHz, Switch ON,
See Figure 19 25°C2.5 V −64 dB
Total harmonic
distortion THD RL = 600 ,
CL = 50 pF, f = 600 Hz to 20 kHz,
See Figure 21 25°C2.5 V 0.025 %
Supply
Positive supply
current I+VIN = V+ or GND, Switch ON or OFF Full 2.7 V 0.1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
9
Electrical Characteristics for 1.8-V Supply
V+ = 1.65 V to 1.95 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Analog Switch
Analog signal range VCOM,
VNO, V NC 0 V+V
Peak
rpeak
0
VNO or VNC
V+,
Switch ON,
25°C
1.8 V
4 4.9
Peak
ON-state resistance
r
peak
0 VNO or VNC V+,
ICOM = −2 mA,
Switch ON,
See Figure 11 Full
1.8 V
4.9
ON-state resistance
ron
VNO or VNC = 1.5 V,
Switch ON,
25°C
1.8 V
1.7 3.2
ON-state resistance
r
on
VNO or VNC = 1.5 V,
ICOM = −2 mA,
Switch ON,
See Figure 11 Full
1.8 V
3.2
ON-state resistance
match between
ron
VNO or VNC = 0.6 V, 1.5 V,
Switch ON,
25°C
1.8 V
0.7
match between
channels
r
on
VNO or VNC = 0.6 V, 1.5 V,
ICOM = −2 mA,
Switch ON,
See Figure 11 Full
1.8 V
0.7
0
VNO or VNC
V+,
25°C 1.85
ON-state resistance
ron(flat)
0 VNO or VNC V+,
ICOM = −2 mA,
Switch ON,
Full
1.8 V
1.85
ON-state resistance
flatness
r
on(flat)
VNO or VNC = 0.6 V, 1.5 V,
Switch ON,
See Figure 11 25°C
1.8 V
0.9
flatness
VNO or VNC = 0.6 V, 1.5 V,
ICOM = −2 mA,
See Figure 11
Full 0.9
NC, NO
INC(OFF),
VNC or VNO = 1.65 V,
Switch OFF,
25°C
1.95 V
0.2
nA
NC, NO
Off leakage current
INC(OFF),
INO(OFF
)
VNC or VNO = 1.65 V,
VCOM = 0,
Switch OFF,
See Figure 12
25
°
C
1.95 V
0.2
nA
NC, NO
INC(ON),
VNC or VNO = 1.65 V,
Switch ON,
25°C
1.95 V
2.8
nA
NC, NO
On leakage current
INC(ON),
INO(ON)
VNC or VNO = 1.65 V,
VCOM = Open,
Switch ON,
See Figure 13
25
°
C
1.95 V
2.8
nA
COM
ICOM(ON)
VNC or VNO = 1.65 V or Open,
Switch ON,
25°C
1.95 V
0.47
nA
COM
On leakage current
I
COM(ON
)
VNC or VNO = 1.65 V or Open,
VCOM = 1.65 V,
Switch ON,
See Figure 13
25
°
C
1.95 V
0.47
nA
Digital Inputs (IN)
Input logic high VIH Full 1.5 5.5 V
Input logic low VIL Full 0 0.6 V
Input leakage
current IIH, IIL VIN = 5.5 V or 0 Full 1.95 V −1 1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
10
Electrical Characteristics for 1.8-V Supply (continued)
V+ = 1.65 V to 1.95 V and TA = −40°C to 85°C (unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS TAV+MIN TYP(1) MAX UNIT
Dynamic
Turn-on time
tON
VCOM = V+,
CL = 35 pF,
25°C
1.65 V to
65 70
ns
Turn-on time
t
ON
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
1.65 V to
1.95 V 95
ns
Turn-off time
tOFF
VCOM = V+,
CL = 35 pF,
25°C
1.65 V to
40 55
ns
Turn-off time
t
OFF
VCOM = V+,
RL = 50 ,
CL = 35 pF,
See Figure 15 Full
1.65 V to
1.95 V 70
ns
Break-before-make
time
tBBM
VNC = VNO = V+/2,
CL = 35 pF,
25°C
1.65 V to
1 60 72
ns
Break-before-make
time
t
BBM
VNC = VNO = V+/2,
RL = 50 ,
CL = 35 pF,
See Figure 16 Full
1.65 V to
1.95 V 0.5
ns
Charge injection QCCL = 1 nF, VGEN = 0 V, See Figure 20 25°C1.8 V 13 pC
NC, NO
OFF capacitance CNC(OFF),
CNO(OFF) VNC or VNO = V+ or GND,
Switch OFF, See Figure 14 25°C1.8 V 23 pF
NC, NO
ON capacitance CNC(ON),
CNO(ON) VNC or VNO = V+ or GND,
Switch ON, See Figure 14 25°C 1.8V 84 pF
COM
ON capacitance CCOM(ON) VCOM = V+ or GND,
Switch ON, See Figure 14 25°C1.8 V 84 pF
Digital input
capacitance CIN VIN = V+ or GND, See Figure 14 25°C1.8 V 2.1 pF
Bandwidth BW RL = 50 ,
Switch ON, See Figure 17 25°C1.8 V 100 MHz
OFF isolation OISO RL = 50 ,
f = 1 MHz, Switch OFF,
See Figure 18 25°C1.8 V −63 dB
Crosstalk XTALK RL = 50 ,
f = 1 MHz, Switch ON,
See Figure 19 25°C1.8 V −63 dB
Supply
Positive supply
current I+VIN = V+ or GND, Switch ON or
OFF Full 1.95 V 0.1 µA
(1) TA = 25°C

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
11
TYPICAL PERFORMANCE
V+ = 1.8 V
V+ = 3 V
VCOM (V)
01234
ron (Ω)
3.5
3
2.5
2
1.5
1
0.5
0
V+ = 2.5 V
V+ = 4.5 V
TA = 255C
Figure 1. r
on
vs V
COM
TA = −40°C
TA = 85°C
TA = 25°C
VCOM (V)
0123
V+ = 3 V
ron (Ω)
Figure 2. r
on
vs V
COM
1.6
1.4
1.2
1
0.8
0.6
0.4
0
0.2
01234
TA = −40°C
TA = 85°C
TA = 25°C
Figure 3. ron vs VCOM
1.2
1
0.8
0.6
0.4
0.2
0
ron (Ω)
VCOM (V)
V+ = 4.5 V
0
2
4
6
8
10
12
14
16
18
−40 −20 0 20 40 60 80 100
Temperature (°C)
V+ = 5 V
Leakage (nA)
Figure 4. Leakage Current vs Temperature
INO(OFF) INC(OFF)
ICOM(ON)
INC(ON)
INO(ON)
0
10
20
30
40
50
0123456
Supply Voltage (V)
VCOM = V +
TA = 25°C
tON/OFF (ns)
Figure 5. t
ON/OFF
vs V
+
tr < 20 ns
tf < 20 ns
0
2
4
6
8
10
12
14
16
18
20
−40 −20 0 20 40 60 80 100
tON/OFF (ns)
Temperature (°C)
Figure 6. t
ON/OFF
vs Temperature
V+ = 5 V tr = 2.5 ns
tf = 2.5 ns

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
12
Power Supply (V)
Logic Threshold (Vt+/Vt–)
Vt–
Vt+
2.5
2
1.5
1
0.5
043.52.521.5 54.5
Figure 7. Logic Threshold vs Power Supply
3−90
−80
−70
−60
−50
−40
−30
−20
−10
0
Frequency (MHz)
Gain (dB)
0.1 100110 1K
Loss − dB
Figure 8. Frequency Response
Bandwidth
OFF Isolation
Crosstalk
0
−1
−2
−4
−5
−6
−7
−8
−9
−3
Figure 9. Power-Supply Current vs
Temperature
0
2
4
6
8
10
12
14
−40 −20 0 20 40 60 80 100
ICC (nA)
Temperature (°C)
V+ = 5 V
Frequency (MHz)
THD + Noise (%)
10 10K100 1K 100K
Figure 10. Total Harmonic Distortion (THD) vs
Frequency
0.035
0.025
0.020
0.015
0.005
0
0.010
0.030 V+ = 3 V

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
13
PIN DESCRIPTION
PIN
NUMBER NAME DESCRIPTION
1 NO Normally-open terminal
2 GND Digital ground
3 NC Normally-closed terminal
4 COM Common terminal
5 V+Power supply
6 IN Digital control pin to connect COM terminal to NO or NC terminals
PARAMETER DESCRIPTION
SYMBOL DESCRIPTION
VCOM Voltage at COM
VNC Voltage at NC
VNO Voltage at NO
ron Resistance between COM and NC or COM and NO ports, when the channel is ON
rpeak Peak ON-state resistance over a specified voltage range
ron Dif ference of ron between channels
ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state under worst-case
input and output conditions
INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state under worst-case
input and output conditions
INC(ON) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM)
being open
INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM)
being open
ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the ON state and
the output (NC or NO) being open
VIH Minimum input voltage for logic high for the control input (IN)
VIL Minimum input voltage for logic low for the control input (IN)
VIN Voltage at IN
IIH, IIL Leakage current measured at IN
tON T urn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay
between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal, when the switch is turning ON.
tOFF Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay
between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal, when the switch is turning OFF.
tBBM Break-before-make time. This parameter is measured under the specified range of conditions and by the propagation delay
between the output of two adjacent analog channels (NC and NO), when the control signal changes state.
QCCharge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO, or COM)
output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.
Charge injection, QC = CL × VO, CL is the load capacitance, and VO is the change in analog output voltage.

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
14
PARAMETER DESCRIPTION (continued)
SYMBOL DESCRIPTION
CNC(OFF) Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
CNO(OFF) Capacitance at the NO port when the corresponding channel (NO to COM) is OFF
CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is ON
CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is ON
CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is ON
CIN Capacitance of IN
OISO OFF isolation of the switch is a measurement OFF-state switch impedance. This is measured in dB in a specific frequency,
with the corresponding channel (NC to COM or NO to COM) in the OFF state.
XTALK Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC to NO or NO to NC).
This is measured in a specific frequency and in dB.
BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is −3 dB below the DC gain.
I+Static power-supply current with the control (IN) pin at V+ or GND
I+This is the increase in I+ for each control (IN) input that is at the specified voltage, rather than at V+ or GND.

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
15
PARAMETER MEASUREMENT INFORMATION
V+
ICOM
ron +VCOM *VNO or VNC
ICOM
W
GND
Channel ON
NC
VI
NO
COM VCOM
VI = VIH or VIL
VNO
VNC
IN
+
+
Figure 11. ON-State Resistance (ron)
Channel OFF
OFF-State Leakage Current
VI = VIH or VIL
V+
GND
NC
VI
NO
COM VCOM
VNO
VNC
IN
+
+
Figure 12. OFF-State Leakage Current (INC(OFF), INO(OFF))
Channel ON
ON-State Leakage Current
VI = VIH or VIL
V+
GND
NC
VI
NO
COM VCOM
VNO
VNC
IN
+
+NOTE: See electrical characteristics for test conditions.
Figure 13. ON-State Leakage Current (ICOM(ON), INC(ON), INO(ON))

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
16
V+
GND
IN
VBIAS VI
VI = VIH or VIL
VBIAS = V+ or GND
Capacitance is measured at NC,
NO, COM, and IN inputs during
ON and OFF conditions.
Capacitance
Meter
VNO
VNC
VCOM
NO
NC
COM
Figure 14. Capacitance (CI, CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON))
CL(2) RL
VCOM
V+
GND
NC or NO
IN
VNC or VNO
VI
NC or NO
COM
Logic
Input(1)
V+
VCOM
50
RLCL
35 pFtON
TEST
V+
50 35 pFtOFF
50%
tON tOFF
50%
90% 90%
Logic
Input
(VI)
V+
Switch
Output
(VNC or VNO)
0
CL(2) RL
(1) All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.
Figure 15. Turn-On (tON) and Turn-Off Time (tOFF)
V+
GND
NC or NO
IN
VNC or VNO
VI
NC or NO COM VCOM
CL(2) RL
tBBM
50%
90% 90%
VNC or VNO = V+/2
RL = 50
CL = 35 pF
Logic
Input(1)
Logic
Input
(VI)
Switch
Output
(VCOM)
V+
0
(1) All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.
Figure 16. Break-Before-Make Time (tBBM)

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
17
V+
GND
NC
IN
VI
NO
COM
50 W
50 W
VNC VCOM
Channel ON: NC to COM
Network Analyzer Setup
Source Power = 0 dBM
(632-mV P-P at 50-W load)
DC Bias = 350 mV
Network Analyzer
Source
Signal
+
VI = VIH or VIL
Figure 17. Bandwidth (BW)
NC
NO
COM
VNC
VCOM
Channel OFF: NC to COM
Network Analyzer Setup
Source Power = 0 dBM
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V+
GND
50 W
50 W
Network Analyzer
Source
Signal
IN
VI
+
VI = VIH or VIL
Figure 18. OFF Isolation (OISO)
NC
NO
50 W
50 W
VNC VCOM
Channel ON: NC to COM
Network Analyzer Setup
Source Power = 0 dBM
(632-mV P-P at 50-W load)
DC Bias = 350 mV
50 W
V+
GND
VNO
Source
Signal
Channel OFF: NO to COM
Network Analyzer
IN
VI
+
VI = VIH or VIL
Figure 19. Crosstalk (XTALK)

W   
SCDS174BAUGUST 2004 – REVISED MAY 2005
www.ti.com
18
V+
GND
NC or NO
IN
RGEN
VI
NC or NO
COM VCOM
CL(2)
OFF
VCOM
ON OFF
VCOM
VGEN +
VI = VIH or VIL
CL = 0.1 nF
VGEN = 0 to V+
RGEN = 0
QC = CL × VCOM
Logic
Input(1)
VIH
VIL
Logic
Input
(VI)
(1) All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns, tf < 5 ns.
(2) CL includes probe and jig capacitance.
Figure 20. Charge Injection (QC)
V+
GND
NC
NO
COM
10 mF
RL
CL(1)
RL = 600
CL = 50 pF
VSOURCE = V+ P-P
fSOURCE = 600 Hz to 20 kHz RL
VSOURCE
V+/2
Analyzer
10 mF
Channel ON: COM to NC
VO
IN
VI+
VI = VIH or VIL
(1) CL includes probe and jig capacitance.
Figure 21. Total Harmonic Distortion (THD)
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TS5A3159DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DBVTE4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS5A3159DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TS5A3159 :
Enhanced Product: TS5A3159-EP
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS5A3159DBVR SOT-23 DBV 6 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TS5A3159DBVT SOT-23 DBV 6 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TS5A3159DCKR SC70 DCK 6 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
TS5A3159DCKT SC70 DCK 6 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS5A3159DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0
TS5A3159DBVT SOT-23 DBV 6 250 205.0 200.0 33.0
TS5A3159DCKR SC70 DCK 6 3000 205.0 200.0 33.0
TS5A3159DCKT SC70 DCK 6 250 205.0 200.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated