This is the PDF file of catalog No.C02E-6 CHIP MONOLITHIC CERAMIC CAPACITOR for High-voltage GHM3000 Series Safety Recognized CO2E6.pdf 00.7.18 muPata Mi Features 1. Chip monolitic ceramic capacitor (certified as con- forming to safety standards) for AC line. 2. Anew monolithic structure for small, high-capaci- tance capable of operating at high-voltage levels. we [| || 4 ef 3. Compared to lead type capacitors, this new capaci- L w tor is greatly downsized and low-profiled to 1/10 pan Number Dimensions (nm) or less in volume, and 1/4 or less in height. L w T emin. | gmin. 4. The type GB can be used as an X2-class capacitor. _GHM3045 | 2.0 40.3 5.740.4 |5.040.4/ 2.0403 | 03 4.0 5. The type GC can be used as an X1-class and Y2-class GHM3145 37203 capacitor. 6. +125 degree C guaranteed. 7. Only for reflow saldering. Standard Recognition @ Application Status of Recognition | pateg 1. ideal use as Y capacitor or X capacitor for various Standard No. Voltage oe Type GB | Type GC switching power supply. 2. Ideal use as linefilter for MODEM. UL UL1444 - O* BSI - VDE oO 9 AC250V EN132400 (r.m.s.) SEV SEMKO EN132400 Class X2 x1, 2 * : Line By Pass only GC Type Part Number Rated Voltage TC Code Capacitance Length L| Width W | Thickness T| Electradeg | Electrode e ) (PF) (mm) | (mm) (mm) (mm) (mm) GHM3045X7R101K-GC | AC250 (r.m.s.) X7R 100 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R151K-GC | AC250 (r.m.s.) X7R 150 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R221K-GC | AC250 (r.m.s.) X7R 220 +10,-10% 57 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R331K-GC | AC250 (r.m.s.) X7R 330 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R471K-GC | AC250 (r.m.s.) X7R 470 +10,-10% 57 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R681K-GC | AC250 (.m.s.) X7R 680 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R102K-GC | AC250 (r.m.s.) X7R 1000 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R152K-GC | AC250 (r.m.s.) X7R 1500 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R222K-GC | AC250 (r.m.s.) X7R 2200 +10,-10% 57 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R332K-GC | AC250 (r.m.s.) X7R 3300 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3045X7R472K-GC | AC250 (r.m.s.} X7R 4700 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GB Type Part Number Rated Voltage TC Code Capacitance Length L| Width W | Thickness T| Electrodeg | Electrode e ) (pF) (mm) (mm) (mm) (mm) (mm) GHM3145X7R103K-GB | AC250 (r.m.s.) X7R 10000 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3145X7R153K-GB | AC250 (r.m.s.) X7R 15000 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3145X7R223K-GB | AC250 (r.m.s.) X7R 22000 +10,-10% 5.7 5.0 2.0 4.0 min. 0.3 min. GHM3145X7R333K-GB | AC250 (r.m.s.) X7R 33000 +10,-10% 57 5.0 2.7 4.0 min. 0.3 min. Dielectric Strength: DC1075V, 60+/- 1s. 95This is the PDF file of catalog No.C0O2E-6 Specifications and Test Methods CO2E6. pdf 00.7.18 No. Item Specification Test Method 1 | Operating 55 to +125 - Temperature Range 2 | Appearance No defects or abnormalities. Visual inspection. 3 | Dimensions Within the specified dimensions. Using calipers. No failure shall be observed when voltage as table is applied between the terminations for 601 s, provided the . . _ charge/discharge current is less than 50mA. 4 | Dielectric Strength | No defects or abnormalities. Test voltage Type GB DC1075V Type GC AC1500V (r.m.s.} insulation Resistance The insulation resistance shall be measured with 50050V and 5 (LR.) More than 6,000M02 within 60+5 $ of charging. 6 | Capacitance Within the specified tolerance. oo The capacitance/D.F. shall be measured at 20 at a frequency of z | Dissipation 0.025 max 1+0.2kHz and a voltage of 1+0.2V (r.m.s.) Factor (D.F.) . . The range of capacitance change compared with the 25 value Capacitance Cap. Change within 55 to +125C shall be within the specified range. 8 | Temperature Within +15% Pretreatment Characteristics Perform a heat treatment at 150~.6C for 60+5 min and then let sit for 24:2 h at room condition. Appearance | No defects or abnormalities. As in Fig., discharge is made 50 times at 5 s intervals from LR. More than 1,000MQ the capacitor(Cd) charged at DC voitage of specified. R3 Ri Dect re 0 | o\W 9 Test + Application | T 40Ky Q ct = Ra Dielectric . _ /) = Cd Type GC} Strength Pass the item No.4. + T Ct: Capacitor under test Cd: 0.001pF R1i:1,000Q2 R2:100MQ = R3: Surge resistance Solder the capacitor to the testing jig (glass epoxy board) shown in Fig.1 using a eutectic solder. Then apply 10N force in the direction of the arrow. The saldering shall be done either with an iron or using the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat 10 Adhesive Strength No removal of the terminations or other defect shall occur. shock. of Termination Speed : 1.0mm/s Glass Epoxy Board Fig.4 Appearance | No defects or abnormalities. Solder the capacitor to the test jig (glass epoxy board). j at : The capacitor shall be subjected to a simple harmonic motion h . : , : ; Capactance_| Within the specified tolerance having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, shall be traversed in approximately 1 min. This motion shall be applied for a period of 2 hin each 3 mutually perpendicular directions (total Vibration f6h 11 : of 6 h). Resistance DF. 0.025 max. CHAPALA UA Ws Ua a Solder resist LAA YA VA Wie-t-cu Glass Epoxy Board Room condition Temperature : 15 to 35, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa 16 96 Continued on the following page.This is the PDF file of catalog No.CO2E-6 Specifications and Test Methods Continued from the preceding page. CO2E6.pdf 00.7.18 No. Item Specification Test Method Solder the capacitor to the testing jig (glass epoxy board) shown No cracking or marking defects shall occur. in Fig.2 using a eutectic solder. Then apply a force in the direction shown in Fig. 3. The soldering shall be done either with an iron or using the reflow method and shall be conducted with 645 care so that the soldering is uniform and free of defects such as ZS heat shock. d ik [ 3 20 50 Pressurizing 12| Deflection speed : 1.0mm/s "a" { Pressurize 700 t16 R230 LXw Dimension (mm} Flexure=1 {mm) a b a Capacitance meter . 5.7X5.0 45 8.0 5.6 1.0 i 7 (in mm) Fig.2 Fig.3 Immerse the capacitor in a solution of ethanol (JIS-K-8101) and 13 Solderability of 75% of the terminations is to be soldered evenly and continuously. rosin (uIS-K-6902) (25% rosin in weight proportion). Termination Immerse in eutectic solder solution for 240.5 s at 2351457. Immersing speed : 25+2.5mm/s Appearance | No marking defects. Preheat the capacitor as table. Immerse the capacitor in y eutectic salder solution at 2605C for 1041s. Let sit at room Capactance Within +10% condition for 24+2 h, then measure. Change elmmersing speed : 25+2.5mm/s LR. More than 1,000MQ Pretreatment Resistance Perform a heat treatment at 150*.9C for 6045 min and then 14 | to Soldering let sit for 24:2 h at room condition. Heat Dielectric Pass the item No.4. *Preheating Strength Step Temperature Time 1 100% to 1207 4 min. 2 170% to 200 1 min. Appearance | No marking defects. Fix the capacitor to the supporting jig (glass epoxy board} shown Capacitance in Fig.4 using a eutectic solder. Change Within +15% Perform the five cycles according to the four heat treatments listed in the following table. DF. 0.05 max. Let sit for 24+2 h at room condition, then measure. LR. More than 3,000MQ T Min. Temp.+3 3043 Room Ti 2to3 Max. T 3043 15 Temperature Cycle Pretreatment Perform a heat treatment at 150*,8 C for 605 min and then Dielectric let sit for 242 h at room condition. Strength Pass the item No.4. EEE ZA VA VA VA Solder resist LA VA VA Yet cu Glass Epoxy Board Fig.4 Appearance | No marking defects. Capactance | Within +15% Humidity Change Sit the capacitor at 402C and relative humidity 90 to 95% for 16; (Steady | D.F. 0.05 max. 0012 h. State) LR. More than 3,000MQ Remove and let sit for 242 h at room condition, then measure. srength Pass the item No.4. "Room condition Temperature : 15 to 35C, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa Continued on the following page. 97 1616 This is the PDF file of catalog No.CO2E-6 CO2E6.pdf 00.7.18 Specifications and Test Methods Continued from the preceding page. No. Item Specification Test Method Appearance | No marking defects. Impulse Voltage 00 1% Ti=1.2)s=1.67T Capactance Each individual capacitor shall be ws T2=50ps Within 20% subjected to a 2.5kV (Type GC:5kV) chang Impulses (the voltage value means sof DF. 0.05 max. Zero to peak) for three times. Then cal + " 7 2 LR. More than 3,000MQ the capacitors are applied to life test 17 | Life Apply voltage as Table for 1,000 h at 125, relative humidity 50% max. ; ; Type Applied voltage Dielectric | 5s the item No.4. gp | AC312.5V (r.ms.), except that once each hour the Strength voltage is increased to AC1,000V (r.m.s.} for 0.1s. Gc AC425V (r.m.s.}, except that once each hour the voltage is increased to AC1,000V (r.m.s.) for 0.18. Appearance | No marking defects. a Within +15% Humidit Me Apply the rated voltage at 402C and relative humidity 90 to 18 loa ing. DF. 0.05 max. 95% for 500**5 h. Remove and let sit for 242 h at room LR. More than 3,000MQ condition, then measure. Dielectric : Strength Pass the item No.4. "Room condition" Temperature : 15 to 35C, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa 98This is the PDF file of catalog No.CO2E-6 @ Capacitance-Temperature Characteristics GHM1000/1500/2000 Series Cap. Change [%] 4 Temperature [Q} li Impedance-Frequency Characteristics GHM1000 Series(SL) 10pF 229F | SA NY, W Ty 2 jonm) 3 3 Ss TTT TT al s00mC ua 1 10M 100M 1G 3G Frequency [Hz] GHM1500 Series 1005 F Y 4000pF toh a EF 40000pF S Ff r00000pF N { * or s00mb SS soma td ed 1M 10M 700M 1 Frequency (Hz] GHM3000 Series CO2E6.pdf 00.7.18 GHM Series Data 30 20 X7R Char. Spec.(upper} Cap. Change (%) Type GC (1028) >= JA XTR Char. Spec.(lower) 10 -B0 -40 -20 0 20 40 60 8 Temperatura (C) GHM1000 Series(R) 0 = 100 120 140 E s & 470pF 1000pF rN SA 1 toomb fOme ye a 1M 10M 100M 1G Frequency (Hz] GHM2000 Series pN NY 1000pF = ToT Z fohm] ras 400000pF LY 0000pF s000 _N x T1441 Wm V/ 40M 100M Frequency [Hz] Continued on the following page. aThis is the PDF file of catalog No.CO2E-6 C02E6.pdf 00.7.18 GHM Series Data Continued from the preceding page. Wf Impedance-Frequency Characteristics GHM3000 Series(GC Type) GHM3000 Series(GB Type) 1000; 1000 100) 100) N N 1 1 4.70F Af 0.68nF Se 10nE 0. 7 0.4 33nF 0.01 to 0.01 1 10 100 1000 1 10 100 1000 Frequency (MHz) Fraquency (MHz) @ Capacitance-AC Voltage Characteristics GHM3000 Series(GC Type} GHM3000 Series(GB Type) 6 at Room Condition (25C) 60, at Room Condition (25C) 4.7nF Le ee A /. = 2 _ 2 z & 8 0.68nF 3 - 4 g 0 5 3 6 a 5 4 So, -60 -60| 0 400 200 300 400 500 0 100 200 300 400 500 AC-Voltage [V(r.m.3.)] AC-Voltage [V(r.m.s.)} 100Taping is standard packaging method. Minimum Quantity Guide : . Quantity (pes.) Dimensions (mm) Part Number 180mm reel L Ww T Paper Tape Plastic Tape 1.0 4,000 - GHM1030 3.2 16 1.25 - 3,000 GHM1035 3.2 25 15 - 2,000 GHM1038 45 2.0 2.0 - 2,000 2.0 - 1,000 GHM1040 45 3.2 25 - 500 1.0 4,000 - GHM1525 2.0 1.25 1.25 - 3,000 1.0 4,000 - High-voltage | GHM1530 3.2 1.6 1.25 - 3,000 16 - 2,000 15 - 2,000 GHM1535 3.2 2.5 2.0 - 1,000 15 : 1,000 2.0 - 1,000 GHM1540 45 3.2 2.5 . 500 26 - 500 2.0 - 1,000 GHM1545 5.7 5.0 2.7 - 500 GHM2143 5.7 2.8 2.0 - 1,000 AC250V GHM2145 5.7 5.0 2.0 - 1,000 GHM2243 57 2.8 2.0 - 1,000 GHM3045 5.7 5.0 2.0 - 1,000 Safty Std. as 2.0 - 1,000 Recognition | GHM3145 5.7 5.0 27 - 500 M@ Tape Carrier Packaging (1) Appearance of Taping @ Plastic Tape @ Paper Tape Packed Chips Chip Cavity for Chip : As specified in (2) Oo ~ Loo > LP. Bottom Tape : 0.05mm in thickness > \ Base Tape : As specified in (2) Packed Chips Chip Continued on the following page. 101This is the PDF file of catalog No.CO2E-6 CO2E6.pdf 00.7.18 Continued from the preceding page. (2) Dimensions of Tape @ Plastic Tape 8mm width 4mm pitch Tape (T21.25 rank) 12mm width 8mm/4mm pitch Tape 4.040.058 / otto" ' : . 8.00.1' 2.040.05 0.340.1 4020.1 91.58" 2.0+0.1 0.25+0.1 175401 " 0 oo 1.7520.1 ye n0nD1 ie tall. | eC slel ololal), | @ old ote, ' ' A 3 _ ' . eA> re th HEE Ed lg 8 : rez ot RIE ait. at. ati Lp. Wh 3 Ps t +c L 8 1a eo eR 7 \ Z mn ay Direction of Feed 2.5 max. Direction of Feed 37 max. Part Number At B* Part Number A B GHMxx25 1.45 2.25 GHMxx38 25 5.1 GHMxx30 2.0 3.6 GHMxx40 3.6 49 GHMxx35 2.9 3.6 GHMxx43 3.2 6.1 Nominal Value GHMxx45 5.4 6.4 *1 4.0+0.1mm in case of GHM1038 Nominal Value (in mm) @ Paper Tape (3) Dimensions of Reel 8mm width 4mm pitch Tape (T=1.0 rank) 4.040.1 4.0+0.1 91.540! 2.0:++0.05 1.1 max. 7 oF 1.75401 feof | o - : | + o L rh rh chp rr ah OB i FF 2 4H tek tree 4H 49] Ie 8 |e ot tot Le Ls iMG L Direction of Feed 9.0 5 (Tape width 8mm) Part Number AY B 13.0 20 (Tape width 12 mm) GHMXxx25 1.45 2.25 GHMxx30 2.0 3.6 *Nominal value (in mm) (in mm) 102This is the PDF file of catalog No.CO2E-6 CO2E6.pdf 00.7.18 (4) Taping Method @ Tapes for capacitors are wound clockwise. The sprocket holes are to the right as the tape is pulled toward the user. Vacant section Chip-mounting unit Vacant section oF TF @) Part of the leader and part of the empty tape shall be 2 Offo ao Glo ao c/o tsau attached to the end of the tape as follows. i | PES ! ( te ] co 7 | @) The top tape or cover tape and base tape are not |. 40 to 200 | 100 to 200 _| attached at the end of the tape for a minimum of 5 _ 250 to 560 pitches. Direction of feed (Top Tape or Cover Tape alone) @ Missing capacitors number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not continuous. (in mm) @ The top tape or cover tape and bottom tape shal! not protrude beyond the edges of the tape and shall not cover sprocket holes. @ Cumulative tolerance of sprocket holes, 10 pitches : +0.3mm. @ Peeling off force : 0.1 to 0.7N in the direction shown on the right. 480 0) _ 465 9 , Top Tape or Cover Tape Se pase Tape 103This is the PDF file of catalog No.CO2E-6 C02E6.pdf 00.7.18 @ Storage and Operating Conditions Do not use or store capacitorsin a corrosive atmo- sphere, especially where chloride gas, sulfide gas, acid, alkali, salt or the like are present and avoid exposure to moisture. Before cleaning, bonding or molding this product, ver- ify that these processes do not affect product quality by testing the performance of a cleaned, bonded or @ Handling Vibration and impact Do not expose a capacitor to excessive shock or vibra- tion during use. Failure to follow the above cautions may result, worst case,in a short circuit and fuming when the product is used, Hf Caution (Rating) 1. Operating Voltage Be sure to use a capacitor only within its rated operating voltage range. When DC-rated capacitors are to be used in AC or ripple voltage circuits, be sure to maintain the Vp-p value of the applied voltage within the rated voltage range. 2. Operating Temperature and Self-generated Heat Keep the surface temperature of a capacitor within the rated operating temperature range. Be sure to take into account the heat produced by the capacitor itself. When a capacitor is used in a high-fre- quency circuit, pulse voltage circuit or the like, it may produce heat due to dielectric loss. Keep such self-generated temperature below 20C in B(X7R) characteristic products. Regarding R and SL characteristic products, the applied voltage should be limited in high frequency circuit. Please contact our sales representatives or engineers for more details. 3. Test Condition for AC Withstanding Voltage (1) Test Equipment Test equipment for AC withstanding voltage shall be used with the performance of the wave similar to 50/60 Hz sine wave. If the distorted sine wave or over load exceeding the molded product in the intended equipment. Store the capacitors where the temperature and rela- tive humidity do not exceed 5 to 40 degrees centigrade and 20 ta 70%. Use capacitors within 6 months. Failure to follow the above cautions may result, worst case,in a short circuit and fuming when the product is used. specified voltage value is applied, the defective may be caused. (2) Voltage Applied Method When the withstanding voltage is applied, capacitor's lead or terminal shall be firmly connected to the out-put of the withstanding voltage test equipment, and then the voltage shail be raised from near Zero to the test voltage. If the test voltage without the raise from near zero voltage would be applied directly to capacitor, test voltage should be applied with the *zero cross. At the end of the test time, the test voltage shall be reduced to near zero, and then capacitor's lead or terminal shall be taken off the out-put of the withstanding voltage test equipment. If the test voltage without the raise from near zero voltage would be applied directly to Voltage Sine Wave capacitor, the surge voltage a ov may arise, and therefore, the defective may be caused. Zero oe J *ZERO CROSS is the point where voltage sine wave pass OV. -See the right figure- Failure to follow the above cautions may result, worst case, in a short circuit and fuming when the product is used. 104This is the PDF file of catalog No.C02E-6 CO2E6.pdf 00.7.18 @ Caution (Soldering and Mounting) 1. Vibration and Impact 3. Land Layout for Cropping PC Board Do not expose a capacitor to excessive shock or vibration Choose a mounting position that minimizes the stress during use. imposed on the chip during flexing or bending of the board. a . {Component Direction] 2. Circuit Board Material Please contact our sales representatives or engineers in case that GHM products (size 4.5 X3.2mm and over) are to be mounted upon a metal-board or metal-frame. Soldering heat causes the expansion and shrinkage of a board or frame. which may result in chip-cracking. Locate chip horizontal to the direction in which stress acts. [Chip Mounting Close to Board Separation Point] Chip arrangement Worst A>C>B=D Best Continued on the following page. 105This is the PDF file of catalog N o.CO2E-6 C02E6.pdf 00.7.18 Continued from the preceding page. 4. Soldering (Prevention of the thermal shock) If a chip component is heated or cooled abruptly during soldering, it may crack due to the thermal shock. To prevent this, adequate soldering condition should be taken following our recommendation below. Carefully perform pre-heating so that temperature difference (AT) between the solder and component surface should be in the following range. When components are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100C. Chip Size) 3.2x1.6mm | 3.2X2.5mm Soldering Method and under and over Reflow Method or . : Soldering Iron Method ATS190C ATS130C Flow Method or . Dip Soldering Method ATS150C a infrared Reflow Soldering Conditions (Example) 220 to 230 Within 10 sec. ES AT 200% LE Pre-heating 60 sec. min, Within120 sec. Temperature (C) Within 20 sec. Flow Soldering Conditions (Example) 230 to 240 Temperature (C} Pre-heating |_lt 60 to 120 sec. Within 5 sec. When soldering chips with a soldering iron, it should be performed in following conditions. Item Conditions Chip Size $2.0X%1.25mm 3.2X 1.6mm Temperature of Iron-tip | 300C max. 270C max. Soldering Iron Wattage 20W max. Diameter of Iron-tip $ 3.0mm max. Soldering Time 3 sec. max. Caution Do not allow the iron-tip to directly touch the ceramic element. Vapor Reflow Soldering (VPS) Conditions (Example) 215% \ = | AT \, f . Q 8) J | Oo e pesn 60 sec. min. Within 20 sec. Within120 sec. Dip Soldering/Soldering Iron Conditions (Example) Temperature (C) Pre-heating 60 ta 120 sec. Within 20 sec. 5. Soldering Method GHM products whose sizes are 3.2X1.6mm and under for flow and reflow soldering, and other sizes for reflow soldering. Be sure to contact our sales representatives or engineers in case that GHM products (size 3.2X2.5mm and over) are to be mounted with flow soldering. It may crack due 106 to the thermal shock. Failure to follow the above cautions may result, worst case, in a short circuit and fuming when the product is used.. Mounting of Chips @ Mechanical shock of the chip placer When the positioning claws and pick up nozzle are worn, the load is applied to the chip while positioning is concentrated to one position, thus causing cracks, Termination Thickness of Chip Capacitor and Desirable Thickness of Adhesives Applied a: 20 to 70um Chip Capacitor b: 30 to 35um breakage, faulty positioning accuracy, etc. 80 to 105pm Careful checking and maintenance are necessary to - r , L. prevent unexpected trouble. _ ft Adhesive 5 b | An excessively low bottom dead point of the suction | Land . . . . Base Board nozzle imposes great force on the chip during mounting, asenes causing cracked chips. Please set the suction nozzle's bottom dead point on the upper surface of the board. 0.3mm min. 0.3mm min. oo LA L JF 100 to 120um - Adhesive Land 2. Construction of Board Pattern After installing chips, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to lower. To pre-vent this, be extremely careful in determining shape and dimension before designing the circuit board diagram. Construction and Dimensions of Pattern (Example) Flow Soldering Chip Capacitor Slit LXw a b c Solder Resist 2.0% 1.25 1.0-1.2 0.9-1.0 0.8-1.1 3.2X1.6 2.2-2.6 1.0-1.1 1.0-1.4 fate | > Reflow Solderin Ye Ww 9 Land | LXW a b c d e 2.0% 1.25 1.0-1.2 0.9-1.0 0.8-1.1 - - Preparing slit help flux 3.2X1.6 2.2-2.4 0.8-0.9 1.0-1.4 1,0-2.0 3.2-3.7 cleaning and resin coating on 3.2X%2.5 2.0-2.4 1.0-1.2 1.8-2.3 1.0-2.0 4.1-4.6 the back of the capacitor. 45X20 2.8-3.4 1,2-1.4 1.4-1.8 1.0-2.8 3.6-4.1 4.5X3.2 2.8-3.4 1.2-1.4 2.3-3.0 1.0-2.8 4.8-5.3 5.7X2.8 4.0-4.6 1.4-1.6 2.1-2.6 4.0-4.0 44-49 5.7X5.0 4.0-4.6 1.4-1.6 3.5-4.8 1.0-4.0 6.6-7.1 (in mm) Land Layout to Prevent Excessive Solder Mounting Close to a Chassis Mounting with Leaded Components Mounting Leaded Components Later di Lead Wire Connected Soldering Iron F Ghdssis toa Part Provided Lead Wire of V___| 7 Solder (Ground solder) with Lead Wires. Conecled Later Examples of Arrangements to be Avoided C Adhesive Base board . . A . . : L_Land Pattern in section in section in section dz . di<d2 Solder Resist Solder Resist Examples of Improvements _ Solder Resist by the Land Divi- sion in section in section in section Continued on the following page. 107Continued from the preceding page. 3. Soldering (Care for minimizing loss of the terminations.) Limit of losing effective area of the terminations and conditions needed for soldering. Depending on the conditions of the soldering temperature and/or immersion (melting time), effective areas may be lost in some part of the terminations. To prevent this, be careful in soldering so that any possible loss of the effective area on the terminations will securely remain minimum 25% on all edge length A-B-C-D of part with A, B, C, D, shown in the Figure below. Termination Soldering Allowance Time e Solder : 6X4 Eutectic Solder 5 g 3B E 6 E oD 5 zB O ao Flow Dip Reflow 0 30 60 90 Time (sec.} In case of repeated soldering, the accumulated soldering time must be within the range shown above. (2) Flux and Solder @ Use rosin-type flux and do not use a highly acidic flux (any containing a minimum of 0.2wt% chlorine). @ Please use 624 eutectic solder, or 525 solder. (Do not use solder with silver.) (3) Solder Buildup @ Flow soldering and iron soldering Use as little solder as possible, and confirm that the solder is securely placed. @ Reflow soldering When soldering, confirm that the solder is placed over 0.2mm of the surface of the terminations. 4, Cleaning To perform ultrasonic cleaning, observe the following conditions on the right. 5. Resin Coating @ When selecting resin materials, select those with low contraction and low moisture absorption coefficient (generally epoxy resin is used). @ Buffer coat can decrease the influence of the resin shrinking (generally silicone resin). [Solder Buildup by Flow Method and Soldering Iron Method] - Adhesive Excessive Solder [ Buildup C J [Solder Buildup by Reflow Method] Chip Capacitor __t 0.2mm min. Rinse bath capacity : Output of 20 watts per liter or less. Rinsing time : 5 minutes maximum. 108This is the PDF file of catalog No.CO2E-6 C02E6.pdf 00.7.18 WISO9000 CERTIFICATIONS Manufacturing plants of these products in this catalog have obtained the {S09001 or ISO9002 certificate. Plant Certified Date Organization Registration NO. Fukui Murata Manufacturing ' OENg. Co. Ltd. Mar. 31, 95 RCI RCJ-85M-01C Izumo Murata Manufacturing May. 11, '95 ISO9001 RCJ-93M-05A Co.,Ltd. Murata Electronics \ SISIR* * Singapore (Pte) Ltd. Aug. 13, '92 1$09002 SG MES 91MO01A Murata Manufacturing \ BSIk** (UK) Ltd. Nov. 18, '92 1s09002 FM 22169 Murata Amazonia 1 RCJ* Industria Comercio Ltda. Sep. '93 1$09002 ROJ(B)-93M-01 Murata Electronics North America 1 UL kkk* State College Plant Jun. "94 1S09002 ANTS4 % RCJ : Reliability Center for Electronic Components of Japan %&* SISIR : Singapore Institute of Standards and Industrial Research % kk BSI: British Standards Institution kk w* UL: Underwriters Laboratories Inc. 109This is the PDF file of catalog No.CO2E-6 COZE6.pdf 00.7.18 Note: 1. Export Control For customers outside Japan) Murata products should not be used or sold for use in the development, production, stockpiling or utilization of any conventional weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. (For customers in Japan) For products which are controlled items subject to the Foreign Exchange and Foreign Trade Law of Japan, the export license specified by the law is required for export. . Please contact our sales representatives or product engineers before using our products listed in this catalog for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property, or when intending to use one of our products for other applications than specified in this catalog. Aircraft equipment @ Aerospace equipment @ Undersea equipment @ Power plant equipment @ Medical equipment Transportation equipment (vehicles, trains, ships, etc.) @ Traffic signal equipment Disaster prevention / crime prevention equipment @) Data-processing equipment {0 Application of similar complexity and/or reliability requirements to the applications listed in the above Nt 3. Product specifications in this catalog are as of July 2000. They are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before your ordering. If there are any questions, please contact our sales representatives or product engineers. 4, The parts numbers and specifications listed in this catalog are for information only. You are requested to approve our product specification or to transact the approval sheet for product specification, before your ordering. 5. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent. 6. None of ozone depleting substances (ODS) under the Montreal Pratocol is used in manufacturing process of us. Murata Manufacturing Co., Ltd. http:/Avww.murata.co.jp/products/ Head Office International Division 2-26-10, Tenjin Nagaokakyo-shi, Kyoto 617-8555, Japan Phone:81-75-955-6502 3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan Phone:81-3-5469-6123 Fax:81-3-5469-6155 E-mail:inti@murata.co.jp