R1170x SERIES
800mA LDO REGULATOR
NO.EA-084-111027
1
OUTLINE
The R1170x Series are positive voltage regulator ICs by CMOS process. The R1170x Series have features of
high ripple rejection, low dropout voltage, high output voltage accuracy, low consumption current. Each of these
ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit
circuit at short mode, a chip enable circuit, and therm al-shunt circuit. Output Voltage of R1170 is fixed in the IC.
Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make
low dropout voltage and chip enable function prolong the battery life. These regulators are remarkable
improvement on the current regulators in terms of ripple rejection, input transient response, and load transient
response.
Maximum Output Current is large for its compact size.
Thus, the R1170x Series are suitable for various power sources for port able appliances.
Since the packages for these ICs are the SOT-89-5 package, HSON-6, or HSOP-6J, high density mounting of
the ICs on boards is possible.
FEATURES
• Supply Current............................................................. Typ. 80 μA
• Standby Current........................................................... Typ. 0.1μA
• Output Current ............................................................. Min. 800mA (VIN=VOUT+1.0V)
• Dropout Voltage ........................................................... Typ. 0.12V (VOUT=3.0V, IOUT=300mA)
• Output Voltage Accuracy.............................................. ±2.0%
• Temperature-Drift Coefficient of Output Voltage.......... Typ.±100ppm/°C
• Line Regulation............................................................ Typ. 0.05%/V
• Output Voltage ............................................................. 1.5V to 5.0V (0.1V steps)
(
For other voltages, please refer to MARK INFORMATIONS.)
• Packages ..................................................................... HSON-6, SOT-89-5, HSOP-6J
• Built-in Current Limit Circuit
• Built-in Thermal Shutdown Circuit
• Ceramic capacitors are re commended to be used with this IC
APPLICATIONS
• Local Power source for Notebook PC.
• Local Power source for portable appliances, cameras, and videos.
• Local Power source for equipment of battery-use.
• Local Power source for home appliances.
R1170x
2
BLOCK DIAGRAMS
R1170xxx1A R1170Dxxx1B
V
DD
GND
V
OUT
CE
Vref
Current Limit
Thermal Shutdown
V
DD
GND
V
OUT
CE
Vref
Current Limit
Thermal Shutdown
SELECTION GUIDE
The output voltage, the chi p-enable polarity, package for the ICs can be selected at the user’s request.
Product Name Package Quantity per Reel Pb Free Halogen Free
R1170Dxx1∗-TR-FE HSON-6 3,000 pcs Yes Yes
R1170Hxx1∗-T1-FE SOT-89-5 1,000 pcs Yes Yes
R1170Sxx1∗-E2-FE HSOP-6J 1,000 pcs Yes Yes
xx : The output voltage can be designated in the range from 1.5V(15) to 5.0V(50) in 0.1V steps.
(For other voltages, please refer to MARK INFORMA TIONS.)
∗ : CE pin polarity are options as follows.
(A) "L" active
(B) "H" active
R1170x
3
PIN CONFIGURATION
• HSON-6 • SOT-89-5 • HSOP-6J
Top View Bottom View
6 5 4
∗
∗
∗
4 5 6
1 2 3 3 2 1
13
54
2
1 3
6 4
2
5
PIN DESCRIPTION
• HSON-6
Pin No Symbol Description
1 VOUT*1 Voltage Regulator Output Pin
2 VOUT*1 Voltage Regulator Output Pin
3 CE or CE Chip Enable Pin
4 GND Ground Pin
5 VDD*1 Input Pin
6 VDD*1 Input Pin
∗) Tab and tab suspension leads in the parts are GND level.
(They are connected to the reverse sid e of the IC.)
The tab is better to be connected to the GN D, but leaving it open is also acceptable.
The tab suspension leads should be open and do not conn ect to other wires or land patterns.
∗1) The VOUT pin and VDD pin must be wired each other when it is mounted on board.
• SOT-89-5
Pin No Symbol Description
1 CE or CE Chip Enable Pin
2 GND Ground Pin
3 NC No Connection
4 VDD Input Pin
5 VOUT Voltage Regulator Output Pin
R1170x
4
• HSOP-6J
Pin No Symbol Description
1 VOUT Voltage Regulator Output Pin
2 GND*1 Ground Pin
3 CE or CE Chip Enable Pin
4 NC No Connection
5 GND*1 Ground Pin
6 VDD Input Pin
∗1) The GND pin must be wired together when it is mounted on board.
ABSOLUTE MAXIMUM RATINGS
Symbol Item Rating Unit
VIN Input Voltage 7.0 V
VCE Input Voltage ( CE or CE Input Pin) −0.3 to VIN+0.3 V
VOUT Output Voltage −0.3 to VIN+0.3 V
Power Dissipation (HSON-6)* 900
Power Dissipation (SOT-89-5)* 900
PD
Power Dissip ation (HSOP-6J)* 1700
mW
Topt Operating Temperature −40 to 85 °C
Tstg Storage Temperature −55 to 125 °C
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system u sing the device
in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment sho uld b e designed that the mounted semiconductor devices o perate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or su rge. And the semicondu ctor devices may receive seriou s damage when they continu e
to operate over the recommended operating conditions.
R1170x
5
ELECTRICAL CHARACTERISTICS
• R1170xxxxA Topt=25°C
Symbol Item Conditions Min. Typ. Max. Unit
VIN Input Voltage 6.0 V
ISS Supply Current VIN−VOUT=1.0V,
VCE=GND 80 160
μA
Istandby Standby Current VIN=VCE=6.0V 0.1 1.0
μA
VOUT Output voltage VIN−VOUT=1.0V
IOUT=100mA ×0.98 ×1.02 V
ΔVOUT/
ΔIOUT Load regulation VIN−VOUT=1.0V
1mA
<
=
IOUT
<
=
300mA 30 100 mV
VOUT=1.5V 0.35 0.45
VOUT=1.6V 0.30 0.35
VOUT=1.7V 0.25 0.30
1.8V
<
=
VOUT
<
=
2.0V 0.20 0.25
2.1V
<
=
VOUT
<
=
2.4V 0.15 0.20
VDIF Dropout Voltage IOUT=300mA
2.5V
<
=
VOUT
<
=
5.0V 0.12 0.18
V
ΔVOUT/
ΔVIN Line regulation IOUT=100mA
VOUT+0.5V
<
=
VIN
<
=
6.0V 0.05 0.30 %/V
1.5V
<
=
VOUT
<
=
4.7V:
f=1kHz, VIN−VOUT=1.0V
Ripple 0.5Vp-p 50
RR Ripple Rejection 4.8V
<
=
VOUT
<
=
5.0V:
f=1kHz, VIN=5.7V
Ripple 0.5Vp-p 50
dB
ΔVOUT/
ΔTopt Output Voltage
Temperature Coefficient IOUT=10mA, VIN−VOUT=1.0V
−40°C
<
=
Topt
<
=
85°C ±100 ppm/
°C
ILIM Output Current VIN−VOUT=1.0V 800 mA
ISC Short Current Limit VOUT=0V 40 mA
RPU Pull-up resistancefor CE pin 1.25 2.50 5.00
MΩ
VCEH CE Input Voltage "H" 1.50 VIN V
VCEL CE Input Voltage "L" 0 0.25 V
TTSD Thermal Shut down
Detector Threshold Temperature Junction Temperature 150 °C
TTSR Thermal Shut down
Released Temperature Junction Temperature 120 °C
R1170x
6
• R1170xxxxB Topt=25°C
Symbol Item Conditions Min. Typ. Max. Unit
VIN Input voltage 6.0 V
ISS Supply Current VIN−VOUT=1.0V,VCE=VIN 80 160
μA
Istandby Standby Current VIN=6.0V,VCE=GND 0.1 1.0
μA
VOUT Reference Voltage for
Adjustable Voltage Regulator VIN−VOUT=1.0V
IOUT=100mA ×0.98 ×1.02 V
ΔVOUT/
ΔIOUT Load regulation VIN−VOUT=1.0V
1mA
<
=
IOUT
<
=
300mA 30 100 mV
VOUT=1.5V 0.35 0.45
VOUT=1.6V 0.30 0.35
VOUT=1.7V 0.25 0.30
1.8V
<
=
VOUT
<
=
2.0V 0.20 0.25
2.1V
<
=
VOUT
<
=
2.4V 0.15 0.20
VDIF Dropout Voltage IOUT=300mA
2.5V
<
=
VOUT
<
=
5.0V 0.12 0.18
ΔVOUT/
ΔVIN Line regulation IOUT=100mA
VOUT+0.5V
<
=
VIN
<
=
6.0V 0.05 0.30 %/V
1.5V
<
=
VOUT
<
=
4.7V:
f=1kHz, VIN−VOUT=1.0V
Ripple 0.5Vp-p 50
RR Ripple Rejection 4.8V
<
=
VOUT
<
=
5.0V:
f=1kHz, VIN=5.7V
Ripple 0.5Vp-p 50
dB
ΔVOUT/
ΔTopt Output Voltage
Temperature Coefficient IOUT=10mA, VIN−VOUT=1.0V
−40°C
<
=
Topt
<
=
85°C ±100 ppm/
°C
ILIM Output Current VIN−VOUT=1.0V 800 mA
ISC Short Current Limit VOUT=0V 40 mA
RPD Pull-down resistance for CE pin 1.25 2.50 5.00 MΩ
VCEH CE Input Voltage "H" 1.5 VIN V
VCEL CE Input Voltage "L" 0 0.25 V
TTSD Thermal Shut down
Detector Threshold Temperature Junction Temperature 150 °C
TTSR Thermal Shut down
Released Temperature Junction Temperature 120 °C
R1170x
7
TEST CIRCUITS
CE
VOUT OUT
GND
10μF
10μF
VDD
IN
R1170xxx1B
SERIES
IOUT
CE
VOUT OUT
GND
10
μ
F
10
μ
F
VDD
IN
R1170xxx1B
SERIES
ISS
Standard Test Circuit Supply Current Test Circuit
CE
V
OUT
OUT
GND
10μF
V
DD
IN
R1170xxx1B
SERIES
I
OUT
P.G.
CE
VOUT OUT
GND I1 I2
10
μ
F10
μ
F
VDD
IN
R1170xxx1B
SERIES
Test Circuit for Ripple Rejection, Test Circuit for Load Transient Response
Input Transient Response
R1170x
8
Technical Notes on External Components and Typical Application
Phase Compensation
In these ICs, phase compensation is made with the output capacitor for securing stable operation even if the
load current is varied. For this purpose, use as much as 10µF Capacitor as CL.
If you use a tantalum type capacitor and ESR value of the capacitor is large, output might be unstable.
Evaluate your circuit with considering frequency characteristics. Further, refer to the Typical Characteristics No.
12.
Mounting on PCB
Make VDD and GND lines sufficient. If their impedance is high, a current flows, the noise picked up or unstable
operation may result. Further use as much as 10µF capacitor between VDD pin and GND pin as close as
possible.
Set an Output capacitor between VOUT pin and GND pin for pha se compensation as close as possible.
(Refer to the example of typical application)
R1170xxx1B V
OUT
OUTIN V
DD
CI=10μF(Ceramic), CL=10μF(Ceramic)
GND
CE
CL
CI
Example of the typical application of R1170xxxxB
R1170x
9
TYPICAL CHARACTERISTICS
1) Output Voltage vs. Output Current (Topt=25°C)
R1170x151B R1170x301B
1.8
1
0.8
1.2
1.4
1.6
0.6
0.4
0.2
0
Output Current I
OUT(mA)
Output Voltage VOUT(V)
0 250 500 750 15001000 1250
V
IN=2V
VIN=3.5V
VIN=2.5V
3.5
2.5
2
3
1.5
1
0.5
00 250 500 750 15001000 1250
Output Current IOUT(mA)
Output Voltage VOUT(V)
VIN=3.5V
VIN=4V
VIN=5V
R1170x501B
Output Current IOUT(mA)
Output Voltage VOUT(V)
6
5
4
3
2
1
00 250 500 750 15001000 1250
V
IN=5.5V
VIN=6V
2) Output Voltage vs. Input Voltage (Topt=25°C)
R1170x151B R1170x201B
1.7
1.6
1.4
1.5
1.3
1.2
1.1
Input Voltage VIN(V)
Output Voltage VOUT(V)
132 456
IOUT=1mA IOUT=10mA
IOUT=100mA
IOUT=300mA
2.2
2.1
2
1.9
1.8
1.7
1.6
1.5
1.4
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
123456
I
OUT
=10mA I
OUT
=1mA
I
OUT
=100mA
I
OUT
=300mA
R1170x
10
R1170x301B R1170x401B
3.2
3.0
2.9
3.1
2.8
2.7
2.6
2.5
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
234 65
I
OUT
=100mA
I
OUT
=300mA
I
OUT
=10mA I
OUT
=1mA
4.2
4.0
3.9
4.1
3.8
3.7
3.6
3.5
3.4
Input Voltage VIN(V)
Output Voltage VOUT(V)
3.5 4 4.5 5 65.5
IOUT=100mA
IOUT=300mA
IOUT=1mA IOUT=10mA
R1170x501B
5.2
4.8
5.0
4.6
4.4
4.2
4.0
3.84.0 4.5 5.0 5.5 6.0
Input Voltage VIN(V)
Output Voltage VOUT(V)
IOUT=100mA
IOUT=300mA
IOUT=10mA
IOUT=1mA
3) Dropout Voltage vs. Output Current
R1170x151B R1170x201B
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
0.8
0.4
0.5
0.6
0.7
0.3
0.2
0.1
00 100 200 800700300 400 500 600
85°C
-40°C
25°C
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
0.8
0.4
0.5
0.6
0.7
0.3
0.2
0.1
00 100 200 800700300 400 500 600
85°C
-40°C
25°C
R1170x
11
R1170x301B R1170x401B
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
0.50
0.20
0.25
0.30
0.35
0.40
0.45
0.15
0.10
0.05
0.00 0 100 200 800300 400 500 600 700
85°C
-40°C
25°C
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
0.45
0.20
0.25
0.30
0.35
0.40
0.15
0.10
0.05
0.00 0 100 200 800300 400 500 600 700
85°C
-40°C
25°C
R1170x501B
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
0.35
0.20
0.25
0.30
0.15
0.10
0.05
0.00 0 100 200 800300 400 500 600 700
85°C
-40°C
25°C
4) Output Voltage vs. Temperature
R1170x151B R1170x201B
1.60
1.55
1.58
1.53
1.50
1.48
1.45
1.43
1.40
Temperature Topt(°C)
Output Voltage VOUT(V)
-50 -25 0 1007525 50
V
IN
=2.5V, I
OUT
=10mA
2.10
2.05
2.08
2.03
2.00
1.98
1.95
1.93
1.90
Temperature Topt(°C)
Output Voltage VOUT(V)
-50 -25 0 1007525 50
VIN=3V, IOUT=10mA
R1170x
12
R1170x301B R1170x401B
3.20
3.10
3.15
3.05
3.00
2.95
2.90
2.85
2.80
Temperature Topt(°C)
Output Voltage VOUT(V)
-50 -25 0 1007525 50
V
IN
=4V, I
OUT
=10mA
4.20
4.10
4.15
4.05
4.00
3.95
3.90
3.85
3.80
Temperature Topt(°C)
Output Voltage V
OUT
(V)
-50 -25 0 1007525 50
V
IN
=5V, I
OUT
=10mA
R1170x501B
5.20
5.10
5.15
5.05
5.00
4.95
4.90
4.85
4.80-50 -25 0 1007525 50
Temperature Topt(°C)
Output Voltage V
OUT
(V)
VIN=6V, IOUT=10mA
5) Supply Current vs. Input Voltage (Topt=25°C)
R1170x151B R1170x201B
120
100
80
60
40
20
0
Input Voltage VIN(V)
Supply Current ISS(μA)
012 6534
120
100
80
60
40
20
0
Input Voltage VIN(V)
Supply Current ISS(μA)
012 6534
R1170x
13
R1170x301B R1170x401B
120
100
80
60
40
20
0
Input Voltage VIN(V)
Supply Current ISS(μA)
012 6534
120
100
80
60
40
20
0
Input Voltage VIN(V)
Supply Current ISS(μA)
012 6534
R1170x501B
120
100
80
60
40
20
0
Input Voltage VIN(V)
Supply Current ISS(μA)
012 6534
6) Supply Current vs. Temperature
R1170x151B R1170x201B
160
140
120
80
100
60
40
20
Temperature Topt(°C)
Supply Current ISS(μA)
-50 -25 0 1007550
25
V
IN
=2.5V
160
140
120
80
100
60
40
20
Temperature Topt(°C)
Supply Current I
SS
(μA)
-50 -25 0 1007550
25
VIN=3V
R1170x
14
R1170x301B R1170x401B
160
140
120
80
100
60
40
20
Temperature Topt(
°
C)
Supply Current ISS(μA)
-50 -25 0 1007550
25
V
IN
=4V
160
140
120
80
100
60
40
20
Temperature Topt(°C)
Supply Current ISS(μA)
-50 -25 0 1007550
25
V
IN
=5V
R1170x501B
160
140
120
80
100
60
40
20
Temperature Topt(°C)
Supply Current I
SS
(μA)
-50 -25 0 1007550
25
V
IN
=6V
7) Dropout Voltage vs. Set Output Voltage (Topt=25°C)
R1170x
0.7
0.5
0.6
0.4
0.3
0.2
0.1
0.0
Set Output Voltage VSET(V)
Droput Voltage VDIF(V)
15234
IOUT
=800mA
I
OUT
=400mA
I
OUT
=600mA
I
OUT
=100mA
R1170x
15
8) Ripple Rejection vs. Frequency
R1170x151B R1170x201B
80
60
70
50
40
30
20
10
0
Ripple Frequency f (kHz)
Ripple Rejection RR(dB)
0.01 0.1 100110
V
IN
=2.5V+0.5Vp-p, I
OUT
=100mA
80
60
70
50
40
30
20
10
0
Ripple Frequency f (kHz)
Ripple Rejection RR(dB)
0.01 0.1 100110
VIN=3V+0.5Vp-p, IOUT=100mA
R1170x301B R1170x401B
80
60
70
50
40
30
20
10
0
Ripple Frequency f (kHz)
Ripple Rejection RR(dB)
0.01 0.1 100110
V
IN
=4V+0.5Vp-p, I
OUT
=100mA
80
60
70
50
40
30
20
10
0
Ripple Frequency f (kHz)
Ripple Rejection RR(dB)
0.01 0.1 100110
VIN=5V+0.5Vp-p, IOUT=100mA
R1170x501B
80
60
70
50
40
30
20
10
0
Ripple Frequency f (kHz)
Ripple Rejection RR(dB)
0.01 0.1 100110
V
IN
=5.75+0.5Vp-p, I
OUT
=100mA
R1170x
16
9) Ripple Rejection vs. Input Voltage
R1170x301B R1170x301B
60
50
40
30
20
10
0
Input Voltage V
IN
(V)
Ripple Rejection RR(dB)
3 3.2 3.63.4
f=400Hz
f=1kHz
f=10kHz
I
OUT
=1mA, C
OUT
=10
μ
F
60
50
40
30
20
10
0
Input Voltage VIN(V)
Ripple Rejection RR(dB)
3 3.2 3.63.4
f=400Hz
f=1kHz
f=10kHz
IOUT=10mA, COUT=10μF
R1170x301B
60
50
40
30
20
10
0
Input Voltage V
IN
(V)
Ripple Rejection RR(dB)
3 3.2 3.63.4
f=400Hz
f=1kHz
f=10kHz
I
OUT
=100mA, C
OUT
=10
μ
F
10) Input Transient Response (Topt=25°C)
R1170x151B
tr=tf=10
μ
s, I
OUT
=100mA, C
OUT
=Ceramic 10
μ
F
1.8
1.75
1.7
1.65
1.6
1.5
1.45
1.55
1.4
4
3.5
3
2.5
2
1
0.5
1.5
0
Time T(μs)
Input Voltage V
IN
(V)
200 40 80 100 120 140 160 180 20060
Output Voltage V
OUT
(V)
Input Voltage
Output Voltage
R1170x
17
R1170x301B
tr=tf=10
μ
s, IOUT=100mA, COUT=Ceramic 10
μ
F
3.4
3.3
3.2
3.1
3.0
2.9
2.8
6
5
4
3
2
1
0
Time T(μs)
Input Voltage VIN(V)
200 40 80 100 120 140 160 180 20060
Output Voltage VOUT(V)
Input Voltage
Output Voltage
R1170x301B
tr=tf=10μs, I
OUT
=100mA, C
OUT
=Ceramic 4.7μF
3.4
3.3
3.2
3.1
3.0
2.9
2.8
6
5
4
3
2
1
0
Time T(μs)
Input Voltage V
IN
(V)
200 40 80 100 120 140 160 180 20060
Output Voltage V
OUT
(V)
Input Voltage
Output Voltage
R1170x501B
tr=tf=10μs, I
OUT
=100mA, C
OUT
=Ceramic 10μF
5.20
5.15
5.10
5.05
5.00
4.95
4.90
6.5
6.0
5.5
5.0
4.5
4.0
3.5
Time T(μs)
Input Voltage V
IN
(V)
200 40 80 100 120 140 160 180 20060
Output Voltage V
OUT
(V)
Input Voltage
Output Voltage
R1170x
18
R1170x501B
Time T(μs)
Input Voltage VIN(V)
Output Voltage VOUT(V)
tr=tf=10
μ
s, IOUT=100mA, COUT=Ceramic 4.7
μ
F
5.20
5.15
5.10
5.05
5.00
4.95
4.90
6.5
6.0
5.5
5.0
4.5
4.0
3.5
200 40 80 100 120 140 160 180 20060
Input Voltage
Output Voltage
11) Load Transient Response (Topt=25°C)
R1170x151B
tr=tf=3
μ
s, C
IN
=Ceramic 10
μ
F, V
IN
=2.5V, C
OUT
=Ceramic 10
μ
F
2.0
1.9
1.8
1.7
1.6
1.5
1.4
120
100
80
60
40
20
0
Time T(μs)
Output Current I
OUT
(mA)
200 40 80 100 120 140 160 180 20060
Output Voltage V
OUT
(V)
Output Current
Output Voltage
R1170x301B
tr=tf=3
μ
s, CIN=Ceramic 10
μ
F, VIN=4V, COUT=Ceramic 10
μ
F
3.5
3.4
3.3
3.2
3.1
3.0
2.9
120
100
80
60
40
20
0
Time T(μs)
Output Current IOUT(mA)
200 40 80 100 120 140 160 180 20060
Output Voltage VOUT(V)
Output Current
Output Voltage
R1170x
19
R1170x301B
tr=tf=3
μ
s, CIN=Ceramic 10
μ
F, VIN=4V, COUT=Ceramic 4.7
μ
F
3.5
3.4
3.3
3.2
3.1
3.0
2.9
120
100
80
60
40
20
0
Time T(μs)
Output Current IOUT(mA)
200 40 80 100 120 140 160 180 20060
Output Voltage VOUT(V)
Output Current
Output Voltage
R1170x501B
tr=tf=3μs, C
IN
=Ceramic 10μF, C
OUT
=Ceramic 10μF
5.20
5.15
5.10
5.05
5.00
4.95
4.90
150
100
50
0
Time T(μs)
Output Current I
OUT
(mA)
200 40 80 100 120 140 160 180 20060
Output Voltage V
OUT
(V)
Output Current
Output Voltage
R1170x501B
tr=tf=3μs, C
IN
=Ceramic 10μF, C
OUT
=Ceramic 4.7μF
Time T(μs)
Output Current I
OUT
(mA)
Output Voltage V
OUT
(V)
5.20
5.15
5.10
5.05
5.00
4.95
4.90
150
100
50
0
200 40 80 100 120 140 160 180 20060
Output Current
Output Voltage
R1170x
20
12) Stable Area (Topt=25°C, VIN = Set Output Voltage+1V, CIN = Ceramic 10μF)
GND
VOUTCE
VIN
VIN IOUT
ESR
R1170xxxxB S.A.
Ceramic
Capacitor
Ceramic
Capacitor
Spectrum
Analyzer
As an output capacitor for this IC, Ceramic capacitor is recommendable. However, other low ESR type
capacitor can be used with this IC.
For your reference, noise level is tested with the circuit as shown above, and if the noise level is 40μV or less
than 40μV, the ESR values are plotted as stable area. Upp er limit is describe d in the next four grap hs, or ES R vs.
Output Current. (Hatched area is the stable area.)
R1170x151B R1170x151B
100
10
1
0.1
Output Current I
OUT
(mA)
ESR(Ω)
0 200 800600400
f=400Hz
f=1kHz
f=10kHz
C
OUT
=Ceramic 10
μ
F
100
10
1
0.1
Output Current I
OUT(mA)
ESR(Ω)
0 200 800600400
C
OUT
=Ceramic 4.7μF
R1170x301B R1170x301B
100
10
1
0.1
Output Current IOUT(mA)
ESR(Ω)
0 200 800600400
C
OUT
=Ceramic 10
μ
F
100
10
1
0.1
Output Current I
OUT
(mA)
ESR(Ω)
0 200 800600400
C
OUT
=Ceramic 4.7μF
R1170x
21
R1170x501B R1170x501B
100
10
1
0.01
0.1
Output Current I
OUT(mA)
ESR(Ω)
0 200 300100 800600 700400 500
C
OUT
=Ceramic 10μF
Output Current I
OUT
(mA)
ESR(Ω)
100
10
1
0.01
0.1
0 200 300100 800600 700400 500
C
OUT
=Ceramic 4.7
μ
F
RICOHCOMPANY,LTD.
ElectronicDevicesCompany
●Higashi-ShinagawaOffice(InternationalSales)
3-32-3,Higashi-Shinagawa,Shinagawa-ku,Tokyo140-8655,Japan
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Phone:+86-21-5027-3200Fax:+86-21-5027-3299
RICOHCOMPANY,LTD.
ElectronicDevicesCompany
●Taipeioffice
Room109,10F-1,No.51,HengyangRd.,TaipeiCity,Taiwan(R.O.C.)
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http://www.ricoh.com/LSI/
1.Theproductsandtheproductspecificationsdescribedinthisdocumentaresubjecttochangeor
discontinuationofproductionwithoutnoticeforreasons
suchasimprovement.Therefore,before
decidingtousetheproducts,pleaserefertoRicohsalesrepresentativesforthelatest
informationthereon.
2.Thematerialsinthisdocumentmaynotbecopiedorotherwisereproducedinwholeorinpart
withoutpriorwrittenconsentofRicoh.
3.Pleasebesuretotakeanynecessaryformalitiesunderrelevantlawsorregulationsbefore
exportingorotherwisetakingoutofyourcountrytheproductsorthetechnicalinformation
describedherein.
4.Thetechnicalinformationdescribedinthisdocumentshowstypicalcharacteristicsofand
exampleapplicationcircuitsfortheproducts.Thereleaseofsuchinformationisnottobe
construedasawarrantyoforagrantoflicenseunderRicoh'soranythirdparty'sintellectual
propertyrightsoranyotherrights.
5.
Theproductslistedinthisdocumentareintendedanddesignedforuseasgeneralelectronic
componentsinstandardapplications(officeequipment,telecommunicationequipment,
measuringinstruments,consumerelectronicproducts,amusementequipmentetc.).Those
customersintendingtouse
aproductinanapplicationrequiringextremequalityandreliability,
forexample,inahighlyspecificapplicationwherethefailureormisoperationoftheproduct
couldresultinhumaninjuryordeath(aircraft,spacevehicle,nuclearreactorcontrolsystem,
trafficcontrolsystem,automotiveand
transportationequipment,combustionequipment,safety
devices,lifesupportsystemetc.)shouldfirstcontactus.
6.Wearemakingourcontinuousefforttoimprovethequalityandreliabilityofourproducts,but
semiconductorproductsarelikelytofailwithcertainprobability.Inordertopreventanyinjuryto
personsordamagestopropertyresultingfromsuchfailure,customersshouldbecarefulenough
toincorporatesafetymeasuresintheirdesign,suchasredundancyfeature,firecontainment
featureandfail-safefeature.Wedonotassumeanyliability
orresponsibilityforanylossor
damagearisingfrommisuseorinappropriateuseoftheproducts.
7.Anti-radiationdesignisnotimplementedintheproductsdescribedinthisdocument.
8.
PleasecontactRicohsalesrepresentativesshouldyouhaveanyquestionsorcomments
concerningtheproductsorthetechnicalinformation.
RICOHCOMPANY.,LTD.ElectronicDevicesCompany
■
Ricoh presented with the Japan Management Quality Award for 1999
.
Ricoh continually strives to promote customer satisfaction, and shares the achievements
of its management quality improvement program with people and society.
■Ricoh awarded ISO 14001 certification.
The Ricoh Group was awarded ISO 14001 certification, which is an international standard for
environmental management systems, at both its domestic and overseas production facilities.
Our current aim is to obtain ISO 14001 certification for all of our business offices.
Ricoh completed the organization of the Lead-free production for all of our products.
After Apr. 1, 2006, we will ship out the lead free products only. Thus, all products that
will be shipped from now on comply with RoHS Directive.