Datashee
t
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protec tion against radioactive rays
. 1/12 TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
TSZ22111・14・001
www.rohm.com
BD555BKFV AC/DC Controller IC
for mains dimmable LED lighting
BD555BKFV
●General Description
The BD555BKFV controller AC/DC controller IC can be
used in a wide range of dimmable LED lighting driver
applications. The main target application is dimmable
retro-fit LED lighting, replacing existing incandescent
light bulbs, halogen spot lights, CFL tubes etc.
●Features
Fixed frequency DC/DC controller (selectable)
Peak current or average current control (PCC/ACC)
Dynamic Load Current Controller (DLCC)
Logarithmic compensation of detected dimming level
Dimmer detector function
Anti-flash function when dimmer is OFF
PWM and analog dimming control supported
Over Current Protection (OCP)
Thermal Shutdown protection (TSD)
Under Voltage Lock Out (UVLO)
●Applications
Retro-fit dimmable LED lighting (E27, E14, GU10, T8
etc.). Wide range of TRIAC and transistor dimmers
supported by DLCC function.
Custom LED lighting with PWM or voltage controlled
dimming.
●Key Specifications
Input voltage range........................................16~39V
Regulated supply voltage.................................11.5V
Fixed DC/DC operating frequency.........40~400kHz
Detectable phase-cut range........................45°~135°
Typical current consumption.............................1mA
Under Voltage Lock Out detection.....................9.0V
Operating temperature range.................-40~+110°C
●Package W(Typ.) x D(Typ.) x H(Max.)
SSOP-B14 5.00mm x 6.40mm x 1.15mm
●Typical A pplication Circuits
Figure 1. Typical application circuit for non-isolated dimmabl e buck topology
Not Recommended for
New Designs
2/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Pin Configuration
Figure 2. Pin configuration Figure 3. Equivalent circuit
●Pin Description
Pin Pin name I/O Function
1 BLDR Out Driver for dynamic load current controller (DLCC) transistor
2 WBLD In Internal strong load current input (connected to internal ‘open drain’ NMOS)
3 ISYS*1 In/Out Sense voltage input for DLCC ON/OFF function
4 GND - Ground terminal
5 DIM In/Out Detected dimming level reference voltage
6 DET In Input for detecting phase-cut angle
7 REF*2 Out Pin for external resistor to set LED current (average current control mode)
8 OSC*2 Out Pin for external resistor to set DC/DC operating frequency
9 FB*3 In Average current feedback input or PCC mode selection (VFB <1.5V)
10 ISNS In Sense voltage for peak current regulation & over current protection (OCP)
11 PGND*4 - Ground terminal for internal BLDR and SW driver stages
12 SW Out Driver output for gate of external DC/DC switching MOSFET
13 VDDH In/Out Regulated supply voltage
14 SUP In Input supply voltage
*1 Between ISYS and GND are internal anti-parallel surge diodes
*2 Connect only resistive load according to application instructions
*3 FB terminal is ‘pre-charged’ to 4V during start-up in order to have smooth start of the LED current regulation. Never connect thi s pin directly to GND.
*4 Between GND and PGND are internal anti-parallel diodes
Not Recommended for
New Designs
3/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Block Diagram
●Description of Blocks
Startup sequence: When an AC input voltage is applied, the rectified mains voltage (VHV) is buffered by capacitor C2 and
starts supplying the BD555BKFV via start-up resistor R6. The VDDH capacitor C5 will be charged by the internal regu lator until
the system UVLO condition is released, after which a PWM signal from terminal SW can start driving the exter nal NMOS when
the anti-flash detector is released.
Anti-flash detector: Some dimmers require a small leakage current to power an internal electron ic control circuit or an indicator
LED. In order to prevent a ‘false start’ when the VHV buffer cap was accidentally charged by this leakage current, the detection
level voltage on the DIM terminal needs to rise above 400m V, before the SW terminal starts switching, lighting up the LEDs.
DC/DC buck converter: When the SW signa l is high, it turn s ON the MN2 MOSFET, building up a current in coil L1 via the LED
string. During the OFF period of MN2, the current flows via fly-back diode D4. Capacitor C4 stabilizes the LED voltage to reduce
the LED current ripple. The LED current is regulated by controlling the LED forward voltage.
Auxiliary supply voltage: The alternating current in the pr imary side of inductor L1 is coupled np:ns to the secondary side,
creating a voltage alternating between VVHV (MN2=ON) and (VLED + Vth,D4)* ns/np (MN2=OFF). This last voltage is passed on to
capacitor C3 via diode D5. This creates an auxiliary supply which improves efficiency by reducing the resistive power loss in the
start-up resistor R6.
LED average current control (ACC) mode: The BD555BKFV features two feedback mechanisms by average current control
(ACC) or peak current control (PCC). In ACC mode, the high-side sensing resistor R7 is used in the LED current mirror (typically
1:500), creating an LED feedback current in transistor Q1. This current flows to the FB terminal and creating a reference voltage
(for LED current regulation) across resistor R12 at the REF terminal.
Figure 4. Block diagram
Not Recommended for
New Designs
4/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
LED peak current control (PCC) mode: Alternatively, in PCC mode (VFB <1.5V), the duty-cycle of the SW signal is d etermine d
by the ‘peak current’ through resistor R10. The ISNS terminal senses the voltage across resistor R10. When this voltage
reaches the reference voltage, the SW signal will be pulled low. During startup and in ACC mode, this function is used as ‘Over
Current Protection’ to limit the current through inductor L1. In both ACC and PCC mode, the REF voltage will be adjusted to the
detected phase-cut in case a dimmer is connected.
Phase-cut detection: via resistive divider R4/R5 at the DE T terminal, the rising a nd falling edge of the phase-cut are detected,
generating an internal PWM signal. Via an internal resistor and external capacitor C1, this PWM signal is averaged into a
dimming reference voltage at the DIM terminal. An internal conversion function creates a logarithmically corrected vo ltage at the
REF terminal. This allows achieving a ‘natur al’ LED light intensity curve as perceived by the human eye, when turning the
dimmer knob.
Dimmer stability: based on the phase-cut detection at the DET terminal, the DLCC dynam ically adjusts the total load current
for stable operation of ‘leading edge’ TRIAC dimmers. For ‘trailing edge’ dimmers, the DLCC load current pulls down the dimmer
output voltage, in order to detect the falling edge. In case the VHV current exceeds the minimum load current requirement, the
DLCC load current can disabled completely. This allows to achieve high efficiency without dimmers.
Dimmer detector: when a dimmer is not present, the DLCC will be switched OFF.
Not Recommended for
New Designs
5/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Absolute Maximum Ratings
Parameter Symbol Maximum rating Unit
Supply voltage (SUP terminal) VSUP 40 V
Internal supply regulator voltage (VDDH ter m inal) VVDDH 15.5 V
SW output current ISW 600*1 mA
BLDR output current IBLDR 60*1 mA
WLBD, ISNS terminal voltage VWBLD, VISNS 15.5 V
WBLD input current (strong load current) ISBLD 300*2 mA
DIM, DET, OSC, REF, FB terminal voltage VDIM, VDET, VOSC, VREF, VFB 4.5 V
FB input current (VFB=4.5V) IFB 4.0 mA
ISYS, PGND terminal voltage VISYS, VPGND +/- 0.5 V
Operating frequency foperating 400 kHz
Maximum power dissipation Pd 0.87*4 W
Operating ambient temperature range Ta -40 ～ +110 °C
Storage temperature range Tstorage -55 ～ +150 °C
Maximum junction temperature Tjunction,max +150 °C
*1 ISW pulse current duration <100ns@foperating
*2 IBLDR pulse current duratio n <1us@fmains never exceed 0.8*Pd
*3 IWBLD pulse current duration <300us@fmains
*4 SSOP-B14 package thermal resistance RJA=143°C/W, mounted on a two-layer PCB of 70x70x1.6mm3
Notice1: Due to in case of the applied voltage or operating ambient temperature range or etc. exceed the absolute maximum ratings, a damage maybe
occurs, and the damage mode (short or open or etc.) can not be supposed, please take a physical safety measure (such as add a fuse) while some s pecial
modes in which the absolute maximum ratings may be exceeded are considered.
Notice2: The power dissipation in BD555BKFV is mainly decided by the switching frequency of the DCDC converter and the current which is applied to the
BLDR pin. Please make the power dissipation caused by those less than 80% of the maximum power dissipation of the package.
●Recommended Operating Range (Ta= -40 ~ +110°C)
Parameter Symbol Range Unit
Supply voltage VSUP 16 ~ 39 V
●Electrical Characteristics
Parameter Symbol Limits Unit Comments
Min. Typ. Max.
Internal Supply Regulator*1
Startup current ISUP,start - 0.4 0.8 mA In UVLO condition
Supply current ON ISUP,NS - 0.8 1.0 mA No switching.
Supply current ON 1 ISUP,ON1 - 1.0 1.3 mA No load on SW/BLDR, fSW =40kHz.
Supply current ON 2 ISUP,ON2 - 2 2.4 mA No load on SW/BLDR, fSW =400kHz.
VDDH internal regulator voltage VVDDH 10.0 11.5 15.0 V VDDH load current IVDDH < 10mA
UVLO release voltage VUVLO,rl 9.20 10.0 10.8 V VDDH rising
UVLO trigger voltage VUVLO,tr V
UVLO,tr - VUVLO,hys V VDDH falling
UVLO hysteresis VUVLO,hys 0.75 1.00 1.25 V
Switching regulator
Minimum frequency fSW_min 32 40 48 kHz fSW = 9.0×106/R11 (kHz)±20%,
for frequency range 40KHz to 400KHz.
Maximum frequency fSW_max 320 400 480 kHz
SW maximum duty cycle max 70 75 80 %
Not Recommended for
New Designs
6/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
Parameter Symbol Limits Unit Comments
Min. Typ. Max.
SW minimum ON-time tON,min - 80 140 ns Determines minimum duty-c ycle
SW slew rate tSW,slew - 50 100 ns VSW = 1…11V at 1nF load (rising/fallin g)
SW driver ON resistance (PMOS) RSW,P - 15 40 V
SW=0V, ISW=-10mA
SW driver OFF resistance
(NMOS) RSW,N - 15 40 V
SW= VDDH, ISW=10mA
Duty cycle, FB=3.5V 20 2 20 38 %
ACC mode
Duty cycle, FB=2.9V 60 36 60 80 %
FB mode selection threshold VFB,mode 1.4 1.6 1.9 V PCC (VFB<1.4V), ACC (VFB>1.9V)
ISNS trigger voltage (OCP) VOCP 1.08 1.20 1.36 V Inductor current limiter in ACC mode
ISNS blanking time (OCP) tOCP,blank 90 140 180 ns Used in PCC & ACC mode
Dimmer phase-cut detector
DET phase cut voltage (rising) VDET,r 215 260 300 mV Monitore d at output bridge rectifier
DET phase cut voltage (falling) VDET,f 75 110 190 mV
DET phase cut hysteresis VDET,hys 75 130 180 mV
DIM voltage (no dimming) VDIM1 2.85 3.0 3.15 V Phase-cut = 135°
DIM voltage (max dimming) VDIM2 0.95 1.0 1.05 V Phase-cut = 45°
REF voltage (no dimming) ACC VREF,A1 1.85 2.0 2.15 V ACC mode (VFB>1.9),
2k < RREF < 10k
REF voltage (max dimming) ACC VREF,A2 75 100 135 mV
ISNS voltage (no dimming) PCC VISNS,P1 1.12 1.24 1.36 V PCC mode (VFB < 1.5V). VISNS peak
current threshold, RREF=2k
ISNS voltage (max dimming) PCC VISNS,P2 200 260 316 mV
Dynamic Load Current Controller
BLDR driver slew rate tBLDR,slew - 1 5 us VSW = 1…11V at 1nF load (rising/falling)
BLDR driver ON resistance RBLDR,P - 100 300 V
BLDR=0V, IBLDR=-10mA
BLDR driver OFF resistance RBLDR,N - 100 300 V
BLDR= VDDH, IBLDR=10mA
Strong load current ISBLD,sat 200 250 - mA Strong load current ON (VISYS<100mV,
VDIM<3.4V, VVDDH=11.5V, VWBLD-VISYS=8V)
Strong load internal NMOS RON R
ON,SBLD - 10 300 Strong load current ON (VISYS<100mV,
VDIM<3.4V, VVDDH=11.5V, VWBLD-VISYS=8V)
Strong load current OFF delay tSB,OFF 180 250 320 µs After phase-cut rising edge
Dimmer detector trigger voltage VDIM,tr 3.3 3.5 3.7 V DLCC load current OFF
Dimmer detector release voltage VDIM,rl V
DIM,tr-VDIM,hys V DLCC load current ON
Dimmer detector hysteresis VDIM,hys 50 100 170 mV
ISYS load current OFF voltage VISYS,OFF -260 -200 -160 mV DLCC load current OFF
ISYS load current ON voltage VISYS,ON VISYS,OFF+VISYS,hys mV DLCC load current ON
ISYS current sense hysteresis VISYS,hys 75 100 140 mV
Anti-flash detector threshold VDIM,start 360 400 440 mV DC/DC starts switching (VDIM >400mV)
*1 The supply regulator has a thermal shutdown function that triggers at about 175°C, having a hysteresis of about 20°C. This protects against a too high
junction-temperature (e.g. due to ‘short’ currents of VDDH, SW or BLDR to (P)GND on the PCB or excessive ambient temperatures).
Not Recommended for
New Designs
7/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Application Examples
The BD555BKFV is typically used as a controller IC in retro-fit dimmable LED lighting systems. The external component
selection is fully dependent on the type of LED driver. For more information about this, please refer to the BD555BKFV
application note. The exampl e circuit below shows a dimmable non-isolated buck co nverter. A non-isolated topology is suitable
for relatively low LED power (e.g. VLED=100V and ILED=40mA) applications in which the LED heatsink is electrical ly isolated by a
non-conductive LED lamp casing.
Figure 5. Final application circuit for non-isolated dimmable ACC LED driver
●Notes of Board Layout
There are a few considerations for designing a small-sized PCB that fits inside a LED lamp casing. Special attention needs to be
given to component placement for optimal grounding and minimum distances of high-voltage wiring.
1) OCP sense resistor ROCP and snubber resistor Rs need to be connected as close as possible to the minus terminal of
the VHV buffer capacitor.
2) The drain terminal of switching NMOS MN2 should be close to the inductor L1p and fly-back diode D4.
3) The GND and PGND terminals need to be connected directly on the PCB.
4) For mains-isolated designs (not described in this doc ument), the isolated PCB terminals need to be se parated from the
'hot' side electronics.
●Selection of Components Externally Connected
Please refer to the BD555BKFV applicatio n note for more information about selecting the external components.
●Notes of Pin Connections
a. Never connect FB pin to GND. It is suggested that pull d own the FB pin to GND with a resistance over 10kΩ,
while you want to use the PCC mode.
b. In case of a dimmable LED driver application, please use a diode with a forward bias from ISYS pin to GND
for protecting the ISYS pin when you want to sens e the G ND curre nt. For a more stable oper ation, ple ase ad d
a capacitance over 1uF between ISYS pin and GND.
c. Never connect capacitive loads to REF pin and OSC pin. Please connect r esistive lo ads to these two pins.
d. Al ways make the GND pin c onnecting with the PGND pin on the PCB. Es pecially, notic e that please ke ep the
GND pin away from the noise. And never apply a minus voltage to all pins except the ISYS pin.
e. Never apply voltage to IC pins while the SUP pin is not applied with a voltage.
Not Recommended for
New Designs
8/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground an d supply lines of the digital bloc k from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and lar ge-current ground trace s, the t wo ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large curre nts. Also ensure that the ground traces of external com ponents do not cause variations
on the ground voltage. The ground lines must be as short and thick as pos sible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maxim um rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent excee ding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the cond itions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especia lly if the IC has more than one po wer
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions dur ing
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mountin g may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder br idge deposited in between pins during assembly to name a few.
Not Recommended for
New Designs
9/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
Operational Notes – continued
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals shoul d be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operation al faults, or physical damage. Therefore, con ditions that cause these diodes to
operate, such as appl ying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure xx. Example of monolit hic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nomi nal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TS D circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceed s the absolute maximum ratings and therefore, under n o
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and une xpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
Not Recommended for
New Designs
10/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Ordering Information
B D 5 5 5 B K F V - E 2
Part No.
Package
FV: SSOP14
Packaging and formin g sp ecificatio n
E2: Embossed tape and reel
None: Tray, Tube
●Marking Diagram (TOP VIEW)
1PIN MARK
SSOP-B14
555BK
Product Name.
LOT No.
Not Recommended for
New Designs
11/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Physical Dimension, Tape and Reel Information
Package Name SSOP-B14
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Not Recommended for
New Designs
12/12
Datasheet
Datasheet
BD555BKFV
TSZ02201-0W1W0C300010-1-2
© 2013 ROHM Co., Ltd. All rights reserved. 30.July.2013 Rev.003
www.rohm.com
TSZ22111・15・001
●Revision History
Date Revision Changes
29.Ma
y
.2012 001 New Release
19.Jul
y
.2013 002 Revision Update
30.Jul
y
.2013
003
p.2
･Add “I/O” column to “Pin Description”.
p.5
･Add “Notice1” and “Notice2” to “Absolute Maximum Ratings”.
p.7
･Delete the descriptions for “Power Dissipation”.
･Add the descriptions for “Notes of Pins Connections”.
p.13, p.14
･Add “Notice”.
Not Recommended for
New Designs
Datasheet
Datasheet
Notice – GE Rev.001
© 2013 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y el ectronic equip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific
Applications.
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Pleas e verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) dependi ng on Ambient temp erature (T a). When used i n sealed area, co nfirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant co ndition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active hal ogenous (chlor i ne, bromine, etc.) flu x is used, the residue of flux may negatively affect prod uct
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specificati on
Not Recommended for
New Designs
Datasheet
Datasheet
Notice – GE Rev.001
© 2013 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).
Precaution for Storage / Transportati on
1. Product perfor m ance and soldered connections may deter iorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even und er ROHM recommended storage condition, sold erability of products out of recommende d storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products wit hin the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using a n authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, e xpressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the developm ent of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Not Recommended for
New Designs