SPEC. No. ED-12G036A ISSUE February 8, 2013 SHARP SYSTEM DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR DISTANCE MEASUREMENT SENSOR MODEL No. GP2Y0E03 Specified for Enclosed please find copies of the Specifications which consists of _20_ pages including cover. This specification sheets and attached sheets shall be both side copy. After confirmation of the contents, please be sure to send back [| copies of the Specifications with approving signature on each. CUSTOMER'S APPROVAL PRESENTED DATE DAIE Sof & Qo/s Soe ey BY py \/ \C/ T. Ichinose, Department General Manager of Development Dept. I System Device Division Electronic Components and Devices Group SHARP CORPORATIONGP2Y0E03(ED-12G036A) Product name : Distance Measuring Sensor Model No. : GP2Y0E03 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) Please do verify the validity of this part after assembling it in customers products, when customer wants to make catalogue and instruction manual based on the specification sheet of this part. (2) This product is designed for use in the following application areas ; -OA equipment Audio visual equipment - Home appliances - Telecommunication equipment (Terminal) - Measuring equipment Tooling machines - Computers If the use of the product in the above application areas is for equipment listed in paragraphs (3) or (4), please be sure to observe the precautions given in those respective paragraphs. (3) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; - Transportation control and safety equipment (aircraft, train, automobile etc.) : Traffic signals - Gas leakage sensor breakers - Rescue and security equipment : Other safety equipment (4) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; Space equipment - Telecommunication equipment (for trunk lines) Nuclear power control equipment - Medical equipment - Power generation and power transmission control system(Key system) (5) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above four paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. 1/20GP2Y0E03(ED-12G036A) Application This specification applies to the outline and the characteristics of the distance measuring sensor: Model No. GP2 YOE03 2, - Outline Refer to the attached drawing No. CY15117i02, Page3 3. Ratings and characteristics Refer to the attached sheet, Page 4. 4. Reliability Refer to the attached sheet, Page7. 5. Outgoing inspection Refer to the attached sheet, Page7. 6. Supplements 6-1 GP2Y0OE03 Example of output distance characteristic Refer to the attached sheet, page 8. 6-2. This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials forODS: CFCs, Halon, Carbon tetrachloride 1.1.1-Trichloroethane (Methy] chloroform) 6-3. Productmass: Approx. 0.85g (TYP) 6-4 Brominated flame retardants Specific brominated flame retardants such as the PBB and PBDE are not used in this device at all. 6-5 Compliance with each regulation 6-5-1 The RoHS directive(2002/95/EC) This product complies with the RoHS directive(2002/95/EC) . Object substances: mercury, lead (except for lead in high melting temperature type solders and glass of electronic components), cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) 6-5-2 Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese: FEf-fS Ey dni 5 4ee tl EEDA), Toxic and hazardous substances . Hexavalent | Polybrominated | Polybrominated Cat M Cadmii aregory Lead oecury aoe | chromium biphenyls diphenyl ethers (Pb) (Hg) (Cd) (cr) (PBB) (PBDE) Distance measuring / / / / / JV sensor v : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard . 7. Notes Refer to the attached sheet, Page9. 8. Packing specification Refer to the attached drawing No. CY15118i09, Pagel 1. 9. Appendix Refer to the attached sheet, Page12. 2/20GP2Y0E03 (ED-12G036A) 2.Outline (Drawing No. CY15117i02) | Scale: 5/1 Unit: mm 14 | i oR [| fal_Ielel in __ FOYT Emitter Receiver {| To pp Side Side NS w o leq Ty Pe eeeeee Hn oO [ | .4Laser Marking 3 om | CD001 |S 10 (0.6) Connection Diagram No [|S 1 |Pin name A A oon np poes a Nol} VDD ly Vo lO 00 z2z2222 22 v No2 T | 28h Gb & & & N ~~ oO | O 0 t Note3_ (1.1) velS Notel: Unspecified tolerance shall be + 0.2mm No6| SCL 22C Clock Note2: The dimensions in parenthesis are shown for reference 2C Data Bus Note3: The PCB backside has some open pattern. Please do not short circuit of these pattern. Laser Matkin 3 GP2Y0E03 (Model No) Material Te Lot No. Month (1 to 9,0,N,D) D d a 1p 5 94-0 (DIN standard symbol) esin Visible-cut filter Year (DIN standard symbol) D | Device T 42ALLOY(Pd-Au DIN standard year production (Remove G,I,0,Q,Y,Z) (It repeats itself by a period for 20 years.) Connector Year |Symbol SM07B-SRKS-TB(HF) 2012! Housing Recommandation 2013| D SHR-07V-BK-B or : : SHR-07V-S-B 2028 | W (JST Mfg. Co., Ltd.) 2029] X 3/20GP2Y0E03(ED-12G036A) 3-1. Schematic t iy 7S ff fy ro a Zh =, | weve + Teo | Toe Te | ta ww J UF 1 1 tI W | fee eee eee eee eee i L_| Voltage ' ] l 1 (at . \ Oseillation | ; (| civeuit | 8 @VDD mF! boptr tats e 1 ! ia 1 ty I @vVout(A) ok I | [EFuse_| Nt @GND | I L ; + LED |_| Diatal Siemal | [Register] |! @VIN(O) | Dutrer Frocessor t GPIO1 HN Cs iio @SCL 1 | j (Lise) | @SDA NC I Please use an electric source with an output current of 150mA or more because LED pulse current is more than 100mA. 3-2. Absolute maximum ratings @ LS j "th 0. luF Ta=25C (unless otherwise specified) Parameter Symbol Ratings Unit Remark Supply voltage VDD -0.3 to+ 5.5 Vv . Output terminal voltage Vout (A) -0.3 to +2.8 Vv - Output current Tout(A) -6.0 to +6.0 mA - VO supply voltage VIN (IO) Oso re (wp aw Vv Refer to3-4 Input terminal voltage GPIO1 -0.3 to VINTO}0.3 Vv Refer to3-4 PC input terminal voltage SCL -0.3 to VINDO}+0.3 Vv Refer to3-4 PC VO terminal voltage SDA -0,3 to VIN(O)+0.3 Vv Refer to3-4 Operating temperature Topr -10 to +60 Cc - Storage temperature Tstg -A0 to +70 Cc ~ Recommended operating conditions Parameter Symbol Rating Unit Remark Supply voltage VDD 2.7 to 5.5 Vv - V/O supply voltage VIN (10) 1.8 to 3.3 Vv - SCL, SDA High level input VIH1 Min. VIN(IO) x 0.7 Vv - SCL, SDA Low level input VILI Max. VIN(IO) x 0.3 Vv - GPIO1 High level input VIE ~ Min. VIN(IO) x 0.7 V Operating state GPIO1 Low level input VIL Max. VIN(IO) x 0.3 Vv Stand-by state 4/203-3. Electro-optical Characteristics GP2Y0E03(ED-12G036A) (Ta=25C, VDD =3V) Parameter Symbol Conditions MIN. | TYP. | MAX. | Unit Measuring distance range L* (Note 1, 2) 4 - 50 cm Distance value D1 L=50cm (Note 1, 2, 3) 45 50 55 cm Distance value D2 L=10cm (Note 1, 2, 3) 9 10 il cm Distance value D3 L=4cm (Note 1, 2, 3) 3 4 5 cm Output terminal voltage Vout(A)l | L=50cm (Note 1,2) 0.3 0.55 0.8 Vv Output terminal voltage Vout(A)2| L=10cm (Note 1,2) 1.9 2.0 2,1 Vv Output terminal voltage Vout(A)3| L=4em (Note 1,2) 2.1 2.2 23 Vv Average supply current Iccl 1=50cm, GPIO1=VIN(IO) - 26 36 mA Stand-by supply current Icc2 GPIO1=GND - 20 60 BA Response time (Note 4) Ts L=50cm L=4cm (Note 5) - - 40 ms * L: Distance to reflective object (Note 1) Under dark condition (Note2) Using reflective object : White paper (Made by Japan Color Research Institute order made color chart : mat, reflective ratio : 90%) (Note 3) Distance data through C bus (Note 4) Max. time means that it takes time to stabilize output due to the change of reflected signal light. Definition : the case that object condition is changed suddenly from the least reflection(max. gain condition in internal circuit) to the most reflection (min. gain condition in internal circuit). (Note 5) Method of measuring (Ts) Connect GPIO1 with GND during measuring L=50cm with reflective object: Gray paper (mat, reflective ratio : 10%). After changing the position (L=4cm with reflective object: White paper (mat, reflective ratio : 90%), Measuring the time of the output terminal : Vout(A) until stabilizing after connecting GPIO1 with VIN(IO). Reflective 10 0 O/ @A Object 0% @50cem 90% @4cm GPIOI 50cm 4com Distance (rC) Vout(A), Th 2.3[V] (spec max. @4cm) 1 + 2.1[V] (spec min. @4cm) [ Ts (Max 40ims) Response time of C output is faster than that of Vout(A) because it is stabilized soon after distance data output. Distance data is updated every 2ms after response time. 5/20GP2Y0E03(ED-12G036A) 3-4. Timing Chart 3-4-1 Power On/Off Timing Sequence lo!T] TS les! VINdO) L ______ TI, T5 : Refer to 3-4-2 VINO) should be turned off before VDD is turned off, or at the same time when VDD is turned off. ?C. communication with other devices connected to the same bus is not allowed after VDD or VIN(O) is turned off. In case that both of VDD and VIN(O) turn off, GPIO1, SCL and SDA should be pull low. In case that only VIN(O) turn off, GPIOL, SCL and SDA should be pull low. If this product is operated under the condition except the above, this product or other device around it may give damage due to excessive current. 3-4-2 Active / Stand-by timing sequence There are two ways (Hardware / Software) to control Active/stand-by state. HW : GPIO1 is set High or Low GPIO1=high : Active state GPIO1=Low : Stand-by state SW : PC register program (Refer to 9-1(5)) SW control is effective when GPIO1 is high. (1) Controlled by GPIO1 VDD VIN(O) | >< T1 GPIO1 | | State Active | Stand-by | Active (2) Controlled by PC VIN(IO) GPIO1 a ot TI 173 Loy rc <> // Stand-by Active '/ Access '\\command command / ' '\ Register State Active | Stand-by i | Active 6/20GP2Y0E03(ED-12G036A) (Ta=25C) Description Min Max Unit Tl 10 power delay after VDD power on 0 5 ms T2 GPIO1 delay after VIN(IO) power on 0 - ms T3 TC access delay after VDD power on 5 - ms T4 TC access delay after GPIO1 high or 500 - us active command completed TS VIN(IO) leading to VDD power off 0 - us 4. Reliability The reliability of products shall be satisfied with items listed below. Confidence level : 90% LIPD : 20 or 30 ae Failure Judgment Samples (n) No. Test Items Test Conditions Criteria Defective (6) 1 cycle 40C to+70C 1 | Temperature cycling (30min.) (30min.) n=11, c=0 25 cycle test Initial x 0.36 > Vout(A)1 ; Vout(A)1 > Initial x 1.64 High temp. and 9 os PE =a 2 high humidity storage +40C, 90%RH, 500h n=11, c=0 3 | High temp. storage +70C, 500h or n=11, 0 4 | Low temp. storage 40C, 500h Initial x 0.8>D1 n=11, 0 5 | Operation life (High temp.) +60C, VDD=3V, 500h D1 > Initial x 1.2 n=11,c=0 , 1000m/s, 6.0ms _ 6 | Mechanical shock 3times/-+X, +Y, -+Z direction (Note 1) n=8, c=0 10 to 55 to 10Hz/Imin. 7 | Variable frequency vibration 2h/X, Y, Z direction n=8, c=0 overall amplitude : 1.5mm (Note 1) Test conditions are according to 3-3 Electro-optical characteristics. (Note 2) After test, measurement shall be measured after leaving under the normal temperature and the normal humidity for two hours, But no dew point. 5. Outgoing inspection (1) Inspection lot Inspection shall be carried out per each delivery lot. (2) Inspection method Asingle sampling plan, normal inspection level II based on ISO 2859 is applied. The AQL according to the inspection items are shown below. Defect Inspection item AQL (%) Major defect (nome 33). characteristics defect OA Minordefar | Defestonammetanceand dimension * Crack, chip, scratch, stain One which affects the characteristics of para. 3-3 shall be defect. 7/20GP2Y0E03(ED-12G036A) 6. Supplements 6-1 Example of output distance characteristics Example of output distance characteristecs of GP2 YOE03 an Oo bb ws o 2 eH oa 3S LO Distence data through I2C [cm] w Oo o 0 10 20 30 40 50 60 Distance to reflective object*1 [cm] Example of output distance characteristics of GP2 YOE03 _ Nb T [TTT ' ' : : ' : : : ' : : i : : ' ' t + 1 { t { { ' ' ' ' ' ' ' ' ' ' ' ' ' 4 1 ' I ' ' { ; 1 ' ' 1 ' 1 ' ' ' 4 1 ' ' ' ' ' ' ' : t ' t t 1 ' : ' t i ' : : t ' : : i : t i t : t t : : 1 : : t : i i : t i { ' 1 ' ' { ' t Vout(A) [V] = T TTTT. 0.5 0 10 20 30 40 50 60 Distance to reflective object*1 [cm] *1 ; Using reflective object: White paper (reflective ratio : 90%) 6-2 Example of directional angle of emitting beam 1.1 J L 0.9 + 0.8 0.7 0.6 0.5 0.4 F 0.3 F 0.2 os ee -10 -8 0 5 10 T T T Relative valueGP2Y0E03(ED-12G036A) 7. Notes [Advice for the optics] 7-1 Lens of this device shall be kept cleanly. There are cases that dust, water or oil and so on deteriorate the characteristics 7-2 of this device. Please consider in actual application. In case that protection cover is set in front of this sensor , the protection cover shall be recommended to use material which doesnt scatter light and be matt finish. And the protection cover which has the most efficient transmittance at the emitting wavelength range of LED for this product (A=850nm+70nm). And this protection cover is recommend to be flat. And this protection cover shall be recommended to be parallel to the emitter and detector portion. In case that protection cover is set in front of this sensor, It emits reflected light from this protection cover. If this reflect light reaches in detector portion, the output distance of this product may be changed. The output distance characteristics of this product may be changed with according to material (@) or transmittance (@) or the thickness (@) or the distance between the protection cover and this product (@) or the angle between surface and back () or the angle between this cover and this sensor(). In case that protection cover is set, please design to consider that this reflective light is minimized. And it shall be effective to put light shield wall between emitting lens and receiving lens as shown in below. A Protection cover YD fT] Gthictaess @Distance Condition light shield wall Nol No2 nonexistence No3 No4 exisitence [*] Direct reflective light becomes large as Distance from sensor to protection cover and thickness of this cover become large. In case thickness is 2mm and distance is lmm, measuring distance is changed shift larger from actual distance than other condition. It shifts can make small by using installation of light shield {*] and compensation function [**] . {*] Noted for installation of light shield Inner distance between lens of detector and lens of emitter is around 0.6mm (reference). So the width of light shield is recommended to be less than 0.6mm. In case the width of light shield is longer than inner distance, measuring distance is changed by Shield a part of emitter lens or detector lens. Please confirm that there is no problem under the actual equipment. And In case between protection cover and light shield or between light shield and this sensor exists space, The effect of light shield is small because light from emitter leaks. The light shield wall is recommended to use the material that have the low transmittance at the emitting wavelength range of LED for this product (A=850nm+70nm). When the material of light shield wall is hard, and the power stress in which it is added to this product is large, measuring distance may shift from actual distance . The width of el Light shield wall \ Light shield wall * Light shield wall cover {**] Noted of compensation function This product has the function which rectifies error shift by the direct reflective light from protection cover. The accuracy after compensation is based on a protection cover or its installation condition. This function can be active when it set correction factor in this product by 2C or E-fuse (refer to 9-2), Please refer to application manual about the detail of this function. Neither installation of a light shield wall nor use of a compensation function guarantees the distance characteristic. These improve error shift of the distance characteristic. Regardless of use of a light shield wall or a compensation function, please use it after confirming with customers product. 9/20GP2Y0E03(ED-12G036A) [Advice for the characteristics] 7-3 74 7-5 7-6 7-7 In case that there is an object near to light exits of the sensor between the sensor and the detected object, please use this device after confirming sufficiently what the characteristics of this sensor do not change by the object. This product has the function to remove disturbance light by the cancellation function of ambient light, a visible light cut lens, etc. But when the detector receive direct light from the sun, tungsten lamp and so on, there are cases that it can not measure the distance exactly. Please consider the design that the detector does not receive direct light from such light source. When you operate the customers set installing this product by the remote control, please consider soft that the output of this product being disregarded at the time of remote control operation by software. Distance between sensor and mirror reflector cannot be measured exactly. In case that reflective object has boundary line clearly, there is cases that distance can not measure exactly. At that time, if direction of boundary line and the line between emitter center and detector center are parallels, it is possible to decrease deviation of measuring distance. (x) OF __. (Incorrect) (Correct) (O) In order to decrease measuring error due to moving direction of object, we recommend to mount the sensor like below drawing. (Incorrect) wt (x) (Moving direction) we Mune direction) For satisfying the specification of the electro optical characteristic in 3-3, it is necessary to install a flat surface of object in vertical of emitted light, and it is necessary to reflect the whole emitted light as shown in the following figure. As shown in the 6-2 (example of directional angle of emitting beam), The angle is around 6 (43) where emission becomes 10% of peaks, The object needs to exist in whole around 10 degrees (5 degrees) area including the variation of peak position. For example, when the object is in 50 cm, it is necessary to install the object of at least 9cm diameter parallel to the surface of this sensor as follows. However above example doesnt guarantee specification, please use it after confirming with customers product. object 7 on (Example : R=90%, matt) | sensor 10/20GP2Y0E03(ED-12G036A) [Notes on handling] 7-9 Please dont do washing. Washing may deteriorate the characteristics of optical system and so on. Please confirm resistance to chemicals under the actual usage since this product has not been designed against washing. 7-10 Please use this product under the condition that applied stress to the connector below 0.49N. And, harness is pulled in the state where it attached this sensor, or please be careful so that the stress more than the above may not be added to this sensor. 7-11 This product have the parts that mount to the substrate by soldering . Since there is a possibility that a solder mounting part may break when this product is used, the stress more than 4.9N should not be added to this product. 8. Packing specification (Drawing No, CY15118i09) Pads (11 pi et Product ads (11 pieces) ae / ater zeeze| 10 sheets of tray Tray (1) Packing number Max 100 pieces per tray Max 1000 pieces per case (2) Close the lid of case and seals with craft tape, and fill in the blanks of Model No., quantity and date. (3) Outside: 264 x 203 x 105 (mm) (4) Indication The content of the indication conforms to EIAJ C-3 and the following items are indicated. Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin 11/209. Appendix PC interface GP2Y0E03(ED-12G036A) This product has 7 bits slave address which comply with C bus standard (max 400kHz), so a measured distance value can be read through PC bus. Besides, this product can change register value for each function through PC bus. The below table shows IC bus terminal. Pin name Description SCL I'C clock SDA IC data bus (1) PC data transfer format Symbols explaining read and write format of this product are shown in the following table. Symbol Description Note Ss Start Master output A ACK Slave output NA NACK Master output P Stop Master output Sub Add Register address Master output Data Data Master / Slave output (2) Write format 5 Slave ID Sub Add Data 0x80 1. Master generates start condition. 2. Master places 1 byte data that include slave address (7bit) with a read/write control bit. 3, Slave issues acknowledgment. 4. Master places 2 byte address data on SDA. 5. Slave issues acknowledgment. 6. Master places 8 bits data on SDA. 7, Slave issues acknowledgement. 8. Master generates a stop condition to end this write cycle. [| Master output Slave output (3) Read format - (1*-eycle) (2-cycle) S} Slavetp | RY a Sub Add a s| Slave ID RW | P 5 Z : 0x80 Ox81 1* cycle 1. Master generates a start condition. 2. Master places 1" byte data that are combined slave address (7bits) with a read/write control bit (R/W: =0) to SDA. 3. Slave issues acknowledgement. 4, Master places 2 byte address data on SDA. 5. Slave issues acknowledgement. 6. Master generates a stop condition to end 1st cycle. 2 cycle 7. Master generates a start condition. 8. Master places 1 byte data that are combined slave address (7bits) with a read/write control bit (R/W=1) to SDA. 9, Slave issues acknowledgement. 10. 8 bits data is read from internal control register of this product which address was assigned by 1* cycle. 11. Master generates negative acknowledgement. 12. Master generates a stop condition to end this read cycle. 12/20GP2Y0E03(ED-12G036A) This product supports the continuation read-out function (Burst-Read), So it can read register value from specified address (8.) by ACK that Master transmits (11.). When read-out of data is stopped, Master transmits NACK. Since it dont need to specify address, it is possible to shorten time reading register value. Also Since this product supports Repeat-Start fiction, it be able to skip (6). process. Since PC bus is not opened between Ist cycle and 2nd cycle by skipping (6). , cross tall< can be prevented also when two or more Master(s) exist on the same bus. This product supports burst-read and repeat start. Below shows these format. burst read without repeat start 5 | Slave ID Sub Add 5 | Slaw ID ---- P Sd Ys 0x80 0x81 Data(0) is the register value which was assigned by Address. Data(1) and Data(2) are the register value of Address+1 and Address+2, respectively. burst read with repeat start S| Slave ID Sub Add Slave ID (4) Read out measured distance value and calculation Register name Add Data Note Distance[11:4] OxSE | Datal Upper Data Distance[3:0] OxSF | Data2 Lower Data Shift Bit[2:0} 0x35 Data3 Coefficient n Read step - @ Read the value of Add:0x5E and Add:0x5F with burst read. @) Read the value of Add:0x35 (Data3=n) @ Measure distance value = Distance[]1:0)/16/(2/n) [cm] Both Distance[11:4] and Distance[3:0] is 8 bits data. 12 bits data of the above Distance[1 1:0] must be composed of jointing 8 bits data of distance[11:4] and the last 4 bits data of distance[3:0] as shown in the below. 11/10} 9} 8] 7] 6] 5] 4) 3] 21 1} 0 Distance[1 1:0] = : ' 7{ 6| 5} 4] 3] 2] 1] 0 Distance[1 1:4] = Distance[3:0] = (5) Active / Stand-by control This product can control operation mode and stand-by mode by PC write command. GPIO1 need to be kept High level to control active/stand-by condition by SW. Register name Add data condition SW suspend [0] | OxE8 0x00 Active 0x01 | Stand-by 13/20GP2Y0E03(ED-12G036A) (6) PC bus timing SDA Vf X \ iv 4 I sce LF & . Tapas na ; 4 ' | SC. \ / \ | \ lt Lage busi s Po" (Ta= 25C) Parameter Symbol Min. Max. Unit SCL clock frequency fect - 400 kHz Hold time for Start/Repeat Start. t HD: STA 0.6 - us After this period, the first clock pulse is generated. Set-up time for a repeated start. t su. STA 0.6 - us Low period of SCL clock. t row 13 - us High period of SCL clock t acu 0.6 - us Data hold time. For C-bus device. t yp: paT - 0.9 us Data set-up time. t su: DAT 100 - ns Rise time of both SDA and SCL signals. t, - 300 ns Fall time of both SDA and SCL signals. ts - 300 ns Set-up time for STOP condition, t su. sto 0.6 - us Bus free time between a STOP and START. t BUF 13 - us Capacitive load for each bus line. Cy - 150 pF INoise margin at LOW level for each connected device. Vat 0.1VDD - Vv Noise margin at HIGH level for each connected device. Vit 0.2VDD - Vv (7) PC DC timing characteristic (Ta= 25C) Parameter Symbol Standard Mode Fast Mode Unit Min, Max. Min. Max. Low level input voltage Vit -0.3 0.3VINdO) -0.3 0.3VIN(O) Vv High level input voltage Vin | 0.7VIN(O) | VING@O)+0.3 | 0.7VINdO) | VINGO)+0.3 Vv 3.9 3.9 Vv Hysteresis of Schmitt trigger inputs Vays VIN(O) > 2V - - 0.05 VIN(IO) - Vv VINdO) <2V - - 0.1 VINCO) - Vv Low level output voltage (open drain of Vor open collector) at 3mA sink current 0 0.4 0 0.4 Vv VINdO) > 2V - - 0 0.2VIN(IO) Vv VINO) < 2V Output fall time from VIHmin to Tor 250 - 250 ns ViLmax with a bus capacitance from 10pF to 400pF Pulse width of spikes which must be t sp - - 0 50 ns suppressed by the input filter Input current each /O pin with an input L -10 10 -10 10 AN voltage between 0.1 VINO) and 0.9VINCO)maxGP2Y0E03(ED-12G036A) 9-2 E-Fuse Programming (1) Summary E-Fuse is a nonvolatile memory which is possible to write program only one time. So it is able to change some settings of this sensor by E-Fuse programming, Also compensation function can be active by E-Fuse programming. In case power supply of this sensor is OFF, this sensor keeps some programs that is written in E-Fuse. So when power supply is ON again, this sensor operates under the programmed condition as before. Below is the basic set-up to program data in E-Fuse. PC MPU with PC Sensor I/F communication rc ex.USB enable E-Fuse LDO (Vpp terminal) 3.340.3V 50mA PC is used when different data is programmed to each sensor. It is unnecessary when same data which was set in MPU is programmed. Vpp terminal is on the back side of this sensor as shown in below figure. 2+ Vpp terminal (2) Electric spec. Power Requirement Vpp Min, Typ. Max. Unit Voltage 3.0 33 3.6 Vv Current 50 mA Power Timing VDD Vpp 15/20GP2Y0E03(ED-12G036A) T poweron : E-Fuse power should be turn on 1ms later than VDD is applied. Tf : E-Fuse power regulator falling time. T program : Program time depends on how many bits are programmed. T read : Read time depends on how many bits are read. Tr : E-Fuse power regulator rising time. (3) Program Flow E-Fuse program through I2C is byte base (8bits can be programmed at one programming cycle), if more than 8bits need to be programmed, two or more cycles are necessary. Below is program flow chart. Stage 3 Stage 2 Stage 1 Add(0xC9):set m(#1) and P Add(0xC8):set E-Fuse bit P Add(OxEC):set data OxFF 1* cycle n(#2) as Oxmn. Map(LSB) 3.3V is applied in Vpp program terminal. L (#1) bit number : m Stage 4 m = bitnumber1 2nd, 3rd... .cycle Add(OxCD) : :set program (#2) bank value: n program data in E-Fuse BankA=1, Bank B=2, Bank C=3, N 0 Bank D=4, Bank E=5 Stage5 Stage 6 Add(OxCA) : set data 0x01 (*) | Add(0xCA):set data 0x00 al 3.3V is stopped in Vpp terminal.. Stage 8 Stage 7 Add(OxEE):set data 0x06 Add(0xEF):set data 0x00 < Add(0xC8):set data:0x40 Add(0xC8):set data 0x00 (*) Delay time Waiting time during data programming : 500us Stage 10 Check fail bit and execute E-Fuse bit replacement (4) E-Fuse bit map There are 5 blocks (Bank A, Bank B, Bank C, Bank D and Bank E) in this sensor. Each block has 64bits. Initial value of each bit is 1. 2C slave address can be changed by programming 0 in designated bit Below shows E-Fuse bit map. * Bank A (Bank value : n=1) Not use. *BankB (Bank value : n=2) Not use. * Bank C (Bank value : n=3) Not use. 16/20GP2Y0E03(ED-12G036A) *BankD (Bank value : n=4) Bit M 0 1 3 4 item x x x x not use 17] | D[18] | D[19] | D[20 Mapped Reg Bit M item x x x x Mapped Reg not use Bit M D[32] |D[33 34] 1D[3 item x x x x x Mapped not use Bit M D[49 50] | D[51] |D[52] item x x x x Map Bank E (Bank value : n=5) Bit M 0 I 3 oi P@SlaveID 3.08002: Mapped Reg pe es 0x27 Bit M 16) |E[17] |E[18] |E[19 item x x x x x item Mapped Reg Bit M item Mapped Reg Bit M item Mapped Reg not use 21 JE331 [E134] JEL3 x E[48] x x x x x not use 49 50 51 52 x x x x x not use (5) Example of E-Fuse Programming PC Slave Address D[38] [D[39] x x x x Ty FDI FD x x 38 x x 39] 53] JEI54] E55] x x D[10 11 * x 12} | D[13 not use ] |D[25] |D[26} x x x x not use 41 42 43] |D[44] x x x x 40 not use 37] [D158] [D159] [DI -CE+Fuse'rep lacement * 10 11 12 x not use x E[40] JE[41 x x x 42 3 38 x x not use 43 44 45] x x x x 47] not use 59 60] jE[61] |E[62 63 x x x x x not use xX: not use This product operates on 2C bus as slave device. This product has 16 kinds of address by programming upper 4 bits of slave address. Bank E is used in order to change slave address. E[3:0] is the bit for address assignment, and E[4] is an enable bit. Changed E[3:0] turns effective after E[4] is programmed to be 0. A7 | A6 | AS | A4 | A3 | A2 | Al | AO Slave ID notes E[3] |E[2] |E[1] |E[o] | x x x IR/W Write Read 0 0 0 0 0 0 0 x 0x00 0x01 0 0 0 1 0 0 0 x 0x10 Oxll1 0 0 1 0 0 0 0 x 0x20 0x21 0 0 1 1 0 0 0 x 0x30 0x31 0 1 0 0 0 0 0 x 0x40 0x41 0 1 0 1 0 0 0 x 0x50 0x51 0 1 1 0 0 0 0 x 0x60 0x61 0 1 1 1 0 0 0 x 0x70 0x71 1 0 0 0 0 0 0 x 0x80 0x81 Default 1 0 0 1 0 0 0 x 0x90 0x91 1 0 1 0 0 0 0 xX 0xAO OxAl 1 0 1 1 0 0 0 x 0xBO OxB1 1 1 0 0 0 0 0 x 0xC0 OxC1 1 1 | 0 ] 0 0 0 x 0xD0 OxD1 1 1 1 0 0 0 0 x OxEO OxE1 1 1 1 1 0 0 0 x OxFO OxF1 17/20GP2Y0E03(ED-12G036A) X<R/W Write : 0. Read : 1 Stagel Please refer to flow chart in 9-2(3) Stage2 Data 0x00 is set in Address OxC8 because LSB of bit map is 0 (=E[0]). Stage3 Data 0x45 is set in Address OxC9 because programming bit number is 5(=E[4:0]) and bank value is 5(=Bank E). Note) Data is defined as Oxmn, where m=bit number 1 and n= bank value. Stage4 Data 0x00 is set in Address OxCD in case that Slave ID(write) is set to 0x00. Data 0x10 is set in Address OxCD in case that Slave ID(write) is set to 0x01. Stage5 ~ Stage8 Please refer to flow chart in 9-2(3). Stage9 Programmed data in E-Fuse is checked whether it is correct or not by the following step. step |Address |Data {R/W |Remark 1/0OxEF 0x00 |W 2|0xEC OxFF |W 3|0xC8 0x40 |W 4|0xC8 0x00 |W 5|OxEF 0x03 [|W 6[0x27__|- R__ [Check 0x27[4:0] = E[4:0] 2 7|O0xEF 0x00 8|OxEC Ox7F E-Fuse programming is done when 0x27[4:0] is equal to E[4:0]. If 0x27[4:0] is not equal to E[4:0], E-Fuse bit replacement should be executed because programming error occurs. (Refer to 9-2(6) E-Fuse bit replacement) (6) E-Fuse Bit Replacement There is the possibility that E-Fuse bit programmed fail (Fail rate is 20ppm/bit). Default value of each bit of E-Fuse is all 1, specified bit can be changed to O by executing program flow of 9-2(3). If the bit cannot be programmed to 0 (always 1), then this bit is fail bit. This product has the function that fail bit can be replaced. The bit number which can be replaced is one. If 2bit are fail in this product then this cannot be used. E-Fuse bit replacement is executed by specifying replace bit in D[63:55] of E-Fuse bit map. LSB of Bank A is 0, and MSB of Bank E is 319. Fail bit can be shown as 9bit number, the number is programmed in D[63:55] to replace it. * The case of A[1] replacement Programmed value in D[63:55] is 1. @ 1+64*0 = 0x0001, where 0 is the bank value of bank A) * The case of C[51] replacement Programmed value in D[63:55] is 179. (= 51+64*2 = 0x00B3, where 2 is the bank value of bank C) + The case of E[4] replacement Programmed value in D[63:55] is 260. (=4+64*4 = 0x0104, where 4 is the bank value of bank E) > (7) Example of E-Fuse Bit Replacement The case where slave address is changed to 0x10(write) and 0x11 (read) is shown in below concretely. Stagel Data=OxFF is set in Address=OxEC. 3.3V is applied in the Vpp terminal. Stage2 Data=0x00 is set in Address=0xC8. Stage3 Data=0x55 is set in Address=0xC9. Stage4 Data=0x01 is set in Address=OxCD. Staged Data=0x01 is set in Address=OxCA. Wait for 500us. 18/20GP2Y0E03(ED-12G036A) Stage6 Data=0x00 is set in Address=0xCA. Vpp terminal is grounded. Stagel Data=OxFF is set in Address=0xEC, 3.3V is applied in the Vpp terminal. Stage2 Data=0x04 is set in Address=0xC8. Stage3 Data=0x15 is set in Address=0xC9. Stage4 Data=0x00 is set in Address=0xCD. Stage5 Data=0x01 is set in Address=0xCA. Wait for 500us. Stage6 Data=0x00 is set in Address=0xCA. Vpp terminal is grounded. Stage7 Data=0x00 is set in Address=0xEF. Data=0x40 is set in Address=0xC8. Data=0x00 is set in Address=0xC8. Stage8 Data=0x06 is set in Address=OxEE. Stage9 Data=OxFF is set in Address=OxEC. Data=0x40 is set in Address=0xC8. Data=0x00 is set in Address=0xC8. Data=0x03 is set in Address=OxEF. Read out the data in Address=0x20. When lower Sbits data[4:0] is 00001, E-Fuse program is finished. When lower Sbits data[4:0] is not 00001, go to stagel O(bit replacement). Stagel0 The case where the lower Sbits data is 10001 is assumed, and is shown in below flow. When E[4] is replaced, Data=0x04 is programmed in D[62:55] in 1" cycle and Data=0x01 is programmed in D[63] in 2 cycle because programmed value is 2600x0104). Stagel0-1 Data=OxFF is set in Address=0xEC. 3.3V is applied in Vpp terminal. Stagel0-2 Data=0x37 is set in Address=0xC8. Stagel0-3 Data=0x74 is set in Address=0xC9., Stagel04 Data=0x04 is set in Address=OxCD. Stagel0-5 Data=0x01 is set in Address=O0xCA. Wait for 500us. Stagel0-6 Data=0x00 is set in Address=OxCA. Vpp terminal is grounded. Stagel0-1 Data=OxFF is set in Address=OxEC. 3.3V is applied in Vpp terminal. Stagel0-2 Data=0x3F is set in Address=OxC8. Stage10-3 Data=0x04 is set in Address=OxC9, Stagel04 Data=0x01 is set in Address=0xCD. Stage10-5 Data=0x01 is set in Address=OxCA. Wait for 500us. Stage10-6 Data=0x00 is set in Address=0xCA. Vpp terminal is grounded. Stagel0-7 Data=0x00 is set in Address=OxEF. Data=0x40 is set in Address=O0xC8, Data=0x00 is set in Address=0xC8. Stagel0-8 Data=0x06 js set in Address=OxEE. 19/20GP2Y0E03(ED-12G036A) Stagel10-9 Data=OxFF is set in Address=0xEC, Data=0x40 is set in Address=0xC8. Data=0x00 is set in Address=0xC8. Data=0x03 is set in Address=0xEF. Read out the data in Address=0x18 and Address=0x19. When Data=0x04 in the Address of 0x18 and Data=0x01 in the address of 0x19, program is finished. When Data 0x04 in the Address of 0x18 and Data#0x19[0]=1, it is not possible to correct (=NG). 20/20