PRODUCT DESCRIPTION
Chem-Wik Rosin is especially designed for
today’s heat se nsitive electronic components.
The lighter mass, pure copper braid
construction allows for better thermal
conductivity, even at low temperatures.
Chem-Wik Rosin responds as much as 50%
faster than conventional desoldering braids.
This design minimizes overheating and
requires less “contact” pressure for greater
operator control. All sizes are coated with a
Type “R” or ganic flux system.
Requires little or no post solder cleaning
No corrosive residues
Optimized weave design for faster
wicking and heat transfer
Halide free
Minimal risk of heat damage to
components and circuit boards
TYPICAL APPLICATIONS
Chem-Wik Rosin desoldering braid sa fely
removes solder from:
Thru-hole Components
Surface Mount Device Pads
BGA Pads
Micro Circuits
Terminals
Lugs and Posts
Identification Script
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Flux Type: Grade WW, Type “R”
Clean-up Required: No
Military Specif ications: MIL-F-14256F
Shelf Life – 2 years from manufacturer
date
STATIC DISSIPATIVE PACKAGING
Static Dissipative packaging is available on
all 5 foot bobbins. The static dissipative
bobbins qualify as electrostatic discharge
protective per DOD Standard 1686 and DOD
Handbook 263. Meets the static delay rate
provision of MIL-B-81705C.
Technical Data Sheet
Chem-Wik
Rosin