1
Rev 13 – 2007 / 08
www.zled.com
SEOUL SEMICONDUCTOR
Z-POWER LED Series
Technical Datasheet for X1019X
Features
• Super high Flux output
and high Luminance
• Designed for high
current operation
• Low thermal resistance
•SMT solderbility
• Lead Free product
•RoHS compliant
Applications
• General Illumination
- Outdoor & Indoor architectural
lighting
-Decorative lighting
- Torch lighting
- Portable lighting (Flash and lamp)
and Reading lighting
- Traffic signaling
Z-Power series is designed for high current operation and
high flux output applications.
Z-Power LED's thermal management perform exceeds
other power LED solutions.
It incorporates state of the art SMD design and Thermal
emission material.
Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive large
LCD backlights
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Full code form : X1 X2 X3 X4 X5 X6–X
7 X8 –X
9 X10 X11 X12 X13
1. Part Number
-X
1 : Color
-X
2 : Z-Power LED series number
-X
3 : LENS type
-X
4 : Chip quantity (or Power Dissipation)
-X
5 : Package outline size
-X
6 : Type of PCB
2. Internal Number
-X
7
-X
8
3. Code Labeling
-X
9 : Luminous flux (or Radiant flux for royal blue)
-X
10 X11 X12 : Dominant wavelength (or x,y coordinates rank code)
-X
13 : Forward voltage
4. Sticker Diagram on Reel & Aluminum Vinyl Bag
Full Code of Z-Power LED Series
PART NO. :
QUANTITY : ###
LOT NUMBER : ##########
BIN CODE :
X1 X2 X3 X4 X5 X6–X
7 X8
X9 X10 X11 X12 X13
For more information about binning and labeling, refer to the Application Note -1
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Rev 13 – 2007 / 08
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1. Dome Type
Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
3. Slug of package is connected to anode.
*The appearance and specifications of the product may be changed for improvement without
notice.
Outline Dimensions
Cathode
Mark
Slug (+)
9.8
(MAX)
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Rev 13 – 2007 / 08
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Notes :
1. All dimensions are in millimeters. (tolerance : ±0.2 )
2. Scale : none
*The appearance and specifications of the product may be changed for improvement without
notice.
PCB Type Outline Dimensions
-
+
-
-
+
+
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Rev 13 – 2007 / 08
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1. Pure White (W10191, W10192)
1-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
1-2 Absolute Maximum Ratings
Characteristics for Z-Power LED
ºC /W8RθJ-B
Thermal resistance [5]
ºC /W6.5RθJ-C
Thermal resistance [6]
V4.03.53.0VF
Forward Voltage [4]
K-6300-CCTCorrelated Color Temperature [3]
MaxTypMin
-
-
70
52
deg.1102Θ1/2View Angle
--Ra
CRI
lm32ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
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Rev 13 – 2007 / 08
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2. Natural white (S10191, S10192)
2-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
2-2 Absolute Maximum Ratings
ESD Sensitivity [7]
ºC /W8RθJ-B
Thermal resistance [5]
ºC /W6.5RθJ-C
Thermal resistance [6]
V4.03.53.0VF
Forward Voltage [4]
K-4000-CCTCorrelated Color Temperature [3]
MaxTypMin
-
-
73
40
deg.1102Θ1/2View Angle
--Ra
CRI
lm-ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
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Rev 13 – 2007 / 08
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3. Warm White (N10191, N10192)
3-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
3-2 Absolute Maximum Ratings
ºC /W8RθJ-B
Thermal resistance [5]
ºC /W6.5RθJ-C
Thermal resistance [6]
V4.03.53.0VF
Forward Voltage [4]
K-3000-CCT Correlated Color Temperature [3]
MaxTypMin
-
-
80
35
deg.1102Θ1/2View Angle
--Ra
CRI
lm24.5ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT ±5% tester tolerance
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
8
Rev 13 – 2007 / 08
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4. Royal Blue (D10191, D10192)
4-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
4-2 Absolute Maximum Ratings
ºC /W8RθJ-B
Thermal Resistance [5]
ºC /W6.5RθJ-C
Thermal Resistance [6]
nm465460455
λD
Dominant Wavelength [3]
MaxTypMin
4.0
-
3.5
255
deg.1302Θ1/2View Angle
V3.0VF
Forward Voltage [4]
mW80ФV [2]
Radiant Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are IEC825 Class 2 for eye safety
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
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Rev 13 – 2007 / 08
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5. Blue (B10191, B10192)
5-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
5-2 Absolute Maximum Ratings
ºC /W8RθJ-B
Thermal Resistance [5]
ºC /W6.5RθJ-C
Thermal Resistance [6]
nm475460455
λD
Dominant Wavelength [3]
MaxTypMin
4.0
-
3.5
11
deg.1302Θ1/2View Angle
V3.0VF
Forward Voltage [4]
lm6ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
--------------------------Caution--------------------------
1. Please do not drive at rated current more than 5 sec. without proper heat sink
2. Blue power light sources represented here are IEC825 Class 2 for eye safety
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
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Rev 13 – 2007 / 08
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6. Cyan (C10191, C10192)
6-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
6-2 Absolute Maximum Ratings
ºC /W8RθJ-B
Thermal Resistance [5]
ºC /W6.5RθJ-C
Thermal Resistance [6]
deg.1302Θ1/2View Angle
nm510505500
λD
Dominant Wavelength [3]
MaxTypMin
4.0
-
3.5
40
V3.0VF
Forward Voltage [4]
lm24.5ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
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Rev 13 – 2007 / 08
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7. Green (G10191, G10192)
7-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
7-2 Absolute Maximum Ratings
ºC /W8RθJ-B
Thermal Resistance [5]
ºC /W6.5RθJ-C
Thermal Resistance [6]
nm535527520
λD
Dominant Wavelength [3]
MaxTypMin
4.0
-
3.5
48
deg.1302Θ1/2View Angle
V3.0VF
Forward Voltage [4]
lm24.5ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC125Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.6PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
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Rev 13 – 2007 / 08
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8. Amber (A10191, A10192)
8-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
8-2 Absolute Maximum Ratings
ºC /W12RθJ-B
Thermal Resistance [5]
ºC /W10.5RθJ-C
Thermal Resistance [6]
nm595590585
λD
Dominant Wavelength [3]
MaxTypMin
3.0
-
2.5
38
deg.1282Θ1/2View Angle
V2.0VF
Forward Voltage [4]
lm24.5ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC100Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.2PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
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9. Red (R10191, R10192)
9-1 Electro-Optical characteristics at IF=350mA, TA=25ºC
9-2 Absolute Maximum Ratings
ºC /W12RθJ-B
Thermal Resistance [5]
ºC /W10.5RθJ-C
Thermal Resistance [6]
deg.1282Θ1/2View Angle
nm632625618
λD
Dominant Wavelength [3]
MaxTypMin
3.0
-
2.5
32
V2.0VF
Forward Voltage [4]
lm24.5ФV [2]
Luminous Flux [1]
Unit
Value
SymbolParameter
ºC100Tj
Junction Temperature
-±20,000V HBM-ESD Sensitivity [7]
ºC-40 ~ +120Tstg
Storage Temperature
W1.2PD
Power Dissipation
ºC-40 ~ +85Topr
Operating Temperature
A0.4IF
Forward Current
UnitValueSymbolParameter
--------------------------Caution--------------------------
Please do not drive at rated current more than 5 sec. without proper heat sink
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrated sphere.
[3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram.
A tolerance of ±0.5nm for dominant wavelength
[4] A tolerance of ±0.06V on forward voltage measurements
[5], [6] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ≤110 ºC)
RθJ-C is measured with only emitter. .(25 ºC ≤TJ≤110 ºC)
Break voltage of Metal PCB is 6.5kVAC
[7] It is included the zener chip to protect the product from ESD.
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Rev 13 – 2007 / 08
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1. Pure White
2. Warm White
300 400 500 600 700 800 900
0.0
0.2
0.4
0.6
0.8
1.0
Standard eye response curve
Relative Spectral Power
Distribution
Wavelength (nm)
300 400 500 600 700 800 900
0.0
0.2
0.4
0.6
0.8
1.0
Relative Spectral Power
Distribution
W a v e le n g th (n m )
Color spectrum, TA=25ºC
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3. Natural white
400 500 600 700
0.0
0.2
0.4
0.6
0.8
1.0
Relative Spectral Power
Distribution
W a v e le n g th (n m )
4. Blue Cyan Green Amber Red
300 400 500 600 700 800 900
0.0
0.2
0.4
0.6
0.8
1.0
Relative Spectral Power Distribution
W avelength[nm]
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1. Forward Voltage vs. Forward Current, TA=25℃
Forward Current Characteristics
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0
50
100
150
200
250
300
350
400
Average Forward Current [mA]
Forward Voltage [V]
Pure White, Warm White, Natural White
Blue, Royal Blue, Green, Cyan
0.00.51.01.52.02.53.0
0
50
100
150
200
250
300
350
400
Average Forward Current [mA]
Forward Voltage [V]
Red, Amber
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2. Forward Current vs. Normalized Relative Luminous Flux, TA=25℃
0 100 200 300 400
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Relative Lumious Flux
Forward Current [m A]
BLUE, Royal Blue, GREEN, WHITE
CYAN, Warm white, Natural white
0 100 200 300 400
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Relative Lumious Flux
Forward Current [mA]
Red, AMBER
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Rev 13 – 2007 / 08
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3. Forward Current vs Chromaticity coordinate TA=25℃
Pure white
0.305 0.310
0.305
0.310
0.315
350mA
150mA
20mA
CIE(Y)
CIE(X)
Warm white
0.431 0.432 0.433 0.434
0.39
0.40
0.41
350mA
100mA
20mA
CIE(Y)
CIE(X)
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Natural white
0.388 0.390 0.392 0.394
0.384
0.386
0.388
0.390
0.392
350mA
150mA
20mA
CIE(Y)
CIE(X)
4. Forward Current vs Wavelength shift TA=25℃
0 50 100 150 200 250 300 350 400
-4
-2
0
2
4
6
8
10
Dominant wavelength Shift(nm)
Forward current(IF)
RED
GREEN
BLUE
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Junction Temperature Characteristics
0 25 50 75 100 125 150
0
1
2
3
4
5
6
Dominant wavelength shift(nm)
Junction Temperature(oC)
RED
GREEN
BLUE
1. Junction Temperature vs Wavelength shift TA=25℃
2. Temperature of Junction vs. Relative Light Output for Blue,Green, Red TA=25℃
0 20 40 60 80 100 120
0
20
40
60
80
100
120
Relative Light Output(%)
Junction Temperature(oC)
RED
GREEN
BLUE
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1. Pure White, Warm White, Natural White
Typical Dome Type Radiation pattern
-80 -60 -40 -20 0
0.0
0.2
0.4
0.6
0.8
1.0
Relative Intensity
Directional angle (deg.)
0
30
60
90
-80 -60 -40 -20 0
0.0
0.2
0.4
0.6
0.8
1.0
Relative Intensity
Directional angle (deg.)
0
30
60
90
2. Royal Blue, Blue, Cyan, Green
3. Amber, Red
-80-60-40-20 0
0.0
0.2
0.4
0.6
0.8
1.0
Relative luminous flux
Angle(deg.)
0
30
60
90
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Rev 13 – 2007 / 08
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1. Pure White, Warm White, Royal Blue, Blue, Cyan, Green, Natural white
(TJMAX = 125 ºC)
2. Amber, Red (TJMAX = 100 ºC)
Ambient Temperature vs Allowable Forward Current
0 20406080100120
0
100
200
300
400
500
Current (mA)
Ambient Temperature T
(
o
C)
RjaT = 40 oC / W
RjaT = 30 oC / W
RjaT = 20 oC / W
020406080100120
0
100
200
300
400
500
Current (mA)
Ambient Temperature TA (oC)
RjaT = 40 oC / W
RjaT = 30 oC / W
RjaT = 20 oC / W
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Rev 13 – 2007 / 08
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Recommended Soldering
Note :
1. All dimensions are in millimeters (tolerance : ±0.2 )
2. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
1. Solder pad
2. Solder paste pattern
1. Paste thickness : 0.2mm
3 solder point
Copper <Rear view>
Thermal enhanced PCB
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Rev 13 – 2007 / 08
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1. Reflow Soldering Conditions / Profile
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Soldering profile, TA=25ºC
Pre-heating
200
180
150
~
0
220
240
260
Rising
5 °C/sec
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (min)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Cooling
-5 °C/sec
Time
[Hr]
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Rev 13 – 2007 / 08
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Rectangular Type Reel Packaging - Rectangular type
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
10 pitch cumlative
tolerance on tape ±0.2
DETAIL 'A'
5°TYPICAL
DETALE"A" CENTER
MIN 1.5
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Rev 13 – 2007 / 08
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Rectangular Type Reel Packaging - Star type
10 pitch cumlative
tolerance on tape ±0.2
5°TYPICAL
DETALE"A"
MIN 1.5
DETAIL 'A'
CENTER
Note :
1. The number of loaded products in the reel is 100ea
2. All dimensions are in millimeters (tolerance : ±0.2 )
3. Scale none
*The appearance and specifications of the product may be changed for improvement without
notice.
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Rev 13 – 2007 / 08
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Packaging Structure
Note : 1. 6 reels are loaded in box
2. Scale none
3. For more information about binning and labeling, refer to the Application Note – 1
4. The Lead-Free Sticker attached on Alumimuim vinyl pack about type of PCB.
Printed label on back of aluminum PCB
######-##-###
######-#####
Part No. - Internal No. - Bin Code
Lot No.
SEOUL SEMICONDUCTOR CO., LTD
a
SEOUL SEMICONDUCTOR CO.,LTD
Z POWER LED
Outer Box
c
a
TYPE
370
b
ORDER CODE : ######
Q'YT : ######
DATE : ######
Z POWER LED
PART NO. : ######-##
c
350 350
b
SIZE(mm)
Aluminum Vinyl Bag
PART NO. : ######-##
BIN CODE NO. : #####
QUANTITY : 100
LOT NO. : ##########
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•Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
(or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30
degrees Centigrade. Humidity 50% maximum.
• Precaution after opening packaging
However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed.
a. Soldering should be done right after opening the package(within 24Hrs).
b. Keeping of a fraction
- Sealing
- Temperature : 5 ~ 40℃Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes,
components should be dried for 10-12hr at 60±5℃
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Anti radioactive ray design is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA(Isopropyl Alcohol) should be used.
• When the LEDs are illuminating, operating current should be decided after considering the
package maximum temperature.
• LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is connected to the anode. Therefore, we recommend to isolate the heat sink.
• Attaching LEDs, don’t use adhesives to generate organic vapor.
Handling of Silicone resin LEDs
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Precaution for use
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency.
Notes for handling of Silicone resin Z-Power LEDs
• Avoid touching silicone resin parts especially by sharp tools such as Tweezers
• Avoid leaving fingerprints on silicone resin parts.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on
the surface of the resin must be prevented.
• Please do not mold over the silicone lens with another resin.
(epoxy, urethane, etc)
