37
S
Termination
Finish
M = Palladium Silver
N = Silver Nickel Gold
S = Solder-Coated
Y = 100% Tin
U = Base Metallization/Barrier
Metal/Solder Coated*
W = Base Metallization/Barrier
Metal/Tinned (Tin or
Tin/Lead Alloy)
*Solder shall have a melting
point of 200ºC or less.
MIL-PRF-55681 Chips
CDR31-CDR35
CDR31
MIL Style
CDR31
CDR32
CDR33
CDR34
CDR35
101
Capacitance
Two digit figures
followed by multiplier
(number of zeros to
be added)
e.g. 101 = 100pF
B
Rated
Voltage
A = 50V
B = 100V
K
Capacitance
Tolerance
C ± .25 pF
D ± .5 pF
F ± 1%
J ± 5%
K ± 10%
M ± 20%
BP
Voltage Temperature
Limits
BP = 0 ± 30 ppm/ºC
without voltage;
0 ± 30 ppm/ºC with
rated voltage from
-55ºC to +125ºC
BX = ±15% without voltage;
+15 -25% with rated
voltage from -55ºC to
+125ºC
M
Failure
Rate Level
M = 1.0%
P = .1%
R = .01%
S = .001%
HOW TO ORDER
NOTE: Contact factory for availability of Termination and
Tolerance Options for Specific Part Numbers.
CDR31 thru CDR35 to MIL-PRF-55681
Type Dielectric Capacitance Tolerance Voltage
pF WVDC
CDR31 BP 1.0 - 2.4 B,C 100
CDR31 BP 2.7 - 9.1 B,C,D 100
CDR31 BP 10.0 - 470 F,J,K 100
CDR31 BP 510 - 680 F,J,K 50
CDR31 BX 470 - 4,700 K,M 100
CDR31 BX 5,600 - 18,000 K,M 100
CDR32 BP 1.0 - 2.4 B,C 100
CDR32 BP 2.7 - 9.1 B,C,D 100
CDR32 BP 10.0 - 1,000 F,J,K 100
CDR32 BP 1,100 - 2,200 F,J,K 50
CDR32 BX 4,700 - 15,000 K,M 100
CDR32 BX 18,000 - 39,000 K,M 50
CDR33 BP 1,000 - 2,200 F,J,K 100
CDR33 BP 2,700 - 3,300 F,J,K 50
CDR33 BX 15,000 - 27,000 K,M 100
CDR33 BX 39,000 - 100,000 K,M 50
CDR34 BP 2,200 - 4,700 F,J,K 100
CDR34 BP 5,100 - 10,000 F,J,K 50
CDR34 BX 27,000 - 56,000 K,M 100
CDR34 BX 100,000 - 180,000 K,M 50
CDR35 BP 4,700 - 10,000 F,J,K 100
CDR35 BP 11,000 - 22,000 F,J,K 50
CDR35 BX 56,000 - 150,000 K,M 100
CDR35 BX 180,000 - 470,000 K,M 50
PACKAGING
Bulk is standard packaging. Tape and reel per RS481 is available upon request.
