DATA SH EET
File under Discrete Semiconductors, SC19a 1998 Feb 17
DISCRETE SEMICONDUCTORS
Package outlines
RF & Microwave Power Transistors
and RF Power Modules
1998 Feb 17 2
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1998 Feb 17 3
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT119A 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 6 leads SOT119A
U2
H
A
F
A
bM
w3
b1
b2
p
w1AB
M
D
1DU
3
Q
c
q
U
1
C
B
1
2
3
4
5
6
e
MC
w
2
H
1
UNIT A
mm
Db
5.59
5.33 0.18
0.07 12.86
12.59 6.48 22.10
21.08 6.48
6.07 12.76
12.06
7.39
6.32
ceU
2
0.5118.42
qw
1
0.261.02
w3
w2
U3
H1
18.55
18.28
U1
25.23
23.95
4.07
3.81
b2
b1
5.34
5.08
p
3.31
2.97
Q
4.58
3.98
FH
12.83
12.57
D1
2.54
2.28
inches 0.220
0.210 0.007
0.003 0.505
0.496 0.255 0.870
0.830 0.255
0.239 0.502
0.475
0.291
0.249 0.020.725 0.010.04
0.730
0.720 0.993
0.943
0.160
0.150
0.210
0.200 0.130
0.117 0.180
0.157
0.505
0.495 0.100
0.090
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 4
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT119D 97-06-28
0 5 10 mm
scale
Flangeless ceramic package; 6 leads SOT119D
5.59
5.33 1.71
1.44
D
D1
A
UNIT Q
mm
b
4.53
3.70
A
5.34
5.08
b1
4.07
3.81
b2
0.16
0.10
c
12.86
12.59
D
12.83
12.57
D1
18.55
18.28
H1
21.97
21.20
H
0.51
w2
0.26
w3
6.48
0.220
0.210 0.067
0.057
inches 0.178
0.146 0.210
0.200 0.160
0.150 0.006
0.004 0.506
0.496 0.505
0.495 0.730
0.720
0.865
0.835 0.02 0.01
0.255
e
b2
Q
c
1
2
3
4
5
6
H
bM
w3
b1
e
A
MA
w2
H1
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 5
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
8-32
UNC
SOT120A 97-06-28
H
b
H
L
detail X
0 5 10 mm
scale
MW
Q
A
NN1
N3
M1
D
c
X
1
4
3
2
Studded ceramic package; 4 leads SOT120A
A
w1A
M
D1
D2
UNIT A W
mm
Db
5.90
5.48 0.18
0.14 9.73
9.47 8.39
8.12 27.44
25.78 3.41
2.92 3.31
2.54
5.97
4.74
cD1N3
4.35
3.98
Q
0.38
w1
L
9.00
8.00
N1
1.60
0.00
M1
1.66
1.39
N
12.83
11.17
D2
9.66
9.39
inches 0.232
0.216 0.007
0.004 0.383
0.373 0.330
0.320 1.080
1.015 0.134
0.115 0.130
0.100
0.283
0.248 0.171
0.157 0.015
0.354
0.315 0.063
0.000
0.065
0.055 0.505
0.440
0.380
0.370
MH
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 6
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT121B 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 4 leads SOT121B
12
43
U
3
D
1
U
2
H
H
L
b
Q
D
U
1
q
A
F
c
p
w
1
M
M
w
2
B
C
C
A
AB
α
0.51
UNIT A
mm
Db
5.82
5.56 0.16
0.10 12.86
12.59 12.83
12.57 28.45
25.52 3.30
3.05 6.48
6.22
7.27
6.17
cD1U3
U2
12.32
12.06 1.02
w1w2
45°
αL
7.93
6.32
U1
24.90
24.63
Q
4.45
3.91
q
18.42
F
2.67
2.41
0.02
inches 0.229
0.219 0.006
0.004 0.506
0.496 0.505
0.495 1.120
1.005 0.130
0.120 0.255
0.245
0.286
0.243 0.485
0.475 0.04
0.312
0.249 0.98
0.97
0.175
0.154 0.725
0.105
0.095
pH
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 7
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT AD1W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 8-32
UNC
α
90°
SOT122A 97-04-18
H
b
H
L
detail X
D
b
5.85
5.58 0.18
0.14
5.97
4.74
cM
1
M
1.02
NN
3
11.82
11.04
w1
0.381
Q
3.38
2.74
3.86
2.92
H
27.56
25.78 9.91
9.14 3.18
2.66 1.66
1.39
7.50
7.23 6.48
6.22 7.24
6.93
LN1
max.
0 5 10 mm
scale
D2
M
ceramic
BeO
metal
W
Q
A
N
N1
N3
M1
D
c
X
1
4
3
2
Studded ceramic package; 4 leads SOT122A
α
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
A
w1A
M
D1
D2
1998 Feb 17 8
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT AD2
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
α
90°
SOT122D 97-04-18
H
b
H
L
D
b
5.85
5.58
4.17
3.27 0.18
0.14 7.50
7.23 7.24
6.98
cQ
1.58
1.27
H
27.56
25.78 9.91
9.14
L
0 5 10 mm
scale
Q
A
D2
D
c
1
4
3
2
Studless ceramic package; 4 leads SOT122D
α
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 9
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT123A 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 4 leads SOT123A
1
2
43
U
3
U
2
H
HL
b
Q
D
U
1
q
A
F
c
p
M
w
2
B
C
C
A
w
1
M
AB
α
UNIT A
mm
Db
5.82
5.56 0.18
0.10 9.73
9.47 9.63
9.42 20.71
19.93 3.33
3.04 6.61
6.09
7.47
6.37
cD1U2U3
9.78
9.39 1.020.51
w2
w1
45°
αL
5.61
5.16
U1
25.15
24.38
Q
4.63
4.11
q
18.42
F
2.72
2.31
inches 0.229
0.219 0.007
0.004 0.383
0.373 0.397
0.371 0.815
0.785 0.131
0.120 0.26
0.24
0.294
0.251 0.385
0.370 0.040.02
0.221
0.203 0.99
0.96
0.182
0.162 0.725
0.107
0.091
pH
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 10
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT147A 97-06-28
0 5 10 mm
scale
Studded ceramic package; 4 leads SOT147A
H
b
H
1
2
3
4
Q
A
N
N1
D
W
c
A
w1A
M
D1
UNIT AW
mm 1/4"×
28 UNF
Db
5.82
5.56 0.16
0.10 12.86
12.59 13.34
12.57 28.45
27.43 13.39
12.62
8.06
7.18
cD1
0.511.40
w1
Q
5.24
4.92
inches 0.229
0.219 0.006
0.004 0.506
0.496 0.525
0.495 1.12
1.08 0.527
0.497
0.317
0.283 0.020.055 0.206
0.194
N1
max.
NH
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 11
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT161A 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 8 leads SOT161A
U2
H
D
A
F
A
bM
w3
b1
H1MC
w2
w1
pAB
M
E
Q
c
q
U
1
e
e
1
C
B
8
7
6
5
2
1
4
3
UNIT A
mm
Db
2.04
1.77
b1
2.93
2.66 0.18
0.10 10.22
10.00
E
10.22
10.00
e
3.50 17.00
16.00 10.34
10.08
7.27
6.47
ce1U2
0.260.51 1.02
w3
18.42
qw
2
w
1
F
2.70
2.08
U1
24.97
24.71
H1
12.83
12.57
p
3.36
2.92
Q
4.32
4.06
3.80
inches 0.080
0.070 0.115
0.105 0.007
0.004 0.402
0.394 0.402
0.394 0.138 0.669
0.630 0.407
0.397
0.286
0.255 0.010.02 0.040.725
0.106
0.082 0.983
0.973
0.505
0.495 0.132
0.120 0.170
0.160
0.150
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 12
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT171A 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 6 leads SOT171A
1
2
3
4
5
6
U2E
E1
H
Q
D
D1
A
F
c
A
bM
w3
H1M
b1
C
w2
e
U1
q
p
C
w1AB
M
B
UNIT A
mm
Db
2.15
1.85
b1
3.20
2.89 0.16
0.07 9.25
9.04
D1
9.30
8.99
E
5.95
5.74 3.58 11.31
10.54 6.00
5.70
6.81
6.07
cE1U2
0.260.51 1.02
w3
18.42
qw
2
w
1
F
3.05
2.54
U1
24.90
24.63
H1
9.27
9.01
p
3.43
3.17
Q
4.32
4.11
e
6.00
5.70
inches 0.085
0.073 0.126
0.114 0.006
0.003 0.364
0.356 0.366
0.354 0.234
0.226 0.140 0.445
0.415 0.236
0.224
0.268
0.239 0.010.02 0.040.725
0.120
0.100 0.980
0.970
0.365
0.355 0.135
0.125 0.170
0.162
0.236
0.224
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 13
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT172D 97-06-28
H
b
b1
H
0 5 10 mm
scale
Q
A
D
D1c
Studless ceramic package; 4 leads SOT172D
1
2
3
4
UNIT A
mm
Db
3.31
3.04
b1
0.89
0.63 0.16
0.10 5.20
4.95 5.33
5.08 1.15
0.88
3.71
2.89
cD1H
26.17
24.63
inches 0.13
0.12 0.035
0.025 0.006
0.004 0.205
0.195 0.210
0.200 0.045
0.035
0.146
0.114 1.03
0.97
Q
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 14
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT A1bpcDEe
1H
EL
pQywv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.10
0.01
1.8
1.5 0.80
0.60
b1
3.1
2.9 0.32
0.22 6.7
6.3 3.7
3.3 2.3
e
4.6 7.3
6.7 1.1
0.7 0.95
0.85 0.1 0.10.2
DIMENSIONS (mm are the original dimensions)
SOT223 96-11-11
97-02-28
wM
bp
D
b1
e1
e
A
A1
Lp
Q
detail X
HE
E
vMA
AB
B
c
y
0 2 4 mm
scale
A
X
132
4
Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
1998 Feb 17 15
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT262A1 97-06-28
0 5 10 mm
scale
Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262A1
p
AF
b
e
D
q
U1
H1
U2
H
Q
c
5
12
43
E
E
1
C
A
w
1
AB
M
B
M
w
3
M
w
2C
UNIT A
mm
Db
5.85
5.58 0.16
0.10 21.98
21.71 11.05 10.29
10.03 20.58
20.06 9.91
9.65
5.77
5.00
ce U2
0.250.51 1.02
w3
27.94
qw
2
w
1
F
1.78
1.52
U1
34.17
33.90
H1
17.02
16.51
p
3.28
3.02
Q
2.85
2.59
EE
1
10.27
10.05
inches 0.230
0.220 0.006
0.004 0.865
0.855 0.435 0.405
0.395 0.81
0.79 0.390
0.380
0.227
0.197 0.010.02 0.041.100
0.070
0.060 1.345
1.335
0.67
0.65 0.129
0.119 0.112
0.102
0.404
0.396
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 16
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT262A2 97-06-28
0 5 10 mm
scale
Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262A2
p
AF
b
e
D
q
U1
H1
U2
H
Q
c
5
12
43
E
E
1
C
A
w
1
AB
M
B
M
w
3
M
w
2C
UNIT A
mm
Db
5.85
5.58 0.16
0.10 21.98
21.71 11.05 10.29
10.03 20.58
20.06 9.91
9.65
5.39
4.62
ce U2
0.250.51 1.02
w3
27.94
qw
2
w
1
F
1.78
1.52
U1
34.17
33.90
H1
17.02
16.51
p
3.28
3.02
Q
2,47
2.20
EE
1
10.27
10.05
inches 0.230
0.220 0.006
0.004 0.865
0.855 0.435 0.405
0.396 0.81
0.79 0.390
0.380
0.212
0.182 0.010.02 0.041.100
0.070
0.060 1.345
1.335
0.67
0.65 0.129
0.119 0.097
0.087
0.404
0.395
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 17
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT262B 97-06-28
0 5 10 mm
scale
Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262B
p
AF
b
e
D
U2
H
Q
c
5
12
43
E
A
w
1
AB
M
q
U
1
H
1
C
B
M
w
2C
E
1
M
w
3
UNIT A
mm
Db
8.51
8.25 0.16
0.10 21.98
21.71 11.05 10.29
10.03 15.50
14.98 9.91
9.65
5.39
4.62
ce U2
0.250.51 1.02
w3
27.94
qw
2
w
1
F
1.78
1.52
U1
34.17
33.90
H1
19.69
19.17
p
3.28
3.02
Q
2,47
2.20
EE
1
10.27
10.05
inches 0.335
0.325 0.006
0.004 0.865
0.855 0.435 0.405
0.395 0.61
0.59 0.390
0.380
0.212
0.182 0.010.02 0.041.100
0.070
0.060 1.345
1.335
0.775
0.755 0.129
0.119 0.097
0.087
0.404
0.396
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 18
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT268A 97-06-28
0 5 10 mm
scale
Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT268A
D
U1
H1
1
2
4
3
5
A
U2
HE
P
bQ
F
c
M
C
A
w3
MC
w2
e
q
B
w1AB
M
UNIT A
mm
Db
1.66
1.39 0.13
0.07 12.96
12.44 6.45 17.02
16.00 6.61
6.35
4.91
4.19
cEU
2
0.260.51 1.02
w3
18.42
qw
2
w
1
F
2.04
1.77
U1
24.90
24.63
H1
8.23
7.72
p
3.43
3.17
Q
2.67
2.41
e
6.48
6.22
inches 0.065
0.055 0.005
0.003 0.510
0.490 0.254 0.670
0.630 0.260
0.250
0.193
0.165 0.010.02 0.040.725
0.080
0.070 0.980
0.970
0.324
0.304 0.135
0.125 0.105
0.095
0.255
0.245
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 19
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT273A 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 6 leads SOT273A
U2
H
D
A
F
A
bM
w3
b1
MC
w2
E
Q
c
H1
q
U1
e
C
B
6
5
4
3
2
1
pw1AB
M
UNIT A
mm
Db
2.42
1.80
b1
3.18
2.92 0.16
0.10 10.93
10.66 4.35 15.75
14.73 10.29
10.03
7.45
7.27
cEU
2
0.250.51 1.02
w3
18.42
qw
2
w
1
F
3.05
2.54
U1
24.90
24.63
H1
10.93
10.66
p
3.31
3.04
Q
4.35
4.03
e
10.29
10.03
inches 0.095
0.071 0.125
0.115 0.006
0.004 0.430
0.420 0.171 0.62
0.58 0.405
0.395
0.286
0.254 0.010.02 0.040.725
0.120
0.100 0.98
0.97
0.43
0.42 0.130
0.120 0.171
0.159
0.405
0.395
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 20
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT279A 97-06-28
0 5 10 mm
scale
Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT279A
D
U1
H1
1
2
4
3
5
A
U2
HE
bQ
F
c
M
C
A
w3
MC
w2
q
e
B
w1AB
pM
UNIT A
mm
Db
1.66
1.39 0.16
0.10 9.28
9.01 3.05 12.96
11.93 5.97
5.71
6.84
6.01
cEU
2
0.250.51 1.02
w3
18.42
qw
2
w
1
F
3.05
2.54
U1
24.90
24.63
H1
4.96
4.19
p
3.48
3.22
Q
4.35
4.03
e
5.97
5.71
inches 0.065
0.055 0.006
0.004 0.365
0.355 0.12 0.51
0.47 0.235
0.225
0.269
0.237 0.010.02 0.040.725
0.120
0.100 0.98
0.97
0.195
0.165 0.137
0.127 0.171
0.159
0.235
0.225
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 21
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT289A 97-06-28
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 4 leads SOT289A
D
U1
H1
1
3
2
4
5
A
U2
HE
p
bQ
F
c
M
A
w3
MC
w2
q
e
C
B
w1AB
M
UNIT A
mm
Db
3.33
3.07 0.10
0.05 13.10
12.90 4.60 19.81
19.05 11.81
11.56
4.65
3.92
cEU
2
0.250.51 1.02
w3
21.44
qw
2
w
1
F
1.65
1.40
U1
28.07
27.81
H1
4.85
4.34
p
3.43
3.17
Q
2.31
2.06
e
11.53
11.33
inches 0.131
0.121 0.004
0.002 0.516
0.508 0.181 0.780
0.750 0.465
0.455
0.183
0.154 0.010.02 0.040.844
0.065
0.055 1.105
1.095
0.191
0.171 0.135
0.125 0.091
0.081
0.454
0.446
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1998 Feb 17 22
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT324B 97-06-05
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 4 leads SOT324B
0.13
0.07
1.66
1.39 8.69
8.07 1.66
1.39 5.59
4.57
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.17
4.37
3.55 2.32
2.00
D
q
U1
2
5
4
1
3
A
U2E
p
b
s
L
L
Q
F
c
UNIT Q
cD
6.91
6.29
EF L p q
mm
b
19.03
18.77
U2
U1
1.66
1.39
s
6.43
6.17 0.5114.22
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
B
1998 Feb 17 23
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT Qbpdc eU2
U1
UFPq
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-05-25
IEC JEDEC EIAJ
mm 4.0
3.8
0.56
0.46
A
9.5
9.0 0.3
0.2
D
30.1
29.9
E
18.6
18.4
12.8
12.6 4.1
3.9 40.74
40.54
2.54
e1
17.78 3.25
3.15
L
6.5
6.1 7.75
7.55
15.4
15.2
48.0
48.4 0.2 0.25
vw
0.1
y
DIMENSIONS (mm are the original dimensions)
SOT365A
0 10 20 mm
scale
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A
P
U2
F
A
U1
U
D
q
E
L
B
C
y
Q
c
vA
A
wM
bp
d
234
1
vM
B
vM
C
vM
B
e
1
ee
1998 Feb 17 24
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-04-18
IEC JEDEC EIAJ
SOT388A
y
0 5 10 mm
scale
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388A
UNIT cbee
1
EQUU
1
wZy
mm 0.30
0.20 5.08 12.2
11.8
L
2.54 17.3
16.9
0.7
0.3 3.45
3.05 0.150.25
DIMENSIONS (mm are the original dimensions)
7.7
7.3 2.3
1.9
A
2.2
1.8 0.56
0.46
U
A
U1
Q
c
E
L
bwM
e1
eeZ
1998 Feb 17 25
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-11-19
IEC JEDEC EIAJ
SOT388B
y
0 5 10 mm
scale
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388B
UNIT cbee
1
EQUU
1
wZy
mm 0.30
0.20 5.08 12.2
11.8
L
2.54 17.3
16.9
0.7
0.3 3.4
3.0 0.150.25
DIMENSIONS (mm are the original dimensions)
6.0
5.6 2.3
1.9
A
2.2
1.8 0.56
0.46
U
A
U1
Q
c
E
L
bwM
e1
eeZ
1234
1998 Feb 17 26
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-10-02
IEC JEDEC EIAJ
SOT388C
y
0 5 10 mm
scale
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388C
UNIT cbee
1
EQUU
1
wZy
mm 0.30
0.20 5.08 12.2
11.8
L
2.54 17.3
16.9
0.7
0.3 3.4
3.0 0.150.25
DIMENSIONS (mm are the original dimensions)
6.0
5.6 2.3
1.9
A
2.7
2.3 0.56
0.46
U
A
U1
Q
c
E
L
bwM
e1
eeZ
1234
1998 Feb 17 27
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT390A 97-05-29
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 2 leads SOT390A
0.16
0.10
5.72
5.46 8.69
8.07 1.66
1.39 6.10
5.33
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.17
4.37
3.55 2.32
2.00
D
q
U1
1
3
2
A
U2E
p
b
L
L
Q
F
c
UNIT Q
cD
6.91
6.29
EF L p q
mm
b
19.03
18.77
U2
U1
6.43
6.17 0.5114.22
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
B
1998 Feb 17 28
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT391A 97-05-29
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 2 leads SOT391A
0.16
0.10
5.85
5.58 11.54
10.51 10.93
9.90 2.29
2.03 16.51
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.17
5.36
4.29 1.66
1.39
D
U1
1
3
2
A
U2E
p
b
L
L
Q
F
c
UNIT Q
cDE
F
2.79
2.29
Lp q
mm
b
22.99
22.73
U2
U1
9.91
9.65 0.51
w1
1.02
w2
A
MC
C
A
w2
q
B
w1AB
M
1998 Feb 17 29
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT391B 97-05-29
0 5 10 mm
scale
Flangeless ceramic package; 2 leads SOT391B
0.16
0.10
5.85
5.58 11.54
10.51 10.93
9.90 1.02
0.76
DIMENSIONS (millimetre dimensions are derived
from the original inch dimensions)
4.09
3.02
D
1
2
A
E
b
L
L
Q
c
UNIT Q
cDE
2.79
2.29
L
mm
b
A
1998 Feb 17 30
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT409A
0 2.5 5 mm
scale
A
Q1
L
Ceramic surface mounted package; 8 leads SOT409A
UNIT cbDE
E
2HH
1LQ
1α
α
w
1
w
2
mm 0.23
0.18
0.58
0.43 4.93
4.01
5.94
5.03
D2
5.16
5.00 4.14
3.99
e
1.27 4.39
4.24
7.47
7.26 0.25 7°
0°
0.25
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1.02
0.51 0.10
0.00
A
2.36
2.06
inches 0.009
0.007
0.023
0.017 0.194
0.158
0.234
0.198 0.203
0.197 0.163
0.157 0.050 0.173
0.167
0.294
0.286 0.010 7°
0°
0.010
0.040
0.020 0.004
0.000
0.093
0.081
98-01-27
c
H
14
85
E
A
E
2
b
H
1
D
D
2
e
B
w
2
w
1
B
1998 Feb 17 31
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT409B
0 2.5 5 mm
scale
A
Q1
L
Ceramic surface mounted package; 8 leads SOT409B
UNIT cbDE
E
2HH
1LQ
1α
α
w
1
w
2
mm 0.15
0.10
0.58
0.43 4.93
4.01
5.94
5.03
D2
5.16
5.00 4.14
3.99
e
1.27 4.39
4.24
7.47
7.26 0.25 2°
0°
0.25
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
0.84
0.69 0.10
0.00
A
2.36
2.06
inches 0.006
0.004
0.023
0.017 0.194
0.158
0.234
0.198 0.203
0.197 0.163
0.157 0.050 0.173
0.167
0.294
0.286 0.010 2°
0°
0.010
0.033
0.027 0.004
0.000
0.093
0.081
98-01-27
c
HE
A
E2
b
H1
D
D2
e
B
w2
w1
B
14
85
1998 Feb 17 32
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT cDdEe
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 5.08 7.62
0.56
0.46
3.0
2.6 0.30
0.20 22.1
21.7 2.4
2.0 13.4
13.0 0.7
0.3 0.25 0.15
bA
DIMENSIONS (mm are the original dimensions)
SOT421A 97-06-20
0 5 10 mm
scale
L
22.4
22.0
U
8.2
7.8
U1
3.4
3.0
Q
0.25
0.05
Z
wye
1
Ceramic single-ended flat package; 4 in-line leads SOT421A
e e
U
U1
D
Z
E
e1
c
A
12 34
b
d
w
M
LQ
y
1998 Feb 17 33
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT422A 97-12-24
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT422A
UNIT Q
cD E
1
EFHp q
mm 0.13
0.08
b
5.21
4.95 10.29
10.03
9.93
9.68 8.76
8.51
D1
10.29
10.03 1.58
1.47 21.61
21.08
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.18 16.51 22.99
22.73
U2
U1
9.91
9.65 0.25
w2
w1
0.76
A
5.72
4.83 3.35
2.92
inches 0.005
0.003
0.205
0.195 0.405
0.395
0.391
0.381 0.345
0.335
0.405
0.395 0.062
0.058 0.89
0.83 0.135
0.125 0.65 0.905
0.895 0.390
0.380 0.01 0.03
0.225
0.190 0.132
0.115
D
D1
q
U1
A
U2E1E
p
b
H
1
3
2
Q
F
c
MC
C
A
w2
B
w1AB
M
1998 Feb 17 34
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT423A 97-04-01
0 5 10 mm
scale
SOT423A
DIMENSIONS (mm are the original dimensions)
D
D1
q
U1
A
U2E1E
p
b
H
1
3
2
Q
F
c
Flanged hermetic ceramic package; 2 mounting holes; 2 leads
UNIT Q
cD E
1
EFHp q
mm 0.16
0.10
b
9.53
9.27 10.29
10.03
12.02
11.76 8.82
8.56
D1
12.83
12.57 1.58
1.46 19.18
18.92 3.43
3.17 16.64
16.38 22.99
22.73
U2
U1
9.91
9.65
A
5.58
5.04 3.42
2.88
1998 Feb 17 35
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT437A 97-05-23
0 5 10 mm
scale
Flanged ceramic package; 2 mounting holes; 2 leads SOT437A
0.13
0.07
1.66
1.39 6.99
6.22 1.66
1.39 17.02
16.00
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.17
5.03
4.31 2.29
2.03
D
U1
1
3
2
A
U2E
p
b
H
Q
F
c
UNIT Q
cD
6.99
6.22
EFHp q
mm
b
14.22 19.03
18.77
U2
U1
6.48
6.22 0.51
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
q
B
1998 Feb 17 36
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT439A 97-05-23
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT439A
0.13
0.05
3.69
3.42 13.09
12.57 1.58
1.47 17.28
15.74
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.17
6.05
5.13 3.36
2.92
D
U1
1
3
2
A
U2E
p
b
H
Q
F
c
UNIT Q
cD
10.55
10.03
EFHp q
mm
b
16.51 22.94
22.73
U2
U1
9.91
9.65 0.51
w1
1.02
w2
A
MC
C
A
w1
w2
AB
M
q
B
1998 Feb 17 37
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT440A 97-05-23
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT440A
0.16
0.07
2.16
1.90 5.85
5.58 1.66
1.39 15.75
14.73
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.18
2.92
4.25
3.27 3.48
2.92
D
U1
1
3
2
A
U2E
p
b
H
Q
F
c
UNIT Q
cD
5.31
5.00
EFHp q
mm
b
1.15
0.88
b1
14.22 20.45
20.19
U2
U1
5.21
4.95 0.51
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
b
1MC
w
2
q
B
1998 Feb 17 38
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT A
max.
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 2.4
SOT441A 97-02-28
b
L
D
3.38
3.08
b
3.2
b1
0.75
c
0.125
Qα
1.3
1.0
D1
5.28
5.12 6
L
min.
90°
0 5 10 mm
scale
Q
A
seating plane
D
D1
c
1
4
3
2
Studless ceramic package; 4 leads SOT441A
L
b1
DIMENSIONS (mm are the original dimensions)
Note
1. This device corporates naked beryllium oxide, the dust of witch is toxic.
α
AI2O3
BeO
1998 Feb 17 39
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
UNIT A
max. D1W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 4.0 8-32
UNC
α
90°
SOT442A 97-02-28
b
L
detail X
D
b
3.2
b1
0.75
c
0.125
M1
1.6
1.4
M
3.27
3.01 1.6
N2N3
min
2.9
8.5
7.5
Q
2.80
2.50
D2
6
L
min. N1
max.
12.5
N
max.
0 5 10 mm
scale
5.25
5.10
3.38
3.08 5.28
5.12
MW
Q
A
N2
N
N1
N3
D1
seating plane
M1
D2
D
c
X
1
4
3
2
Studded ceramic package; 4 leads SOT442A
L
b1
DIMENSIONS (mm are the original dimensions)
Note
1. This device corporates naked beryllium oxide, the dust of witch is toxic.
α
1998 Feb 17 40
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT443A 97-05-23
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT443A
0.16
0.07
3.21
2.89 10.47
9.90 1.61
1.44 6.25
5.74
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.41
3.20
6.33
4.87 3.61
2.84
D
q
U1
1
3
2
A
U2E1E
p
b
L
L
Q
F
c
UNIT Q
cD
10.22
9.90
E1
8.13
7.87
EFLp q
mm
b
16.51 23.12
22.70
U2
U1
9.91
9.70 0.51
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
B
1998 Feb 17 41
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-05-26
IEC JEDEC EIAJ
SOT445A
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT445A
0.15
0.09
3.15
2.95 5.31
5.01
7.9
7.7 4.1
3.9 1.82
1.22 15.84
14.64
DIMENSIONS (mm are the original dimensions)
3.35
3.05
4.01
3.36 3.33
3.03
D
D2
D1
q
U1
1
3
2
A
U2E1
E2E
p
b
H
Q
F
c
UNIT Q
cD E
2
4.25
3.95
E1
7.65
7.35
D1
8.15
7.85
D2EFHp q
mm
b
20.47
20.17
U2
U1
5.18
4.98 0.51
w1
1.0214.22
w2
A
MC
C
Aw1
w2
AB
M
B
1998 Feb 17 42
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT445C 97-05-23
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT445C
0.15
0.09
3.15
2.95 5.31
5.01
8.13
7.87 4.20
3.93 1.82
1.22 15.84
14.64
DIMENSIONS (mm are the original dimensions)
3.35
3.05
5.57
4.70 3.33
3.03
D
D2
D1
q
U1
1
3
2
A
U2E1
E2E
p
b
H
Q
F
c
UNIT Q
cD E
2
4.25
3.95
E1
7.65
7.35
D1
8.15
7.85
D2EFHp q
mm
b
14.22 20.47
20.17
U2
U1
5.18
4.98 0.51
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
B
1998 Feb 17 43
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT448A 97-05-29
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT448A
0.13
0.05
3.69
3.42 15.68
15.16 8.08
7.82 1.63
1.52 17.02
16.00
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.31
2.79
6.18
5.23 3.42
2.94
D
q
U1
1
3
2
A
U2E1E
p
b
H
Q
F
c
UNIT Q
cD
10.29
10.03
E1
EFHp q
mm
b
25.53
25.27
U2
U1
9.91
9.65 0.5120.32
w1
1.02
w2
A
MC
C
A
w2
B
w1AB
M
1998 Feb 17 44
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT460A 97-05-23
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT460A
0.16
0.07
9.78
9.52 12.45
11.68 6.94
6.22 1.66
1.39 6.10
5.33
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.28
3.02
5.39
4.49 2.37
1.95
D
q
U1
1
3
2
A
U2E
p
b
L
L
Q
F
c
UNIT Q
cDEFLp q
mm
b
22.99
22.73
U2
U1
6.43
6.17 0.5117.98
w1
1.02
w2
A
MC
C
Aw1
w2
AB
M
B
1998 Feb 17 45
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT468A 97-12-24
0 5 10 mm
scale
Flanged ceramic (AIN) package; 2 mounting holes; 2 leads SOT468A
D
D1
U1
1
3
2
A
U2
H EE1
p
bQ
F
c
MC
C
A
w2
q
B
w1AB
M
UNIT Q
cD E
1
EFHp q
mm 0.15
0.10
b
11.81
11.58 10.29
10.03
D1
15.37
15,11 1.65
1.60 16.74
16.48
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.30
3.05 20.32 25.53
25.27
U2
U1
9.91
9.65 0.254
w2
w1
0.508
A
5.23
4.62 2.21
2.06
inches 0.006
0.004
0.465
0.455 0.405
0.395
10.26
10.06
0.404
0.396
0.605
0.595
15.39
15,09
0.606
0.594 0.065
0.063 0.659
0.649 0.130
0.120 0.800 1.005
0.995 0.390
0.380 0.01 0.02
0.206
0.182 0.087
0.081
1998 Feb 17 46
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT469A 97-04-01
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT469A
21.11
20.85
20.76
20.44 1.40
1.14 30.61
30.35 3.43
3.17 26.14
25.88 31.12
30.86 15.93
15.67
2.16
1.90
D
q
D1
U1
A
U2E
1
2
3
p
b
H
Q
F
c
0.13
0.07
1.12
0.86
DIMENSIONS (mm are the original dimensions)
5.73
4.53
UNIT Q
cDD
1
13.95
13.63
EFHp q
mm
b U2
U1
A
1998 Feb 17 47
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT482B
0 5 10 mm
scale
Leadless surface mounted package; plastic cap; 4 terminations SOT482B
UNIT b1b2b3
bcDD
1
dEE
1ee
1LL
1L
2
mm 1.90
1.59 1.9
1.7 1.4
1.2 0.6
0.4 0.70
0.57 13.7
13.3 13.35
13.05 8.2
7.8 7.85
7.55 2.6
2.4 4.6
4.4 1.15
0.85 3.85
3.55
0.8
0.6 2.0 2.65
2.35
DIMENSIONS (mm are the original dimensions)
A
A
b3
b3
b2
d
L
L2
L1
c
E1
b2
b1
b
(4×)
D
12 34
D
1
E
ee e
1
PROPOSAL 98-07-07
pin 1 index
1998 Feb 17 48
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT494A
0 5 10 mm
scale
Flanged double-ended ceramic (AIN) package; 2 mounting holes; 4 leads SOT494A
p
AF
b
e
D
U2
H
Q
c
5
12
4
3
D1
E
A
w1AB
M
q
U
1
H
1
C
B
M
w
2C
E
1
M
w
3
UNIT A
mm
Db
11.81
11.56 0.15
0.10 33.96
28.02 31.37
30.61 10.29
10.03 16.74
16.48 10.29
10.03
5.26
4.60
cD1U2
0.250.25 0.51
w3
qw
2
w
1
F
1.66
1.60
U1
41.28
41.02
36.07
H1
27.81
27.05
p
3.30
3.05
Q
2.21
2.06
EE
1
10.26
10.06
e
15.75
0.465
0.455 0.006
0.004 1.337
1.103 1.235
1.205 0.405
0.395 0.659
0.649 0.405
0.395
0.207
0.181 0.010.01 0.02
0.065
0.063 1.625
1.615
1.42
1.095
1.065 0.130
0.120 0.087
0.081
0.404
0.396 0.62
inches
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
PROPOSAL 97-10-17
1998 Feb 17 49
Philips Semiconductors
RF & Microwave Power Transistors
and RF Power Modules Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT502A
0 5 10 mm
scale
Flanged LDMOST package; 2 mounting holes; 2 leads SOT502A
p
L
AF
b
D
U2
H
Q
c
1
3
2
D1
E
A
C
q
U1
C
B
E1
M M
w2
UNIT A
mm
Db
12.83
12.57 0.15
0.08 20.02
19.61 9.50
9.25 19.94
18.92 9.91
9.65
4.72
3.99
cU2
0.25 0.5127.94
qw
2
w
1
F
1.14
0.89
U1
34.16
33.91
L
5.33
4.32
p
3.38
3.12
Q
1.70
1.45
EE
1
9.50
9.30
inches 0.505
0.495 0.006
0.003 0.788
0.772
D1
19.96
19.66
0.786
0.774 0.374
0.364 0.785
0.745 0.390
0.380
0.186
0.157 0.01 0.021.100
0.045
0.035 1.345
1.335
0.210
0.170 0.133
0.123 0.067
0.057
0.374
0.366
H
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
PROPOSAL 98-05-15
w1AB
M M M