KBL400G - KBL410G GLASS PASSIVATED
* Glass passivated chip
* High current capability
* High surge current capability
* High reliability
* Low reverse current
* Low forward voltage drop
* Ideal for printed circuit board
* Pb / RoHS Free
* Case : Molded plastic
* Epoxy : UL94V-O rate flame retardant
* Terminals : Plated lead solderable per
MIL-STD-202, Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
* Weight : 5.15 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
C ambient temperature unless otherwise specified
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
SYMBOL KBL
400G KBL
401G KBL
402G KBL
404G KBL
406G KBL
408G KBL
410G UNIT
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Current Ta=50°CIF(AV) 4.0 A
Peak Forward Surge Current Single half sine wave
Superimposed on rated load (JEDEC Method)
Maximum Forward Voltage per Diode at IF = 4 A VF1.1 V
Maximum DC Reverse Current Ta = 25 °CIR10 µA
at Rated DC Blocking Voltage Ta = 100 °CIR(H) 1.0 mA
Typical Thermal Resistance ( Note 1 ) RθJA 19 °C/W
Operating Junction Temperature Range TJ - 50 to + 150 °C
Storage Temperature Range TSTG - 50 to + 150 °C
1 ) Thermal resistance from Junction to Ambient with units mounted on a 3" X 3" X 0.11" THK ( 7.5cm X 7.5cm X 0.3cm ) Cu. plate.
Page 1 of 2 Rev. 02 : March 24, 2005
RATING
IFSM 150 A
0.085 (2.16)
0.065 (1.65)
KBL
0.77 (19.56)
0.265 (6.73 )
0.235 (5.97)
0.200 (5.08)
0.190 (4.82)
0.052 (1.32)
0.048 (1.22)
Dimensions in inches and ( millimeter )
AC AC
0.825 (20.95)
0.605 (15.36)
1.1 (27.94)
MIN.
1.0 (25.4)
MIN.