VS-GB90DA60U
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Revision: 23-Oct-17 1Document Number: 94771
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Insulated Gate Bipolar Transistor
(Warp 2 Speed IGBT), 90 A
FEATURES
NPT warp 2 speed IGBT technology with
positive temperature coefficient
Square RBSOA
•HEXFRED
® anti-parallel diodes with ultrasoft
reverse recovery
Fully isolated package
Very low internal inductance ( 5 nH typical)
Industry standard outline
UL approved file E78996
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
BENEFITS
Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
Easy to assemble and parallel
Direct mounting to heatsink
Plug-in compatible with other SOT-227 packages
Lower conduction losses and switching losses
Low EMI, requires less snubbing
PRIMARY CHARACTERISTICS
VCES 600 V
IC DC 90 A at 90 °C
VCE(on) typical at 100 A, 25 °C 2.40 V
IF DC 108 A at 90 °C
Speed 8 kHz to 30 kHz
Package SOT-227
Circuit configuration Single switch with AP diode
SOT-227
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage VCES 600 V
Continuous collector current IC
TC = 25 °C 147
A
TC = 90 °C 90
Pulsed collector current ICM 300
Clamped inductive load current ILM 300
Diode continuous forward current IF
TC = 25 °C 180
TC = 90 °C 108
Gate-to-emitter voltage VGE ± 20 V
Power dissipation, IGBT PD
TC = 25 °C 625
W
TC = 90 °C 300
Power dissipation, diode PD
TC = 25 °C 379
TC = 90 °C 182
Isolation voltage VISOL Any terminal to case, t = 1 min 2500 V
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown
voltage VBR(CES) VGE = 0 V, IC = 250 μA 600 - -
V
Collector to emitter voltage VCE(on)
VGE = 15 V, IC = 100 A - 2.4 2.8
VGE = 15 V, IC = 100 A, TJ = 125 °C - 3 3.4
VGE = 15 V, IC = 100 A, TJ = 150°C - 3.3 -
Gate threshold voltage VGE(th)
VCE = VGE, IC = 250 μA 3 3.9 5.0
VCE = VGE, IC = 250 μA, TJ = 125 °C - 2.5 -
Temperature coefficient of threshold
voltage VGE(th)/TJVCE = VGE, IC = 1 mA (25 °C to 125 °C) - -10 - mV/°C
Collector to emitter leakage current ICES
VGE = 0 V, VCE = 600 V - 7 100 μA
VGE = 0 V, VCE = 600 V, TJ = 125 °C - 1.5 6.0 mA
VGE = 0 V, VCE = 600 V, TJ = 150 °C - 6 10
Forward voltage drop, diode VFM
IC = 100 A, VGE = 0 V - 1.6 2.1
VIC = 100 A, VGE = 0 V, TJ = 125 °C - 1.56 2.0
IC = 100 A, VGE = 0 V, TJ = 150 °C - 1.53 -
Gate to emitter leakage current IGES VGE = ± 20 V - - ± 200 nA
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Total gate charge (turn-on) Qg
IC = 100 A, VCC = 480 V, VGE = 15 V
- 460 690
nCGate to emitter charge (turn-on) Qge - 160 250
Gate to collector charge (turn-on) Qgc - 70 130
Turn-on switching loss Eon
IC = 100 A, VCC = 360 V,
VGE = 15 V, Rg = 5 
L = 500 μH, TJ = 25 °C
Energy losses
include tail and
diode
recovery.
Diode used
60APH06
-0.39-
mJTurn-off switching loss Eoff -1.10-
Total switching loss Etot -1.49-
Turn-on delay time td(on) - 245 -
ns
Rise time tr-53-
Turn-off delay time td(off) - 240 -
Fall time tf-63-
Turn-on switching loss Eon
IC = 100 A, VCC = 360 V,
VGE = 15 V, Rg = 5 
L = 500 μH, TJ = 125 °C
-0.52-
mJTurn-off switching loss Eoff -1.24-
Total switching loss Etot -1.76-
Turn-on delay time td(on) - 240 -
ns
Rise time tr-54-
Turn-off delay time td(off) - 250 -
Fall time tf-80-
Reverse bias safe operating area RBSOA
TJ = 150 °C, IC = 300 A, Rg = 22 
VGE = 15 V to 0 V, VCC = 400 V,
VP = 600 V, L = 500 μH
Fullsquare
Diode reverse recovery time trr
IF = 50 A, dIF/dt = 200 A/μs, VR = 200 V
-95-ns
Diode peak reverse current Irr -10- A
Diode recovery charge Qrr - 480 - nC
Diode reverse recovery time trr IF = 50 A, dIF/dt = 200 A/μs,
VR = 200 V, TJ = 125 °C
- 144 - ns
Diode peak reverse current Irr -16- A
Diode recovery charge Qrr - 1136 - nC
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Fig. 1 - Maximum DC IGBT Collector Current vs.
Case Temperature
Fig. 2 - Typical Collector to Emitter Voltage (V)
Fig. 3 - Maximum Allowable Forward Current vs.
Case Temperature, Diode Leg
Fig. 4 - Typical Forward Voltage Drop Characteristics
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Junction and storage temperature range TJ, TStg -40 - 150 °C
Junction to case IGBT RthJC
- - 0.20
°C/WDiode - - 0.33
Case to heatsink RthCS Flat, greased surface - 0.1 -
Weight -30- g
Mounting torque Torque to terminal - - 1.1 (9.7) Nm (lbf.in)
Torque to heatsink - - 1.8 (15.9) Nm (lbf.in)
Case style SOT-227
I
C
-
Continuous Collector Current (A)
Allowable Case Temperature (°C)
0 20 40 60 80 100 120 140 160
0
20
40
60
80
100
120
140
160
DC
VCE - Collector-to-Emitter Voltage (V)
IC - Collector to Emitter Current (A)
0.0 1.0 2.0 3.0 4.0 5.0 6.0
0
200
100
50
150
250
300 VGE = 15V
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
IF - Continuous Forward Current (A)
Allowable Case Temperature (°C)
0 20 40 60 80 100 120 140 160 180 200
0
20
40
60
80
100
120
140
160
V
F
-
Forward Voltage Drop (V)
I
F
- Forward Current (A)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
0
40
80
120
160
200
TJ = 25 °C
TJ = 125 °C
TJ = 150 °C
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Fig. 5 - Typical IGBT Transfer Characteristics
Fig. 6 - Typical IGBT Zero Gate Voltage Collector Current
Fig. 7 - Typical IGBT Threshold Voltage
Fig. 8 - Typical IGBT Collector to Emitter Voltage vs. Junction
Temperature, VGE = 15 V
Fig. 9 - Typical IGBT Energy Losses vs. IC
TJ = 125 °C, L = 500 μH, VCC = 360 V,
Rg = 5 , VGE = 15 V, Diode used: 60APH06
Fig. 10 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, L = 500 μH, VCC = 360 V,
Rg = 5 , VGE = 15 V, Diode used: 60APH06
V
GE
-
Gate-to-Emitter Voltage (V)
I
C
-
Collector-to-Emitter Current (A)
0
20
40
60
80
100
120
140
160
3.0 3.5 4.0 4.5 5.0 6.05.5 6.5
TJ = 150 °C
TJ = 25 °C
TJ = 125 °C
VCES - Collector-to-Emitter Voltage (V)
ICES - Collector Current (mA)
0.0001
0.001
0.01
0.1
1
10
100
0 100 200 300 400 500 600
TJ = 25 °C
TJ = 125 °C
TJ = 150 °C
V
GETH
-
Threshold Voltage (V)
I
C
(mA)
5
4
4.5
3
3.5
2
2.5
1
1.5
0.20 0.40 0.60 0.80 1.00
TJ =125 °C
TJ = 25 °C
V
CE
-
Collector-to-Emitter Voltage (V)
T
J
- Junction Temperature (V)
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
0 20 40 60 80 100 120 140 160
Ic = 30 A
Ic = 50 A
Ic = 100 A
Ic = 75 A
I
C
-
Collector Current (A)
Switching Energy (mJ)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Eon
Eoff
10 20 30 40 50 60 70 80 90 100 110 120
IC - Collector Current (A)
Switching Time (μs)
0.1
1
0.01
0 20 40 60 80 100 120
td(off)
td(on)
tf
tr
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Fig. 11 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, IC = 100 A, L = 500 μH,
VCC = 360 V, VGE = 15 V, Diode used: 60APH06
Fig. 12 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, L = 500 μH, VCC = 360 V,
IC = 100 A, VGE = 15 V, Diode used: 60APH06
Fig. 13 - Typical Reverse Recovery Time vs. dIF/dt, of Diode
Fig. 14 - Typical Stored Charge vs. dIF/dt of Diode
Fig. 15 - Typical Reverse Recovery Current vs. dIF/dt of Diode
Rg (Ω)
Energy Losses (mJ)
0.5
1
1.5
2
2.5
3
3.5
4
0
0 10 20 30 40 50
Eoff
Eon
R
g
(Ω)
0.01
0.1
1
0102030405060
Switching Time (μs)
td(off)
td(on)
tf
tr
40
60
80
100
120
140
160
180
200
100 1000
trr (ns)
diF/dt (A/μs)
25 °C
125 °C
IF = 50 A
VR = 200 V
0
500
1000
1500
2000
100 1000
Q
rr
(nC)
di
F
/dt (A/μs)
25 °C
125 °C
IF = 50 A
VR = 200 V
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Fig. 16 - Maximum Thermal Impedance ZthJC Characteristics, IGBT
Fig. 17 - Maximum Thermal Impedance ZthJC Characteristics, Diode
Fig. 18 - IGBT Reverse BIAS SOA, TJ = 150 °C, VGE = 15 V
0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10
t1 - Rectangular Pulse Duration (s)
ZthJC - Thermal Impedance
Junction to Case (°C/W)
.
.
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
D = 0.75
D = 0.50
D = 0.25
D = 0.1
D = 0.05
D = 0.02
DC
0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10
t1 - Rectangular Pulse Duration (s)
ZthJC - Thermal Impedance
Junction to Case (°C/W)
.
.
P
DM
t
1
t
2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
D = 0.75
D = 0.50
D = 0.25
D = 0.1
D = 0.05
D = 0.02
DC
I
C
(A)
1 10 100 1000
0
1
10
100
1000
V
CE
(V)
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19a - Clamped Inductive Load Test Circuit 19b - Pulsed Collector Current Test Circuit
20a - Switching Loss Test Circuit
20b - Switching Loss Waveforms Test Circuit
* Driver same type as D.U.T.; VC = 80 % of Vce(max)
* Note: Due to the 50 V power supply, pulse width and inductor
will increase to obtain Id
50 V
1000 V
D.U.T.
L
VC *
2
1
Rg
VCC
D.U.T.
R = VCC
ICM
+
-
L
Diode clamp/
D.U.T.
D.U.T./
driver
- 5 V
+
-
R
g
V
CC
+
-
t = 5 µs
t
d(on)
tf
tr
90 %
td(off)
10 %
90 %
10 %
5 %
VC
IC
Eon Eoff
Ets = (Eon + Eoff)
1
2
3
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ORDERING INFORMATION TABLE
CIRCUIT CONFIGURATION
CIRCUIT CIRCUIT
CONFIGURATION CODE CIRCUIT DRAWING
Single switch with AP
diode D
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95423
Packaging information www.vishay.com/doc?95425
1
-Insulated gate bipolar transistor (IGBT)
-Vishay Semiconductors product
2
- B = IGBT Gen 5
3
- Current rating (90 = 90 A)
4
- Circuit conguration (D = single switch with AP diode)
5
- Package indicator (A = SOT-227)
6
- Voltage rating (60 = 600 V)
8
7
-Speed/type (U = ultrafast IGBT)
Device code
51 32 4 6 7 8
GVS- B 90 D A 60 U
3 (C)
2 (G)
1, 4 (E)
1
43
2
Lead Assignment
Outline Dimensions
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SOT-227 Generation II
DIMENSIONS in millimeters (inches)
Note
Controlling dimension: millimeter
38.30 (1.508)
37.80 (1.488)
-A-
12.50 (0.492)
13.00 (0.512)
7.45 (0.293)
7.60 (0.299)
Ø 4.10 (0.161)
Ø 4.30 (0.169)
30.50 (1.200)
29.80 (1.173)
31.50 (1.240)
32.10 (1.264)
14.90 (0.587)
15.20 (0.598)
6.25 (0.246)
6.50 (0.256)
25.70 (1.012)
24.70 (0.972)
2.10 (0.083)
2.20 (0.087)
-B-
R full
2.20 (0.087)
1.90 (0.075)
8.30 (0.327)
7.70 (0.303)
4 x
4.10 (0.161)
4.50 (0.177)
-C-
0.13 (0.005)
12.30 (0.484)
11.70 (0.460)
25.00 (0.984)
25.50 (1.004)
M M M
0.25 (0.010) CA B
4 x M4 nuts
Legal Disclaimer Notice
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