© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SLVU2.8-4 Series
Description
Features
Applications
The SLVU2.8-4 was designed to protect low voltage,
CMOS devices from ESD and lightning induced transients.
There is a compensating diode in series with each low
voltage TVS to present a low loading capacitance to the line
being protected. These robust structures can safely absorb
repetitive ESD strikes at ±30kV (contact discharge) per IEC
61000-4-2 standard and each structure can safely dissipate
up to 40A (IEC 61000-4-5 2nd edition, tP=8/20μs) with very
low clamping voltages.
Pinout
Functional Block Diagram
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, IEC 61000-4-5
2nd edition, 40A (8/20μs)
• Low capacitance of 2pF
per line
• Low leakage current of
1μA (MAX) at 2.8V
• SOIC-8 (JEDEC MO-012)
pin configuration allows
for simple flow-through
layout
• RoHS Compliant and
Lead Free
• Moisture Sensitivity Level
(MSL-1)
• 10/100/1000 Ethernet
• WAN/LAN Equipment
• Switching Systems
• Desktops, Servers, and
Notebooks
• Analog Inputs
• Base Stations
5678
4321
Pin 1.3
Pin 2.4
Pin 6.8
Pin 5.7
RoHS
Pb
GREEN
Application Example
Ethernet
PHY
J1
J8
RJ-45
Connector
SLVU2.8-4
Device is shown
as transparent
for actual footprint
Case GND
Tx+
Tx-
Rx+
Rx-
SLVU2.8-4 Series 2.8V 40A TVS Array
Additional Information
Samples
Resources
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SLVU2.8-4 Series
Absolute Maximum Ratings
Parameter Rating Units
Peak Pulse Power (tP=8/20µs) 600 W
Peak Pulse Current (tP=8/20µs) 40 A
Operating Temperature –40 to 125 ºC
Storage Temperature –55 to 150 ºC
Electrical Characteristics (TOP = 25°C)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM IR≤1μA 2.8 V
Reverse Breakdown Voltage VBR IT=2μA 3.0 V
Snap Back Voltage VSB IT=50mA 2.8 V
Reverse Leakage Current ILEAK VR=2.8V (Each Line) 1 μA
Clamping Voltage1VCIPP=5A, tP=8/20μs (Each Line) 7. 0 8.5 V
Clamping Voltage1VCIPP=24A, tP=8/20μs (Each Line) 13.9 15.0 V
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±30 kV
IEC61000-4-2 (Air) ±30 kV
Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) (Each Line) 0.4 Ω
Diode Capacitance1CDVR=0V, f=1MHz (Each Line) 2.0 2.5 pF
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Note: 1Parameter is guaranteed by design and/or device characterization.
Figure 2: Clamping Voltage vs. IPP
Figure 1:
Capacitance vs. Reverse Voltage
Figure 3: 8/20 µs Pulse Waveform
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0 0.5 1.0 1.5 2.0 2.5
DC Bias (V)
Capacitance (pF)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
0
2
4
6
8
10
12
14
0510 15 20 25
Peak Pulse Current-IPP (A)
Clamping Voltage-V
C
(V)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SLVU2.8-4 Series
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Package SOIC-8
Pins 8
JEDEC MS-012
Millimetres Inches
Min Max Min Max
A1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 1.65 0.050 0.065
B0.31 0.51 0.012 0.020
c0.17 0.25 0.007 0.010
D4.80 5.00 0.189 0.197
E5.80 6.20 0.228 0.244
E1 3.80 4.00 0.150 0.157
e1.27 BSC 0.050 BSC
L0.40 1.27 0.016 0.050
o
Recommended
Soldering Pad Outline
(Reference Only)
F
L
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material V-0 per UL 94 Molded Epoxy
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-203 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/12/17
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SLVU2.8-4 Series
Ordering Information
Part Number Package Marking Min. Order Qty.
SLVU2.8-4BTG SOIC-8 U2.8-4 2500
Part Numbering System Part Marking System
SLVU2.8 BTG
Series
Package
B = SOIC-8
No. of channels
T= Tape & Reel
-4
G= Green
U2.8-4
U2.8
Product Series
U = SLVU2.8
Voltage Level
-4
No. of channels
Embossed Carrier Tape & Reel Specification — SOIC Package
User Feeding Direction
Pin 1 Location
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F5.4 5.6 0.213 0.22
P2 1. 9 2.1 0.075 0.083
D1. 5 1. 6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161
10P0 40.0 ± 0.20 1.574 ± 0.008
W11. 9 12.1 0.468 0.476
P7. 9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t0.30 ± 0.05 0.012 ± 0.002
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
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