Mar
.
201
3. V
ersion 2
.0
MagnaC
hip Semiconducto
r Ltd
.
1
MP
KB
2C
A
15
0U60
600V
FRD Module
A
bsolute Maximum Ra
tings
@Tc = 25
o
C (Per Le
g)
Characterist
ics
Conditions
Symbol
Rating
Unit
Repetitive Peak
Reverse Voltag
e
V
RRM
60
0
V
Reverse DC Vol
tage
V
R(DC)
48
0
V
Average Forw
ard
Curren
t
T
C
=25
o
C
Resistive Load
I
F(AV)
3
00
A
T
C
=
10
0
o
C
15
0
A
Surge(non-r
epetitive) Forw
ard
Current
One Half Cy
cle at 60Hz,
Peak Value
I
FSM
2
75
0
A
I
2
t for Fusing
Value for One Cy
cle Curren
t,
t
w
= 8.3ms, T
j
= 25
℃
Start
I
2
t
31
.3* 10
3
A
2
s
Junction
T
e
mperature
T
J
-40 ~ 150
℃
Maximum Pow
er Dissipation
P
D
460
W
Isolation
Voltage
@AC 1 minutes
V
isol
2500
V
Storage Temper
ature
T
stg
-40 ~ 1
25
℃
Mounting Torqu
e(M6)
-
4.0
N.m
Terminal Torque(M
5)
Typical Including
Screws
-
2.0
N.m
Weight
-
120
g
MP
KB
2C
A
15
0U
60
60
0V FRD Module
General Description
Ultra-FRD module devices ar
e optimized to r
educe losses
and
EMI/RFI in high frequency po
wer conditioning electr
ical
systems.
These diode modules ar
e ideally suited for po
wer converters,
motors drives and othe
r applications wher
e switching losses
are significant portion of the t
otal losses.
Features
Rep
etitive Reverse V
oltage : V
RRM
=
60
0V
L
ow Forward V
oltage
: V
F
(typ.)
=
1.
45
V
Average Forward Current : I
F
(
Av
.)=150A
@T
C
=100
℃
Ult
ra-Fast Reverse Recovery
T
im
e : t
rr
(typ.) =
40
ns
E
xtensive Characterization of Recovery Parameters
Red
uced EMI and RFI
Is
olation T
ype Package
A
pplications
Hig
h Speed & High Power converters, Welders
V
ariou
s Switching and T
elecommunication Power Supply
5
DM
-1
Center Comm
on
E
301932
Mar
.
201
3. V
ersion 2
.0
MagnaC
hip Semiconducto
r Ltd
.
2
MP
KB
2C
A
15
0U60
600V
FRD Module
Electrical Characteristics
@Tc = 25
o
C
(unle
ss otherwise
specified)
Characterist
ics
Conditions
Symbol
Min.
Typ.
Max.
Unit
Cathode Anode
Breakdow
n Voltage
I
R
=100uA
V
R
60
0
-
-
V
Diode Max
imum Forwar
d Voltage
I
F
=1
5
0A
T
C
=25
℃
V
FM
-
1.45
1.
8
V
T
C
=100
℃
-
1.35
-
Diode Peak Rev
erseRecover
y Current
T
c
=100
℃
,
V
RRM
applied
T
C
=100
℃
I
RRM
-
-
1.0
mA
Diode Reve
rse Recovery Ti
me
I
F
=1
A,
V
R
=30V
di/dt = -300A/uS
T
C
=
25
℃
t
rr
-
40
55
ns
Diode Reve
rse Recovery Ti
me
I
F
=150
A,
V
R
=3
00V
di/dt = -300A/uS
T
C
=25
℃
t
rr
-
110
140
ns
T
C
=100
℃
-
180
-
Thermal Characteristics
Characterist
ics
Conditions
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistan
ce(Isolation Typ
e)
Junction to Case
R
th(j-c)
-
-
0.27
℃
/W
Mar
.
201
3. V
ersion 2
.0
MagnaC
hip Semiconducto
r Ltd
.
3
MP
KB
2C
A
15
0U60
600V
FRD Module
Fig.1 T
ypical Forward V
oltage Drop
vs. Instantaneous Forw
ard Current
Fig.2 T
ypical Reverse R
ecovery Time
V
s.
–
di/dt
Fig.3 T
ransient T
hermal I
mpedance(Zth
jc)
Characteristics
Fig.4 Forward Cur
rent Derating Cu
rve
0.0
0.5
1.0
1.5
2.0
2.5
0
50
100
150
200
250
300
Forward Current,I
F
[A]
T
C
=25
℃
T
C
=125
℃
Forward Voltage
Drop,V
F
[V]
100
200
300
400
500
0
30
60
90
120
150
Reverse R
ecovery Tim
e[ns]
di/dt[A/us]
1E-5
1E-4
1E-3
0.01
0.1
1
10
1E-4
1E-3
0.01
0.1
1
T
C
=25
℃
Thermal Response Zthjc[
℃
/W]
Rectangular Pulse Duration
Time[sec]
0
20
40
60
80
100
120
140
160
0
50
100
150
200
250
300
350
400
DC
Average Forwar
d Current,I
F(AVG)
[A]
Case Temperatute, Tc[
℃
]
Mar
.
201
3. V
ersion 2
.0
MagnaC
hip Semiconducto
r Ltd
.
4
MP
KB
2C
A
15
0U60
600V
FRD Module
Package Dimension
5
DM
-1
Dimensions are in mil
limeters, un
less otherwise s
pecified
T
BD
T
BD
MA
X
23.
5
15.
0±
0
.5
Mar
.
201
3. V
ersion 2
.0
MagnaC
hip Semiconducto
r Ltd
.
5
MP
KB
2C
A
15
0U60
600V
FRD Module
DISCLAIMER:
The
Products
are
not
de
signed
fo
r
use
in
hostile
environments,
including,
without
limitation,
aircraft,
nuclear
power
generation,
medical
appliances,
and
devices
or
systems
in
which
malfunction
of
any
Product
can
reasonably
be
expected
to
result
in
a
personal
injury.
Sel
ler’s
customers
using
or
selling
Seller’s
products
for
use
in
such
applications do so at their own risk and agree to fully defend and indemnify
Seller.
MagnaC
hip reserves
the
right
to change
the
specifications and circuitry
without notice
at
any t
ime. MagnaChip does
not
consid
er
responsibility
for
use
of
any
circuitry
other
tha
n
cir
cuitry
entirely
inc
luded
in
a
MagnaC
hip
product.
is
a
registered
trademark
of
MagnaChip
Semiconductor
Ltd.
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