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RoHS
Analysis
Certificates
(CoA)
for
Direct
lvlaterials
CY2545C022,CY2545C022T
Last
Updated:
07/29/2010
Bill
of
Materials
Mold
compound
Lead
frame/Substrate
Lead
finish/Solder
ball
Die
attach
Bonding
wire
Die
Assembly
site
A
G700
STW
C194
/
AQT
C194
/L
G
Micron
C194
Amkor
Pure
Sn
8290
Heraeus
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