CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- High temperature metallurgically bonded construction
- Fast switching for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
FAL FBL FDL FGL FJL FKL FML
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
Cj pF
Trr 250 ns
T
JO
C
T
STG O
C
Document Number: DS_D1405033 Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
Surface Mount Fast Recover
y
Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Sub SMA Sub SMA
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL RSF
AL
RSF
BL
RSF
DL
RSF
GL
RSF
JL
RSF
KL
RSF
ML UNIT
Marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 0.5
4
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
10 A
Maximum instantaneous forward voltage (Note 1)
@ 0.5 A V
F
1.3 V
Note 1: Pulse test with PW=300μs, 1% duty cycle
Maximum reverse recovery time (Note 3)
Typical thermal resistance R
θjC
R
θjA
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
5μA
50
Typical junction capacitance (Note 2)
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
150 500
32
150
O
C/W
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
PART NO.
PART NO.
RSFML
RSFML
RSFML
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405033 Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
RSFxL
(Note 1) Prefix "H"
RU
Suffix "G"
Sub SMA 1,800 / 7" Plastic reel (8mm tape)
RV Sub SMA 3,000 / 7" Plastic reel (8mm tape)
RT Sub SMA 7,500 / 13" Paper reel (8mm tape)
MT Sub SMA 7,500 / 13" Plastic reel (8mm tape)
RQ Sub SMA 10,000 / 13" Paper reel (8mm tape)
MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape)
R3 Sub SMA 1,800 / 7" Plastic reel (12mm tape)
RF Sub SMA 3,000 / 7" Plastic reel (12mm tape)
R2 Sub SMA 7,500 / 13" Paper reel (12mm tape)
M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape)
RH Sub SMA 10,000 / 13" Paper reel (12mm tape)
MH Sub SMA 10,000 / 13" Plastic reel (12mm tape)
Note 1: "x" defines voltage from 50V (RSFAL) to 1000V (RSFML)
EXAMPLE
PREFERRED P/N AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
RSFML RU RU
RSFML RUG RU G Green compound
RSFMLHRU H RU AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
0
0.1
0.2
0.3
0.4
0.5
0.6
0 255075100125150175
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
0
2
4
6
8
10
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
0.001
0.01
0.1
1
10
0 20406080100
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=100℃
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 5 TYPICAL FORWARD CHARACTERISTICS
Pulse Width=300μs
1% Duty Cycle
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405033 Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
A 1.4 0.055
B 1.2 0.047
C 3.1 0.122
MARKING DIAGRAM
D 1.9 0.075
E 4.3 0.169
1
10
1 10 100
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405033 Version: J14
RSFAL thru RSFML
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
