LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D - JUNE 1987 - REVISED SEPTEMBER 2003 D Low Power Drain . . . 900 W Typical With D D D D D D D D D LP211 . . . D PACKAGE LP311 . . . D, P, OR PS PACKAGE (TOP VIEW) 5-V Supply Operates From 15 V or From a Single Supply as Low as 3 V Output Drive Capability of 25 mA Emitter Output Can Swing Below Negative Supply Response Time . . . 1.2 s Typ Low Input Currents: Offset Current . . . 2 nA Typ Bias Current . . . 15 nA Typ Wide Common-Mode Input Range: -14.5 V to 13.5 V Using 15-V Supply Offset Balancing and Strobe Capability Same Pinout as LM211, LM311 Designed To Be Interchangeable With Industry-Standard LP311 EMIT OUT IN+ IN- VCC- 1 8 2 7 3 6 4 5 VCC+ COL OUT BAL/STRB BALANCE description/ordering information The LP211 and LP311 devices are low-power versions of the industry-standard LM211 and LM311 devices. They take advantage of stable, high-value, ion-implanted resistors to perform the same function as the LM311 series, with a 30:1 reduction in power consumption, but only a 6:1 slowdown in response time. They are well suited for battery-powered applications and all other applications where fast response times are not needed. They operate over a wide range of supply voltages, from 18 V down to a single 3-V supply with less than 300-A current drain, but are still capable of driving a 25-mA load. The LP211 and LP311 are quite easy to apply free of oscillation if ordinary precautions are taken to minimize stray coupling from the output to either input or to the trim pins. In addition, offset balancing is available to minimize input offset voltage. Strobe capability also is provided to turn off the output (regardless of the inputs) by pulling the strobe pin low. The LP211 is characterized for operation from -25C to 85C. The LP311 is characterized for operation from 0C to 70C. ORDERING INFORMATION TA VIO max AT 25C PACKAGE PDIP (P) -0C 0C to 70C 7 5 mV 7.5 SOIC (D) SOP (PS) -25C 25C to 85C 7 5 mV 7.5 SOIC (D) ORDERABLE PART NUMBER Tube of 50 LP311P Tube of 75 LP311D Reel of 2500 LP311DR Reel of 2000 LP311PSR Tube of 75 LP211D Reel of 2500 LP211DR TOP-SIDE MARKING LP311P LP311 L311 LP211 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright (c) 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D - JUNE 1987 - REVISED SEPTEMBER 2003 functional block diagram BALANCE BAL/STRB IN+ COL OUT IN- EMIT OUT absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage (see Note 1): VCC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V VCC- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -18 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Input voltage, VI (either input, see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V Voltage from emitter output to VCC- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Voltage from collector output to VCC- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V Voltage from collector output to emitter output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V Package thermal impedance, JA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC-. 2. Differential input voltages are at IN+ with respect to IN-. 3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage of 15 V, whichever is less. 4. The output may be shorted to ground or to either power supply. 5. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN 2 (|VCC| 15 V) Input voltage VCC+ - VCC- Supply voltage VCC- + 0.5 3.5 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MAX UNIT VCC+ - 1.5 V 30 V LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D - JUNE 1987 - REVISED SEPTEMBER 2003 electrical characteristics at specified free-air temperature, VCC = 15 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN 25C VID VOL Input offset voltage Low-level output voltage RS < 100 k, k See Note 7 VID < -10 10 mV, See Note 8 IOL = 25 mA, VCC = 4.5 V, VID < -10 10 mV, mV See Note 8 VCC- = 0, IOL = 1 1.6 6 mA mA, Input offset current IIB Input bias current See Note 7 MAX 2 7.5 Full range 10 25C 04 0.4 1 5 1.5 Full range 01 0.1 0 0.4 4 2 25 UNIT mV V 25C IIO TYP Full range 35 25C 15 Full range nA 100 150 nA Low level strobe current Low-level V(strobe) = 0.3 V, See Note 9 VID < -10 10 mV, IO(off) Output off-state current VID > 10 mV, VCE = 35 V AVD Large signal differential Large-signal differential-voltage voltage amplification RL = 5 k ICC+ Supply current from VCC+ VID = -50 mV, RL = Full range 150 300 A ICC- Supply current from VCC- VID = 50 mV, RL = Full range - 80 - 180 A 25C 100 300 A A 25C 0.2 100 nA 25C 40 100 V/mV All typical values are at VCC = 15 V, TA = 25C. NOTES: 7. The offset voltages and offset currents given are the maximum values required to drive the output within 1 V of either supply with a 1-mA load. Thus, these parameters define an error band and take into account the worst-case effects of voltage gain and input impedance. 8. Voltages are with respect to EMIT OUT and VCC- tied together. 9. The strobe should not be shorted to ground; it should be current driven at 100 A to 300 A. switching characteristics, VCC = 5 V, TA = 25C (unless otherwise noted) PARAMETER Response time TEST CONDITIONS TYP UNIT See Note 10 1.2 s NOTE 10: The response time is specified for a 100-mV input step with 5-mV overdrive. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 LP211, LP311 LOW-POWER DIFFERENTIAL COMPARATORS WITH STROBES SLCS003D - JUNE 1987 - REVISED SEPTEMBER 2003 TYPICAL APPLICATION CIRCUIT VCC+ 3 k BAL/STRB 3 k BALANCE TTL Strobe BAL/ STRB 2N2222 15 k NOTE: If offset balancing is not used, the BALANCE and BAL/STRB pins should be shorted together. NOTE: Do not connect strobe pin directly to ground, because the output is turned off whenever current is pulled from the strobe pin. Figure 2. Strobing Figure 1. Offset Balancing 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 7-Jun-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) LP211D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office LP211DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office LP211DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office LP211DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples LP211DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples LP211DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples LP211P OBSOLETE PDIP P 8 LP311D ACTIVE SOIC D 8 75 LP311DE4 ACTIVE SOIC D 8 LP311DG4 ACTIVE SOIC D LP311DR ACTIVE SOIC LP311DRE4 ACTIVE LP311DRG4 TBD Call TI Samples Not Available Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office LP311P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office LP311PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office LP311PWLE OBSOLETE TSSOP PW 8 TBD (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Call TI Call TI Call TI Samples Not Available PACKAGE OPTION ADDENDUM www.ti.com 7-Jun-2010 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP211DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LP311DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP211DR SOIC D 8 2500 340.5 338.1 20.6 LP311DR SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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