Advance Product Information This document contains information for a new product.
Cirrus Logic reserves the right to modify this product without notice.
Copyright © Cirrus Logic, Inc. 2006
(All Rights Reserved)
http://www.cirrus.com
CS5530
24-bit ADC with Ultra-low-noise Amplifier
Features & Description
Chopper-stabilized Instrumentation
Amplifier, 64X
• 12 nV/Hz @ 0.1 Hz (No 1/f noise)
• 500 pA Input Current
Digital Gain Scaling up to 40x
Delta-sigma Analog-to-digital Converter
• Linearity Error: 0.0015% FS
• Noise Free Resolution: Up to 19 bits
Scalable VREF Input: Up to Analog Supply
Simple Three-wire Serial Interface
• SPI™ and Microwire™ Compatible
• Schmitt-trigger on Serial Clock (SCLK)
Onboard Offset and Gain Calibration
Registers
Selectable Word Rates: 6.25 to 3,840 Sps
Selectable 50 or 60 Hz Rejection
Power Supply Configurations
• VA+ = +5 V; VA- = 0 V; VD+ = +3 V to +5 V
• VA+ = +2.5 V; VA- = -2.5 V; VD+ = +3 V to +5 V
• VA+ = +3 V; VA- = -3 V; VD+ = +3 V
General Description
The CS5530 is a highly integrated ∆Σ Analog-to-Digital
Converter (ADC) which uses charge-balance techniqu es
to achieve 24-bit performance . The ADC is optimized for
measuring low-level unipolar or bipolar signals in weigh
scale, process control, scientific, and medical
applications.
To accommodate these applications, the ADC
includes
a very-low-noise, chopper-stabilized instrumentation
amplifier (12 nV/Hz @ 0.1 Hz) with a gain of 64X. This
device also includes a fourth-order ∆Σ modulator fol-
lowed by a digital filter
which provides twenty selectable
output word rates of 6.25, 7.5, 12.5, 15, 25, 30, 50, 60, 100,
120, 200, 240, 400, 480, 800, 960, 1600, 1920, 3200 , and
3840 Sps (MCLK = 4.9152 MHz).
To ease communication between the ADC and a micro-
controller, the converter includ es a simple three-wire se-
rial interface which is SPI and Microwire compatible with
a Schmitt-trigger input on the serial clock (SCLK).
High dynamic range, programmable output rates, and
flexible power supply options make this device an ideal
solution for weigh scale and process control
applications.
ORDERING INFORMATION
See page 35.
VA+ C1 C2 VREF+ VREF- VD+
DIFFERENTIAL
4
TH
ORDER
∆Σ
MODULATOR
PROGRAMMABLE
SINC FIR FILTER
AIN1+
AIN1- SERIAL
INTERFACE
LATCH CLOCK
GENERATOR CALIBRATION
SRAM/CONTROL
LOGIC
DGND
CS
SDI
SDO
SCLK
OSC2OSC1A1A0VA-
64X
OCT ‘06
DS742A1
CS5530
2DS742A1
TABLE OF CONTENTS
1. CHARACTERISTICS AND SPECIFICATIONS .................................................................4
ANALOG CHARACTERISTICS................................................................................4
TYPICAL NOISE-FREE RESOLUTION (BITS), CS5530-CS................................... 6
5 V DIGITAL CHARACTERISTICS ..........................................................................7
3 V DIGITAL CHARACTERISTICS ..........................................................................7
DYNAMIC CHARACTERISTICS..............................................................................8
ABSOLUTE MAXIMUM RATINGS...........................................................................8
SWITCHING CHARACTERISTICS..........................................................................9
2. GENERAL DESCRIPTION .............................................................................................. 11
2.1. Analog Input ........................................................................................................... 11
2.1.1. Analog Input Span .......................................................................................... 12
2.1.2. Voltage Noise Density Performance ........................................................... 12
2.1.3. No Offset DAC ............................................................................................12
2.2. Overview of ADC Register Structure and Operating Modes .................................. 12
2.2.1. System Initialization ....................................................................................12
2.2.2. Command Register Descriptions ................................................................14
2.2.3. Serial Port Interface ....................................................................................16
2.2.4. Reading/Writing On-Chip Registers ............................................................17
2.3. Configuration Register ...........................................................................................17
2.3.1. Power Consumption ................................................................................... 17
2.3.2. System Reset Sequence ............................................................................17
2.3.3. Input Short ..................................................................................................17
2.3.4. Voltage Reference Select ..........................................................................17
2.3.5. Output Latch Pins .......................................................................................18
2.3.6. Filter Rate Select ........................................................................................18
2.3.7. Word Rate Select ........................................................................................ 18
2.3.8. Unipolar/Bipolar Select ...............................................................................18
2.3.9. Open Circuit Detect .................................................................................... 18
2.3.10. Configuration Register Description ...........................................................19
2.4. Calibration ..............................................................................................................21
2.4.1. Calibration Registers ..................................................................................21
2.4.2. Gain Register .............................................................................................21
2.4.3. Offset Register ...........................................................................................21
2.4.4. Performing Calibrations ..............................................................................22
2.4.5. System Calibration ...................................................................................... 22
2.4.6. Calibration Tips ...........................................................................................22
2.4.7. Limitations in Calibration Range .................................................................23
2.5. Performing Conversions ........................................................................................23
2.5.1. Single Conversion Mode ............................................................................. 23
2.5.2. Continuous Conversion Mode ....................................................................24
2.6. Using Multiple ADCs Synchronously .....................................................................25
2.7. Conversion Output Coding .................................................................................... 25
2.7.1. Conversion Data Output Descriptions ........................................................26
2.8. Digital Filter ............................................................................................................27
2.9. Clock Generator .....................................................................................................28
2.10. Power Supply Arrangements .................................................................................28
2.11. Getting Started ....................................................................................................... 31
2.12. PCB Layout ............................................................................................................31
3. PIN DESCRIPTIONS ...................................................................................................... 32
Clock Generator ......................................................................................................32
Control Pins and Serial Data I/O .............................................................................32
Measurement and Reference Inputs ......................................................................33
Power Supply Connections .....................................................................................33
4. SPECIFICATION DEFINITIONS ..................................................................................... 33
5. PACKAGE DRAWINGS .................................................................................................. 34
6. ORDERING INFORMATION .......................................................................................... 35
7. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION .................... 35
CS5530
DS742A1 3
LIST OF FIGURES
Figure 1. SDI Write Timing (Not to Scale)...............................................................................10
Figure 2. SDO Read Timing (Not to Scale).............................................................................10
Figure 3. Front End Configuration...........................................................................................11
Figure 4. Input Model for AIN+ and AIN- Pins.........................................................................11
Figure 5. Measured Voltage Noise Densit y......... .... ... ... ... .... ... ... .............................................12
Figure 5. Measured Voltage Noise Densit y......... .... ... ... ... .... ... ... .............................................12
Figure 6. CS5530 Register Diagram.......................................................................................13
Figure 7. Command and Data Word Timing ...........................................................................16
Figure 8. Input Reference Model when VRS = 1 ....................................................................18
Figure 9. Input Reference Model when VRS = 0 ....................................................................18
Figure 10. System Calibration of Offset..................................................................................22
Figure 11. System Calibration of Gain....................................................................................22
Figure 12. Synchronizing Multiple ADCs.................................................................................25
Figure 13. Digital Filter Response (Word Rate = 60 Sps).......................................................27
Figure 14. 120 Sps Filter Magnitude Plot to 120 Hz ...............................................................27
Figure 15. 120 Sps Filter Phase Plot to 120 Hz......................................................................27
Figure 16. Z-Transforms of Digital Filters................................................................................27
Figure 17. On-chip Oscillator Model........................................................................................28
Figure 18. CS5530 Configured with a Single +5 V Supply ........ ... .... ... ... ... ... .... ... ... ... .... ... ... ...29
Figure 19. CS5530 Configured with ±2.5 V Analog Supplies..................................................29
Figure 20. CS5530 Configured with ±3 V Analog Supplies.....................................................30
LIST OF TABLES
Table 1. Conversion Timing for Single Mode..........................................................................24
Table 2. Conversion Timing for Continuous Mode..................................................................24
Table 3. Output Coding...........................................................................................................25
CS5530
4DS742A1
1. CHARACTERISTICS AND SPECIFICATIONS
ANALOG CHARACTERISTICS
(VA+, VD+ = 5 V ±5%; VREF+ = 5 V; VA-, VREF-, DGND = 0 V; MCLK = 4.9152 MHz;
OWR (Output Word Rate) = 60 Sps; Bipolar Mode)
(See Notes 1 and 2.)
Notes: 1. Applies after system calibration at any temperature within 0 °C to +70 °C.
2. Specifications guaranteed by design, characterization, and/or test. LSB is 24 bits.
3. This specification applies to the device only and doe s not include any effects by external parasitic
thermocouples.
4. Drift over specified tempera ture range after calibration at power-up at 25 °C.
Parameter CS5530-CS UnitMin Typ Max
Accuracy
Linearity Error - ±0.0015 ±0.003 %FS
No Missing Codes 24 - - Bits
Bipolar Offset - ±16 ±32 LSB24
Unipolar Offset - ±32 ±64 LSB24
Offset Drift (Notes 3 and 4) - 10 - nV/°C
Bipolar full-scale Error - ±8±31 ppm
Unipolar full-scale Error - ±16 ±62 ppm
full-scale Drift (Note 4) - 2 - ppm/°C
CS5530
DS742A1 5
ANALOG CHARACTERISTICS (Continued)
(See Notes 1 and 2.)
Notes: 5. See the section of the data sheet which discusses input models.
6. Input current on VREF+ or VREF- may increase to 250 nA if operated within 50 mV of VA+ or VA-. This
is due to the rough charge buffer being saturated under these conditions.
Parameter Min Typ Max Unit
Analog Input
Common Mode + Signal on AIN+ or AIN- Bipolar/Unipolar Mode (VA-) + 1.6 - (VA+) - 1.6 V
CVF Current on AIN+ or AIN- - 1200 - pA
Input Current Noise - 0.4 - pA/Hz
Open Circuit Detect Current 100 300 - nA
Common Mode Rejection DC
50, 60 Hz -
-130
120 -
-dB
dB
Input Capacitance - 10 - pF
Voltage Reference Input
Range (VREF+) - (VREF-) 1 2.5 (VA+)-(VA-) V
CVF Current (Note 5, 6) - 50 - nA
Common Mode Rejection DC
50, 60 Hz -
-120
120 -
-dB
dB
Input Capacitance 11 - 22 pF
System Calibration Specifications
Full-scale Calibration Range Bipolar/Unipolar Mode 3 - 110 %FS
Offset Calibration Range Bipolar Mode -100 - 100 %FS
Offset Calibration Range Unipolar Mode -90 - 90 %FS
CS5530
6DS742A1
ANALOG CHARACTERISTICS (Continued)
(See Notes 1 and 2.)
7. All outputs un loaded. All input CMOS levels.
8. Tested with 100 mV change on VA+ or VA-.
TYPICAL NOISE-FREE RESOLUTION (BITS), CS5530-CS (See Notes 9 and 10)
9. Noise Free Resolution listed is for Bipolar operation, and is calculat ed as LOG((Input Sp an)/(6.6xRMS
Noise))/LOG(2) rounded to the nearest bit. For Unipolar operation, the input span is 1/2 as large, so one
bit is lost. The input span is calculated in the analog input span section of the data she et . Th e No ise
Free Resolution table is computed with a value of 1.0 in the gain register. Values other than 1.0 will
scale the noise, and change the Noise Free Resolution accordingly.
10. “Noise Free Resolution” is no t the same as “Effective Resolution”. Effective Resolution is based on the
RMS noise value, while Noise Free Resolution is based on a pe ak-to-peak noise value sp ecified as 6.6
times the RMS noise value. Effective Resolution is calculated as LOG((Input Span)/(RMS
Noise))/LOG(2).
Specifications are subject to change without notice.
Parameter
CS5530-CS
Min Typ Max Unit
Power Supplies
DC Power Supply Currents (Normal Mode) IA+, IA-
ID+
-
-
7
0.5 9
1mA
mA
Power Consum pt ion Normal Mode (Note 7)
Standby
Sleep
-
-
-
40
5
500
50
-
-
mW
mW
µW
Power Supply Rejection (Note 8)
DC Positive Supplies
DC Negative Supply -
-115
115 -
-dB
dB
Output Word Rate (Sps) -3 dB Filter Frequency (Hz) Noise-free Bits Noise (nVrms)
7.5 1.94 19 17
15 3.88 19 24
30 7.75 18 34
60 15.5 18 48
120 31 17 68
240 62 16 115
480 122 16 163
960 230 15 229
1,920 390 15 344
3,840 780 13 1390
CS5530
DS742A1 7
5 V DIGITAL CHARACTERISTICS
(VA+, VD+ = 5 V ±5%; VA-, DGND = 0 V; See Notes 2 and 11.)
3 V DIGITAL CHARACTERISTICS
(TA = 25 °C; VA+ = 5V ±5%; VD+ = 3.0V±10%; VA-, DGND = 0V; See Notes 2 and 11.)
11. All measurements performed under static conditions.
Parameter Symbol Min Typ Max Unit
High-Level Input Voltage All Pins Except SCLK
SCLK VIH 0.6 VD+
(VD+) - 0.45 -
-VD+
VD+ V
Low-Level Input Voltage All Pins Except SCLK
SCLK VIL 0.0
0.0 -0.8
0.6 V
High-Level Output Voltage A0 and A1, Iout = -1.0 mA
SDO, Iout = -5.0 mA VOH (VA+) - 1.0
(VD+) - 1.0 --V
Low-Level Output Voltage A0 and A1, Iout = 1.0 mA
SDO, Iout = 5.0 mA VOL - - (VA-) + 0.4
0.4 V
Input Leakage Current Iin 1±10µA
SDO 3-State Leakage Current IOZ --±10µA
Digital Output Pin Capacitance Cout -9-pF
Parameter Symbol Min Typ Max Unit
High-Level Input Voltage All Pins Except SCLK
SCLK VIH 0.6 VD+
(VD+) - 0.45 -VD+
VD+ V
Low-Level Input Voltage All Pins Except SCLK
SCLK VIL 0.0
0.0 -0.8
0.6 V
High-Level Output Voltage A0 and A1, Iout = -1.0 mA
SDO, Iout = -5.0 mA VOH (VA+) - 1.0
(VD+) - 1.0 --V
Low-Level Output Voltage A0 and A1, Iout = 1.0 mA
SDO, Iout = 5.0 mA VOL - - (VA-) + 0.4
0.4 V
Input Leakage Current Iin 1±10µA
SDO 3-State Leakage Current IOZ --±10µA
Digital Output Pin Capacitance Cout -9-pF
CS5530
8DS742A1
DYNAMIC CHARACTERISTICS
12. The ADCs use a Sinc5 filter for the 3200 Sps and 3840 Sps output word rate (OWR) an d a Sinc5 filter
followed by a Sinc3 filter for the other OWRs. OWRsinc5 refers to the 3200 Sps (FRS = 1) or 3840 Sps
(FRS = 0) word rate associated with the Sinc5 filter.
13. The single conversion mode only outpu ts fully settle d conversions. See Table 1 for more d etails about
single conversion mode timing. OWRSC is used here to designate the different conversion time
associated with single conversions.
14. The continuous conversion mode outputs every conversion. Th is means that the filt er’s settling time
with a full-scale step input in the continuous conversion mode is dictated by the OWR.
ABSOLUTE MAXIMUM RATINGS
(DGND = 0 V; See Note 15.)
Notes: 15. All voltages with respect to ground.
16. VA+ and VA- must satisfy {(VA+) - (VA-)} +6.6 V.
17. VD+ and VA- must sa tisfy {(VD+) - (VA-)} +7.5 V.
18. Applies to all pins including continuous overvoltage conditions at the analog input (AIN) pins.
19. Transient current of up to 100 mA will not cause SCR latch-up. Maximum input current for a power
supply pin is ±50 mA.
20. Total power dissip ation, including all input currents and output currents.
WARNING: Operation at or beyond these limits may result in permanent damage to the dev ice.
Normal operation is not guaranteed at these extremes.
Parameter Symbol Ratio Unit
Modulator Sampling Rate fsMCLK/16 Sps
Filter Settling Time to 1/2 LSB (full-scale Step Input)
Single Conversion mode (Notes 12, 13, and 14)
Continuous Conversion mode, OW R < 320 0 Sps
Continuous Co nv er sion mo de, OWR 3200 Sps
ts
ts
ts
1/OWRSC
5/OWRsinc5 + 3/OWR
5/OWR
s
s
s
Parameter Symbol Min Typ Max Unit
DC Power Supplies (Notes 16 and 17)
Positive Digital
Positive Analog
Negative Analog
VD+
VA+
VA-
-0.3
-0.3
+0.3
-
-
-
+6.0
+6.0
-3.75
V
V
V
Input Current, Any Pin Except Supplies (Notes 18 and 19) IIN --±10mA
Output Current IOUT --±25mA
Power Dissipation (Note 20) PDN - - 500 mW
Analog Input Voltage VREF pins
AIN Pins VINR
VINA
(VA-) -0.3
(VA-) -0.3 -
-(VA+) + 0.3
(VA+) + 0.3 V
V
Digital Input Voltage VIND -0.3 - (VD+) + 0.3 V
Ambient Operating Temperature TA0-70°C
Storage Temperature Tstg -65 - 150 °C
CS5530
DS742A1 9
SWITCHING CHARACTERISTICS
(VA+ = 2.5 V or 5 V ±5%; VA- = -2.5V±5% or 0 V; VD+ = 3.0 V ±10% or 5 V ±5%;DGND = 0 V; Levels: Logic 0 = 0
V, Logic 1 = VD+; CL = 50 pF; See Figures 1 and 2.)
Notes: 21. Device parameters are specified with a 4.9152 MHz clock.
22. Specified using 10% and 90% points on wavefo rm of interest. Output loaded with 50 pF.
23. Oscillator start-up time varies with crystal parameters. This specification does not apply when using an
external clock source.
Parameter Symbol Min Typ Max Unit
Master Clock Frequency (Note 21)
External Clock or Crystal Oscillator MCLK 1 4.9152 5 MHz
Master Clock Duty Cycle 40 - 60 %
Rise Times (Note 22)
Any Digital Inpu t Except SCLK
SCLK
Any Digital Output
trise -
-
-
-
-
50
1.0
100
-
µs
µs
ns
Fall Times (Note 22)
Any Digital Inpu t Except SCLK
SCLK
Any Digital Output
tfall -
-
-
-
-
50
1.0
100
-
µs
µs
ns
Start-up
Oscillator Start-up Time XTAL = 4.9152 MHz (Note 23) tost -20-ms
Serial Port Timing
Serial Clock Frequency SCLK 0 - 2 MHz
Serial Clock Pulse Width High
Pulse Width Low t1
t2
250
250 -
--
-ns
ns
SDI Write Timing
CS Enable to Valid Latch Clock t350 - - ns
Data Set-up Time prior to SCLK rising t450 - - ns
Data Hold Time After SCLK Rising t5100 - - ns
SCLK Falling Prior to CS Disable t6100 - - ns
SDO Read Timing
CS to Data Valid t7--150ns
SCLK Falling to New Data Bit t8--150ns
CS Rising to SDO Hi-Z t9--150ns
CS5530
10 DS742A1
CS
SCLK
MSB
MSB-1
LSB
SDI
t3
t6t4 t5 t1
t2
Figure 1. SDI Write Timing (Not to Scale)
CS
SCLK
MSB MSB-1
LSB
SDO
t7
t9
t8
t1
t2
Figure 2. SDO Read Timing (Not to Scale)
CS5530
DS742A1 11
2. GENERAL DESCRIPTION
The CS5530 is a ∆Σ Analog-to-Digital Converter
(ADC) which uses charge-balance techniques to
achieve 24-bit performance. The ADC is optimized
for measuring low-level unipolar or bipolar signals
in weigh scale, process control, scientific, and med-
ical applications.
To accommodate these applications, the ADC
in-
cludes a very-low-noise, chopper-stabilized instru-
mentation amplifier (12 nV/Hz @ 0.1 Hz) with a
gain of 64X. This ADC also includes a fourth-order
∆Σ modulator followed by a digital filter
which pro-
vides twenty selectable output word rates of 6.25,
7.5, 12.5, 15, 25, 30, 50, 60, 100, 120, 200, 240, 400,
480, 800, 960, 1600, 1920, 3200, and 3840 samples
per second (MCLK = 4.9152 MHz).
To ease communication between the ADCs and a
micro-controller, the converters include a simple
three-wire serial interface which is SPI and Mi-
crowire compatible with a Schmitt-trigger input on
the serial clock (SCLK).
2.1 Analog Input
Figure 3 illustrates a block diagram of the CS5530.
The front end includes a chopper-stabilized instru-
mentation amplifier with a gain of 64X.
The amplifier is chopper-stabilized and operates
with a chop clock frequency of MCLK/128. The
CVF (sampling) current into the instrumentation
amplifier is typically 1200 pA over 0°C to +70°C
(MCLK=4.9152 MHz). The common-mode plus
signal range of the instrumentation amplifier is
(VA-) + 1.6 V to (VA+) - 1.6 V.
Figure 4 illustrates the input model for the 64X am-
plifier.
Note: The C = 14pF capacitor is for input current
modeling only. For physical input capacitance
see ‘Input Capacitance’ specification under
Analog Characteristics.
VREF+
Sinc
Digital
Filter
64x
AIN+
AIN-
X1
VREF-
X1
Differential
4 Order
∆Σ
Modulator
th 5Programmable
Sinc
D ig ita l F ilte r
3Serial
Port
1000
1000
22 nF C1 PIN
C2 PIN
Figure 3. Front End Configuration
AIN
C = 14 pF
φ Coarse
1
φ Fine
1
V 12 mV
i = fV C
os osn
f = MCLK
16
Figure 4. Input Model for AIN+ and AIN- Pins
CS5530
12 DS742A1
2.1.1 Analog Input Span
The full-scale input signal that the converter can dig-
itize is a function of the reference voltage connected
between the VREF+ and VREF- pins. The full-scale
input span of the converter is
((VREF+) (VREF-))/(64Y), where 64 is the gain
of the amplifier and Y is 2 for VRS = 0, or Y is 1 for
VRS = 1. VRS is the Voltage Reference Select bit,
and must be set according to the differential voltage
applied to the VREF+ and VREF- pins on the part.
See section 2.3.4 for more details.
With a 2.5 V reference, the full-scale biploar input
range is equal to ±2.5/64, or about ±39 mV. Note
that these input ranges assume the calibration regis-
ters are set to their default values (i.e. Gain = 1.0 and
Offset = 0.0). The gain setting in the Gain Register
can be altered to map the digital codes of the con-
verter to set full scales from 1 mV to 40 mV.
2.1.2 Voltage Noise Density Performance
Figure 5 illustrates the measured voltage noise den-
sity versus frequency from 0.1 Hz to 10 Hz. The de-
vice was powered with ±2.5 V supplies, using
120 Sps OWR, bipolar mode, and with the input
short bit enabled.
2.1.3 No Offset DAC
An offset DAC was not included in the CS5530 be-
cause the high dynamic range of the converter
eliminates the need for one. The offset register can
be manipulated by the user to mimic the function of
a DAC if desired.
2.2 Overview of ADC Register Structure
and Operating Modes
The CS5530 ADC has an on-chip controller, which
includes a number of user-accessible registers. The
registers are used to hold offset and gain calibration
results, configure the chip's operating modes, hold
conversion instructions, and to store conversion
data words. Figure 6 depicts a block diagram of the
on-chip controller’s internal registers.
The converter has 32-bit registers to function as the
offset and the gain calibration registers. These reg-
isters hold calibration results. The contents of thes e
registers can be read or written by the user. This al-
lows calibration data to be off-loaded into an exter-
nal EEPROM. The user can also manipulate the
contents of these registers to modify the offset or
the gain slope of the converter.
The converter includes a 32-bit configuration reg-
ister which is used for setting options such as the
power down modes, resetting the converter, short-
ing the analog input, enabling logic outputs, and
other user options.
The following pages document how to initialize the
converter and perform offset and gain calibrations.
Each of the bits of the configuration register is de-
scribed. Also the Command Register Quick Refer-
ence can be used to decode all valid commands (the
first 8-bits into the serial port).
2.2.1 System Initialization
The CS5530 provide no power-on-reset function.
To initialize the ADC, the user must perform a soft-
ware reset via the configuration register. Before
accessing the configuration register, the user must
insure serial port synchronization by using the Se-
rial Port Initialization sequence. This sequence re-
sets the serial port to the command mode and is
accomplished by transmitting at least 15 SYNC1
command bytes (0xFF hexadecimal), followed by
one SYNC0 command (0xFE hexadecimal). Note
that this sequence can be initiated at anytime to
reinitialize the serial port. To complete the system
1.0
10.0
100.0
0.1 1 10
Frequency (Hz)
nV/Hz
Figure 5. Measured Voltage Noise Density
CS5530
DS742A1 13
initialization sequence, the user must also perform
a system reset sequence which is as follows: Write
a logic 1 into the RS bit of the configuration regis-
ter. This will reset the calibration registers and
other logic (but not the serial port). A valid reset
will set the RV bit in the configuration register to a
logic 1. After writing the RS bit to a logic 1, wait
8 master clock cycles, then write the RS b it back to
logic 0. Note that the other bits in the configura-
tion register cannot be written on this write cycle
as they are being held in reset until RS is set back
to logic 0. While this involves writing an entire
word into the configuration register to casue the
RS bit to go to logic 0, the RV bit is a read only bit,
therefore a write to the configuration register will
not overwrite the RV bit. After clearing the RS bit
back to logic 0, read the configuration register to
check the state of the RV bit as this indicates that a
valid reset occurred. Reading the configuration
register clears the RV bit back to logic 0.
Completing the reset cycle initializes the on-chip
registers to the following states:
After the configuration register has been read to
clear the RV bit, the register can then be written to
set the other function bits or other registers can be
written or read.
Once the system initialization or reset is complet-
ed, the on-chip controller is initialized into com-
mand mode where it waits for a valid command
(the first 8-bits written into the serial port are shift-
ed into the command register). Once a valid com-
mand is received and decoded, the byte instructs
the converter to either acquire data from or transfer
data to an internal register, or perform a conversion
or a calibration. The Command Register Descrip-
tions section lists all valid commands.
Offset (1 x 32)
Offset Register (1 x 32)
Conversion Data
Register (1 x 32)
Configuration Register (1 x 32)
Power Save Select
Reset System
Input Short
Voltage Reference Select
Output Latch
CS
SDI
SDO
SCLK
Read Only
Command
Register (1 × 8)
Write Only
Serial
Interface
Data (1 x 32)
Filter Rate Select
Word Rate
Unipolar/Bipolar
Open Circuit Detect
Gain (1 x 32)
Gain Register (1 x 32)
Figure 6. CS5530 Register Diagram
Configuration Register: 00000000(H)
Offset Register: 00000000(H)
Gain Register 01000000(H)
CS5530
14 DS742A1
2.2.2 Command Register Descriptions
READ/WRITE OFFSET REGISTER
R/W (Read/Write)
0 Write offset register.
1 Read offset register.
READ/WRITE GAIN REGISTER
R/W (Read/Write)
0 Write gain register.
1 Read gain register.
READ/WRITE CONFIGURATION REGISTER
Function: These commands are used to read from or write to the configuration register.
R/W (Read/Write)
0 Write configuration register.
1 Read configuration register.
PERFORM CONVERSION
MC (Multiple Conversions)
0 Perform a single conversion.
1 Perform continuous conversions.
PERFORM SYSTEM OFFSET CALIBRATION
PERFORM SYSTEM GAIN CALIBRATION
SYNC1
Function: Part of the serial port re-initialization sequence.
D7(MSB) D6 D5 D4 D3 D2 D1 D0
0000R/W001
D7(MSB) D6 D5 D4 D3 D2 D1 D0
0000R/W010
D7(MSB) D6 D5 D4 D3 D2 D1 D0
0000R/W
011
D7(MSB) D6 D5 D4 D3 D2 D1 D0
1MC000000
D7(MSB) D6 D5 D4 D3 D2 D1 D0
10000101
D7(MSB) D6 D5 D4 D3 D2 D1 D0
10000110
D7(MSB) D6 D5 D4 D3 D2 D1 D0
11111111
CS5530
DS742A1 15
SYNC0
Function: End of the serial port re-initialization sequence.
NULL
Function: This command is used to clear a port flag and keep the converter in the continuous conversion mode.
D7(MSB) D6 D5 D4 D3 D2 D1 D0
11111110
D7(MSB) D6 D5 D4 D3 D2 D1 D0
00000000
CS5530
16 DS742A1
2.2.3 Serial Port Interface
The CS5530’s serial interface consists of four con-
trol lines: CS, SDI, SDO, SCLK. Figure 7 details
the command and data word timing.
CS, Chip Select, is the control line which enables
access to the serial port. If the CS pin is tied low,
the port can function as a three wire interface.
SDI, Serial Data In, is the data signal used to trans-
fer data to the converters.
SDO, Serial Data Out, is the data signal used to
transfer output data from the converters. The SDO
output will be held at high impedance any time CS
is at logic 1.
SCLK, Serial Clock, is the serial bit-clock which
controls the shifting of data to or from the ADC’s
serial port. The CS pin must be held low (logic 0)
before SCLK transitions can be recognized by the
port logic. To accommodate optoisolators SCLK is
designed with a Schmitt-trigger input to allow an
optoisolator with slower rise and fall times to di-
rectly drive the pin. Additionally, SDO is capable
of sinking or sourcing up to 5 mA to directly drive
an optoisolator LED. SDO will have less than a 400
mV loss in the drive voltage when sinking or sourc-
ing 5 mA.
Command Time
8SCLKs Data Time 32 SCLKs
Write Cycle
CS
SCLK
SDI
MSB
Command Time
8SCLKs
CS
SCLK
SDI
Read Cycle
SDO
MSB LSB
Command Time
8SCLKs
8 SCLKs Clear SDO Flag
SDO
SCLK
SDI
MSB LSB
Clock Cycles
t*
d
CS
Data Time 32 SCLKs
Data Time 32 SCLKs
LSB
Data Conversion Cycle
/OWR
MCLK
* td is the time it ta kes th e A DC to p e r form a conversi on. Se e the Si n g le
Conversion and Continuous Conversion sections of the data sheet for more
details about conversion timing.
Figure 7. Command and Data Word Timing
CS5530
DS742A1 17
2.2.4 Reading/Writing On-Chip Registers
The CS5530’s offset, gain, and configuration regis-
ters are readable and writable while the conversion
data register is read only.
As shown in Figure 7, to write to a particular regis-
ter the user must transmit the appropriate write
command and then follow that command by 32 bits
of data. For example, to write 0x80000000 (hexa-
decimal) to the gain register, the user would first
transmit the command byte 0x02 (hexadecimal)
followed by the data 0x80000000 (hexadecimal).
Similarly, to read a particular register the user must
transmit the appropriate read command and then
acquire the 32 bits of data. Once a register is written
to or read from, the serial port returns to the com-
mand mode.
2.3 Configuration Register
To ease the architectural design and simplify the
serial interface, the configuration register is thirty-
two bits long, however, only fifteen of the thirty
two bits are used. The following sections detail the
bits in the configuration register.
2.3.1 Power Consumption
The CS5530 accommodates three power consump-
tion modes: normal, standby, and sleep. The default
mode, “normal mode”, is entered after power is ap-
plied. In this mode, the CS5530 typically consumes
35 mW. The other two modes are referred to as the
power save modes. They power down most of the
analog portion of the chip and stop filter convolu-
tions. The power save modes are entered whenever
the power down (PDW) bit of the configuration
register is set to logic 1. The particular power save
mode entered depends on state of the PSS (Power
Save Select) bit. If PSS is logic 0, the converter en-
ters the standby mode reducing the power con-
sumption to 4 mW. The standby mode leaves the
oscillator and the on-chip bias generator for the an-
alog portion of the chip active. This allows the con-
verter to quickly return to the normal mode once
PDW is set back to a logic 0. If PSS and PDW are
both set to logic 1, the sleep mode is entered reduc-
ing the consumed power to around 500 µW. Since
this sleep mode disables the oscillator, approxi-
mately a 20 ms oscillator start-up delay period is
required before returning to the normal mode. If an
external clock is used, there will be no delay.
2.3.2 System Reset Sequence
The reset system (RS) bit permits the user to per-
form a system reset. A system reset can be initiated
at any time by writing a logic 1 to the RS bit in the
configuration register. After the RS bit has been
set, the internal logic of the chip will be initialized
to a reset state. The reset valid (RV) bit is set indi-
cating that the internal logic was properly reset.
The RV bit is cleared after the configuration regis-
ter is read. The on-chip registers are initialized to
the following default states:
After reset, the RS bit should be written back to
logic 0 to complete the reset cycle. The ADC will
return to the command mode where it waits for a
valid command. Also, the RS bit is the only bit in
the configuration register that can be set when ini-
tiating a reset (i.e. a second write command is need-
ed to set other bits in the Configuration Register
after the RS bit has been cleared).
2.3.3 Input Short
The input short bit allows the user to internally
ground the inputs of the ADC. This is a useful func-
tion because it allows the user to easily test the
grounded input performance of the ADC and elim-
inate the noise effects due to the external system
components.
2.3.4 Voltage Reference Select
The voltage reference select (VRS) bit selects the
size of the sampling capacitor used to sample the
voltage reference. The bit should be set based upon
Configuration Register: 00000000(H)
Offset Register: 00000000(H)
Gain Register 01000000(H)
CS5530
18 DS742A1
the magnitude of the reference voltage to achieve
optimal performance. Figures 8 and 9 model the ef-
fects on the reference’s input impedance and input
current for each VRS setting. As the models show,
the reference includes a coarse/fine charge buffer
which reduces the dynamic current demand of the
external reference.
The reference’s input buffer is designed to accom-
modate rail-to-rail (common-mode plus signal) in-
put voltages. The differential voltage between the
VREF+ and VREF- can be any voltage from 1.0 V
up to the analog supply (depending on how VRS is
configured), however, the VREF+ cannot go above
VA+ and the VREF- pin can not go below VA-.
Note that the power supplies to the chip should be
established before the reference voltage.
2.3.5 Output Latch Pins
The A1-A0 pins of the ADC mimic the D24-D23
bits of the configuration register. A1-A0 can be
used to control external multiplexers and other log-
ic functions outside the converter. The A1-A0 out-
puts can sink or source at least 1 mA, but it is
recommended to limit drive currents to less than
20 µA to reduce self-heating of the chip. These out-
puts are powered from VA+ and VA-. Their output
voltage will be limited to the VA+ voltage for a
logic 1 and VA- for a logic 0. Note that if the latch
bits are used to modify the analog input signal the
user should delay performing a conversion until he
knows the effects of the A0/A1 bits are fully set-
tled.
2.3.6 Filter Rate Select
The Filter Rate Select bit (FRS) modifies the output
word rates of the converter to allow either 50 Hz or
60 Hz rejection when operating from a 4.9152
MHz crystal. If FRS is cleared to logic 0, the word
rates and corresponding filter characteristics can be
selected using the Configuration Register. Rates
can be 7.5, 15, 30, 60, 120, 240, 480, 960, 1920, or
3840 Sps when using a 4.9152 MHz clock. If FRS
is set to logic 1, the word rates and corresponding
filter characteristics scale by a factor of 5/6, mak-
ing the selectable word rates 6.25, 12.5, 25, 50,
100, 200, 400, 800, 1600, and 3200 Sps when using
a 4.9152 MHz clock. When using other clock fre-
quencies, these selectable word rates will scale lin-
early with the clock frequency that is used.
2.3.7 Word Rate Select
The Word Rate Select bits (WR3-WR0) allow slec-
tion of the output word rate of the converter as de-
picted in the Configuration Register Descriptions.
The word rate chosen by the WR3-WR0 bits is
modified by the setting of the FRS bit as presented
in the previous paragraph.
2.3.8 Unipolar/Bipolar Select
The UP/BP Select bit sets the converter to measure
either a unipolar or bipolar input span.
2.3.9 Open Circuit Detect
When the OCD bit is set it activates a current
source as a means to test for open thermocouples.
VREF
C=14pF
f=
2
φFine
1
V8mV
i=fV C
os
os
n
φCoarse
MCLK
16
VRS = 1; 1 V V 2.5 V
REF
Figure 8. Input Reference Model when VRS = 1
VREF
C= 7pF
f=
2
φFine
1
V16 mV
i=fV C
os
osn
φCoarse
MCLK
16
VRS = 0; 2.5 V < V VA+
REF
Figure 9. Input Reference Model when VRS = 0
CS5530
DS742A1 19
2.3.10 Configuration Register Description
PSS (Power Save Select)[31]
0 Standby Mode (Oscillato r active, allows quick power-up).
1 Sleep Mode (Oscillator inactive).
PDW (Power Down Mode)[30]
0 Normal Mode
1 Activat e th e p ow e r save select mode.
RS (Reset System)[29]
0 Normal Operation.
1 Activate a Reset cycle. See System Reset Sequence in the datasheet text.
RV (Reset Valid)[28]
0 Normal Operation
1 System was reset. This bit is read only. Bit is cleared to logic zero after the configuration register is read.
IS (Input Short)[27]
0 Normal Input
1 All signal input pairs for each channel are disconnected from the pins and shorted internally.
NU (Not Used)[26]
0 Must always be logic 0. Reserved for future upgrades.
VRS (Voltage Reference Select)[25]
0 2.5 V < VREF [(VA+) - (VA-)]
11 V VREF 2.5V
A1-A0 (Output Latch bits)[24:23]
The latch bits (A1 and A0) will be set to the logic state of these bits when the Configuration register is written.
Note that these logic outputs are powered from VA+ and VA-.
00 A1 = 0, A0 = 0
01 A1 = 0, A0 = 1
10 A1 = 1, A0 = 0
11 A1 = 1, A0 = 1
NU (Not Used)[22:20]
0 Must always be logic 0. Reserved for future upgrades.
Filter Rate Select, FRS[19]
0 Use the default outp ut word rates.
1 Scale all output word rates and their corresponding filter characteristics by a factor of 5/6.
NU (Not Used)[18:15]
0 Must always be logic 0. Reserved for future upgrades.
D31(MSB) D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
PSS PDW RS RV IS NU VRS A1 A0 NU NU NU FRS NU NU NU
D15 D14D13D12D11D10D9D8D7D6D5D4D3D2D1D0
NU WR3 WR2 WR1 WR0 UP/BP OCDNUNUNUNUNUNUNUNUNU
CS5530
20 DS742A1
WR3-WR0 (Word Rate) [14:11]
The listed Word Rates are for continuous conversion mode using a 4.9152 MHz clock. All word rates will
scale linearly with the clock frequency used. The very first conversion using continuous conversion mode
will last longer, as will conversions done with the single conversion mode. See the section on Performing
Conversions and Tables 1 and 2 for more details.
Bit WR (FRS = 0) WR (FRS = 1)
0000 120 Sps 100 Sps
0001 60 Sps 50 Sps
0010 30 Sps 25 Sps
0011 15 Sps 12.5 Sps
0100 7.5 Sps 6.25 Sps
1000 3840 Sps 3200 Sps
1001 1920 Sps 1600 Sps
1010 960 Sps 800 Sps
1011 480 Sps 400 Sps
1100 240 Sps 200 Sps
All other combinations are not used.
U/B (Unipolar / Bipolar) [10]
0 Select Bipolar mode.
1 Select Unipolar mode.
OCD (Open Circuit Detect Bit) [9]
When set, this bit activates a 300 nA current source on the input channel (AIN+) selected by the channel
select bits. Note that the 300nA current source is rated at 25°C. This feature is particularly useful in ther-
mocouple applications when the user wants to drive a suspected open thermocouple lead to a supply rail.
0 Normal mode.
1 Activate current source.
NU (Not Used) [8:0]
0 Must always be logic 0. Reserved for future upgrades.
CS5530
DS742A1 21
2.4 Calibration
Calibration is used to set the zero and gain slope of
the ADC’s transfer function. The CS5530 provides
system calibration.
Note: After the ADC is reset, it is functional and can
perform measurements without being
calibrated (reme mber that the VRS bit in the
configuration register must be properly
configured). If the converter is operated
without calibraton, the converter will utilize
the initialized values of the on-chip regist er s
(Offset = 0.0; Gain = 1.0) to calculate output
words. Any initial offset and gain er rors in the
internal circuitry of the chip will remain.
2.4.1 Calibration Registers
The CS5530 converter has an offset register that is
used to set the zero point of the converter’s transfer
function. As shown in Offset Register section, one
LSB in the offset register is 1.835007966 X 2-24
proportion of the input span (bipolar span is 2 times
the unipolar span, gain register = 1.000...000 deci-
mal). The MSB in the offset register determines if
the offset to be trimmed is positive or negative (0
positive, 1 negative). Note that the magnitude of
the offset that is trimmed from the inpu t is mapp ed
through the gain register. The converter can typi-
cally trim ±100 percent of the input span. As shown
in the Gain Regi ster section, the gain register spans
from 0 to (64 - 2-24). The decimal equivalent mean-
ing of the gain register is
where the binary numbers have a value of either
zero or one (bD29 is the binary value of bit D29).
While gain register settings of up to 64 - 2-24 are
available, the gain register should never be set to
values above 40.
2.4.2 Gain Register
The gain register span is fro m 0 to (64-2-24). After Reset D24 is 1, all other bits are ‘0’.
2.4.3 Offset Register
One LSB represents 1.83500 7966 X 2-24 proportion of the input span (bipolar span is 2 times unipolar span).
Offset and data word bits align by MSB. After reset, all bits are ‘0’.
The offset register is stored as a 32-bit, two’s complement number, where the last 8 bits are all 0.
Db
D2925bD2824bD2723bD0224 )++++ bDi224 i+()
i0=
29
==
Decimal Point
MSB D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
NU NU 2524232221202-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8
0000000100000000
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 LSB
2-9 2-10 2-11 2-12 2-13 2-14 2-15 2-16 2-17 2-18 2-19 2-20 2-21 222 2-23 2-24
0000000000000000
MSB D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
Sign 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 2-10 2-11 2-12 2-13 2-14 2-15 2-16
0000000000000000
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 LSB
2-17 2-18 2-19 2-20 2-21 2-22 2-23 2-24 NU NU NU NU NU NU NU NU
0000000000000000
CS5530
22 DS742A1
2.4.4 Performing Calibrations
To perform a calibration, the user must send a com-
mand byte with its MSB=1, and the appropriate
calibration bits (CC2-CC0) set to choose the type
of calibration to be performed. The calibration will
be performed using the filter rate, and siganl span
(unipolar or bipolar) as set in the configuration reg-
ister. The length of time it takes to do a calibration
is slightly less than the amount of time it takes to do
a single conversion (see Table 1 for single conver-
sion timing). Offset calibration takes 608 clock cy-
cles less than a single conversion when FRS = 0,
and 729 clock cycles less when FRS = 1. Gain cal-
ibration takes 128 clock cycles less than a single
conversion when FRS = 0, and 153 clock cycles
less when FRS = 1.
Once a calibration cycle is complete, SDO falls and
the results are automatically stored in either the
gain or offset register. SDO will remain low until
the next command word is begun. If additional cal-
ibrations are performe d while referencing the same
calibration registers, the las t calibration results will
replace the effects from the previous calibration.
Only one calibration is performed with each com-
mand byte.
2.4.5 System Calibration
For the system calibration functions, the user must
supply the converter input calibration signals which
represent ground and full-scale. When a system off-
set calibration is performed, a ground referenced sig-
nal must be applied to the converter. Figure 10
illustrates system offs et calibration.
As shown in Figure 11, the user must input a signal
representing the positive full-scale point to perform
a system gain calibration. In either case, the cali-
bration signals must be within the specified calibra-
tion limits for each specific calibration step (refer
to the System Calibration Specifications).
2.4.6 Calibration Tips
Calibration steps are performed at the output word
rate selected by the WR3-WR0 bits of the configu-
ration register. To minimize the effects of peak-to-
peak noise on the accuracy of calibration the con-
verter should be calibrated using the slowest word
rate that is acceptable. It is recommended that
word rates of 240 Sps and higher not be used for
calibration.) To minimize digital noise near the de-
vice, the user should wait for each calibration step
to be completed before reading or writing to the se-
rial port. Reading the calibration registers and aver-
aging multiple calibrations together can produce a
more accurate calibration result. Note that access-
ing the ADC’s serial port before a calibration has
finished may result in the loss of synchronization
between the microcontroller and the ADC, and may
prematurely halt the calibration cycle.
Figure 10. System Calibration of Offset Figure 11. System Calibration of Gain
CS5530
DS742A1 23
For maximum accuracy, calibrations should be per-
formed for both offset and gain.
When the device is used without calibration, the
uncalibrated gain accuracy is about ±1 percent.
Note that the gain from the offset register to the
output is 1.83007966 decimal, not 1. If a user wants
to adjust the calibration coefficients externally,
they will need to divide the information to be writ-
ten to the offset register by the scale factor of
1.83007966. (This discussion assumes that the gain
register is 1.000...000 decimal. The offset register
is also multiplied by the gain register before being
applied to the output conversion words).
2.4.7 Limitations in Calibration Range
System calibration can be limited by signal head-
room in the analog signal path inside the chip as
discussed under the Analog Input section of this
data sheet. For gain calibration, the full-scale input
signal can be reduced to 3% of the nominal full-
scale value. At this point, the gain register is ap-
proximately equal to 33.33 (decimal). While the
gain register can hold numbers all the way up to
64 - 2-24, gain register settings above a decimal
value of 40 should not be used. With the convert-
er’s intrinsic gain error, this minimum full-scale in-
put signal may be higher or lower. In defining the
minimum full-scale Calibration Range (FSCR) un-
der Analog Characteristics, margin is retained to
accommodate the intrinsic gain error. Inversely, the
input full-scale signal can be increased to a point in
which the modulator reaches its 1’s density limit of
86 percent, which under nominal conditions occurs
when the full-scale input signal is 1.1 times the
nominal full-scale value. With the chip’s intrinsic
gain error, this maximum full-scale input signal
maybe higher or lower. In defining the maximum
FSCR, margin is again incorporated to accommo-
date the intrinsic gain error.
2.5 Performing Conversions
The CS5530 offers two distinctly different conver-
sion modes. The paragraphs that follow detail the
differences in the conversion modes.
2.5.1 Single Conversion Mode
When the user transmits the perform single conver-
sion command, a single, fully settled conversion is
performed using the word rate and polarity selec-
tions set in the configuration register. Once the
command byte is transmitted, the serial port enters
data mode where it waits until the conversion is
complete. When the conversion data is available,
SDO falls to logic 0 to act as a flag to indicate that
the data is available. Forty SCLKs are then needed
to read the conversion data word. The first 8
SCLKs are used to clear the SDO flag. During the
first 8 SCLKs, SDI must be logic 0. The last 32
SCLKs are needed to read the conversion result.
Note that the user is forced to read the conversion
in single conversion mode as the serial port will re-
main in data mode until SCLK transitions 40 time s.
After reading the data, the serial port returns to the
command mode, where it waits for a new command
to be issued. The single conversion mode will take
longer than conversions performed in the continu-
ous conversion mode. The number of clock cycles
a single conversion takes for each Output Word
Rate (OWR) setting is listed in Table 1. The ± 8
(FRS = 0) or ± 10 (FRS = 1) clock ambiguity is due
to internal synchronization between the SCLK in-
put and the oscillator.
Note: In the single conversion mode, more than one
conversion is actually performed, but only the
final, fully settled result is output to the
conversion data register.
CS5530
24 DS742A1
2.5.2 Continuous Conversion Mode
When the user transmits the perform continuous
conversion command, the converter begins contin-
uous conversions using the word rate and polarity
selections set in the configuration register. Once
the command byte is transmitted, the serial port en-
ters data mode where it waits until a conversion is
complete. After the conversion is done, SDO falls
to logic 0 to act as a flag to indicate that the data is
available. Forty SCLKs are then needed to read the
conversion. The first 8 SCLKs are used to clear the
SDO flag. The last 32 SCLKs are needed to read
the conversion result. If ‘00000000’ is provided to
SDI during the first 8 SCLKs when the SDO flag is
cleared, the converter remains in this conversion
mode and continues to convert using the same word
rate and polarity information. In continuous con-
version mode, not every conversion word needs to
be read. The user needs only to read the conversion
words required for the application as SDO rises and
falls to indicate the availability of new conversion
data. Note that if a conversion is not read before the
next conversion data becomes available, it will be
lost and replaced by the new conversion data. To
exit this conversion mode, the user must provide
‘11111111’ to the SDI pin during the first 8 SCLKs
after SDO falls. If the user decides to exit, 32
SCLKs are required to clock out the last conversion
before the converter returns to command mode.
The number of clock cycles a continuous conver-
sion takes for each Output Word Setting is listed in
Table 2. The first conversion from the part in con-
tinuous conversion mode will be longer than the
following conversions due to start-up overhead.
The ± 8 (FRS = 0) or ± 10 (FRS = 1) clock ambigu-
ity is due to internal synchronization between the
SCLK input and the oscillator.
Note: When changing channels, or after performing
calibrations and /or s ing le co nv er sio ns, the
user must ignore the first three (for OWRs
less than 3200 Sps, MCLK = 4.9152 MHz) or
first five (for OWR 3200 Sps) conversions in
continuous conversion mode, as residual
filter coefficients must be flushed from the
filter before acc urat e co nversions are
performed.
Table 1. Conversion Timing for Single Mode
(WR3-WR0) Clock Cycles
FRS = 0 FRS = 1
0000 171448 ± 8 205738 ± 10
0001 335288 ± 8 402346 ± 10
0010 662968 ± 8 795562 ± 10
0011 1318328 ± 8 1581994 ± 10
0100 2629048 ± 8 3154858 ± 10
1000 7592 ± 8 9110 ± 10
1001 17848 ± 8 21418 ± 10
1010 28088 ± 8 33706 ± 10
1011 48568 ± 8 58282 ± 10
1100 89528 ± 8 107434 ± 10
Table 2. Conversion Timing for Conti nuous Mode
FRS (WR3-WR0) Clock Cycles
(First Conversion) Clock Cycles
(All Other
Conversions)
0 0000 89528 ± 8 40960
0 0001 171448 ± 8 81920
0 0010 335288 ± 8 163840
0 0011 662968 ± 8 327680
0 0100 1318328 ± 8 655360
0 1000 2472 ± 8 1280
0 1001 12728 ± 8 2560
0 1010 17848 ± 8 5120
0 1011 28088 ± 8 10240
0 1100 48568 ± 8 20480
1 0000 107434 ± 10 49152
1 0001 205738 ± 10 98304
1 0010 402346 ± 10 196608
1 0011 795562 ± 10 393216
1 0100 1581994 ± 10 786432
1 1000 2966 ± 10 1536
1 1001 15274 ± 10 3072
1 1010 21418 ± 10 6144
1 1011 33706 ± 10 12288
1 1100 58282 ± 10 24576
CS5530
DS742A1 25
2.6 Using Multiple ADCs Synchronously
Some applications require synchronous data out-
puts from multiple ADCs converting different ana-
log channels. Multiple CS5530 devices can be
synchronized in a single system by using the fol-
lowing guidelines:
1) All of the ADCs in the system must be operated
from the same oscillator source.
2) All of the ADCs in the system must share com-
mon SCLK and SDI lines.
3) A software reset must be performed at the same
time for all of the ADCs after system power-up (by
selecting all of the ADCs using their respective CS
pins, and writing the reset sequence to all parts, us-
ing SDI and SCLK).
4) A start conversion command must be sent to all
of the ADCs in the system at the same time. The ±
8 clock cycles of ambiguity for the first conversion
(or for a single conversion) will be the same for all
ADCs, provided that they were all reset at the same
time.
5) Conversions can be obtained by monitoring
SDO on only one ADC, (bring CS high for all but
one part) and reading the data out of each part indi-
vidually, before the next conversion data words are
ready.
An example of a synchronous system using two
CS5530 devices is shown in Figure 12.
2.7 Conversion Output Coding
The CS5530 outputs 24-bit data conversion words.
To read a conversion word the user must read the
conversion data register. The conversion data reg-
ister is 32 bits long and outputs the conversions
MSB first. The last byte of the conversion data reg-
ister contains an overflow flag bit. The overrange
flag (OF) monitors to determine if a valid conver-
sion was performed.
The CS5530 output data conversions in binary for-
mat when operating in unipolar mode and in two's
complement when operating in bipolar mode. Ta-
ble 3 shows the code mapping for both unipolar and
bipolar modes. VFS in the tables refers to the posi-
tive full-scale voltage range of the converter in the
specified gain range, and -VFS refers to the nega-
tive full-scale voltage range of the converter. The
total differential input range (between AIN+ and
AIN-) is from 0 to VFS in unipolar mode, and from
-VFS to VFS in bipolar mode.
CLOCK
SOURCE
CS5530
CS5530
SDO
SDI
SCLK
CS
OSC2
SDO
SDI
SCLK
CS
OSC2
µC
Figure 12. Synchr onizing Multiple ADCs
Table 3. Outp ut Coding
Unipolar Input
Voltage Offset
Binary Bipolar Input
Voltage Two's
Complement
>(VFS-1.5 LSB) FFFFFF >(VFS-1.5 LSB) 7FFFFF
VFS-1.5 LSB FFFFFF
------
FFFFFE VFS-1.5 LSB 7FFFFF
------
7FFFFE
VFS/2-0.5 LSB 800000
------
7FFFFF -0.5 LSB 000000
------
FFFFFF
+0.5 LSB 000001
------
000000 -VFS+0.5 LSB 800001
------
800000
<(+0.5 LSB) 000000 <(-VFS+0.5 LSB) 800000
CS5530
26 DS742A1
2.7.1 Conversion Data Output Descriptions
CS5530 (24-BIT CONVERSIONS)
Conversion Dat a Bits [31: 8]
These bits depict the latest output conversion.
OF (Over-range Flag Bit) [2]
0 Bit is clear when over-range condition has not occurred.
1 Bit is set when input signal is more positive than the positive full-scale, more negative than zero (unipolar
mode) or when the input is more negative than the negative full-scale (bipolar mode).
Other Bits [7:3], [1:0]
These bits are masked logic zero.
D31(MSB) D30 D29 D28 D27 D26 D25 D24 D23 D22 D21 D20 D19 D18 D17 D16
MSB 2221201918 1716151413121110 9 8
D15 D14D13D12D11D10D9D8D7D6D5D4D3D2D1D0
7 65432 1LSB00000OF00
CS5530
DS742A1 27
2.8 Digital Filter
The CS5530 has a linear phase digital filter which
is programmed to achieve a range of output word
rates (OWRs) as sta ted in the Configuration Regis-
ter Description section. The ADC uses a Sinc5 dig-
ital filter to output word rates at 3200 Sps and 3840
Sps (MCLK = 4.9152 MHz). Other output word
rates are achieved by using the Sinc5 filter followed
by a Sinc3 filter with a programmable decimation
rate.Figure 13 shows the magnitude response of the
60 Sps filter, while Figures 14 and 15 show the
magnitude and phase response of the filter at 120
Sps. The Sinc3 is active for all output word rates
except for the 3200 Sps and 3840 Sps (MCLK =
4.9152 MHz) rate. The Z-transforms of the two fil-
ters are shown in Figure 16. For the Sinc3 filter,
“D” is the programmable decimation ratio, which is
equal to 3840/OWR when FRS = 0 and 3200/OWR
when FRS = 1.
The converter’s digital filters scale with MCLK.
For example, with an output word rate of 120 Sps,
the filter’s corner frequency is at 31 Hz. If MCLK
is increased to 5.0 MHz, the OWR increases by
1.0175 percent and the filter’s corner frequency
moves to 31.54 Hz. Note that the converter is not
specified to run at MCLK clock frequencies greater
than 5 MHz.
Figure 13. Digi tal Filter Response (Word Rate = 60 Sps)
-120
-80
-40
0
Gain (dB)
0 60 120 180 240 300
Frequency (Hz)
FRS = 0
-120
-80
-40
0
04080120
Frequency (Hz)
G a in (dB )
Flatness
Frequency dB
2-0.01
4-0.05
6-0.11
8-0.19
10 -0.30
12 -0.43
14 -0.59
16 -0.77
19 -1.09
32 -3.13
Figure 14. 120 Sps Filter Magnitude Plot to 120 Hz
-180
-90
0
90
180
030 60 90 120
Frequen cy (Hz)
Ph ase (Deg rees)
Figure 15. 120 Sps Filter Phase Plot to 120 Hz
Note: See the text regarding the Sinc3 filter’s
decimation ra tio “D”.
Sinc51z80
()
5
1z16
()
5
--------------------------1z16
()
3
1z4
()
3
--------------------------1z4
()
2
1z2
()
2
----------------------- 1z2
()
3
1z1
()
3
-----------------------
×××=
Sinc31zD
()
3
1z1
()
3
-------------------------
=
Figure 16. Z-Transforms of Digital Filter s
CS5530
28 DS742A1
2.9 Clock Generator
The CS5530 includes an on-chip inverting amplifi-
er which can be connected with an external crystal
to provide the master clock for the chip. Figure 17
illustrates the on-chip oscillator. It includes loading
capacitors and a feedback resistor to form a Pierce
oscillator configuration. The chips are designed to
operate using a 4.9152 MHz crystal; however, oth-
er crystals with frequencies between 1 MHz to 5
MHz can be used. One lead of the crystal should be
connected to OSC1 and the other to OSC2. Lead
lengths should be minimized to reduce stray capac-
itance. Note that while using the on-chip oscillator,
neither OSC1 or OSC2 is capable of directly driv-
ing any off chip logic. When the on-chip oscillator
is used, the voltage on OSC2 is typically 1/2 V
peak-to-peak. This signal is not compatible with
external logic unless additional external circuitry is
added. The OSC2 output should be used if the on-
chip oscillator output is used to drive other circuit-
ry.
The designer can use an external CMOS compati-
ble oscillator to drive OSC2 with a 1 MHz to 5
MHz clock for the ADC. The external clock into
OSC2 must overdrive the 60 microampere output
of the on-chip amplifier. This will not harm the on-
chip circuitry. In this scheme, OSC1 should be left
unconnected.
2.10 Power Supply Arrangements
The CS5530 is designed to operate from single or
dual analog supplies and a single digital supply.
The following power supply connections are possi-
ble:
VA+ = +5 V; VA- = 0 V; VD+ = +3 V to +5 V
VA+ = +2.5 V; VA- = -2.5 V; VD+ = +3 V to +5 V
VA+ = +3 V; VA- = -3 V; VD+ = +3 V
A VA+ supply of +2.5 V, +3.0 V, or +5.0 V should
be maintained at ±5% tolerance. A VA- supply of
-2.5 V or -3.0 V should be maintained at ±5% tol-
erance. VD+ can extend from +2.7 V to +5.5 V
with the additional restriction that [(VD+) - (VA-)
< 7.5 V].
Figure 18 illustrates the CS5530 connected with a
single +5.0 V supply to measure differential inputs
relative to a common mode of 2.5 V. Figure 19 il-
lustrates the CS5530 connected with ±2.5 V bipolar
analog supplies and a +3 V to +5 V digital supply
to measure ground referenced bipolar signals. Fig-
ures 20 illustrates the CS5532 connected with ±3 V
analog supplies and a +3 V digital supply to mea-
sure ground referenced bipolar signals.
OSC1
MCLK
NOTE: 20 pF capacitors are on chip and
should not be added externally.
1 M
OSC2
20 pF 20 pF
+
-VTH
~
~60 µA
Figure 17. On-chip Oscillator Model
CS5530
DS742A1 29
OSC2
VD+
VA+
VREF+
VREF-
DGNDVA -
AIN1+ SDI
SCLK
SDO
CS5530
OSC1
CS
10
+5 V
Analog
Supply 0.1 µF 0.1 µF
+
-
17
3
1
2AIN1-
515
9
10
13
11
12
14
166
Optional
Clock
Source
Serial
Data
Interface
4.9152 MHz
20
19
7 A0
8A1
C1
C2
4
22 nF
18
NC
NC
Figure 18. CS5530 Configured with a Single +5 V Supply
OSC2
VD+
VA+
VREF+
VREF-
DGNDVA -
AIN1+ SDI
SCLK
SDO
CS5530
OSC1
CS
+2.5 V
Analog
Supply 0.1 µF 0.1 µF
+
-
17
3
1
2AIN1-
515
9
10
13
11
12
14
166
Optional
Clock
Source
Serial
Data
Interface
4.9152 MHz
20
19
7 A0
8A1
C1
C2
4
22 nF
-2.5 V
Analog
Supply
18
+3 V ~ +5 V
Digital
Supply
NC
NC
Figure 19. CS5530 Configured with ±2.5 V Analog Supplies
CS5530
30 DS742A1
OSC2
VD+
VA+
VREF+
VREF-
DGNDVA -
AIN1+ SDI
SCLK
SDO
CS5530
OSC1
CS
10
+3 V
Analog
Supply 0.1 µF 0.1 µF
+
-
17
3
1
2AIN1-
515
9
10
13
11
12
14
166
Optional
Clock
Source
Serial
Data
Interface
4.9152 MHz
20
19
7 A0
8A1
C1
C2
4
22 nF
-3 V
Analog
Supply
18
NC
NC
Figure 20. CS5530 Configured with ±3 V Analog Supplies
CS5530
DS742A1 31
2.11 Getting Started
This A/D converter has several features. From a
software programmer’s prospective, what should
be done first? To begin, a 4.9152 MHz or 4.096
MHz crystal takes approximately 20 ms to start. To
accommodate for this, it is recommended that a
software delay of approximately 20 ms be inserted
before the start of the processor’s ADC initializa-
tion code. Next, since the CS5530 does not provide
a power-on-reset function, the user must first ini-
tialize the ADC to a known state. This is accom-
plished by resetting the ADC’s serial port with the
Serial Port Initialization sequence. This sequence
resets the serial port to the command mode and is
accomplished by transmitting 15 SYNC1 com-
mand bytes (0xFF hexadecimal), followed by one
SYNC0 command (0xFE hexadecimal). Once the
serial port of the ADC is in the command mode, the
user must reset all the internal logic by performing
a system reset sequence (see 2.3.2 System Reset
Sequence). After the converter is properly reset,
the configuration register bits should be configured
as appropriate, for example, the voltage reference
selection, word rate, signal polarity(unipolar or bi-
polar) should be configured.
Calibrations or conversions can then be performed
as appropriate.
2.12 PCB Layout
For optimal performance, the CS5530 should be
placed entirely over an analog ground plane. All
grounded pins on the ADC, including the DGND
pin, should be connected to the analog ground
plane that runs beneath the chip. In a split-plane
system, place the analog-digital plane split imme-
diately adjacent to the digital portion of the chip.
CS5530
32 DS742A1
3. PIN DESCRIPTIONS
Clock Generator
OSC1; OSC2 – Master Clock
An inverting amplifier inside the chip is connected between these pins and can be used with a
crystal to provide the master clock for the device. Alternatively, an external (CMOS compatible)
clock (powered relative to VD+) can be supplied into the OSC2 pin to provide the master clock
for the device.
Control Pins and Serial Data I/O
CS – Chip Select
When active low, the port will recognize SCLK. When high the SDO pin will output a high
impedance state. CS should be changed when SCLK = 0.
SDI – Serial Data Input
SDI is the input pin of the serial input port. Data will be input at a rate determined by SCLK.
SDO – Serial Data Output
SDO is the serial data output. It will output a high impedance state if CS = 1.
SCLK – Serial Clock Input
A clock signal on this pin determines the input/output rate of the data for the SDI/SDO pins
respectively. This input is a Schmitt trigger to allow for slow rise time signals. The SCLK pin
will recognize clocks only when CS is low.
A0 – Logic Output (Analog), A1 – Logic Output (Analog)
The logic states of A1-A0 mimic the A1-A0 bits in the Configuration Register. Logic
Output 0 = VA-, and Logic Output 1 = VA+.
1
2
3
4
5
6
7
813
14
15
16
17
18
19
20
VREF+
VREF-
SCLK
CS
DGND
A1
A0
VA-
VA+
C2
C1
AIN1-
AIN1+
9
10 11
12 SDO
OSC1
OSC2 SERIAL DATA INPUT
LOGIC OUTPUT (ANALOG)
POSITIVE ANALOG POWER
AMPLI FIE R CAPACITOR CONNECT
AMPLI FIE R CAPACITOR CONNECT
DIFFERENTIAL ANALOG INPUT
CHIP SELECT
VOLTAGE REFERENCE INPUT
VOLTAGE REFERENCE INPUT
SERIAL CLOCK INPUT
POSITIVE DIGITAL POWER
DIGI TAL GROUND
SERIAL DATA OUT
MASTER CLOCK
CS5530
DIFFERENTIAL ANALOG INPUT
NC
NC
SDI
VD+
NEGA TI VE A NAL O G PO WER
MASTER CLOCK
LOGIC OUTPUT (ANALOG)
CS5530
DS742A1 33
Measurement and Reference Inputs
AIN1+, AIN1- – Differential Analog Input
Differential input pins into the device.
VREF+, VREF- – Voltage Reference Input
Fully differential inputs which establish the voltage reference for the on-chip modulator.
C1, C2 – Amplifier Capacitor Inputs
Connections for the instrumentation amplifier’s capacitor.
Power Supply Connections
VA+ – Positive Analog Power
Positive analog supply voltage.
VD+ – Positive Digital Power
Positive digital supply voltage (nominally +3.0 V or +5 V).
VA- – Negative Analog Power
Negative analog supply voltage.
DGND – Digital Ground
Digital Ground.
4. SPECIFICATION DEFINITIONS
Linearity Error
The deviation of a code from a straight line which connects the two endpoints of the ADC
transfer function. One endpoint is located 1/2 LSB below the first code transition and the other
endpoint is located 1/2 LSB beyond the code transition to all ones. Units in percent of full-
scale.
Differential Nonlinearity
The deviation of a code's width from the ideal width. Units in LSBs.
Full-scale Error
The deviation of the last code transition from the ideal [{(VREF+) - (VREF-)} - 3/2 LSB]. Units
are in LSBs.
Unipolar Offset
The deviation of the first code transition from the ideal (1/2 LSB above the voltage on the AIN-
pin.). When in unipolar mode (U/B bit = 1). Units are in LSBs.
Bipolar Offset
The deviation of the mid-scale transition (111...111 to 000...000) from the ideal (1/2 LSB below
the voltage on the AIN- pin). When in bipolar mode (U/B bit = 0). Units are in LSBs.
CS5530
34 DS742A1
5. PACKAGE DRAWINGS
Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the partin g line, mold flash or protr usions shall not exceed 0.20 mm per
side.
2. Dimension “b” does no t include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
INCHES MILLIMETERS NOTE
DIM MIN MAX MIN MAX
A -- 0.084 -- 2.13
A1 0.002 0.010 0.05 0.25
A2 0.064 0.074 1.62 1.88
b 0.009 0.015 0.22 0.38 2,3
D 0.272 0.295 6.90 7.50 1
E 0.291 0.323 7.40 8.20
E1 0.197 0.220 5.00 5.60 1
e 0.024 0.027 0.61 0.69
L 0.025 0.040 0.63 1.03
20 PIN SSOP PACKAGE DRAWING
E
N
123
eb2A1
A2 A
D
SEATING
PLANE
E11
L
SIDE VIEW
END VIEW
TOP VIEW
CS5530
DS742A1 35
6. ORDERING INFORMATION
7. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
Model Number Bits Channels Linearity Error (Max) Temperature Rang e Package
CS5530-CS 24 1 ±0.003% 0°C to +70°C 20-pin 0.2" Plastic SSOP
CS5530-CSZ 24 1 ±0.003% 0°C to +70°C 20-pin 0.2" Plastic SSOP, Lead Free
Model Number Peak Reflow Temp MSL Rating Max Floor Life
CS5530-CS 240 °C 2 365 Days
CS5530-CSZ 260 °C 3 7 Days
CS5530
36 DS742A1
Revision History
REVISION DATE CHANGES
A1 OCT 2006 A dvance Release
Contacting Cirrus Logic Support
For all product questions and inquiries contact a Cirrus Logic Sales Representative.
To find the one nearest to you go to www.cirrus.com
IMPORTANT NOTICE
"Advance" product information describes products that are in development and subject to development changes.
Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) beli eve that the information contained in this document is accurate and r eliable. However, th e informatio n is subject t
o
change without notice and is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant info
r
mation to verify, before placing orders, that inform ation being relied on is current and complete. All pr oducts are sold subject to the terms an d conditions of sale supplie
d
at the ti me of order ac knowledgmen t, incl uding thos e pertai ning to wa rranty, indemnif icati on, and li mitatio n of liab ility . No responsibility is assumed by Cirrus for th
e
use of this information , includi ng use of this in formation as the b asis for m a nu factur e or sale of any items, or for infringement of patents or other rights of third partie
s
This document is the property of Cirrus and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyright
s
trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the information contained herein and gives consent for copie
s
to be made of t he in f ormation onl y fo r use wi th i n y our or g an iza t i on wi th r esp ec t t o Ci rr us int eg ra ted ci r cui t s or ot her pr od ucts of Cirr us. This con sen t do es no t ex te n
d
to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPE
R
TY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE I
N
AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICE
S
LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO B
E
FULLY AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIE
D
WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH
A
MANNER. IF THE CUSTOMER OR CUSTOMER 'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PROD UCTS IN CRITICAL APPLICATIONS, CUSTO
M
ER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM AN
Y
AND ALL LIABILITY, INCLUDING ATTORNEYS' FEES AND COSTS, THAT MAY RESULT FROM OR ARISE IN CONNECTION WITH THESE USES.
Cirrus Logic, Cirrus, and the Cirrus Logic logo designs are trademarks of Cirrus Logic, Inc. All other brand an d product na mes in this docum ent may be trad emarks
o
service marks of their respective owners.
SPI is a trademark of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.