XX2065-8.00BLACK ANODIZE - Wakefield Engineering

621 AND 623 SERIES (EXTRUSION PROFILE 1327)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

302 AND 303 SERIES

301 SERIES

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR MOUNTING HOLES

SERIES

301

302

303

Extruded

Heat Sinks

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

Low-Profile Heat Sinks for All Metal-Case Power Semiconductors

Footprint Thermal Performance at Typical Load

Standard Dimensions Height Mounting Natural Forced Weight

P/N in. (mm) in. (mm) Hole Pattern Convection Convection lbs. (grams)

621A 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) (1) TO-3 75°C @ 15W 2.0°C/W @ 250 LFM 0.1000 (45.36)

621K 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) None 75°C @ 15W 2.0°C/W @ 250 LFM 0.1000 (45.36)

623A 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) (1) TO-3 52°C @ 15W 1.5°C/W @ 250 LFM 0.2100 (95.26)

623K 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) None 52°C @ 15W 1.5°C/W @ 250 LFM 0.210O (95.26)

A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case

power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find a

wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) in

width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the

standard TO-3 package. Material: Aluminum Alloy, Black Anodized.

TO-3

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases

Outline Mounting Thermal Performance at Typical Load

Standard Dimensions Length “A” Hole (s) Natural Forced Weight

P/N in. (mm) in. (mm) Pattern and Number Convection Convection lbs. (grams)

301K 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) None 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31)

301M 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31)

301N 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 1

⁄4-28UNF, 0.625 in. thread depth 70°C @ 15W 2.5°C/W @ 250 LFM 0.0580 (26.31)

302M 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth 50°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (60.33)

302MM 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth 50°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (6033)

302N 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 1

⁄4-28UNF, 0.625 in. thread depth 5O°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (60.33)

302NN 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 1

⁄4-28UNF, 0.625 in. thread depth 50°C @ 15W 1.8°C/W @ 250 LFM 0.1330 (60.33)

303M 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56)

303MM 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56)

303N 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 1

⁄4-28UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56)

303NN 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 1

⁄4-28UNF, 0.625 in. thread depth 37°C @ 15W 1.3°C/W @ 250 LFM 0.2680 (121.56)

The large fin area in minimum total volume provided by the radial design of the 301/302/303

Series offers maximum heat transfer efficiency in natural convection. All types are available

with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the

302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and

“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black

Anodized.

STUD-MOUNT

621/623 SERIES

301/302/303 SERIES

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

WTS001_p26-49 6/14/07 10:56 AM Page 45

Extruded

Heat Sinks

Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes

Space-saving double surface 413, 421, and 423 Series utilize finned surface

area on both sides of the power semiconductor mounting surface to provide

maximum heat dissipation in a compact profile. Ready to install on popular

power components in natural and forced convection applications. Apply Wake-

field Type 126 silicone-free thermal compound or Wakefield DeltaPad™ inter-

face materials for maximum performance. Material: Aluminum Alloy, Black An-

odized.

TO-3; DO-5; Stud-Mount

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

Double-Surface Heat Sinks for TO-3 Case Styles TO-3; Stud-Mount

With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are

recommended for critical space applications where maximum heat dissipation is required for

high-power TO-3 case styles. Forced convection performance is also exemplary with these

double surface fin types. Semiconductor mounting hole style “F” offers a single centered 0.270

in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for

mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request. Material:

Aluminum Alloy, Black Anodized.

Standard Width Overall Dimensions Height Semiconductor Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattem Natural Convection Forced Convection lbs. (grams)

401A 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) (1) TO-3 80°C @ 30W 1.5° C/W @ 250 LFM 0.1500 (68.04)

401F 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 80°C @ 30W 1.5°C/W @ 250 LFM 0.1500 (68.04)

401K 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) None 80°C @ 30W 1.5° C/W @ 250 LFM 0.1500 (68.04)

403A 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) (1) TO-3 55°C @ 30W 0.9° C/W @ 250 LFM 0.3500 (158.76)

403F 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 55°C @ 30W 0.9°C/W @ 250 LFM 0.3500 (158.76

403K 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) None 55°C @ 30W 0.9° C/W @ 250 LFM 0.3500 (158.76)

MECHANICAL DIMENSIONS

SEMICONDUCTOR MOUNTING HOLES

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

403 SERIES

AFKV

401 SERIES

401 AND 403 SERIES

(EXTRUSION

PROFILE 1024)

413 SERIES

(EXTRUSION

PROFILE 2276)

421 SERIES

(EXTRUSION

PROFILE 1025)

SERIES

413

421

423 SERIES

(EXTRUSION PROFILE 1025)

AFKV

Nominal Dimensions

Standard Width Length Height “A” Semiconductor Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams)

413A 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) (1) TO-3 72°C @ 50W 0.85°C/W @ 250 LFM 0.6300 (285.77)

413F 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) 0.270 in. (6.9)-Dia Hole 72°C @ 50W 0.85°C/W @ 250 LFM 0.6300 (285.77)

413K 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) None 72°C @ 50W 0.85°C/W @ 250 LFM 0.6300 (285.77)

421A 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) (1) TO-3 58°C @ 50W 0.7°C/W @ 250 LFM 0.6300 (285.77)

421F 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) 0.270 in. (6.9)-Dia Hole 58°C @ 50W 0.7°C/W @ 250 LFM 0.6300 (285.77)

421K 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) None 58°C @ 50W 0.7°C/W @ 250 LFM 0.6300 (285.77)

423A 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) (1) TO-3 47°C @ 50W 0.5°C/W @ 250 LFM 1.1700 (530.71)

423K 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) None 47°C @ 50W 0.5°C/W @ 250 LFM 1.1700 (530.71)

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

SEMICONDUCTOR MOUNTING HOLES

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

401 & 403 SERIES

413/421/423 SERIES

WTS001_p26-49 6/14/07 10:56 AM Page 46

Extruded

Heat Sinks

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

High-Performance Heat Sinks for 30-100W Metal Power Semiconductors

Need maximum heat dissipation from a TO-3 rectifier heat sink in

minimum space? The Wakefield 431 and 433 Series center chan-

nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol-

ume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to

100-watt operating range. Additional interface resistance reduction for maximized overall per-

formance can be achieved with proper application of Wakefield Type 126 silicone-free thermal

compound. Material: Aluminum Alloy, Black Anodized.

TO-3; Stud-Mount

TO-3

Nominal Dimensions

Standard Width Length “A” Height Semiconductor Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams)

431K 4.750 (120.7) 3.000 (76.2) 3.000 (76.2) None 55°C @ 5OW 0.40°C/W @ 250 LFM 0.7800 (353.81)

433K 4.750 (120.7) 5.500 (139.7) 3.000 (76.2) None 42°C @ 5OW 0.28°C/W @ 250 LFM 1.4900 (675.86)

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

SERIES

431

433

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLE

431 AND 433 SE-

RIES

(EXTRUSION PRO-

FILE 2726)

Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles

Nominal Dimensions

Standard Width Length Height Semiconductor Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams)

435AAAA 4.250 (108.0) 5.500 (139.7) 4.300 (109.2) (4) TO-3 37°C @ 50W 0.38°C/W @ 250 LFM 1.1500 (521.64)

54°C @ 80W 0.24°C/W @ 600 LFM

MECHANICAL DIMENSIONS

Dimensions: in. (mm) NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLES

AAAA

High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes Stud-Mount

Nominal Dimensions

Standard Width Length Height Semiconductor Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams)

441K 4.750 (120.7) 5.500 (139.7) 4.500 (114.3) None 34°C @ SOW 0.30°C/W @ 250 LFM 1.9700 (893.59)

47°C @ 80W 0.19°C/W @ 600 LFM

Designed for vertical mounting within a power supply enclosure

or equipment cabinet without forced airflow available. This Wake-

field 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection with a

maximum 55°C heat sink temperature rise above ambient. When applied in a forced convec-

tion environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to ambient)

at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material: Aluminum

Alloy, Black Anodized.

This lightweight high-performance heat sink is designed to mount

and cool efficiently one to four TO-3 style metal case power semi-

conductors. The Type 435AAAA is the standard configuration available from stock, predrilled

for mounting four TO-3 style devices. Increased performance can be achieved with the proper

selection and installation of a Wakefield Type 175 DeltaPad Kapton™ interface material for

each power semiconductor or, for maximum reduction of case-to-sink interface loss, the appli-

cation of Wakefield Type 126 silicone-free thermal compound. Material: Aluminum Alloy, Black

Anodized.

435 SERIES

(EXTRUSION

PROFILE 4226)

MECHANICAL DIMENSIONS NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLE

441 SERIES

(EXTRUSION

PROFILE 1273)

Dimensions: in. (mm)

431 & 433 SERIES

435 SERIES

441 SERIES

WTS001_p26-49 6/14/07 10:56 AM Page 47

Extruded

Heat Sinks

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes Stud-Mount

Wakefield Engineering has designed four standard heat sink types for ease of installation and

efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount

power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are de-

signed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is available

predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black anodized.

Nominal Dimensions

Standard Width Length Height Hex Style Mounting Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Type Hole Pattern Natural Convection Forced Convection lbs. (grams)

465K 4.000 (101.6) 5.000 (127.0) 4.000 (101.6) 1.060 in. Hex None 38°C @ 5OW 0.27°C/W @ 500 LFM 1.9300 (875.45)

476K 5.000 (127.0) 6.000 (152.4) 5.000 (127.0) 1.250 in. Hex None 25°C @ 5OW 0.19°C/W @ 500 LFM 2.8200 (1279.15)

476W 5.000 (127.0) 6.000 (152.4) 5.000 (127.0) 1.250 in. Hex 0.765 in. 25°C @ 5OW 0.19°C/W @ 500 LFM 2.8000 (1270.08)

(19.4) Dia.

Center Mount

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLES

476 SERIES (EXTRUSION

PROFILE 1245)

465 SERIES (EXTRUSION

PROFILE 1244)

Heat Sinks for High-Power Hex-Type Rectifiers and Diodes Stud-Mount

Nominal Dimensions

Standard Width Length Height Hex Style Mounting Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Type Hole Pattern Natural Convection Forced Convection lbs. (grams)

486K 6.250 (158.8) 6.000 (152.4) 6.250 (158.8) 1.750 in. Hex None 24°C @ 50W 0.20°C/W @ 250 LFM 4.2100 (1909.66)

86°C @ 250W 0.13°C/W @ 500 LFM

489K 6.250 (158.8) 9.000 (228.6) 6.250 (158.8) 1.750 in. Hex None 19°C @ 50W 0.15°C/W @ 250 LFM 6.1400 (2785.10)

75°C @ 250W 0.10°C/W @ 500 LFM

These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for

mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000

in. (50.8) area on the semiconductor base mounting surface which is free of anodize. Material:

Aluminum Alloy, Black Anodized.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLE

MECHANICAL DIMENSIONS

486 AND 489 SERIES (EX-

TRUSION

PROFILE 1541)

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

SERIES

486

489

465 & 476 SERIES

486 & 489 SERIES

WTS001_p26-49 6/14/07 10:56 AM Page 48

Extruded

Heat Sinks

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

King Size Heat Sinks for High-Power Rectifiers

The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller

power devices. The semiconductor device mounting surface is free of anodize on the entire

surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets (see

accessories section) for mounting to enclosure wall and for electrical isolation. The anodize-

free mounting surface is milled for maximum contact area. The 490 Series Can also be drilled

for mounting and cooling IGBTs and other isolated power modules. Material: Aluminum Alloy,

Black Anodized.

GENERAL PURPOSE

Nominal Dimensions

Standard Width Length “A” Height Semiconductor Thermal Performance at Typical Load Weight

P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams)

490-35K 9.250 (235.0) 3.500 (88.9) 6.750 (171.5) None 84°C @ 20OW 0.18° C/W @ 600 LFM 3.2400 (1469.66)

490-6K 9.250 (235.0) 6.000 (152.4) 6.750 (171.5) None 60°C @ 20OW 0.13° C/W @ 600 LFM 5.4700 (2481.19)

490-12K 9.250 (235.0) 12.000 (304.8) 6.750 (171.5) None 45°C @ 20OW 0.09°C/W @ 600 LFM 10.6200(4817.23)

MECHANICAL DIMENSIONS

490 SERIES

(EXTRUSION PROFILE 2131)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLE

Dimensions: in. (mm)

PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S

Thermal Resistance at Typical Load

Overall Dimensions: in. (mm) Device Base Natural Forced

Standard Length Height Width Mounting Area Base Mounting Convection (Øsa)(1) Convection (Øsa)

P/N in. (mm) in. (mm) in. (mm) (mm) Holes (°C/W) (°C/W @ 500 LFM)

394-1AB 3.000 (76.2) 1.500 (38.1) 5.000 (127.0) 101 x 76 4 1.85 0.90

394-2AB 5.500 (139.7) 1.500 (38.1) 5.000 (127.0) 101 x 139 6 1.51 0.60

395-1AB 3.000 (76.2) 2.500 (63.5) 5.000 (127.0) 50 x 76 4 1.10 0.50

395-2AB 5.500 (139.7) 2.500 (63.5) 5.000 (127.0) 50 x 139 6 0.90 0.32

396-1AB 3.000 (76.2) 1.380 (35.1) 5.000 (127.0) 50 x 76 4 1.85 1.07

396-2AB 5.500 (139.7) 1.380 (35.1) 5.000 (127.0) 50 x 139 6 1.51 0.64

Note: 1.Thermal resistance values shown are for black anodized finish at 50°C rise above ambient.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

MECHANICAL DIMENSIONS

394 SERIES

(EXTRUSION PROFILE 7332)

395 SERIES

(EXTRUSION PROFILE 7330)

396 SERIES

(EXTRUSION PROFILE 7331)

Dimensions: in. (mm)

490 SERIES

394, 395, 396 SERIES

WTS001_p26-49 6/14/07 10:56 AM Page 49

EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS

Heat Sinks for “Full-Brick” DC/DC Converters

Natural Convection

Footprint Forced Convection Power Dissipation (Watts)

Standard Dimensions Height Fin Number Thermal Resistance 40°C Rise Heat Sink

P/N in. (mm) in. (mm) Orientation of Fins at 300 ft/min (C/W) to Ambient

557-140AB 4.60 (116.8) x 2.40 (61.0) 1.40 (35.6) Horizontal 6 1.3 14

558-75AB 2.40 (61.0) x 4.60 (116.8) 0.75 (19.1) Vertical 16 1.8 12

559-50AB 2.40 (61.0) x 4.60 (116.8) 0.50 (12.7) Vertical 27 2.2 10

Material: Aluminum, Black Anodized

• Standard mounting hole pattern mates with Vicor DC/DC converters. • Aluminum extruded fin

construction keeps DC/DC converter modules cool in both forced and natural convection appli-

cations. • Three fin heights, two flow direction options. • Black anodized finish standard.

• Integral thermal interface pad option eliminates need to order and install pad separately.

• Ordering a single part number with the hardware kit option provides everything necessary to

keep your converter cool.

TO-220 and TO-218

MECHANICAL DIMENSIONS

PRODUCT DESIGNATION 557 SERIES

DIMENSIONS

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

PRODUCT DESIGNATION

558 SERIES

DIMENSIONS

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

PRODUCT DESIGNATION

559 SERIES

DIMENSIONS

Dimensions: in. (mm)

SERIES 557, 558 & 559

Extruded

Heat Sinks

WTS001_p50-68 6/14/07 10:46 AM Page 50

Extruded

Heat Sinks

Standard Description For Use with Series Mounting Hipot Rating Weight

P/N Hardware Material (VAC) lbs. (grams)

103 Spool-shaped insulator 300, 400, 600, 111, 113 #6-32 screw Teflon 1500 0.00012 (0.05)

107 Spool-shaped insulator 300, 400, 600, 111, 113 #6-32 screw, nut Teflon 5000 0.0034 (1.54)

Teflon Mounting Insulators

MOUNTING HARDWARE FOR EXTRUDED HEAT SINKS

EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS

Heat Sinks for “Half-Brick” DC/DC Converters

THERMAL PERFORMANCE

Footprint Natural Convection Forced Convection

Standard Dimensions Height Fin Number Power Dissipation (Watts) Thermal Resistance

P/N in. (mm) in. (mm) Orientation of Fins 60°C Rise Heat Sink to Ambient at 300 ft/min (C/W)

517-95AB 2.28 (57.9) x 2.40 (61.0) 0.95 (24.1) Horizontal 8 11W 2.1

527-45AB 2.28 (57.9) x 2.40 (61.0) 0.45 (11.4) Horizontal 11 7W 2.3

527-24AB 2.28 (57.9) x 2.40 (61.0) 0.24 (6.1) Horizontal 11 5W 4.2

518-95AB 2.40 (61.0) x 2.28 (57.9) 0.95 (24.1) Vertical 8 11W 2.2

528-45AB 2.40 (61.0) x 2.28 (57.9) 0.45 (11.4) Vertical 11 7W 2.1

528-24AB 2.40 (61.0) x 2.28 (57.9) 0.24 (6.1) Vertical 11 5W 3.5

Material: Aluminum, Black Anodized

• Standard mounting hole patterns mate with the majority of “half-brick” DC/DC converters on

the market. • Aluminum extruded fin construction keeps DC/DC converter modules cool in

both forced and natural convection applications. • Vertical and horizontal fin configurations

available in a variety of heights. • Black anodized finish standard. • Integral thermal interface

pad option eliminates need to order and install pad separately. • Ordering a single part number

with the hardware kit option provides everything necessary to keep your converter cool.

TO-220 and TO-218

MECHANICAL DIMENSIONS

517, 527, 518 AND 528 SERIES

PRODUCT DESIGNATION

517/527 SERIES DIMENSIONS 518/528 SERIES DIMENSIONS

Dimensions: in. (mm)

SERIES 517, 527, 518 & 528

103 SERIES 107 SERIES

100 SERIES

WTS001_p50-68 6/14/07 10:46 AM Page 51

EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS

Heat Sinks for “Quarter-Brick” DC/DC Converters

Footprint Forced Convection

Standard Dimensions Height Fin Number Thermal Resistance

P/N in. (mm) in. (mm) Orientation of Fins at 300 ft/min (C/W)

537-95AB 2.28 (57.9) x 1.45 (36.8) 0.95 (24.1) Horizontal 8 2.1

537-45AB 2.28 (57.9) x 1.45 (36.8) 0.45 (11.4) Horizontal 13 2.3

537-24AB 2.28 (57.9) x 1.45 (36.8) 0.24 (6.1) Horizontal 14 4.2

547-95AB 1.45 (36.8) x 2.28 (57.9) 0.95 (24.1) Vertical 11 2.2

547-45AB 1.45 (36.8) x 2.28 (57.9) 0.45 (11.4) Vertical 20 2.1

547-24AB 1.45 (36.8) x 2.28 (57.9) 0.24 (6.1) Vertical 22 3.5

Material: Aluminum, Black Anodized

• Mounting slots accomodate two hole patterns: 1.86” x 1.03” and 2.00” x 1.20”, fitting the

vast majority of quarter-brick converters on the market. • Designed for optimum use in forced

convection applications. • Vertical and horizontal fin configurations available in a variety of

heights. • Black anodized finish standard. • Integral thermal interface pad option eliminates

need to order and install pad separately. • Ordering a single part number with the hardware kit

option provides everything necessary to keep your converter cool.

TO-220 and TO-218

MECHANICAL DIMENSIONS 537 & 547 SERIES

PRODUCT DESIGNATION

537 SERIES DIMENSIONS

Dimensions: in. (mm)

537 & 547 SERIES

Extruded

Heat Sinks

547 SERIES DIMENSIONS

WTS001_p50-68 6/14/07 10:46 AM Page 52

Bonded Fin

Heat Sinks

Height Thermal Resistance (5)

(Øsa) at Typical Load

Standard Catalog P/N(5) Milled Base (1) Nonmilled Base (2) Natural Forced

Milled Nonmilled Base Width Length (“M Series”) (“U” Series) Convection(3) Convection(4)

Base(1) Base(2) in. (mm) in. (mm) in. (mm) in. (mm) (°C/W) (°C/W @ 100 CFM)

510-3M 510-3U 7.380 (187.452) 3.000 (76.2) 3.106 (78.9) 3.136 (79.7) 0.56 0.088

510-6M 510-6U 7.380 (187.452) 6.000 (152.4) 3.106 (78.9) 3.136 (79.7) 0.38 0.070

510-9M 510-9U 7.380 (187.452) 9.000 (228.6) 3.106 (78.9) 3.136 (79.7) 0.29 0.066

510-12M 510-12U 7.380 (187.452) 12.000 (304.8) 3.106 (78.9) 3.136 (79.7) 0.24 0.062

510-14M 510-14U 7.380 (187.452) 14.000 (355.6) 3.106 (78.9) 3.136 (79.7) 0.21 0.059

511-3M 511-3U 5.210 (132.33) 3.000 (76.2) 2.350 (59.7) 2.410 (61.2) 0.90 0.120

511-6M 511-6U 5.210 (132.33) 6.000 (152.4) 2,350 (59.7) 2.410 (61.2) 0.65 0.068

511-9M 511-9U 5.210 (132.33) 9.000 (228.6) 2.350 (59.7) 2.410 (61.2) 0.56 0.060

511-12M 511-12U 5.210 (132.33) 12.000 (304.8) 2.350 (59.7) 2.410 (61.2) 0.45 0.045

512-3M 512-3U 7.200 (182.88) 3.000 (76.2) 2.350 (59.7) 2.410 (61.2) 0.90 0.120

512-6M 512-6U 7.200 (182.88) 6.000 (152.4) 2.350 (59.7) 2.410 (61.2) 0.65 0.068

512-9M 512-9U 7.200 (182.88) 9.000 (228.6) 2.350 (59.7) 2.410 (61.2) 0.56 0.060

512-12M 512-12U 7.200 (182.88) 12.000 (304.8) 2.350 (59.7) 2.410 (61.2) 0.45 0.045

MECHANICAL DIMENSIONS

Series A B C Flatness

511-U 512-U 0.250 (6.4) 2.410 (61.2) 0.372 (9.4) 0.006 in./in. (0.15 mm/mm)

511-M 512-M 0.220 (5.6) 2.350 (59.7 0.342 (8.7) 0.002 in./in. (0.05 mm/mm)

Dimensions: in. (mm)

Series A B Flatness

510-U 0.216 (5.5) 3.136 (79.7) 0.006 in./in. (0.15 mm/mm)

510-M 0.165 (4.2) 3.106 (78.9) 0.002 in./in. (0.05 mm/mm)

510 SERIES 510 Series (Extrusion Profile 5113)

511 Series (Extrusion Profile 6438-1)

511 AND 512 SERIES 512 Series (Extrusion Profile 6438-2)

Notes:

1. Precision-milled base for maximum heat transfer

performance (flatness 0.002 in./in.)

2. Nonmilled base flatness: 0.006 in./in.

3. Natural convection heat dissipation for distributed heat

sources at 50°C rise.

4. Forced convection heat dissipation for distributed heat

sources at 100 cubic feet per minute, shrouded condition.

5. Standard models are provided without finish.

510, 511 & 512 SERIES

NATURAL AND FORCED CONVECTION CHARACTERISTICS

HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTS, RELAYS

High Performance Heat Sinks for Power Modules, IGBTs and Solid State Relays

Thermal Resistance at Typical Load

Standard P/N, Finish Natural Forced

Black Gold Length Convection (Øsa) Convection (Øsa) Weight

Anodized Iridite in. (mm) (°CW) (°CW) lbs. (grams)

392-120AB 392-120AG 4.725 (120.0) 0.50 0.16 @ 100 CFM 4.452 (2019.43)

392-180AB 392-180AG 7.087 (180.0) 0.43 0.11 @ 100 CFM 6.636 (3010.09)

392-300AB 392-300AG 11.811 (300.0) 0.33 0.08 @ 100 CFM 1O.420 (4726.51)

392 SERIES

(EXTRUSION

PROFILE 5658)

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

MECHANICAL DIMENSIONS

Dimensions: in. (mm)

NATURAL

CONVECTION

392-120 (1 MOD)

392-180 (1 MOD)

392-300 (1 MOD)

392-300 (3 MOD)

FORCED

CONVECTION

392-120 (1 MOD)

392-120 (3 MOD)

392-180 (1 MOD)

392-180 (3 MOD)

392-300 (3 MOD)

392 SERIES

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