1White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
128Kx8 MONOLITHIC FLASH, SMD 5962-96690
FEATURES
Access Times of 50*, 60, 70, 90, 120, 150ns
Packaging
• 32 lead, Hermetic Ceramic, 0.400" SOJ (Package
101)
• 32 pin, Hermetic Ceramic, 0.600" DIP (Package
300)
• 32 lead, Flatpack (Package 220)
• 32 lead, Formed Flatpack (Package 221)
• 32 pin, Rectangular Ceramic Leadless Chip
Carrier (Package 601)
100,000 Erase/Program Cycles Minimum
Sector Erase Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
Organized as 128Kx8
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply.
Low Power CMOS
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Page Program Operation and Internal Program
Control T ime.
This product is subject to change without notice.
Note: For programming information refer to Flash Programming 1M5 Application Note.
* The access time of 50ns is available in Industrial and Commercial temperature ranges
only.
Pin Confi guration For WMF128K8-XXX5
Pin Description
A0-16 Address Inputs
I/O0-7 Data Input/Output
CS# Chip Select
OE# Output Enable
WE# Write Enable
VCC +5.0V Power
VSS Ground
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
V
SS
V
CC
WE#
NC
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
Top View
32 DIP
32 CSOJ
32 Flatpack
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
4 3 2 1 32 31 30
14 15 16 17 18 19 20
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
I/O3
I/O4
I/O5
I/O6
A14
A13
A8
A9
A11
OE#
A10
CS#
I/O7
A12
A15
A16
NC
VCC
WE#
NC
Pin Confi guration For WMF128K8-XCLX5
Top View
32 CLCC
2White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ABSOLUTE MAXIMUM RATINGS (1)
Parameter Unit
Operating Temperature -55 to +125 °C
Supply Voltage (VCC) -2.0 to +7.0 V
Signal Voltage Range (any pin except A9) (2) -2.0 to +7.0 V
Storage Temperature Range -65 to +150 °C
Lead Temperature (soldering, 10 seconds) +300 °C
Data Retention Mil Temp 10 years
Endurance (write/erase cycles) (Mil Temp) 10,000 min cycles
A9 Voltage for sector protect (VID) (3) -2.0 to +14.0 V
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs
may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on
output and I/O pins is VCC + 0.5V. During voltage transitions, outputs may overshoot
to Vcc + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is
+13.5V which may overshoot to 14.0 V for periods up to 20ns.
DC CHARACTERISTICS — CMOS COMPATIBLE
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter Symbol Conditions Min Max Unit
Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC 10 μA
Output Leakage Current ILO VCC = 5.5, VIN = GND to VCC 10 μA
VCC Active Current for Read (1) ICC1 CS# = VIL, OE# = VIH 35 mA
VCC Active Current for Program or Erase (2) ICC2 CS# = VIL, OE# = VIH 50 mA
VCC Standby Current ICC3 VCC = 5.5, CS# = VIH, f = 5MHz 1.6 mA
Output Low Voltage VOL IOL = 8.0 mA, VCC = 4.5 0.45 V
Output High Voltage VOH1 IOH = -2.5 mA, VCC = 4.5 0.85 x VCC V
Output High Voltage VOH2 IOH = -100 μA, VCC = 4.5 VCC - 0.4 V
Low VCC Lock-Out Voltage VLKO 3.2 V
NOTES:
1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE# at VIH.
2. ICC active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Max Unit
Supply Voltage VCC 4.5 5.5 V
Input High Voltage VIH 2.0 VCC + 0.5 V
Input Low Voltage VIL -0.5 +0.8 V
Operating Temp. (Mil.) TA-55 +125 °C
Operating Temp. (Ind.) TA-40 +85 °C
A9 Voltage for Sector Protect VID 11.5 12.5 V
CAPACITANCE
TA = +25°C
Parameter
Symbol
Conditions Max Unit
Address Input capacitance CAD
VI/O = 0 V, f = 1.0 MHz
15 pF
Output Enable capacitance COE
VIN = 0 V, f = 1.0 MHz
15 pF
Write Enable capacitance CWE
VIN = 0 V, f = 1.0 MHz
15 pF
Chip Select capacitance CCS
VIN = 0 V, f = 1.0 MHz
15 pF
Data I/O capacitance CI/O
VI/O = 0 V, f = 1.0 MHz
15 pF
This parameter is guaranteed by design but not tested.
AC TEST CIRCUIT AC TEST CONDITIONS
Parameter Typ Unit
Input Pulse Levels
VIL = 0, VIH = 3.0
V
Input Rise and Fall 5 ns
Input and Output Reference Level 1.5 V
Output Timing Reference Level 1.5 V
Notes:
VZ is programmable from -2V to +7V.
IOL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
VZ is typically the midpoint of VOH and VOL.
IOL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
I
Current Source
D.U.T.
C = 50 pf
eff
I
OL
V 1.5V
(Bipolar Supply)
Z
Current Source
OH
3White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC CHARACTERISTICS – READ ONLY OPERATIONS
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter Symbol -50 -60 -70 -90 -120 -150 Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Read Cycle Time tAVAV tRC 50 60 70 90 120 150 ns
Address Access Time tAVQV tACC 50 60 70 90 120 150 ns
Chip Select Access Time tELQV tCE 50 60 70 90 120 150 ns
OE# to Output Valid tGLQV tOE 25 30 35 40 50 55 ns
Chip Select to Output High Z (1) tEHQZ tDF 20 20 20 25 30 35 ns
OE# High to Output High Z (1) tGHQZ tDF 20 20 20 25 30 35 ns
Output Hold from Address, CS# or OE#
Change, whichever is First
tAXQX tOH 000000ns
NOTES:
1. Guaranteed by design, but not tested
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter Symbol -50 -60 -70 -90 -120 -150 Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time tAVAV tWC 50 60 70 90 120 150 ns
Chip Select Setup Time tELWL tCS 000000ns
Write Enable Pulse Width tWLWH tWP 25 30 35 45 50 50 ns
Address Setup Time tAVWH tAS 000000ns
Data Setup Time tDVWH tDS 25 30 30 45 50 50 ns
Data Hold Time tWHDX tDH 000000ns
Address Hold Time tWHAX tAH 40 45 45 45 50 50 ns
Chip Select Hold Time tWHEH tCH 000000ns
Write Enable Pulse Width High tWHWL tWPH 20 20 20 20 20 20 ns
Duration of Byte Programming Operation (min) tWHWH1 14 14 14 14 14 14 μs
Sector Erase Time tWHWH2 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 sec
Read Recovery Time before Write tGHWL 000000ms
VCC Set-up Time tVCS 50 50 50 50 50 50 μs
Chip Programming Time 12.5 12.5 12.5 12.5 12.5 12.5 sec
Output Enable Setup Time tOES 000000ns
Output Enable Hold Time (1) tOEH 10 10 10 10 10 10 ns
NOTES:
1. For Toggle and Data# Polling.
4White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter Symbol -50 -60 -70 -90 -120 -150 Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time tAVAV tWC 50 60 70 90 120 150 ns
WE# Setup Time tWLEL tWS 000000ns
CS# Pulse Width tELEH tCP 25 30 35 45 50 50 ns
Address Setup Time tAVEL tAS 000000ns
Data Setup Time tDVEH tDS 25 30 30 45 50 50 ns
Data Hold Time tEHDX tDH 000000ns
Address Hold Time tELAX tAH 40 45 45 45 50 50 ns
WE# Hold from WE# High tEHWH tWH 0000 00ns
CS# Pulse Width High tEHEL tCPH 20 20 20 20 20 20 ns
Duration of Programming Operation tWHWH1 14 14 14 14 14 14 μs
Duration of Erase Operation tWHWH2 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 2.2 60 sec
Read Recovery before Write tGHEL 000000ns
Chip Programming Time 12.5 12.5 12.5 12.5 12.5 12.5 sec
5White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC WAVEFORMS FOR READ OPERATIONS
s
es
s
e
r
d
dA
S#
C
E#O
E#
W
s
t
up
tu
OZ hgiH
elbatS sesser
d
d
A
t
EO
t
CR
d
il
aV
tu
ptu
O
t
EC
t
C
C
A
t
HO
Z hg
i
H
t
FD
6White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
s
e
ss
er
d
dA
E#W
E#
O
S#
C
a
t
aD
V 0.
5
APAPH5
5
55
t
CW
t
S
W
DP D#
7
D
TU
O
t
HA
t
H
PC
t
PC
t
HD
t
S
D
Data# Polling
t
S
A
t
LEH
G
H0
A
t
1H
WH
W
7White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
Addresses
CS#
OE#
WE#
Data
VCC
5555H 2AAAH 2AAAH SA5555H 5555H
tWP
tCS
tVCS
1010H/3030H5555H8080H5555H AAAAHAAAAH
tAH
tAS
tGHWL
tWPH
tDH
tDS
8White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
S#
C
E#
O
E#
W
t
EO
t
E
O
t
E
C
t
HC
t
HO
O# #
/
I
7
O/I dna
51
O/I
7
O/I dna
51
ataD dilaV
Z
hgiH
O/I
6-0
O/I dna
41-8
d
ilavnI
O/I
51-0
ataD dilaV
t
FD
O
/I
7
dna
O/I
5
1
O
/
I
6-0
dna
O/I
41-8
t
HEO
t
2
r
o
1
H
WHW
a
t
a
D
9White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
s
e
ss
er
d
dA
E#W
E#
O
S#
C
a
t
aD
V 0.
5
APAPH5
5
55
t
CW
t
S
W
DP D#
7
D
TU
O
t
HA
t
H
PC
t
PC
t
HD
t
S
D
Data# Polling
t
S
A
t
LEH
G
H0
A
t
1H
WH
W
10 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 101: 32 LEAD, CERAMIC SOJ
1.27 (0.050) TYP
21.1 (0.830) ± 0.25 (0.010)
19.1 (0.750) TYP
11.3 (0.442)
± 0.30 (0.012)
3.96 (0.156) MAX
0.2 (0.008)
± 0.05 (0.002)
9.55 (0.376) ± 0.25 (0.010)
1.27 (0.050) ± 0.25 (0.010)
0.89 (0.035)
Radius TYP
PIN 1 IDENTIFIER
PACKAGE 220: 32 LEAD, CERAMIC FLATPACK
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
10.41 (0.410)
± 0.13 (0.005)
2.60 (0.102) MAX
0.127 (0.005)
+ 0.05 (0.002)
–
0.025 (0.001)
PIN 1
IDENTIFIER
1.27 (0.050) TYP
19.05 (0.750) TYP
10.16 (0.400)
± 0.51 (0.020)
0.43 (0.017)
± 0.05 (0.002)
20.83 (0.820)
± 0.25 (0.010)
11 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED
2.5 (0.100)
TYP
1.27 (0.050)
± 0.1 (0.005)
0.46 (0.018)
± 0.05 (0.002)
0.84 (0.033)
± 0.4 (0.014)
3.2 (0.125) MIN
15.04 (0.592)
± 0.3 (0.012)
0.25 (0.010)
± 0.05 (0.002)
15.25 (0.600)
± 0.25 (0.010)
42.4 (1.670) ± 0.4 (0.016)
4.34 (0.171) ± 0.79 (0.031)
PIN 1 IDENTIFIER
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 221: 32 LEAD, FORMED CERAMIC FLATPACK
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
10.41 (0.410)
±0.13 (0.005)
1.27 (0.050) TYP
19.05 (0.750) TYP 1.52 (0.060) TYP
0.43 (0.017)
±0.05 (0.002)
20.83 (0.820)
±0.25 (0.010)
3.35 (0.132)
MAX
1.27 (0.050) TYP
0.15 (0.006)
TYP
0°/ -4° 0.63 (0.025) TYP
+
+
13.47 (0.530)
±0.13 (0.005)
12 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 601: 32 PIN, RECTANGULAR CERAMIC LEADLESS CHIP CARRIER
7.62 (0.300) TYP
5.08
(0.200)
TYP
3.81
(0.150) TYP
10.16
(0.400)
TYP
0.38 (0.015) x 45°
PIN 1 IDENTIFIER
0.56 (0.022)
0.71 (0.028)
11.25 (0.443)
11.60 (0.457)
13.79 (0.543)
14.15 (0.557)
1.63 (0.064)
2.54 (0.100)
PIN 1
1.02 (0.040) x 45°
3 PLACES
32PinCLCCpkgdim.eps
13 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
V
PP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
PACKAGE TYPE:
DE = 32 Lead Ceramic SOJ (Package 101)
C = 32 Pin Ceramic DIP (Package 300)
FE = 32 Lead Ceramic Flatpack (Package 220)
FF = 32 Lead Formed Ceramic Flatpack (Package 221)
CL = 32 Pin rectangular Ceramic Leadless Chip Carrier (Package 601)
ACCESS TIME (ns)
ORGANIZATION, 128K x 8
Flash
MONOLITHIC
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W M F 128K8 - XXX X X 5 X
14 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WMF128K8-XXX5
April 2001
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
DEVICE TYPE SECTOR SIZE SPEED PACKAGE SMD NO.
128K x 8 Flash Monolithic 16KByte 150ns 32 pin DIP (C) 5962-96690 01HYX
128K x 8 Flash Monolithic 16KByte 120ns 32 pin DIP (C) 5962-96690 02HYX
128K x 8 Flash Monolithic 16KByte 90ns 32 pin DIP (C) 5962-96690 03HYX
128K x 8 Flash Monolithic 16KByte 70ns 32 pin DIP (C) 5962-96690 04HYX
128K x 8 Flash Monolithic 16KByte 60ns 32 pin DIP (C) 5962-96690 05HYX
128K x 8 Flash Monolithic 16KByte 150ns 32 lead SOJ (DE) 5962-96690 01HXX
128K x 8 Flash Monolithic 16KByte 120ns 32 lead SOJ (DE) 5962-96690 02HXX
128K x 8 Flash Monolithic 16KByte 90ns 32 lead SOJ (DE) 5962-96690 03HXX
128K x 8 Flash Monolithic 16KByte 70ns 32 lead SOJ (DE) 5962-96690 04HXX
128K x 8 Flash Monolithic 16KByte 60ns 32 lead SOJ (DE) 5962-96690 05HXX
128K x 8 Flash Monolithic 16KByte 150ns 32 lead Flatpack (FE) 5962-96690 01HTX
128K x 8 Flash Monolithic 16KByte 120ns 32 lead Flatpack (FE) 5962-96690 02HTX
128K x 8 Flash Monolithic 16KByte 90ns 32 lead Flatpack (FE) 5962-96690 03HTX
128K x 8 Flash Monolithic 16KByte 70ns 32 lead Flatpack (FE) 5962-96690 04HTX
128K x 8 Flash Monolithic 16KByte 60ns 32 lead Flatpack (FE) 5962-96690 05HTX
128K x 8 Flash Monolithic 16KByte 150ns 32 lead Formed Flatpack (FF) 5962-96690 01HUX
128K x 8 Flash Monolithic 16KByte 120ns 32 lead Formed Flatpack (FF) 5962-96690 02HUX
128K x 8 Flash Monolithic 16KByte 90ns 32 lead Formed Flatpack (FF) 5962-96690 03HUX
128K x 8 Flash Monolithic 16KByte 70ns 32 lead Formed Flatpack (FF) 5962-96690 04HUX
128K x 8 Flash Monolithic 16KByte 60ns 32 lead Formed Flatpack (FF) 5962-96690 05HUX
