© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 2 1Publication Order Number:
MMBF5460LT1/D
MMBF5460LT1
JFET − General Purpose
Transistor
P−Channel
Features
Pb−Free Package is Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain−Gate Voltage VDG 40 Vdc
Reverse Gate−Source Voltage VGSR 40 Vdc
Forward Gate Current IGF 10 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
PD225
1.8 mW
mW/°C
Thermal Res istance, Junction−to−Ambient RqJA 556 °C/W
Junction and Storage Temperature TJ, Tstg −55 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
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SOT−23 (TO−236)
CASE 318
STYLE 10
Device Package Shipping
ORDERING INFORMATION
MMBF5460LT1 SOT−23 3,000 / Tape & Ree
l
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
MMBF5460LT1G SOT−23
(Pb−Free) 3,000 / Tape & Ree
l
12
3
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1
M6E M G
G
M6E = Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
2 SOURCE
3
GATE
1 DRAIN
MMBF5460LT1
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Gate−Source Breakdown Voltage
(IG = 10 mAdc, VDS = 0) V(BR)GSS 40 Vdc
Gate Reverse Current
(VGS = 20 Vdc, VDS = 0)
(VGS = 20 Vdc, VDS = 0, TA = 100°C)
IGSS
5.0
1.0 nAdc
mAdc
Gate Source Cutoff Voltage
(VDS = 15 Vdc, ID = 1.0 mAdc) VGS(off) 0.75 6.0 Vdc
Gate Source Voltage
(VDS = 15 Vdc, ID = 0.1 mAdc) VGS 0.5 4.0 Vdc
ON CHARACTERISTICS
Zero−Gate−Voltage Drain Current
(VDS = 15 Vdc, VGS = 0) IDSS −1.0 5.0 mAdc
SMALL−SIGNAL CHARACTERISTICS
Forward Transfer Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz) |Yfs| 1000 4000 mmhos
Output Admittance
(VDS = 15 Vdc, VGS = 0, f = 1.0 kHz) |yos| 75 mmhos
Input Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz) Ciss 5.0 7.0 pF
Reverse Transfer Capacitance
(VDS = 15 Vdc, VGS = 0, f = 1.0 MHz) Crss 1.0 2.0 pF
MMBF5460LT1
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3
Yfs FORWARD TRANSFER ADMITTANCE ( mhos)mYfs FORWARD TRANSFER ADMITTANCE ( mhos)m
DRAIN CURRENT versus GATE
SOURCE VOLTAGE FORWARD TRANSFER ADMITTANCE
versus DRAIN CURRENT
ID, DRAIN CURRENT (mA)
Yfs FORWARD TRANSFER ADMITTANCE ( mhos)m
4.0 4000
0 0.2
VGS, GATE−SOURCE VOLTAGE (VOLTS)
Figure 1. VGS(off) = 2.0 Volts
1.0
ID, DRAIN CURRENT (mA)
3.5
ID, DRAIN CURRENT (mA)
10 10000
0 1.0
VGS, GATE−SOURCE VOLTAGE (VOLTS)
Figure 2. VGS(off) = 4.0 Volts
ID, DRAIN CURRENT (mA)
ID, DRAIN CURRENT (mA)
16 10000
0
VGS, GATE−SOURCE VOLTAGE (VOLTS)
Figure 3. VGS(off) = 5.0 Volts
ID, DRAIN CURRENT (mA)
Figure 4. VGS(off) = 2.0 Volts
Figure 5. VGS(off) = 4.0 Volts
Figure 6. VGS(off) = 5.0 Volts
3.0
2.5
2.0
1.5
1.0
0.5
00.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
VDS = 15 V
200
300
500
700
1000
2000
3000
0.2 0.3 0.5 0.7 2.0 3.0 4.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
00.5 1.5 2.0 2.5 3.0 3.5 4.0 500
700
1000
2000
3000
5000
7000
0.5 0.7 1.0 2.0 3.0 5.0 7.0
14
12
10
8.0
6.0
4.0
2.0
01.0 2.0 3.0 8.04.0 5.0 6.0 7.0 500
700
1000
2000
3000
5000
7000
0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
TA = −55°C
25°C
125°C
VDS = 15 V
f = 1.0 kHz
VDS = 15 V
TA = −55°C
25°C
125°C
VDS = 15 V
TA = −55°C
25°C
125°C
VDS = 15 V
f = 1.0 kHz
VDS = 15 V
f = 1.0 kHz
MMBF5460LT1
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4
1000
0.1 0.2
ID, DRAIN CURRENT (mA)
Figure 7. Output Resistance
versus Drain Current
10 0.5 1.0 2.0 5.0 10
ross, OUTPUT RESISTANCE (k ohms)
C, CAPACITANCE (pF)
10
0
VDS, DRAIN−SOURCE VOLTAGE (VOLTS)
Figure 8. Capacitance versus
Drain−Source Voltage
0
NF, NOISE FIGURE (dB)
10
RS, SOURCE RESISTANCE (k Ohms)
Figure 9. Noise Figure versus
Source Resistance
0
Figure 10. Equivalent Low Frequency Circuit
20
30
50
70
100
200
300
500
700
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10 20 30 40
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
1.0 10 100 1000 10,000
NOTE:
1. Graphical data is presented for dc conditions. Tabular data is given
for pulsed conditions (Pulse Width = 630 ms, Duty Cycle = 10%).
*Cosp is Coss in parallel with Series Combination of Ciss and Crss.
vi
Crss
Ciss ross Coss | yfs | vi
COMMON SOURCE
y PARAMETERS FOR FREQUENCIES
BELOW 30 MHz
yis = jW Ciss
yos = jW Cosp * + 1/ross
yfs = yfs |
yrs = −jW Crss
VDS = 15 V
f = 1.0 kHz
IDSS = 3.0 mA
6.0 mA
10 mA
f = 1.0 MHz
VGS = 0
Ciss
Coss
Crss
VDS = 15 V
VGS = 0
f = 100 Hz
MMBF5460LT1
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5
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE,
NEW STANDARD 318−08.
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
HE0.35 0.54 0.69 0.014 0.021 0.029
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
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