DATASHEET Board Level Cooling - 3747 BOARD LEVEL COOLING - 3747 37472 is a series of square pin fin board level heat sinks designed to cool BGA and FPGA devices. Representative image only. ORDERING INFORMATION Part Number Device Type 374724B00032G 374724B00035G 374724B60024G BGA, FPGA BGA, FPGA BGA, FPGA HEAT SINK DETAILS Property Details Property Details Material Finish Device Attachment Options: 374724B00032G Device Attachment Options: 374724B00035G Device Attachment Options 374724B60024G Thermal Interface Material: 374724B00032G Thermal Interface Material: 374724B00035G Thermal Interface Material: 374724B60024G Aluminum Black Anodize Heat Sink Width (mm) Heat Sink Length (mm) Heat Sink Height (mm) Heat Sink Mounting Direction 35.00 35.00 18.00 Horizontal, Vertical Tape Tape Solder Anchor Clip T405R Chomerics Tape for Metal Surfaces T411 Chomerics Tape for All Surfaces T766 Chomerics Phase Change for All Surfaces MECHANICAL & PERFORMANCE Drawing dimensions are shown in mm, (in) Part Number: 374724B00032G, 374724B00035G USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com DATASHEET Board Level Cooling - 3747 Part Number: 374724B60024G Mounting Details: USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com