DATASHEET
BoardLevelCooling–3747
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING–3747
37472isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumberDeviceType
374724B00032GBGA,FPGA
374724B00035GBGA,FPGA
374724B60024GBGA,FPGA
PartNumber:374724B00032G,374724B00035G
PropertyDetails
HeatSinkWidth(mm)35.00
HeatSinkLength(mm)35.00
HeatSinkHeight(mm)18.00
HeatSinkMountingDirectionHorizontal,Vertical
HEATSINKDETAILS
PropertyDetails
MaterialAluminum
FinishBlackAnodize
DeviceAttachmentOptions:
374724B00032GTape
DeviceAttachmentOptions:
374724B00035GTape
DeviceAttachmentOptions
374724B60024GSolderAnchorClip
ThermalInterfaceMaterial:
374724B00032G
T405RChomericsTapeforMetal
Surfaces
ThermalInterfaceMaterial:
374724B00035G
T411ChomericsTapeforAllSurfaces
ThermalInterfaceMaterial:
374724B60024G
T766ChomericsPhaseChangeforAll
Surfaces
DATASHEET
BoardLevelCooling–3747
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
PartNumber:374724B60024G
MountingDetails:
