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Document No. 70-0090-09 www.psemi.com ©2003-2010 Peregrine Semiconductor Corp. All rights reserved.
RF1 RF2
CTRL
5050CMOS
Control
Driver
ESD ESD
The PE4246 RF Switch is designed to cover a broad range of
applications from 1 to 5000 MHz. It is non-reflective at both
RF1 and RF2 ports. This SPST switch integrates a single-pin
CMOS control interface, and provides low insertion loss while
operating with extremely low bias from a single +3-volt supply.
In a typical application, the high isolation PE4246 can replace
multiple RF switches of lesser isolation performance. It is
offered in a small 3x3 mm DFN package.
The PE4246 is manufactured on Peregrine’s UltraCMOS™
process, a patented variation of silicon-on-insulator (SOI)
technology on a sapphire substrate, offering the performance
of GaAs with the economy and integration of conventional
CMOS.
Product Specification
Absorptive SPST UltraCMOS™
RF Switch: 1 - 5000 MHz
Product Description
Figure 1. Functional Diagram
PE4246
Features
Non-reflective 50-ohm RF switch
50-ohm (0.25 watt) terminations
High isolation: 55 dB at 1000 MHz,
48 dB at 3000 MHz
Low insertion loss: 0.8 dB at 1000 MHz,
0.9 dB at 3000 MHz
High linearity: +33 dBm input 1dB
compression point
CMOS/TTL single-pin control
Single +3-volt supply operation
Extremely low bias: 33 µA @ 3 V
Available in a 6-lead DFN package
Notes: 1. Device linearity will begin to degrade below 1 MHz.
2. The DC transient at the output of the switch when the control voltage is switched from Low to High or High to Low in a 50 test set-up,
measured with 1ns risetime pulses and 500 MHz bandwidth.
3. Note Absolute Maximum ratings in Table 3.
Table 1. Electrical Specifications @ +25 °C, VDD = 3 V (ZS = ZL = 50 )
Figure 2. Package Type
6-lead DFN
Parameter Condition Minimum Typical Maximum Units
Operation Frequency1 1 5000 MHz
Operating Power CTRL=1/CTRL=0 30/24 dBm
Insertion Loss
1-2000 MHz
2000-3000 MHz
3000-4000 MHz
4000-5000 MHz
0.8
0.9
1.0
1.3
1.0
1.1
1.3
1.8
dB
dB
dB
dB
Isolation
1-2000 MHz
2000-3000 MHz
3000-4000 MHz
4000-5000 MHz
49
45
43
40
55
48
46
44
dB
dB
dB
dB
Return Loss 1-5000 MHz 11 20 dB
Input 1 dB Compression3 1-5000 MHz 30 33 dBm
Input IP3 1-5000 MHz 50 dBm
Video Feedthrough2 15 mVpp
Switching Time 2 µs
Peregrine Specification 71/0008
Product Specification
PE4246
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©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 UltraCMOS™ RFIC Solutions
Table 2. Pin Descriptions
Table 3. Absolute Maximum Ratings
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe the
same precautions that you would use with other ESD-
sensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
rating specified in Table 3.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™ de-
vices are immune to latch-up.
Table 4. Operating Ranges
Notes: 1. A bypass capacitor should be placed as close as possible
to the pin.
2. Both RF pins must be DC blocked by an external capacitor
or held at 0 VDC.
3. The exposed pad must be soldered to the ground plane for
proper switch performance.
Figure 3. Pin Configuration
Table 5. Control Logic Truth Table
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted to
the limits in the Operating Ranges table. Operation
between operating range maximum and absolute
maximum for extended periods may reduce reliability.
Pin
No.
Pin
Name Description
1 VDD Nominal 3 V supply connection.1
2 GND Ground connection. 3
3 RF1 RF port. 2
4 CTRL CMOS or TTL logic level:
High = RF1 to RF2 signal path
Low = RF1 isolated from RF2
5 GND Ground connection. 3
6 RF2 RF port. 2
Symbol Parameter/Condition Min Max Unit
VDD Power supply voltage -0.3 4.0 V
VI Voltage on CTRL input -0.3 5.5 V
TST Storage temperature -65 150 °C
PIN Input power (50 ),
CTRL=1/CTRL=0 33/24 dBm
VESD ESD voltage
(Human Body Model) 200 V
Parameter Min Typ Max Unit
VDD Power Supply 2.7 3.0 3.3 V
IDD Power Supply Current
(VDD = 3 V, VCNTL = 3 V) 33 40 µA
Control Voltage High 0.7xVDD 5 V
Control Voltage Low 0 0.3xVDD V
TOP Operating temperature -40 85 °C
Control Voltage Signal Path
CTRL = CMOS or TTL High RF1 to RF2
CTRL = CMOS or TTL Low RF1 isolated from RF2
Exposed
Solder Pad
(bottom side)
V
DD
GND
RF1
RF2
GND
CTRL4
5
6
3
2
1
Device Description
The PE4246 high-isolation SPST RF Switch is
designed to support a variety of applications
where high isolation performance is demanded
and a non-reflective input and output is desired.
This switch is able to replace multiple lesser
performing switches in a very small 3x3 mm DFN
footprint.
Control Logic
The control logic input pin (CTRL) is typically driven by
a 3-volt CMOS logic level signal, and has a threshold of
50% of VDD. For flexibility to support systems that have
5-volt control logic drivers, the control logic input has
been designed to handle a 5-volt logic HIGH signal. (A
minimal current will be sourced out of the VDD pin when
the control logic input voltage level exceeds VDD.)
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the PE4246 in
the 6-lead 3x3 DFN package is MSL1.
Product Specification
PE4246
©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 www.psemi.com
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-100
-80
-60
-40
-20
0
0 1000 2000 3000 4000 5000
Isolation (dB)
Frequency (MHz)
20
30
40
50
60
20
30
40
50
60
0 1000 2000 3000 4000 5000
IIP3 (dBm)
1dB Compression Point (dBm)
Frequency (MHz)
IIP3
Input 1dB Compression
-3
-2.5
-2
-1.5
-1
-0.5
0
0 1000 2000 3000 4000 5000
Insertion Loss (dB)
Frequency (MHz)
-40 C
25 C85 C
Typical Performance Data @ 25 °C (Unless Otherwise Noted)
Figure 4. Insertion Loss Figure 5. Input 1dB Compression Point and IIP3
Figure 6. Isolation
T = -40 °C to 85 °C
Product Specification
PE4246
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©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 UltraCMOS™ RFIC Solutions
-35
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000 4000 5000
Ret urn Loss (dB)
Frequency (MHz)
-35
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000 4000 5000
Return Loss (dB)
Frequency (MHz)
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000 4000 5000
Return Loss (dB)
Frequency (MHz)
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000 4000 5000
Return Loss (dB)
Frequency (MHz)
Typical Performance Data @ +25 °C
Figure 7. RF1 Return Loss (CTRL = High) Figure 8. RF2 Return Loss (CTRL = High)
Figure 9. RF1 Return Loss (CTRL = Low) Figure 10. RF2 Return Loss (CTRL = Low)
Product Specification
PE4246
©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 www.psemi.com
Page 5 of 8
Evaluation Kit
The SPST Switch Evaluation Kit board was
designed to ease customer evaluation of the
PE4246 SPST switch. The RF1 port is connected
through a 50 transmission line to the top left
SMA connector, J1. The RF2 port is connected
through a 50 transmission line to the top right
SMA connector, J2. A through transmission line
connects SMA connectors J3 and J4. This
transmission line can be used to estimate the loss
of the PCB over the environmental conditions
being evaluated.
The board is constructed of a two metal layer FR4
material with a total thickness of 0.031”. The
bottom layer provides ground for the RF
transmission lines. The transmission lines were
designed using a coplanar waveguide model with
trace width of 0.0476”, trace gaps of 0.030”,
dielectric thickness of 0.028”, metal thickness of
0.0021” and εR of 4.3. Note that the predominate
mode for these transmission lines is coplanar
waveguide with a ground plane.
J5 and J6 provide a means for controlling DC and
digital inputs to the device. J6-1 is connected to
the device VDD input. J5-1 is connected to the
device CTRL input. J5-2 and J6-2 are GND
connections. A decoupling capacitor (100 pF) is
provided on both CTRL and VDD traces. It is the
responsibility of the customer to determine proper
supply decoupling for their design application.
Removing these components from the evaluation
board has not been shown to degrade RF
performance.
Figure 11. Evaluation Board Layouts
Figure 12. Evaluation Board Schematic
Peregrine Specification 102/0134
Peregrine Specification 101/0102
Product Specification
PE4246
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©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 UltraCMOS™ RFIC Solutions
6-lead DFN
Figure 13. Package Drawing
NOTE: The exposed solder pad (on the bottom of the package) is not electrically connected to any other pin
(isolated).
Figure 14. Marking Specifications
4246
YYWW
ZZZZZ
YYWW = Date Code (last two digits of year and work week)
ZZZZZ = Last five digits of Lot Number
06L SLP
(3x3mm)
Product Specification
PE4246
Page 7 of 8
©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 UltraCMOS™ RFIC Solutions
Table 6. Dimensions
Dimension DFN 3x3 mm
Ao 3.23 ± 0.1
Bo 3.17 ± 0.1
Ko 1.37 ± 0.1
P 4 ± 0.1
W 8 +0.3, -0.1
T 0.254 ± 0.02
R7 Quantity 3000
R13 Quantity N.A.
Note: R7 = 7 inch Lock Reel, R13 = 13 inch Lock Reel
6-lead DFN
Table 7. Ordering Information
Order Code Part Marking Description Package Shipping Method
4246-51 4246 PE4246G-06DFN 3x3mm-12800F Green 6-lead 3x3 mm DFN Tape or loose
4246-52 4246 PE4246G-06DFN 3x3mm-3000C Green 6-lead 3x3 mm DFN 3000 units / T&R
4246-00 PE4246-EK PE4246-06DFN 3x3mm-EK Evaluation Kit 1 / Box
Figure 15. Tape and Reel Specifications
Device Orientation in Tape
Top of
Device
Pin 1
Tape Feed Direction
Product Specification
PE4246
©2003-2010 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0090-09 www.psemi.com
Page 8 of 8
Sales Offices
The Americas
Peregrine Semiconductor Corporation
9380 Carroll Park Drive
San Diego, CA 92121
Tel: 858-731-9400
Fax: 858-731-9499
Europe
Peregrine Semiconductor Europe
timent Maine
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Tel: +33-1-4741-9173
Fax : +33-1-4741-9173
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data
sheet contains design target specifications for product
development. Specifications and features may change in
any manner without notice.
Preliminary Specification
The data sheet contains preliminary data. Additional data
may be added at a later date. Peregrine reserves the right
to change specifications at any time without notice in order
to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine
decides to change the specifications, Peregrine will notify
customers of the intended changes by issuing a CNF
(Customer Notification Form).
The information in this data sheet is believed to be reliable.
However, Peregrine assumes no liability for the use of this
information. Use shall be entirely at the user’s own risk.
No patent rights or licenses to any circuits described in this
data sheet are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in
devices or systems intended for surgical implant, or in other
applications intended to support or sustain life, or in any
application in which the failure of the Peregrine product could
create a situation in which personal injury or death might occur.
Peregrine assumes no liability for damages, including
consequential or incidental damages, arising out of the use of
its products in such applications.
The Peregrine name, logo, and UTSi are registered trademarks
and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks
of Peregrine Semiconductor Corp.
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Americas
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Phone: 858-731-9475
Fax: 848-731-9499
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