TRPGP40ATGC - TEXAS INSTRUMENTS

MPXV4006

Rev 3, 1/2009

Freescale Semiconductor

Pressure

+Integrated Silicon Pressure Sensor

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXV4006 series piezoresistive transducers are state-of-the-art

monolithic silicon pressure sensors designed for the applian c e, consumer,

health care and industrial market. The analog output can be read directly into

the A/D input of Freescale microcontrollers. This transducer combines

advanced micromachining techniques, thin-film metallization, and bi polar

processing to provide an accurate, high level analog output signal that is

proportional to the applied pressure. The axial port has been modified to

accommodate industrial grade tubing.

Features

• 2.5% Maximum Error over +10°C to +60°C with Auto Zero

• 5% Maximum Error over +10°C to +60°C without Auto Zero

• Durable Thermoplastic (PPS) Package

• Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations

• Available with Standard Fluorosilicone Gel or Media Resistant Gel

ORDERING INFORMATION

Device Name Package

Options Case

No.

# of Ports Pressure Type Option Device

Marking

None Single Dual Gauge Differential Absolute Surface

Mount Through-

Hole

Small Outline Package (Media Resistant Gel) (MPVZ4006 Series)

MPVZ4006GW6U Rail 1735 • • • MZ4006GW

MPVZ4006GW7U Rail 1560 • • • MZ4006GW

MPVZ4006G6U Rail 482 • • • MPVZ4006G

MPVZ4006G6T1 Tape and

Reel 482 • • • MPVZ4006G

MPVZ4006G7U Rail 482B • • • MPVZ4006G

Small Outline Package (MPXV4006 Series)

MPXV4006GC6U Rail 482A • • • MPXV4006G

MPXV4006GC6T1 Tape and

Reel 482A • • • MPXV4006G

MPXV4006GC7U Rail 482C • • • MPXV4006G

MPXV4006GP Tray 1369 • • • MPXV4006GP

MPXV4006DP Tray 1351 • • • MPXV4006DP

MPXV4006

0 to 6 kPa (0 to 0.87 psi)

0.2 to 4.8 V Output

Integrated

Pressure Sensor

Series

Application Examples

• Washing Machine W ater Level

Measurement (Reference AN1950)

• Ideally Suited for Microprocessor or

Microcontroller-Based Systems

• Appliance Liquid Level an d Pressure

Measurement

• Respiratory Equ i pment

MPXV4006

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Pressure

SMALL OUTLINE PACKAGE SURFACE MOUNT

SMALL OUTLINE PACKAGE THROUGH-HOLE

MPVZ4006GW6U

CASE 1735-01 MPVZ4006G6U/T1

CASE 482-01

MPVZ4006G7U

CASE 482B-03

MPVZ4006GW7U

CASE 1560-02

MPXV4006GC6U/C6T1

CASE 482A-01

MPXV4006GC7U

CASE 482C-03

MPXV4006DP

CASE 1351-01 MPXV4006GP

CASE 1369-01

MPXV4006

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Freescale Semiconductor 3

Pressure

Operating Characteristics

Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

Characteristic Symbol Min Typ Max Unit

Pressure Range POP 0—6.0

612 kPa

mm H2O

Supply Voltage(1)

1. Device is ratiometric within this specified excitation range.

VS4.75 5.0 5.25 Vdc

Supply Current IS— — 10 mAdc

Full Scale Span(2)

2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum rated pressure.

VFSS —4.6— V

Offset(3)(5)

3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.

Voff 0.152 0.265 0.378 V

Sensitivity V/P — 766

7.511 —mV/kPa

mV/mm H2O

Accuracy(4)(5) (10 to 60°C)

4. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to

and from the minimum or maximum operating temperature points, with zero differential pressure applied.

Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum

or maximum rated pressure, at 25°C.

Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with

minimum rated pressure applied.

TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C.

TcOffset: Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.

5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the

zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is

defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified

accuracy assumes a maximum temperature change of ±5°C between autozero and measurement.

—

±2.46

±5.0

%VFSS with

auto zero

%VFSS without

auto zero

MPXV4006

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4Freescale Semiconductor

Pressure

Maximum Ratings

Figure 1. Fully Integ rated Pressure Sensor Schematic

Table 2. Maximum Ratings(1)

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Parametrics Symbol Value Units

Maximum Pressure (P1 > P2) Pmax 24 kPa

Storage Temperature Tstg -30° to +100°°C

Operating Temperature TA+10° to +60°°C

Sensing

Element

GND

Vout

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and

Ground

Reference

Shift Circuitry

for small outline package device

MPXV4006

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Pressure

On-Chip Temperature Compensation and Calibration

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal condi tioning circuitry

onto a single mo no l i thic chip.

Figure 2 illustrates the Differential or Gauge configuration

in the basic chip carrier (Case 482). A gel die coat isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPXV4006/MPVZ4006 series sensor operating

characteristics are based on use of dry air as pressure media.

Media, other than dry air, may have adverse effects on sensor

performance and long-term reliability. Internal reliability and

qualification test for dry air, and other media, are available

from the factory . Contact the factory for information regarding

media tolerance in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller . Proper decoupling of

the power supply is recommended.

Figure 4 and Figure 5 shows the sensor output signal

relative to pressure input. Typical, minimum and maximum

output curves are shown for operation over a temperature

range of 10°C to 60°C using the decoupling circuit shown in

Figure 3. The output will saturate outside of the specified

pressure range.

Figure 2. Cross Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering Recommendations

(For additional output filterin g, please refer to

Application Note AN1646.)

Figure 4. Output versus Pressure Differential

at ±5.0% VFSS (without auto zero, Note 5 in

Operating Charac teristics)

Figure 5. Output versu s Pressure Differential

at ±2.46% VFSS (with auto zero, Note 5 in

Operating Characteristics)

Fluorosilicone

Gel Die Coat

Wire

Bond

Differential Sensing

Element

Thermoplastic

Case

Stainless

Steel Cap

Lead

Frame

P2 Die Bond

Die

1.0 μF

IPS

470 pF

OUTPUT

+5 V

0.01 μFGND

Vout

Differential Pressure (kPa)

4.0

3.0

2.0

1.0

002.0

4.5

4.0 6.0

5.0

3.5

2.5

1.5

0.5

VS = 5.0 Vdc

TEMP = 10 to 60°C

Transfer Function (kPa):

Vout = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS

Differential Pressure (kPa)

Output (V)

4.0

3.0

2.0

1.0

002.0

4.5

4.0 6.0

MAX

MIN

5.0

3.5

2.5

1.5

0.5

VS = 5.0 Vdc

TEMP = 10 to 60°C

TYPICAL

Output (V)

Transfer Function (kPa):

Vout = VS*[(0.1533*P ) + 0.053] ± 2.46% VFSS

MAX

MIN

TYPICAL

MPXV4006

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6Freescale Semiconductor

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing a gel die coat which

isolates the die from the environment. The pressure sensor is

designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

tab l e below:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommende d to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 6. SOP Footprint (Case 482)

Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table

Part Number Case Type Pressure (P1) Side Identifier

MPVZ4006GW6U 1735-01 Vertical Port Attached

MPVZ4006GW7U 1560-02 Vertical Port Attached

MPVZ4006G6U/T1 482-01 Stainless Steel Cap

MPVZ4006G7U 482B-03 Stainless Steel Cap

MPXV4006GC6U/T1 482A Vertical Port Attached

MPXV4006GC7U 482C-03 Vertical Port Attached

MPXV4006GP 1369-01 Side with Port Attached

MPXV4006DP 1351-01 Side with Part Marking

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP

2.54

0.300

7.62

inch

MPXV4006

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Pressure

CASE 1351-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure

CASE 1351-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure

CASE 1369-01

ISSUE B

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure

CASE 1369-01

ISSUE B

SMALL OUTLINE PACKAGE

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Pressure

PACKAGE DIMENSIONS

D8 PL

0.25 (0.010) A S

-A-

-B-

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C5.380.2300.212 5.84

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0˚ 7˚ 0˚ 7˚

N0.405 0.415 10.29 10.54

S0.709 0.725 18.01 18.41

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

MILLIMETERSINCHES

0.100 BSC 2.54 BSC

DIM

MIN

0.415

0.210

0.026

0.009

0.100

0˚

0.405

0.540

MAX

0.425

0.220

0.034

0.011

0.120

15˚

0.415

0.560

MIN

10.54

5.33

0.66

0.23

2.54

0˚

10.29

13.72

MAX

10.79

5.59

0.864

0.28

3.05

15˚

10.54

14.22

PIN 1 IDENTIFIER

SEATING

PLANE

-T-

DETAIL X

-A-

-B-

D8 PL

0.25 (0.010) A S

DETAIL X

NOTES:

DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

MAXIMUM MOLD PROTRUSION 0.15 (0.006).

ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

CASE 482B-03

ISSUE B

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure PACKAGE DIMENSIONS

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C12.700.5200.500 13.21

D0.960.0420.038 1.07

G0.100 BSC 2.54 BSC

H0.002 0.010 0.05 0.25

J0.009 0.011 0.23 0.28

K0.061 0.071 1.55 1.80

M0 7 0 7

N0.444 0.448 11.28 11.38

S0.709 0.725 18.01 18.41

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5

TYPICAL DRAFT.

____

8 PL

0.25 (0.010) A S

–A–

–B–

PIN 1 IDENTIFIER

SEATING

PLANE

–T–

V0.245 0.255 6.22 6.48

W0.115 0.125 2.92 3.17

CASE 482A-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure

PACKAGE DIMENSIONS

CASE 1560-02

ISSUE C

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure PACKAGE DIMENSIONS

CASE 1560-02

ISSUE C

SMALL OUTLINE PACKAGE

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Pressure

PACKAGE DIMENSIONS

CASE 1560-02

ISSUE C

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure PACKAGE DIMENSIONS

CASE 1735-01

ISSUE A

SMALL OUTLINE PACKAGE

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Pressure

PACKAGE DIMENSIONS

CASE 1735-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXV4006

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18 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS

CASE 1735-01

ISSUE A

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure

PACKAGE DIMENSIONS

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A10.540.4250.415 10.79

B10.540.4250.415 10.79

C12.700.5200.500 13.21

D0.660.0340.026 0.864

G0.100 BSC 2.54 BSC

J0.009 0.011 0.23 0.28

K0.100 0.120 2.54 3.05

M0 15 0 15

N0.444 0.448 11.28 11.38

S0.540 0.560 13.72 14.22

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5

TYPICAL DRAFT.

6. DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

____

PIN 1

SEATING

PLANE

–T–

–A–

–B–

V0.245 0.255 6.22 6.48

W0.115 0.125 2.92 3.17

IDENTIFIER

D8 PL

0.25 (0.010) A S

DETAIL X

CASE 482C-03

ISSUE A

SMALL OUTLINE PACKAGE

MPXV4006

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Pressure PACKAGE DIMENSIONS

NOTES:

CONTROLLING DIMENSION: INCH.

INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

0.004 (0.1)

DETAIL G

SEATING

PLANE

e/2

0.004 (0.1) BC

A0.006 (0.15) B

8Xb

2 PLACES 4 TIPS

MIN MAX MIN MAX

MILLIMETERSINCHES

0.370 0.390 9.39 9.91

0.002 0.010 0.05 0.25

0.038 0.042 0.96 1.07

0.465 0.485 11.81 12.32

0.680 0.700 17.27 17.78

0.465 0.485 11.81 12.32

0.270 0.290 6.86 7.37

0.160 0.180 4.06 4.57

0.009 0.011 0.23 0.28

0.110 0.130 2.79 3.30

0.100 BSC 2.54 BSC

0.240 0.260 6.10 6.60

0.115 0.135 2.92 3.43

0.040 0.060 1.02 1.52

0˚ 7˚ 0˚ 7˚

DIM

∅

GAGE

PLANE

DETAIL G

LA1

.014 (0.35)

STYLE 1:

PIN 1. GND

2. +Vout

3. Vs

4. -Vout

5. N/C

6. N/C

7. N/C

8. N/C

STYLE 2:

PIN 1. N/C

2. Vs

3. GND

4. Vout

5. N/C

6. N/C

7. N/C

8. N/C

CASE 1351-01

ISSUE O

SMALL OUTLINE PACKAGE

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Pressure

PACKAGE DIMENSIONS

NOTES:

CONTROLLING DIMENSION: INCH.

INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

0.004 (0.1)

DETAIL G

SEATING

PLANE

∅

e/2

0.004 (0.1) BC

A0.008 (0.20) B

8Xb

2 PLACES 4 TIPS

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.300 0.330 7.11 7.62

A1 0.002 0.010 0.05 0.25

b0.038 0.042 0.96 1.07

D0.465 0.485 11.81 12.32

E1 0.465 0.485 11.81 12.32

M0.270 0.290 6.86 7.36

N0.080 0.090 2.03 2.28

P0.009 0.011 0.23 0.28

T0.115 0.125 2.92 3.17

0.100 BSC 2.54 BSC

F0.245 0.255 6.22 6.47

K0.120 0.130 3.05 3.30

L0.061 0.071 1.55 1.80

0˚ 7˚ 0˚ 7˚

0.717 BSC 18.21 BSC

GAGE

PLANE

DETAIL G

LA1

.014 (0.35)

CASE 1369-01

ISSUE O

SMALL OUTLINE PACKAGE

MPXV4006

Rev. 3

1/2009

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